硅基BIB红外探测器研究进展

以锗基和硅基为主的阻挡杂质带（blocked impurity band,BIB）红外探测器的兴起有力推进了红外天文学的快速发展,其中硅基BIB红外探测器在特定波长的航天航空领域有着不可替代的地位。国外对硅基BIB红外探测器的研究已有40多年,以美国航空航天局（NASA）为主的科研机构已经实现了硅基BIB红外探测器在天文领域的诸多应用,而国内对硅基BIB红外探测器的研究尚处于起步阶段。本文首先阐述了硅基BIB红外探测器的工作原理,然后简单概述了器件结构和制备工艺,并对不同类型的硅基BIB探测器的性能进行了对比分析,之后介绍了其在天文探测中的应用,最后对硅基BIB红外探测器未来的发展进行了展望。     

外延阻挡杂质带探测器的抗反射

传统外延阻挡杂质带探测器由于其材料物性和特殊的结构设计存在很强的反射,这些能量损失非常不利于器件的探测性能.报道了一种类光栅双层超构表面微结构阵列,并将此人工微结构引入到外延阻挡杂质带红外探测器以抑制对入射光的反射.实验结果显示,具有超构表面微结构阵列的器件在波长30μm处反射率低于3％,在25.3～32.2μm波段范...     

硅基阻挡杂质带太赫兹探测器及其成像研究

太赫兹探测及成像技术是推动太赫兹科学技术发展的基础和关键.为了实现高灵敏太赫兹探测及成像,设计了一种台面型硅基阻挡杂质带太赫兹探测器,详细介绍了其结构及探测机理,描述了其制备工艺流程,并搭建了黑体响应测试系统.结果表明,4.2K温度条件下,3.8V工作偏压时,探测器峰值响应率可达55A/W,响应频段覆盖6.7～60THz.此外,搭建了一套两维扫描成像系统,实现了高分辨率被动成像.实验结果表明,成像系统空间分辨率可达400μm、温度分辨率约为7.5mK.     

用于远红外探测的Si:P阻挡杂质带红外探测器研制

提出了全外延技术方案制备阻挡杂质带薄膜,避免了离子注入制备背电极层影响外延薄膜质量的技术难点.基于硅器件工艺设计制作了Si:P阻挡杂质带红外探测器.测量了器件的光电流响应谱和暗电流特性曲线,指认了叠加在光电流响应谱上的尖锐杂质峰对应阻挡层中磷原子的杂质跃迁.研究了器件在低温下小偏压范围内的暗电流起源.通过对计算结果分析,排除了该区域暗电流起源于热激发电导和跳跃式电导的可能,指出暗电流来自器件对冷屏的光电响应.器件工作温度5 K,工作偏压1.6 V时,响应波段覆盖2.5~40μm,峰值波长28.8μm,峰值响应率20.1 A/W,峰值探测率3.7×1013cm·Hz1/2/W(背景光子通量低于1013ph/cm2·s).     

近表面加工技术制备的高性能Ge:B 阻挡杂质带探测器

阻挡杂质带（BIB）探测器是当前远红外天文探测领域的主流探测器。通过近表面加工技术成功制备出了高性能的Ge:B BIB探测器,响应波数范围从50 cm^-1到400 cm^-1。在3.5 K温度和30 mV工作电压下,器件在峰值响应84.9 cm^-1处的响应率达到21.46 A·W^-1,探测率达到4.34×10¹⁴cm·Hz^1/2·W^-1。研究了BIB探测器中界面势垒对响应光谱的影响。提出了一种新的激发模式—电极区内的载流子可以通过光激发的方式越过势垒。此外,还发现了一种增强BIB探测器在小波数处相对响应强度的方法。     

混合式长波线列TDI红外探测器改进互连工艺研究

根据目前混合式红外焦平面互连工艺以及对长波线列延时积分红外探测器产量增长的需求,结合现有的工艺设备能力,开发出\"共片工艺\",以最大限度地提高在互连工艺段的生产效率.     

