The flame retardant group‐synergistic‐effect of a phosphaphenanthrene and triazine double‐group compound in epoxy resin

A flame retardant tri‐(phosphaphenanthrene‐(hydroxyl‐methylene)‐phenoxyl)‐1, 3, 5‐triazine (Trif‐DOPO) and its control samples are incorporated into diglycidyl ether of bisphenol‐A (DGEBA) and 4, 4′‐diamino‐diphenyl sulfone (DDS) to prepare flame retardant thermosets, respectively. According to the results of limited oxygen index (LOI), UL94 vertical burning test and cone calorimeter test, the Trif‐DOPO/DGEBA/DDS thermoset with 1.2 wt % phosphorus possesses the LOI value of 36% and UL94 V‐0 flammability rating, and Trif‐DOPO can decrease the peak of heat release rate (pk‐HRR) and reduce the total heat release (THR) of thermosets. All these prove better flame retardant performance of Trif‐DOPO than that of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide(DOPO). The residue photos of thermosets after cone calorimetry test disclose that Trif‐DOPO can promote the formation of thick and tough melting char layer for combined action of the flame retardant groups of Trif‐DOPO. The results from thermo gravimetric analysis (TGA) and pyrolysis‐gas chromatography‐mass spectrometry(Py‐GC/MS) show that the groups in Trif‐DOPO can be decomposed and produce PO₂ fragments, phosphaphenanthrene and phenoxy fragments, which can jointly quench the free radical chain reaction during combustion. Therefore, the excellent flame retardancy of Trif‐DOPO is attributed to its flame retardant group‐synergic‐effect. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 39709.     

High performance modification of hyperbranched polyborate on diglycidyl ether of bisphenol‐a resin

High performance epoxy resin was obtained by introducing hyperbranched polyborate (HBPB) into diglycidyl ether of bisphenol A (DGEBA) resin to overcome the defects such as low char yield and poor toughness of DGEBA resin. By virtue of the massive functional end groups, hyperbranched and rigid boron‐containing structures of HBPB, the thermal resistance of DGEBA resin cured with diamino diphenyl sulfone (DDS) can be greatly improved. Moreover, with the toughening effect of hyperbranched structures of HBPB, the mechanical properties such as flexural strength and interlaminar shear strength of the carbon fiber reinforced DGEBA‐DDS composite could be greatly increased by HBPB without a decrease on modulus and glass transition temperature of DGEBA‐DDS resin. POLYM. COMPOS. 36:424–432, 2015. © 2014 Society of Plastics Engineers     

Synergistic barrier flame‐retardant effect of aluminium poly‐hexamethylenephosphinate and bisphenol‐A bis(diphenyl phosphate) in epoxy resin

Two flame retardants, aluminium poly‐hexamethylenephosphinate (APHP) and bisphenol‐A bis(diphenyl phosphate) (BDP), were incorporated into diglycidyl ether of bisphenol A (DGEBA) thermoset with 4,4′‐diaminodiphenyl sulfone (DDS) as curing agent, and then the synergistic flame‐retardant behaviors of the cured thermosets were investigated. Compared with thermosets containing 10 wt% APHP and 10 wt% BDP alone, the sample with 3.3 wt% APHP and 6.7 wt% BDP (3.3%APHP/6.7%BDP/EP; EP is DGEBA/DDS) possessed a better flame‐retardant effect since its limited oxygen index reached 35.0% and in the UL94 test it passed the V‐0 rating. The cone calorimeter test revealed that the 3.3%APHP/6.7%BDP/EP sample generated less gaseous fragments and more smoke particles instead of fuels and verified that APHP and BDP exhibited an outstanding synergistic effect on the barrier effect. Macroscopic digital photos and micrographs from scanning electron microscopy further disclose that BDP facilitated the formation of a flexible film covering holes in the residue. The flexible film was combined with aluminium phosphate particles which were produced by decomposed APHP, thereby forming a char layer with increased barrier effect. The synergistic barrier effect from APHP and BDP imposed a better flame‐retardant performance for epoxy thermosets. © 2017 Society of Chemical Industry     

A simple imide compound as a curing agent for epoxy resin. I. Synthesis and properties

