Development and characterization of a wood adhesive using bagasse lignin

Bagasse is spent fiber left after extraction of sugar. It is mainly used as a fuel to concentrate sugarcane juice. In the present work, the possibility of preparing wood adhesives from bagasse has been explored. The parameters for the preparation of a lignin phenol formaldehyde (LPF) adhesive, (lignin concentration, formaldehyde to phenol molar ratio, catalyst concentration, reaction time and reaction temperature) have been optimized. It was found that up to 50% of phenol can be substituted by bagasse lignin to give LPF wood adhesive having better bonding strength in comparison to a control phenol formaldehyde (CPF) wood adhesive. Prepared resins were characterized using IR, DSC and TGA. IR spectra of LPF resin showed structural similarity with CPF resin. Thermal stability of LPF resin was found to be lower as compared to CPF resin. DSC studies reveal a lower curing temperature for LPF adhesive in comparison to CPF adhesive. A shelf-life study reveals that LPF exhibits consistent behavior as compared to CPF in respect to adhesive strength.     

Development and characterization of a lignin–phenol–formaldehyde wood adhesive using coffee bean shell

In the present study, the possibility of development of a wood adhesive using coffee bean shell lignin (Cbsl) has been explored. Cbsl-modified phenolic adhesive has been prepared by replacing phenol with lignin at different weight percents. The optimization of weight percent lignin incorporation was carried out with respect to mechanical properties. It was found that up to 50 wt% of phenol could be replaced by Cbsl to give lignin–phenol–formaldehyde adhesive (LPF) with improved bond strength in comparison to control phenol–formaldehyde (CPF). Optimized LPF and CPF adhesives were characterized by IR, DSC and TGA. The IR spectrum of LPF showed structural similarity to CPF. Thermal stability of LPF adhesive was found to be lower as compared to that of CPF. DSC studies revealed a higher rate of curing in the LPF adhesive.     

Eucalyptus bark lignin substituted phenol formaldehyde adhesives: A study on optimization of reaction parameters and characterization

The major adhesive resin worldwide used in the manufacture of plywood is phenol formaldehyde resole (PF) resin. The raw material for this kind of adhesive is derived from petroleum oil. Because of rising prices of crude oil and the scarcity of petroleum products, their replacement by natural resource–based raw material has become a necessity. In the present work, the possibility of replacing phenol in PF resin with lignin was explored. The parameters for preparation of bark lignin substituted PF (LPF) adhesive, such as lignin concentration, formaldehyde to phenol molar ratio, catalyst concentration, reaction time, and reaction temperature, were optimized. It was found that up to 50 wt % of phenol can be substituted by lignin to give an LPF adhesive with better bonding strength compared to that of control PF resin. Prepared resins were characterized using IR, DSC, and TGA. IR spectra of LPF adhesive showed structural similarity with that of PF adhesives. Thermal stability of LPF adhesive was found to be lower compared to that of control PF (CPF) adhesive. DSC studies revealed a lower curing temperature for LPF resin than that for CPF resin. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 3514–3523, 2004     

Properties of plywood panels bonded with ionic liquid-modified lignin–phenol–formaldehyde resin

The aim of this research was to investigate the physical and mechanical properties of plywood panels bonded with ionic liquid-modified lignin–phenol–formaldehyde (LPF) resin. For this purpose, soda bagasse lignin was modified by 1-ethyl-3-methylimidazolium acetate ([Emim][OAc]) ionic liquid, and then, various contents of modified lignins (10, 15, and 20 wt%) were added as a substitute of phenol in phenol–formaldehyde (PF) resin synthesis. The properties of the synthesized resin were compared with those of a control PF resin. The changes in curing behavior of the resins prepared were analyzed by differential scanning calorimetry (DSC). The physical properties of the resins prepared, as well as the water absorption, thickness swelling, shear strength, and formaldehyde emission of the plywood panels bonded with these adhesives, were measured according to standard methods. DSC analysis indicated that in comparison with PF resins, curing of the LPF resin occurred at lower temperatures. The physical properties of the synthesized resins indicated that viscosity and solid content increased, while gel time and density decreased by addition of treated lignin to the PF resin. Although the panels containing resins with modified lignin yielded low formaldehyde emission, their dimensional stability was worse than those bonded with a commercial PF adhesive. The plywood prepared using IL-treated lignin PF resins has shear strength, which satisfy the requirements of the relevant standards specifications and significantly better than that of panels prepared with the control PF resin. The mechanical properties of the panels could be significantly enhanced with increased percentage of treated lignin content from 0 to 20 wt%.     