长波红外探测器线列生产的测试方法

本文详细描述长波红外ＨｇＣｄＴｅ（ＭＣＴ）探测器线列生产的设计,制造和测试方法。     

可用于多波段融合的超结构/阻挡杂质带复合结构探测器（特邀）

太赫兹辐射是指频率在30 μm~1 mm范围内的电磁波,具有穿透性强、安全性高、特征性强及定向性好等特点,因此,太赫兹技术在天文观测、安全监控、物质鉴定及生物医学等领域具有广阔的应用前景。阻挡杂质带探测器具有灵敏度高、阵列规模大、探测谱段宽等核心优势,是太赫兹辐射探测的优良选择。阻挡杂质带探测器目前主要采用三种材料体系,分别为Si、Ge、GaAs。基于这三种材料体系的阻挡杂质带探测器可实现在3~500 μm的超宽波段探测。超结构是由亚波长结构单元构成人工复合结构,在光电探测器上引入超结构,利用等离激元共振、偶极共振调控特性,可以将电磁场能量强烈的局域在金属/探测器界面位置。因此,超结构与阻挡杂质带结合,可有效调控探测峰位、缩小探测峰半高宽、强化光谱分辨能力,并有望大规模应用于3~500 μm的多波段融合探测。同时,超结构与阻挡杂质带探测器结合,可进一步提高器件响应率,减小器件尺寸,降低工艺难度。文中简要叙述了阻挡杂质带探测器的工作机理,介绍了国内外阻挡杂质带探测器的研究历史及研究现状。最后,在探测器波段调控、光谱分辨、增强吸收等角度详细介绍了Si、Ge、GaAs基超结构/阻挡杂质带复合结构探测器的研究现状,并结合目前该技术发展瓶颈问题,在高纯材料生长、光场局域效应机理研究等方面提出了下一步的研究展望。     

Bake stability of long-wavelength infrared HgCdTe photodiodes

The bake stability was examined for HgCdTe wafers and photodiodes with CdTe surface passivation deposited by thermal evaporation. Electrical and electrooptical measurements were performed on various long-wavelength infrared HgCdTe photodiodes prior to and after a ten-day vacuum bakeout at 80°C, similar to conditions used for preparation of tactical dewar assemblies. It was found that the bakeout process generated additional defects at the CdTe/ HgCdTe interface and degraded photodiode parameters such as zero bias impedance, dark current, and photocurrent. Annealing at 220°C under a Hg vapor pressure following the CdTe deposition suppressed the interface defect generation process during bakeout and stabilized HgCdTe photodiode performance.     

硅基中长波红外减反微结构研究

采用微加工工艺在Si衬底上制备了微柱和微锥阵列,结合光学建模分析,研究了结构参数对中长波（2.5~9 m）红外光反射率的影响规律。使用严格耦合波分析方法（RCWA）计算的微结构反射光衍射效率与傅里叶红外变换光谱仪（FTIR）测试的反射率结果吻合较好。研究结果表明,Si基微结构对TM及TE偏振光均有良好的红外光减反特性,微锥结构具有更好的减反效果,2.5~6.5 m中红外偏振光的反射率低至2%,同时表现出良好的宽谱与广角度减反特性。     

键合法制备硅基1.55μm InP-InGaAsP量子阱激光器

在硅基上成功地制备出了1.55μm InP-InGaAsP量子阱激光器.设计并生长了适合于键合的量子阱激光器结构材料,通过直接键合技术,将Si衬底与InP-InGaAsP外延片键合到一起.剥离去掉InP衬底后,在5～6μm的薄膜上制备出20μm条形边发射激光器.室温下,阈值电流160mA(电流密度为2.7kA/cm2),功率可达10mW以上(在约350mA电流下),实现了1.55μm长波长边发射激光器与Si的集成.目前,该结果国际上还未见报道.     

基于标准CMOS工艺用于非制冷红外探测器的低成本红外吸收结构

This paper introduces a low-cost infrared absorbing structure for an uncooled infrared detector in a standard 0.5 m CMOS technology and post-CMOS process. The infrared absorbing structure can be created by etching the surface sacrificial layer after the CMOS fabrication, without any additional lithography and deposition procedures. An uncooled infrared microbolometer is fabricated with the proposed infrared absorbing structure.The microbolometer has a size of 6565 m2and a fill factor of 37.8%. The thermal conductance of the microbolometer is calculated as 1.3310 5W/K from the measured response to different heating currents. The fabricated microbolometer is irradiated by an infrared laser, which is modulated by a mechanical chopper in a frequency range of 10–800 Hz. Measurements show that the thermal time constant is 0.995 ms and the thermal mass is 1.3210 8J/K. The responsivity of the microbolometer is about 3.03104V/W at 10 Hz and the calculated detectivity is 1.4108cm Hz1=2/W.     