A simple imide compound, 4‐amino‐phthalimide (APH), was synthesized as a curing agent for epoxy resin. APH was prepared from the hydration of 4‐nitro‐phthalimide, which was prepared from the nitration of phthalimide. The chemical structure of APH was verified by IR and ¹H‐NMR spectra. The thermal properties and dielectric constant (ε) of a phosphorus‐containing novolac epoxy resin cured by APH were determined and compared with those of epoxy resins cured by either 4,4′‐diamino diphenyl methane (DDM) or 4,4′‐diamino diphenyl sulfone (DDS). The results indicate that the epoxy resin cured by APH showed better thermal stability and a lower ε than the polymer cured by either DDM or DDS. This was due to the introduction of the imide group of APH into the polymer structure. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Properties and behavior of CTBN‐modified epoxy with IPN structure

CTBN‐modified epoxy resins (CMEs) with an interpenetrating‐network (IPN) structure and a nanometer‐sized morphology were prepared. Two systems of CMEs, called CNE/DDS/I‐CTBN‐B and CNE/DDS/I‐CTBN‐D, with IPN structures, were synthesized by heat‐curing a homogeneous resin, CNE/DDS/CTBN/2‐MI, obtained by mixing a carboxyl‐terminated butadiene–acrylonitrile liquid rubber (CTBN) with a solution of polyglycidyl ether of o‐cresol‐formaldehyde novolac (CNE), 4,4′‐diamino diphenyl sulfone (DDS), and 2‐methyl imidazole (2‐MI), in the presence of benzoyl peroxide and dicumyl peroxide, respectively. The IPN morphologies of the two systems of CMEs were identified by small‐angle X‐ray scattering by measuring the value of the specific interfacial surface area S_sp between the cured CNE/DDS matrix and the vulcanized CTBN. Properties such as fracture toughness, internal stress, and thermal and dynamic mechanical properties of these IPN‐structured CMEs were studied in detail, and were compared with those of a conventional CME, CNE/DDS/CTBN, obtained by dispersing CTBN particles in a crosslinked CNE/DDS matrix. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Synthesis and performance of a novel nitrogen‐containing cyclic phosphate for intumescent flame retardant and its application in epoxy resin

A novel nitrogen‐containing cyclic phosphate (NDP) was synthesized and well characterized by ¹H, ¹³C, ³¹P NMR, mass spectra and elemental analysis. NDP was used as an additive intumescent flame retardant (AIFR) to impart flame retardancy and dripping resistance for diglycidyl ether of bisphenol‐A epoxy resin (DGEBA) curied by 4,4′‐diaminodiphenylsulfone (DDS) with different phosphorus content. The flammability, thermal stability, and mechanical properties of NDP modified DGEBA/DDS thermosets were investigated by UL‐94 vertical burning test, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and Izod impact strength and flexural property tests. The results showed that NDP modified DGEBA/DDS thermosets exhibited excellent flame retardancy, moderate changes in glass transition temperature and thermal stability. When the phosphorus content reached only 1.5 wt %, the NDP modified DGEBA/DDS thermoset could result in satisfied flame retardancy (UL‐94, V‐0). The TGA curves under nitrogen and air atmosphere suggested that NDP had good ability of char formation, and there existed a distinct synergistic effect between phosphorus and nitrogen. The flame retardant mechanism was further realized by studying the structure and morphology of char residues using FT‐IR and scanning electron microscopy (SEM). It indicated that NDP as phosphorus‐nitrogen containing flame retardant worked by both of the condensed phase action and the vapor phase action. Additionally, the addition of NDP decreased slightly the flexural strength of the flame retarded DGEBA epoxy resins, and increased the Izod impact strength of these thermosets. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41859.     

Structure‐property relationship in polyaniline‐filled castor oil based chain extended polyurethanes

A series of polyaniline (Pani)‐filled chain extended polyurethanes (PUs) were prepared by condensation polymerization of castor oil with methylene diisocyanate (MDI) as crosslinker and diamino diphenyl sulfone (DDS) as chain extender. The effect of different amounts of Pani (varying from 5% to 25%) on the chain extended PUs has been reported. The Pani‐filled chain extended PU sheets were characterized by their physico‐mechanical properties such as density, tensile strength, percentage elongation at break and surface hardness. Electrical properties, such as volume and surface conductivity, also have been reported. These results are corroborated with microcrystalline parameters of PU/Pani estimated using wide angle X‐ray scattering (WAXS). Polym. Eng. Sci. 44:772–778, 2004. © 2004 Society of Plastics Engineers.     