Thermoplastic and moisture-dependent behavior of lignin phenol formaldehyde resins

Bonding kinetics of thermosetting adhesives is influenced by a variety of factors such as temperature, humidity, and resin properties. A comparison of lignin-based phenol formaldehyde (LPF) and phenol formaldehyde (PF) adhesive in terms of reactivity and mechanical properties referring to testing conditions (temperature, moisture of specimen) were investigated. For this purpose, two resins were manufactured aiming for similar technological resin properties. The reactivity was evaluated by B-time measurements at different temperatures and the development of bonding strength at three different conditions, testing immediately after hot pressing, after applying a cooling phase after hot pressing, or sample conditioning at standard climate. In addition, the moisture stability of the two fully cured resins was examined. The calculated reactivity index demonstrated that LPF requires more energy for curing than PF. Further results indicate that lignin as substituent for phenol in PF resin has a negative impact on its moisture resistance. Additionally, the known thermoplastic behavior of lignin could also be detected in the behavior of the cured resin. This behavior is relevant for the adhesive in use and necessitates a cooling phase before testing the bonding strength development of lignin-based adhesive systems. © 2019 The Authors. Journal of Applied Polymer Science published by Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 48011.     

Environmentally friendly mixed tannin/lignin wood resins

We obtained lignin‐based wood adhesives satisfying the requirements of relevant international standards for the manufacture of wood particleboard. These were based on two different low‐molecular‐mass lignins. These lignin‐based wood adhesives did not use any formaldehyde in their formulation; formaldehyde was substituted with a nonvolatile nontoxic aldehyde, namely, glyoxal. The last formaldehyde present, contributed by a fortifying synthetic phenol–formaldehyde resin, was also eliminated by the substitution of the phenol–formaldehyde resin with a natural, vegetable polyflavonoid tannin extract to which no aldehyde was added. This substitution brought the total content of natural material up to 80 wt % of the total adhesive. The adhesives yielded good internal bond strength results of the panels, enough to pass relevant international standard specifications for interior‐grade panels. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Engineering biomass into formaldehyde‐free phenolic resin for composite materials

The use of formaldehyde to prepare phenol‐formaldehyde (PF) resins is one of the primary challenges for the world‐wide PF industry with respect to both sustainability and human health. This study reports a novel one‐pot synthesis process for phenol‐5‐hydroxymethylfurfural (PHMF) resin as a formaldehyde‐free phenolic resin using phenol and glucose, and the curing of the phenolic resin with a green curing agent organosolv lignin (OL) or Kraft lignin (KL). Evidenced by ¹³C NMR, the curing mechanism involves alkylation reaction between the hydoxyalkyl groups of lignin and the ortho‐ and para‐carbon of PHMF phenolic hydroxyl group. The curing kinetics was studied using differential scanning calorimetry and the kinetic parameters were obtained. The OL/KL cured PHMF resins were tested in terms of thermal stability, and mechanical properties for their applications in fiberglass reinforced composite materials. The results obtained demonstrated that OL/KL can be promising curing agents for the PHMF resins. © 2015 American Institute of Chemical Engineers AIChE J, 61: 1275–1283, 2015     

Commercial lignosulfonates from different sulfite processes as partial phenol replacement in PF resole resins

Four commercial spruce lignosulfonates representing the most common acidic, neutral, and alkaline sulfite pulping processes and varying significantly in molecular weight characteristics were tested as partial (40 wt %) phenol substitute materials for the manufacture of lignosulfonate‐phenol‐formaldehyde (LPF) resole resins. Similar as recently reported for technical lignins from nonsulfite pulping processes (kraft, soda, organosolv), all lignosulfonates of this study effectuated a faster viscosity gain during resole cooking compared to the lignin‐free reference resin (1000 mPa s after 120 min vs. 250 min to reach 1000 mPa s). Sodium lignosulfonate featuring the lowest weight average molecular weight (M_w 5780 g mol^?1) and dispersity (Ð 6.1) turned out to be superior to the other lignosulfonates with regard to curing rate (B‐time; 3:37 min vs. 6:41–9:08 min) and tensile shear strength development under hot pressing (120 °C; T_S,max = 5.64 N mm^?2 after 8 min) for beech veneer strips glued together with the respective LPF resins. Calcium and magnesium lignosulfonates are less suited with regard to phenol replacement due to the poor performance of the respective LPF adhesives in terms of tensile shear strength (T_S,max = 3.29–3.49 N mm^?2 after 12 min) most likely caused by considerable amounts of side products formed in the course of formose‐type reactions. Phenolation of the two promising lignosulfonates, that is, sodium and ammonium lignosulfonate, did neither considerably increase the rate of PF network formation during resin cooking and curing nor improve tensile strength development during hot pressing. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 45893.     

