共查询到18条相似文献,搜索用时 312 毫秒
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光亮镀铜层产生麻点是酸性镀铜工艺中常见故障之一。综述了镀前处理不当,预镀层质量不好,光亮剂过多,润滑剂不足和添加剂间的兼容性等是产生麻点的原因。通过两个生产实践的实例,详细分析了酸性光亮镀铜镀层产生麻点的原因及排除故障方法。 相似文献
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酸性光亮镀铜添加剂的作用及控制 总被引:2,自引:0,他引:2
1 前言 1963年美国研究开发了全光亮镀铜工艺后,各国电镀技术人员对酸性光亮镀铜添加剂进行了研究.我国在1978年成功开发了N、M型宽温度全光亮整平酸性光亮镀铜工艺.该工艺比普通酸性镀铜有显著优点:(1)镀层全光亮、整平性好,可省去抛光,降低生产成本. 相似文献
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印制电路板酸性镀铜光亮剂 总被引:4,自引:1,他引:3
前言在生产印制电路板(即PCB)之前,酸性镀铜溶液就已经得到了应用,其延展性令人满意,但它的分散能力比较差。多少年来,人们试图使用有机添加剂来改善镀液性能,开始添加单宁酸、间苯二酚、明胶、酚磺酸、糊精、尿素、蛋白胨,镀层结晶虽然比原先光滑、细小,但外观不亮;四十年代发现硫脲及其衍生物,可获得半光亮镀层.五十年代采用有机聚硫化合物,大分子染料和含巯基的化合物作为光亮剂.六、七十年代合成了大量新型化合物作为镀液添加剂。一种新型的高分散能力光亮硫酸盐镀铜溶液问世,促使酸性光 相似文献
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钢铁件酸性镀铜前的预镀工艺研究 总被引:2,自引:0,他引:2
实验研究了钢铁件酸性镀铜前的预镀工艺,确定了硫脲浸铜工艺,讨论了工艺中各成分及含量对镀层结合力的影响,得到了硫脲浸铜工艺的成分及最佳含量,硫酸铜10—12g/L、硫酸75—100m/L、硫脲0.2—0.3g/L、添加剂8—10mL/L.由此工艺预浸后,再进行酸性镀铜,得到的镀层结合力良好。 相似文献
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简介了银合金基体镀金的工艺流程、配方及工艺要点。氰化物预镀铜打底用以提高镀层与基体结合力,酸性光亮镀铜提高产品亮度;光亮镍镀层做防扩散层;酸性镀金代替碱性镀金可以提高金镀层的硬度和耐磨性。 相似文献
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以75 g/L CuSO4·5H2O、230 g/L硫酸和0.1 g/L十二烷基苯磺酸钠(SDBS)组成的溶液作为基础镀液,并以Cl-、聚乙二醇(PEG-10000)、聚二硫二丙烷磺酸钠(SPS)及2,2′-二硫代二吡啶(2-PDS)作为添加剂,在温度(23±2)℃、电流密度1.8 A/dm2和空气搅拌的条件下对印制电路板(PCB)上深径比为10∶1的通孔电镀铜。以深镀能力作为评价指标,通过正交试验对添加剂用量进行优化,得到较优的组合为:SPS 5 mg/L,PEG 250 mg/L,Cl- 60 mg/L,2-PDS 2 mg/L。采用该组合添加剂电镀通孔时,深镀能力高达112.9%,镀层均匀、细致、平整,抗热冲击性能良好,符合PCB生产对可靠性的要求。 相似文献
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采用脉冲电镀法在碳纤维表面镀铜,研究了硫酸铜、硫酸、添加剂、施镀时间、电流密度、占空比等因素的影响,确定了合适的镀液成分和电镀工艺. 采用冷热循环法检测镀层与碳纤维的结合力,采用SEM和XRD考察了铜镀层质量. 结果表明,以130 g/L CuSO4×5H2O, g/L H2SO4 50, 30 g/L KNO3及6 mL/L光亮剂为镀液、室温下电流密度82 mA/mm2、占空比40%、施镀时间6 min为电镀条件,可在碳纤维表面得到表面平整细致、结晶度良好的铜镀层. 镀层结合力由原来的270 kPa提高到450 kPa. 相似文献
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《Ceramics International》2019,45(16):19658-19668
This study presents high thermal conductivity (TC) Cu-diamond composites synthesized by electrodeposition and the critical effects of two kinds of competitive additives (DVF-B, accelerator, DVF-C, inhibitor) on electroplating void-free Cu matrix diamond composites. The surface and internal microstructures of the composites synthesized with different plating time are investigated, which show the critical effects of additives. Well-combined diamond/copper interfaces are promoted and void-free Cu-diamond composites are obtained, leading to the improved TC of 614.87 W/m K. The effects of DVF-B and DVF-C on microstructure, crystallization, interfacial combination of the composite materials are detailed investigated. Interestingly, DVF-B tends to promote copper fully filling in small and micro intervals formed by diamond particles, while DVF-C prefers to restrain copper deposition in large intervals and leveling copper nodules. Thus, voids/gaps and nodules are eliminated in Cu-diamond composites, leading to the well-combined interface and high TC. The concentrations of additive system are recommended as DVF-B of larger than 5 ml/L with DVF-C from 5 ml/L to 14 ml/L. This work utilizes the competitive additives for electroplating void-free copper matrix - diamond composites, which may solve the limitation of high TC Cu-diamond composites in microelectronic industry. 相似文献
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V.M. Dubin R. Akolkar C.C. Cheng R. Chebiam A. Fajardo F. Gstrein 《Electrochimica acta》2007,52(8):2891-2897
Various technical issues related to feature scaling and recent electrochemical technologies advances for on-chip copper interconnects at Intel are reviewed. Effects of additives on electroplating, as well as performance of novel Cu direct plating on ruthenium liner are discussed. An electroless cobalt capping layer of Cu lines, which led to increased electromigration resistance, has been characterized. The potential application of carbon nanotubes as future interconnects materials, their properties and controlled placement by using dielectrophoresis are also reviewed. 相似文献
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电镀废水处理技术研究现状及趋势 总被引:3,自引:0,他引:3
分析了电镀废水的来源、特点和危害,介绍了当前常用的电镀废水处理技术,同时对螯合沉淀法和天然矿物污水处理剂在电镀废水治理方面的应用进行简单说明,并结合新的排放标准对电镀废水处理技术的发展趋势进行了展望. 相似文献
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The effect of indole, IN, and 5-chloroindole, Cl-IN, on the anodic dissolution of copper in acidic sodium chloride solutions was studied using voltammetry on a rotating disc electrode (RDE). Both compounds used at 10–3 M concentration act as strong inhibitors on the copper dissolution, but indole exhibits better inhibiting properties. The inhibitory action substantially increases with decreasing solution pH. The influence of these organic additives on the electrodeposition of copper on platinum was also investigated using RDE and electrochemical quartz crystal microbalance (EQCM) techniques. The EQCM measurements show that a sparingly soluble layer of the inhibitor is responsible for the protective effects observed in chloride solutions. 相似文献