Molecular-beam epitaxial growth of CdSe<Subscript>x</Subscript>Te<Subscript>1−x</Subscript> on Si(211)

We report on the first successful growth of the ternary-alloy CdSe_xTe_1−x(211) on 3-in. Si(211) substrates using molecular-beam epitaxy (MBE). The growth of CdSeTe was performed using a compound CdTe effusion source and an elemental Se effusion source. The alloy composition (x) of the CdSe_xTe_1−x ternary compound was controlled through the Se:CdTe flux ratios. Our results indicated that the crystalline quality of CdSeTe decreases as the alloy composition increases, which is possibly due to an alloy-disordering effect. A similar trend was observed for the CdZnTe ternary-alloy system. However, the alloy-disordering effect in CdSeTe was found to be less severe than that in CdZnTe. We have carried out the growth of CdSeTe on Si at different temperatures. An optimized growth window was established for CdSeTe on Si(211) to achieve high-crystalline-quality CdSeTe/Si layers with 4% Se. The as-grown layers exhibited excellent surface morphology, low surface-defect density (less than 500 cm⁻²), and low x-ray full width at half maximum (FWHM) values near 100 arcsec. Additionally, the CdSeTe/Si layer exhibited excellent lateral uniformity and the best etched-pit density (EPD) value on a 4% CdSeTe, measured to be as low as 1.4 × 10⁵ cm⁻².     

Development and fabrication of two-color mid- and short-wavelength infrared simultaneous unipolar multispectral integrated technology focal-plane arrays

We report the development and fabrication of two-color mid-wavelength infrared (MWIR) and short-wavelength infrared (SWIR) HgCdTe-based focalplane arrays (FPAs). The HgCdTe multilayers were deposited on bulk CdZnTe (ZnTe mole fraction ∼3%) using molecular beam epitaxy (MBE). Accurate control of layer composition and growth rate was achieved using in-situ spectroscopic ellipsometry (SE). Epilayers were evaluated using a variety of techniques to determine suitability for subsequent device processing. These techniques included Fourier transform infrared (FTIR) spectroscopy, Hall measurement, secondary ion mass spectroscopy (SIMS), defect-decoration etching, and Nomarski microscopy. The FTIR transmission measurements confirmed SE’s capability to provide excellent compositional control with run-to-run x-value variations of ∼0.002. Nomarski micrographs of the as-grown surfaces featured cross-hatch patterns resulting from the substrate/epilayer lattice mismatch as well as various surface defects (voids and “microvoids”), whose densities ranged from 800–8,000 cm⁻². A major source of these surface defects was substrate particulate contamination. Epilayers grown following efforts to reduce these particulates exhibited significantly lower densities of surface defects from 800–1,700 cm⁻². Dislocation densities, as revealed by a standard defect-decoration etch, were 2–20×10⁵ cm⁻², depending on substrate temperature during epitaxy. The FPAs (128×128) were fabricated from these epilayers. Preliminary performance results will be presented.     

Electrical Characterization of Different Passivation Treatments for Long-Wave Infrared InAs/GaSb Strained Layer Superlattice Photodiodes

Silicon dioxide (SiO₂), silicon nitride (Si _x N _y ), and zinc sulfide (ZnS) with ammonium sulfide [(NH₄)₂S] as a prepassivation surface treatment were compared as passivants for InAs/GaSb strained layer superlattice detectors with a 0% cutoff wavelength of ∼10 μm. SiO₂ did not show significant improvement and the zero-bias resistance-area product (R ₀ A) was 0.72 Ω-cm² at 77 K. Si _x N _y passivation showed a nominal improvement with an R ₀ A value of 4.1 Ω-cm² at 77 K. ZnS with (NH₄)₂S treatment outperformed others significantly, improving the R ₀ A value to 492 Ω-cm² at 77 K. Variable-area diode measurements indicated a bulk-limited R ₀ A value of 722 Ω-cm². ZnS-passivated diodes exhibited maximum surface resistivity with a value of 2500 Ω-cm.