金刚石工具胎体自由烧结工艺研究

以专用于自由烧结型金刚石工具胎体的亚微米级合金粉末为主要粘结剂,采用自由烧结工艺,通过正交试验研究了烧结温度、保温时间、升温速率三个因素对胎体力学性能的影响。结果表明,随着保温时间的增加或者烧结温度的提高,相对密度、洛氏硬度和抗弯强度先提高后降低,而升温速率对胎体的性能影响不显著,并在重复试验中也验证了正交试验极差分析结果,因此优选的自由烧结工艺为:保温时间60min,升温速率300℃·h~(-1),烧结温度875℃。     

微波烧结工艺对熔融石英陶瓷生坯性能影响的研究

以熔融石英粉末为主要原料,氮化硅为烧结助剂,采用微波烧结工艺对熔融石英陶瓷生坯制品进行烧结,采用常温抗折强度测试、体积密度测试、XRD射线衍射,研究了微波参数对生坯制品的物理力学性能及生坯微观组织的影响。结果表明:当微波升温速率为10℃/min,烧结温度为1150℃,保温时间为2 h时,熔融石英陶瓷生坯制品的常温抗折强度可达到31.6 MPa,体积密度达到1.87 g/cm3,对比常规烧结工艺,在相同的烧结工艺参数下,提升了陶瓷生坯的性能。     

TiB2陶瓷的放电等离子烧结

利用放电等离子烧结技术制备TiB2陶瓷。分析了烧结温度、保温时间和升温速率对烧结体致密度及显微结构的影响。实验结果表明：随着烧结温度的提高，烧结体的致密度及晶粒大小均增加。延长保温时间，样品的晶粒有明显长大。提高升温速率，有利于抑制晶粒生长，但样品的致密度降低。在TiB2的烧结过程中，存在颗粒间的放电。在烧结温度为1500℃，压力为30MPa，升温速率为100℃／min，真空中由SPS烧结制备的TiB2陶瓷相对密度可达98％。     

SPS工艺参数对Cu-Cr-Nb合金性能和组织的影响

利用放电等离子烧结(SPS)制备了Cu-8Cr-4Nb合金,研究了保温时间和升温速率对Cu-8Cr-4Nb致密度、电导率、力学性能和组织结构的影响。结果表明当:当烧结压力为30 MPa,烧结温度分别为800℃、900℃、950℃时,在保温时间为10 min、升温速率为100℃/min下,合金的相对致密度分别达到98.98%、99.09%、99.02%,接近理论致密度。合金电导率、硬度、抗拉强度也优于其他工艺参数。     

细晶氧化铝陶瓷基板的流延成型和显微结构控制研究

采用砂磨工艺获得了亚微米氧化铝复合粉体,用于制备微晶氧化铝陶瓷基板,研究了浆料组成对浆料流变学性质、生坯密度、生坯应力-应变行为的影响,以及烧结制度对平均晶粒尺寸和基板抗弯强度的影响。结果表明,固相含量、R值(增塑剂和黏结剂的质量比)和分散剂用量等关键因素决定了流延浆料的流变学性质。R值增大导致生坯强度和密度降低,提高固相含量有利于增加最大可流延厚度,优化工艺条件下可制备0.16～1.20 mm的坯片。当烧结温度为1 550℃、升温速率为2.5℃/min、保温时间为60 min时,制备的陶瓷基板平均晶粒尺寸为1.1μm左右,晶粒尺寸分布均匀,抗弯强度达到(440±25) MPa。     

聚苯硫醚的固相成型工艺研究

本文研究了PPS粉末固相压缩烧结成型工艺,重点研究了压缩工艺参数对制品生密度和机械性能的影响规律,其中包括:压缩压力、最大压力保持时间、施压速率、压缩温度等对PPS制品的生密度和机械性能的的影响.结果表明,压缩工艺参数对制品性能有重大影响,适宜的压缩工艺条件为:最大压力150～200MPa;保压时间:不低于3min;升压速率宜缓,在3min内达最大值.通过实验发现,压缩温度对制品性能有重要影响,适宜的压缩温度应在PPS的Tg以上,Tm以下,以120℃为宜.在上述较好的工艺条件下,所压制品的相对密度可达0.94.本研究为PPS粉末固相压缩烧结成型工艺提供了重要的依据.     