Engineering Plastics from Lignin. IX. Phenolic Resin Synthesis and Characterization

The performance of phenol-formaldehyde (PF) resins, formulated with lignin derivatives previously synthesized as phenolic resin prepolymers, was evaluated by thermal analysis of the curing process, and by a hard maple shear block test. At 54 and 60% phenol replacement levels, respectively, kraft (KL) and steam explosion lignin (SEL)-based resoles exhibited cure behavior very similar to a standard PF resin. Acid hydrolysis lignin gelled prematurely, and was found to be incompatible with the normal synthesis procedure. Differential scanning calorimetry (DSC) was used to compare kinetic parameters for the curing process of neat and lignin derived phenolic resins. Activation energies and cure rates determined by DSC showed no difference between adhesives. High lignin contents had no inhibitory effect on resin cure. Shear strength properties were evaluated in a compression test, and results illustrate that both lignin-based resins have acceptable strength properties, both in a dry and accelerated aging test. Of the lignins tested, kraft lignin consistently demonstrated superior performance as a pre-polymer in phenolic adhesives. This was attributed to differences in the chemical structure of the two lignins, which had been found to vary in terms of their reactivity with formaldehyde and phenol. KL had been noted to be more amenable to derivatization with formaldehyde and phenol, hence its ability to crosslink with a phenol-formaldehyde fraction during resin synthesis was increased. Positive structural features in KL are a high phenolic guaiacyl (3-methoxy, 4-hydroxy phenyl) content, low carbon-to-carbon bonding between aromatic rings, high solubility in alkali, and a higher number average molecular weight than SEL.     

Time–temperature–transformation cure diagrams of phenol–formaldehyde and lignin–phenol–formaldehyde novolac resins

In this study, the time–temperature– transformation (TTT) cure diagrams of the curing processes of several novolac resins were determined. Each diagram corresponded to a mixture of commercial phenol–formaldehyde novolac, lignin–phenol–formaldehyde novolac, and methylolated lignin–phenol–formaldehyde novolac resins with hexamethylenetetramine as a curing agent. Thermomechanical analysis and differential scanning calorimetry techniques were applied to study the resin gelation and the kinetics of the curing process to obtain the isoconversional curves. The temperature at which the material gelled and vitrified [the glass‐transition temperature at the gel point (_gelT_g)], the glass‐transition temperature of the uncured material (without crosslinking; T_g0), and the glass‐transition temperature with full crosslinking were also obtained. On the basis of the measured of conversion degree at gelation, the approximate glass‐transition temperature/conversion relationship, and the thermokinetic results of the curing process of the resins, TTT cure diagrams of the novolac samples were constructed. The TTT diagrams showed that the lignin–novolac and methylolated lignin–novolac resins presented lower T_g0 and _gelT_g values than the commercial resin. The TTT diagram is a suitable tool for understanding novolac resin behavior during the isothermal curing process. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Combination of lignin polyol–tannin adhesives and polyethylenimine for the preparation of green water‐resistant adhesives

In this study, a green adhesive from renewable lignin and tannin was developed with polyethylenimine (PEI) with a method to improve the water resistance of the lignin/tannin adhesive. Lignin polyols were prepared through the liquefaction of oil‐palm empty fruit bunches. The characteristics of the adhesive samples were compared with those of a commercial phenol–formaldehyde resin. Three plywood specimens bonded with the new adhesive showed a very high tensile strength (63.04 MPa) and were very water resistant. The effect of the solid content of the adhesives on the tensile strength and gel time and various weight ratios of PEI on the tensile strength and water resistance of the plywood specimens were evaluated. Thermal stability tests revealed that the lignin polyol–tannin/PEI adhesives had a high heat resistance (360 °C). © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43437.     