Tertiary‐amine‐free,non‐planar,sulfone‐containing,tetrafunctional epoxy and its application as a high temperature matrix

Non‐amine‐derived tetrafunctional epoxies have several advantages over the amine‐derived N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenyl methane (TGDDM) in high temperature applications. Although two non‐amine‐derived tetrafunctional epoxies were developed in our laboratory, further improvements in toughness using less loading amount is still desirable. Thus, a tertiary‐amine‐free, non‐planar and triphenylmethane‐containing tetrafunctional epoxy (STFE) with a sulfone spacer was synthesized. When it was mixed with diglycidyl ether of bisphenol A (DGEBA) and cured with 4,4′‐diaminodiphenylsulfone (DDS), both thermal and mechanical performances outperformed TGDDM. Moreover, STFE modified system shows the highest toughness (35.7 kJ m^–2) among three amine‐free and triphenylmethane‐containing epoxies at merely 5 wt% loading. Molecular simulation and thermomechanical analysis results suggest that the improved mechanical properties could be related to the geometry of the molecule and larger free volume. Despite a marginal drop in T_g, the thermal degradation temperature is better than that of TGDDM/DDS. In addition, the moisture resistance of STFE/DGEBA/DDS is much better than that of TGDDM/DDS. Thus, STFE modified DGEBA could be a potential replacement for TGDDM in some high temperature applications. © 2020 Society of Chemical Industry     

Preparation and properties of high performance phthalide‐containing bismaleimide modified epoxy matrices

A series of intercrosslinked networks formed by diglycidyl ether of bisphenol A epoxy resin (DGEBA) and novel bismaleimide containing phthalide cardo structure (BMIPP), with 4,4′‐diamino diphenyl sulfone (DDS) as hardener, have been investigated in detail. The curing behavior, thermal, mechanical and physical properties and compatibility of the blends were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), notched Izod impact test, scanning electron microscopy (SEM) and water absorption test. DSC investigations showed that the exothermic transition temperature (T_p) of the blend systems shifted slightly to the higher temperature with increasing BMIPP content and there appeared a shoulder on the high‐temperature side of the exothermic peak when BMIPP content was above 15 wt %. TGA and DMA results indicated that the introduction of BMIPP into epoxy resin improved the thermal stability and the storage modulus (G′) in the glassy region while glass transition temperature (T_g) decreased. Compared with the unmodified epoxy resin, there was a moderate increase in the fracture toughness for modified resins and the blend containing 5 wt % of BMIPP had the maximum of impact strength. SEM suggested the formation of homogeneous networks and rougher fracture surface with an increase in BMIPP content. In addition, the equilibrium water uptake of the modified resins was reduced as BMIPP content increased. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Novel dibutyltin oxide–tributyl phosphate condensate as accelerator for the curing of the epoxy resin/4,4′‐diamino diphenyl sulfone system. I. Chemical reactions and properties of the cured resin

A crystalline condensate of dibutyltin oxide and tributyl phosphate (Sn‐P‐c) was more effective than the stannous octoate and dibutyltin dilaurate in accelerating the curing of the epoxy resin/4,4′‐diamino diphenyl sulfone (DDS) system, based on an equal tin concentration. Water took part in the reaction and played an important role in the morphology and mechanical properties of the cured resin when Sn‐P‐c was used as the accelerator. In the presence of Sn‐P‐c, water first reacted with glycidyl ether to yield glycerol ether; the yielded hydroxyl group may further catalyze the amino/epoxy group reaction. In the absence of water or polar hydroxyl additives, Sn‐P‐c did not completely dissolve in the resin systems, and the cured resin was translucent material with poor mechanical strength. In the presence of a small amount of water, the cured material became transparent. Both flexural strength and maximum deflection were increased greatly. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 1229–1236, 2001     

PHASE-SEPARATION BEHAVIOR IN POLY(ETHER IMIDE)-MODIFIED EPOXY BLENDS

Phase-separation behavior of aromatic amine-cured diglycidyl ether of bisphenol-A (DGEBA) epoxy oligomer and poly(ether imide) (PEI) engineering thermoplastic-modifier mixtures was investigated by means of small-angle light scattering (SALS) and optical microscopy. The starting reactant mixtures comprising epoxy, PEI, and the curing agents, namely diamino diphenyl sulfone (DDS) and methylene dianiline (MDA), were found to be single phase. During curing, phase separation occurred in the epoxy/PEI/DDS system, whereas no phase separation took place in MDA-cured epoxy/PEI blends. The difference between the two systems has been attributed to thermodynamic and kinetic aspects of cure reaction in thermoplastic-modified thermosetting (TMT) polymeric blends. Spinodal decomposition as characterized by an increase of scattered intensity, shift of the peak angle to a smaller scattering angle, and development of a regularly phase-separated structure followed by coarsening was found to be the dominant mechanism of reaction-induced phase separation in DDS-cured epoxy/PEI blend compositions.     

Preparation and properties of MWCNTs/poly(acrylonitrile‐ styrene‐butadiene)/epoxy hybrid composites

Poly(acrylonitrile‐styrene‐butadiene) (ABS) was used to modify diglycidyl ether of bisphenol‐A (DGEBA) type epoxy resin, and the modified epoxy resin was used as the matrix for making multiwaled carbon tubes (MWCNTs) reinforced composites and were cured with diamino diphenyl sulfone (DDS) for better mechanical and thermal properties. The samples were characterized by using infrared spectroscopy, pressure volume temperature analyzer (PVT), thermogravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermo mechanical analyzer (TMA), universal testing machine (UTM), and scanning electron microscopy (SEM). Infrared spectroscopy was employed to follow the curing progress in epoxy blend and hybrid composites by determining the decrease of the band intensity due to the epoxide groups. Thermal and dimensional stability was not much affected by the addition of MWCNTs. The hybrid composite induces a significant increase in both impact strength (45%) and fracture toughness (56%) of the epoxy matrix. Field emission scanning electron micrographs (FESEM) of fractured surfaces were examined to understand the toughening mechanism. FESEM micrographs reveal a synergetic effect of both ABS and MWCNTs on the toughness of brittle epoxy matrix. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Cure kinetics of ternary blends of epoxy resins studied by nonisothermal DSC data

The curing kinetics of blends of diglycidyl ether of bisphenol A (DGEBA), cycloaliphatic epoxy resins, and carboxyl‐terminated butadiene‐acrylonitrile random copolymer (CTBN) in presence of 4,4′‐diamino diphenyl sulfone (DDS) as the curing agent was studied by nonisothermal differential scanning calorimetry (DSC) technique at different heating rates. The kinetic parameters of the curing process were determined by isoconversional method given by Malek for the kinetic analysis of the data obtained by the thermal treatment. A two‐parameter (m, n) autocatalytic model (Sestak‐Berggren equation) was found to be the most adequate selected to describe the cure kinetics of the studied epoxy resins. The values of E_a were found to be 88.6 kJ mol^?1 and 61.6 kJ mol^?1, respectively, for the studied two sample series. Nonisothermal DSC curves obtained using the experimental data show a good agreement with that theoretically calculated. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Disecondary amine synthesis and its reaction kinetics with epoxy prepolymers

3,3′‐Diaminodiphenyl sulfone (3,3′‐DDS) was reacted with acetaldehyde in the presence of sodium triacetoxy borohydride via reductive amination to yield a 3,3′‐DDS based secondary diamine, N,N′‐diethyl‐3,3′‐diaminodiphenyl sulfone. Near IR analysis indicated that the 5060 cm^?1 peak for primary amine (? NH₂) in 3,3′‐DDS was absent in the reaction product spectrum. The ? NH₂ proton peak at δ 5.66 ppm shifted to δ 6.16 ppm in the product. Methyl and methylene protons of CH₃? CH₂? NH? Ph? group were observed at δ 3.01 and 1.12 ppm, respectively, in the product. The carbon NMR spectrum of the reaction product showed new peaks at δ 37.46 and 14.47 ppm that further confirmed secondary amine formation. The liquid chromatography coupled mass spectra peaks at 248–250 for 3,3′‐DDS and 304 for the reaction product further supported the formation of N,N′‐diethyl‐3,3′‐diaminodiphenyl sulfone. A blend of N,N′‐diethyl‐3,3′‐diaminodiphenyl sulfone with diglycidyl ether of bisphenol‐A (DGEBA) epoxy prepolymer started reacting at about 110–125°C surpassing an energy barrier of ～ 66 kJ/mol as determined via differential scanning calorimetry analysis. Reaction kinetics were characterized via near IR spectroscopy specific to the reaction between secondary amine and DGEBA epoxy prepolymer. The results confirmed >97% conversion at a cure protocol of 5 h at 80°C, 5 h at 100°C, 11 h at 125°C, and 6 h at 185°C. N,N′‐diethyl‐3,3′‐diaminodiphenyl sulfone‐DGEBA thermoplastics displayed tensile and flexural modulii of 3.08 and 2.86 GPa, respectively, and glass transition temperature (T_g) of 120.77°C. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Effect of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide on liquid oxygen compatibility of bisphenol a epoxy resin