Pyrogallol–formaldehyde thermosetting adhesives

A new thermosetting wood adhesive system from pyrogallol has been developed. Pyrogallol can be easily obtained from tara pods (Caesalpinia spinosa) a native leguminosae of low cost widely distributed in Peru. In this work, polymerization of formaldehyde with pyrogallol was carried out at different pH values and optimal conditions were determined to establish the adhesive formulation. The reactivity of this resin was characterized by differential scanning calorimetry (DSC) and the results were compared with those obtained with resins made with tara tannin, gallic acid, and phenol. The results show that tara tannin and gallic acid are less reactive due to the presence of deactivating groups (i.e., carboxylates) in the phenolic moieties while their polymerization is limited to that of a bidimensional network upon curing. In contrast, pyrogallol–formaldehyde kinetic parameters (Ea and ΔH) were determined and they are comparable with those of phenol-formaldehyde adhesives. In addition, mechanical property values (MOR, MOE, and IB) of particleboards prepared with pyrogallol–formaldehyde compare favorably to those of Canadian standard requirements (CSA). Main assets of the new thermosetting adhesive is lower pressing times and temperatures than those currently used in the industry. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 65:399–408, 1997     

Replacing 100% of phenol in phenolic adhesive formulations with lignin

Lignin, produced as a byproduct of pulp and paper and bioethanol industries, is a polyphenolic compound that has excellent potential to be used as phenol replacement in phenolic adhesive formulation. In this study, the phenol portion of phenol formaldehyde (PF) resin has been replaced by an agricultural‐based lignin, which was produced as a byproduct of a cellulosic bioethanol process through dilute‐acid pretreatment and enzymatic hydrolysis from corn stover. The PF resol resin was formulated using isolated lignin under alkaline condition. Chemical, physical, and thermal properties of the isolated lignin, PF resin and adhesive were measured using advanced analytical techniques such as Fourier transformed infrared spectroscopy (FTIR), size exclusion chromatography (SEC), phosphorous nuclear magnetic resonance spectroscopy (³¹P NMR), thermogravimetric analysis (TGA), and differential scanning calorimetry (DSC). The developed 100% lignin‐based adhesive and a commercially formulated phenol resorcinol formaldehyde (PRF, as reference) were used to prepare single‐lap‐joint samples for mechanical testing. The plywood samples were pressed under exactly the same conditions (time, temperature, and pressure) as what recommended for the commercial PRF formulation. According to two‐way ANOVA results, statistically there was no significant difference between the shear strengths of plywood samples made with 100% lignin‐based adhesive and those made with the commercial PRF resin. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 45124.     

木质素酚醛树脂的固化动力学及机理研究

通过差示扫描量热法（Dsc）和红外光谱（IR）分别研究了木质素酚醛树脂（LPF）的固化动力学及机理。DSC分析表明,LPF的固化反应起始温度比酚醛树脂高,终止温度及活化能比酚醛树脂低,因此,LPF凝胶点比酚醛树脂高,贮存稳定性比酚醛树脂好,固化速度比酚醛树脂快;IR分析表明,LPF的固化机理与酚醛树脂相似,都是羟基之间及羟基与芳环上的氢之间的缩合反应。不同的是LPF固化后仍有部分醚键结构。     

木质素酚醛树脂与木材界面反应的研究

通过差示扫描量热法（DSC）和红外光谱（FTIR）分别研究了木质素酚醛树脂（LPF）与木粉的界面反应的动力学和机理。DSC分析表明,LPF与木粉界面反应的特征温度和活化能均明显低于酚醛树脂（PF）与木粉的界面反应;FTIR分析表明,LPF与木粉界面反应的机理为羟基之间的缩合以及羟基与芳环上氢原子之间的缩合反应,和PF与木粉界面反应机理相似。     

Influence of acrylamide copolymerization of urea–formaldehyde resin adhesives to their chemical structure and performance

To lower the formaldehyde emission of wood‐based composite panels bonded with urea–formaldehyde (UF) resin adhesive, this study investigated the influence of acrylamide copolymerization of UF resin adhesives to their chemical structure and performance such as formaldehyde emission, adhesion strength, and mechanical properties of plywood. The acrylamide‐copolymerized UF resin adhesives dramatically reduced the formaldehyde emission of plywood. The ¹³C‐NMR spectra indicated that the acrylamide has been copolymerized by reacting with either methylene glycol remained or methylol group of UF resin, which subsequently contributed in lowering the formaldehyde emission. In addition, an optimum level for the acrylamide for the copolymerization of UF resin adhesives was determined as 1%, when the formaldehyde emission and adhesion strength of plywood were taken into consideration. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Wood–phenol adhesives prepared from carboxymethylated wood. I