In this study, bisphenol A epoxy resin (DGEBA) was chemically modified by 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide (DOPO), and the molecular structure of the modified epoxy resin was characterized by Fourier transform infrared spectra. The effects of DOPO on liquid oxygen compatibility of DGEBA were calculated using mechanical impact method. The results indicated that epoxy resin (EP‐P1)/4,4‐diaminobisphenol sulfone (DDS) was compatible with liquid oxygen. When compared with EP/DDS, differential scanning calorimetry and thermogravimetry analyses showed that EP‐P1/DDS and EP‐P2/DDS had much higher glass transition temperatures and char yield. X‐ray photoelectron spectroscopic analysis suggested that phosphorus atoms on the surface of EP‐P1/DDS and EP‐P2/DDS could act in the solid phase to restrain the incompatible reaction, which was in accordance with the flame‐retardant mechanism of phosphorus‐containing compounds. The compatibility mechanism of EP‐P1/DDS was further proposed. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40848.     

Poly(Amide‐Imide)s Based on Amino‐Terminated Oligoimides

Abstract

An amino‐terminated oligoimide was prepared by the Michael addition reaction of ethylene bis‐maleimide (EBM) and 4,4′‐diamnio diphenyl‐sulfone (DDS) at an EBM:DDS molar ratio of 1:2. The poly(amide‐imide)s (PAI)s were prepared by condensation of this EBMDDS oligoimide with various aliphatic bisesters. The resultant PAIs were characterized by elemental analysis, IR spectral studies, and the number average molecular weight estimated by non‐aqueous conductometric titration and thermogravimetry. The curing reaction of an epoxy resin [a diglycidyl ether of bis‐phenol‐A (DGEBA)] with PAIs was monitored by differential scanning calorimetry (DSC). Glass‐ and carbon‐reinforced laminates of PAI‐epoxy resin were also prepared and characterized.     

Curing and thermal behavior of diglycidyl ether of bisphenol A in the presence of a mixture of amines

The curing behavior of diglycidyl ether of bisphenol A (DGEBA) was investigated by differential scanning calorimetry with mixtures of silicon‐containing amide–amines and diaminodiphenyl sulfone (DDS). Silicon‐containing amide–amines were prepared by the reaction of 2.5 mol of 4,4′‐diaminodiphenyl ether (E), 4,4′‐diaminodiphenyl methane (M), 3,3′‐diaminodiphenyl sulfone (mS), 4,4′‐diaminodiphenyl sulfone (pS), bis(3‐aminophenyl) methyl phosphine oxide (B), or tris(3‐aminophenyl) phosphine oxide (T) with 1 mol of bis(4‐chlorobenzoyl) dimethyl silane. Mixtures of the amide–amines and DDS at ratios of 0:1, 0.25:0.75, 0.5:0.5, 0.75:0.25, and 1:0 were used to investigate the curing behavior of DGEBA. A single exotherm was observed on curing with a mixture of amide–amine and DDS. This clearly shows that the mixture participated in the cocuring reaction. The peak exotherm temperature depended on the structure and the molar ratio of amide–amines. With all of the amide–amines and DDS, a significant decrease in the kick‐off temperature of the curing exotherm was observed on the incorporation of a 0.25 molar fraction of amide–amines. Thus, with the mixture, the curing temperatures were reduced and were lowest for ether‐containing amide‐amines and highest for methylene‐containing amide–amines. The char yield was almost similar in the samples cured with amide–amines (E, pS, or mS) or DDS. The char yield was higher than for either of the constituents when a mixture was used. A synergistic behavior was observed when a mixture of E, M, mS, or pS and DDS was used, whereas mixture of B or T and DDS showed antigonism in the char yield. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 1739–1747, 2003     