Preparation of carboxymethylated wood (CM wood)–phenol resin adhesives has been attempted by two methods, “kneading method” and “solvolysis method,” and their adhesion strength has been studied. The two preparation methods differ in the dissolution step. In the case of the kneading method, CM wood was dissolved in aqueous phenol by kneading at 100–120°C under shear, whereas, in the case of the solvolysis method, the dissolution was facilitated by phenolysis at 80°C in the presence of appropriate amounts of hydrochloric acid. The wood-based adhesive prepared by the solvolysis method revealed excellent and enhanced applicability compared with that of the adhesive prepared by the kneading method, although the latter can be used as an adhesive for wood. Adhesion strength of these adhesives was enhanced when poorly substituted CM wood and appropriate amounts of formaldehyde were used in the resin preparation. A crosslinking agent for carboxymethyl cellulose, that is, polymeric MDI, was also added just before application. The water-proof adhesion strength was higher than the JIS specification for phenol resin adhesives for this modification.     

Polyamine-modified urea–formaldehyde-bonded wood joints. III. Fracture toughness and cyclic stress and hydrolysis resistance

The objective of this study was to improve the durability and stability of urea–formaldehyde-bonded wood products by decreasing the internal stress developed during the resin cure and by improving the ability of the cured system to withstand cyclic stresses. Urea–formaldehyde resins were modified either by incorporating urea-capped di-and trifunctional amines into the resin structure or by using the hydrochloride derivatives of some of these amines as the curing agent, or by both methods. This study supplements our previous work by examining the effects of additional amines and subjecting bonded products to additional testing. Solid wood joints bonded with a variety (7 of 15) of modified adhesives had resistance to cyclic stress superior compared to that of joints bonded with unmodified urea–formaldehyde adhesive; at least three of the modified adhesives approached the behavior of phenol–formaldehyde-bonded joints. Resistance to moist heat aging, although still inferior to that of phenol–formaldehyde-bonded joints, was significantly improved for joints bonded with modified adhesives over joints made with unmodified resins. The fracture behavior of joints made with modified adhesives was different from that of joints made with unmodified resins. The fracture energy was greater for joints made with three of four modified adhesives than for joints made with unmodified resins. Modified adhesives produced particleboards made with enhanced cyclic stress resistance. Formaldehyde emission from particleboards made with resins modified with urea-terminated amines was less than emission from boards made with unmodified resins. However, emissions from particleboards made with amine hydrochlorides were not improved compared to those from boards made with an ammonium chloride curing agent. © 1993 John Wiley & Sons, Inc.

1 This article is a US Government work and, as such, is in the public domain in the United States of America.

     

Reduction of Formaldehyde Emission from Particleboard by Phenolated Kraft Lignin

The aim of this study was the reduction of formaldehyde emission from particleboard by phenolated Kraft lignin. For this purpose, the lignin was extracted from black liquor and then modified by phenolation. During the urea formaldehyde (UF) resin synthesis different proportions of unmodified and phenolated Kraft lignins (10%, 15%, and 20%) were added at pH = 7 instead of the second urea. Physicochemical properties and structural changes of resins so prepared, as well as the internal bond (IB) strength and formaldehyde emission associated with the panels bonded with them were measured according to standard methods. The Fourier transform infrared (FTIR) analysis of lignin indicated that the content of O–H bonds increased in phenolated lignin while the aliphatic ethers C–O bonds decreased markedly in the modified lignin. Since both synthesis of UF resins and lignin phenolation are carried out under acid conditions, phenolation is an interesting way of modifying lignin for use in wood adhesive. The panels bonded with these resins showed significantly lower formaldehyde emission compared to commercial UF adhesives. The UF resin with 20% phenolated lignin exhibited less formaldehyde release without significant differences in internal bond strength and physicochemical properties compared to an unmodified UF resin. XRD analysis results indicated that addition of phenolated lignin decreased the crystallinity of the hardened UF resins.     

Use of a methylolated softwood ammonium lignosulfonate as partial substitute of phenol in resol resins manufacture

The synthesis of lignin‐phenol‐formaldehyde (LPF) was studied to determine its optimum operating conditions. The lignin proposed as phenol substitute has been the softwood ammonium lignosulfonate. The resin synthesis was optimized by varying the methylolated lignosulfonate content, 18–52%; the sodium hydroxide to phenol‐modified lignosulfonate molar ratio, 0.3–0.94; and the formaldehyde to phenol‐modified lignosulfonate molar ratio, 1.1–3.5. The parameters employed in the characterization of LPF resins were free phenol, free formaldehyde, gel time, alkaline number, viscosity, pH, solid content, and chemical structure changes. The properties of LPF resin comply with the requirements for its utilization in plywood manufacture. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 643–650, 2004