Curing of epoxy resin using imide‐amines

The curing behavior of diglycidyl ether of bisphenol‐A (DGEBA) was investigated by differential scanning calorimetry, using varying molar ratios of imide‐amines and 4,4′‐diaminodiphenyl sulfone (DDS). The imide‐amines were prepared by reacting 1 mol of pyromellitic dianhydride (P) with excess (2.5 mol) of 4,4′‐diaminodiphenyl ether (E), 4,4′‐diaminodiphenyl methane (M), or 4,4′‐diaminodiphenyl sulfone (S) and designated as PE, PM, PS. Structural characterization was done using FTIR, ¹H NMR, ¹³C NMR spectroscopic techniques and elemental analysis. The mixture of imide‐amines and DDS at ratio of 0 : 1, 0.25 : 0.75, 0.5 : 0.5, 0.75 : 0.25, and 1 : 0 were used to investigate the curing behavior of DGEBA. The multiple heating rate method (5, 10, 15, and 20°C/min) was used to study the curing kinetics of epoxy resins. The peak exotherm temperature was found to be dependent on the heating rate, structure of imide‐amine, and also on the ratio of imide‐amine : DDS used. Activation energy was highest in case of epoxy cured using a mixture of DDS : imide‐amine of a ratio of 0.75 : 0.25. Thermal stability of the isothermally cured resins was also evaluated in a nitrogen atmosphere using dynamic thermogravimetry. The char yield was highest in case of resins cured using mixture of DDS : PS (0.25 : 0.75; EPS‐3), DDS : PM (0.25 : 0.75; EPM‐3), and DDS : PE (0.75 : 0.25; EPE‐1). © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 3502–3510, 2006     

Novel adamantane‐containing epoxy resin

A novel adamantane‐containing epoxy resin diglycidyl ether of bisphenol‐adamantane (DGEBAda) was successfully synthesized from 1,3‐bis(4‐hydroxyphenyl)adamantane by a one‐step method. The proposed structure of the epoxy resin was confirmed with Fourier transform infrared, ¹H‐NMR, gel permeation chromatography, and epoxy equivalent weight titration. The synthesized adamantane‐containing epoxy resin was cured with 4,4′‐diaminodiphenyl sulfone (DDS) and dicyandiamide (DICY). The thermal properties of the DDS‐cured epoxy were investigated with differential scanning calorimetry and thermogravimetric analysis (TGA). The dielectric properties of the DICY‐cured epoxy were determined from its dielectric spectrum. The obtained results were compared with those of commercially available diglycidyl ether of bisphenol A (DGEBA), a tetramethyl biphenol (TMBP)/epoxy system, and some other associated epoxy resins. According to the measured values, the glass‐transition temperature of the DGEBAda/DDS system (223°C) was higher than that of the DGEBA/DDS system and close to that of the TMBP/DDS system. TGA results showed that the DGEBAda/DDS system had a higher char yield (25.02%) and integral procedure decomposition temperature (850.7°C); however, the 5 wt % degradation temperature was lower than that of DDS‐cured DGEBA and TMBP. Moreover, DGEBAda/DDS had reduced moisture absorption and lower dielectric properties. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Thermal,mechanical, and dielectric studies on the DGEBA epoxy blends by using liquid oxidized poly(1,2‐butadiene) as a reactive component

Liquid oxidized poly(1,2‐butadiene) (LOPB) with multi epoxy groups is synthesized to modify diglycidyl end‐caped poly(bisphenol A‐co‐epichlorohydrin) (DGEBA) cured by 4,4′‐diaminodiphenyl sulfone (DDS). FTIR spectra shows that DGEBA and LOPB can be effectively cured by DDS, and the epoxide rubber particles are evenly distributed in the composites till their addition up to 20 wt % of DGEBA as seen from the scanning electron microscope (SEM). Their decomposition temperatures (Td) increase with the increase in LOPB addition at around 10 wt % of DGEBA while the Td for the composite containing 20 wt % LOPB of DGEBA is lower than that of the neat epoxy. The addition of LOPB improves their storage moduli and especially these values at temperatures higher above 150 °C; all the composites exhibit higher glass transition temperature (T_g) than that of the neat epoxy, and the maximum T_g reaches up to 255 °C for the composite containing 15 wt % LOPB of DGEBA. The incorporation of LOPB effectively decreases their dielectric constants and the composite with 10 wt % LOPB of DGEBA possesses the lowest one. The synergic improvements in their various properties are attributed to the networks formation via covalent linkage between the two phases in these reactive blends. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017 , 134, 44689.