氮气和氢气气氛下无压烧结金刚石工具胎体的性能差异分析

在同样的烧结温度和保温时间下,试样块分别在氢气气氛和氮气气氛下进行无压烧结,并通过对比两种气氛下烧结试样块的致密度、抗弯强度和硬度,分析两者的性能差异。实验结果表明:在900℃/120 min的无压烧结条件下,氢气气氛条件下的试样块相比氮气气氛条件下的试样块,致密度高出1%,硬度高出5 HRB,抗弯强度无明显差异。     

工艺参数对反应烧结AIN陶瓷的影响

以Al,AlN粉为原料，采用反应烧结技术制备AlN陶瓷。Al粉含量、Al粉粒径、成型压力和升温制度是RBAN的重要工艺参数，优化工艺参数可制备出性能良好的AlN陶瓷。Al体积分数45％,1700℃温度下可制备出烧结密度为93％，抗弯强度为292MPa的AlN陶瓷。     

高性能氧化锆陶瓷最优工艺研究

通过共沉淀法制备了高性能Y-ZrO_2陶瓷,研究了等静压压力、烧结温度和保温时间对氧化锆陶瓷相对密度、抗弯强度、硬度和断裂韧性的影响。结果表明,随等静压压力的增大,相对密度和抗弯强度增大,硬度和断裂韧性变化不大;随烧结温度的升高和保温时间的延长,相对密度和抗弯强度先增大后减小,硬度和断裂韧性先增大后略有下降。在等静压压力200MPa、1450℃烧结、保温2h时获性能最高的氧化锆陶瓷材料。     

利用主烧结曲线预测TiO2陶瓷无压烧结显微组织演变

纳米金红石TiO2粉末在高温热膨胀仪中进行恒速无压烧结,升温速率为2℃/min和5℃/min,热膨胀仪自动记录烧结收缩量,根据全期烧结模型,建立TiO2主烧结曲线;利用阿基米德法测量烧结体的相对密度,利用扫描电镜观察烧结体在不同温度的显微组织演变.结果表明:利用主烧结曲线得到的相对密度和Archimedes法实测的密度吻合,证明了主烧结曲线对烧结路径不敏感,烧结体的相对密度仅是时间和温度的函数.烧结体的显微组织是烧结温度和时间的函数,烧结体的相对密度和显微组织有关联,主烧结曲线理论可以用来预测和控制烧结体的相对密度、显微组织和陶瓷性能.     

Rapid microwave sintering of centimetric zirconia: Scalability and electromagnetic-thermal-fluid-dynamic simulation

Microwave sintering is a method presenting the following advantages for flash sintering: contactless/volumetric heating, and the possibility to control the heating cycle of the microwave power. In this study, the transition from a typical 100 K/min to an ultra-rapid heating rate of 500 K/min is studied. The heating homogeneity of the typical hybrid configuration using silicon carbide susceptors is tested up to the stability limit of the system. We show that zirconia specimens as thick as 10 mm can be heated and sintered up to 500 K/min heating rate at which thermal cracks appear. However, the centimetric size of the specimens seems to favor coarsening implying an important remaining porosity in the end. A comprehensive simulation including microwave heating and convection has allowed the determination of the heating regime transition during the flash process and the quantification of each specimen's cooling fluxes.     

纳米TiO2陶瓷无压烧结的主烧结曲线

采用纳米金红石相TiO2粉末在空气中进行烧结,用热膨胀仪记录恒定加热速率条件下的烧结过程,测量了烧结体密度,根据烧结3个阶段的全期烧结模型(combined-stage sintering model),建立TiO2主烧结曲线(master sintering curve).纳米TiO2主烧结曲线对烧结路径不敏感,烧结体的相对密度仅是时间和温度的函数,利用主烧结曲线得到的相对密度和Archimedes法实测的密度吻合,证明了主烧结曲线的有效性;根据纳米金红石的主烧结曲线,得到其在空气中的烧结激活能为105 kJ/mol;可以预测烧结收缩量和最终相对密度,准确描述烧结全程的烧结行为.     

纳米介电陶瓷的晶粒尺寸效应及低温烧结技术

微电子技术对纳米陶瓷材料的需求催生了各种新型纳米陶瓷材料制备与烧结技术的开发与研究。结合纳米晶介电陶瓷的晶粒尺寸效应（即晶粒尺寸与陶瓷介电特性、烧结特性之间的依赖关系）,系统介绍了制备纳米晶介电陶瓷材料的低温烧结技术,包括液相烧结、两步烧结、水热压烧结和放电等离子体烧结,重点阐述了各种低温烧结技术的基本原理、使用设备、实验参数,比较了其优、缺点和应用领域,综述了近年来国内外相关领域的研究进展,并对这些技术目前存在的问题和今后的研究方向进行了分析和展望。     

纯B4C和掺碳B4C的烧结机制

研究了中位粒径为0．42μm的纯B4C和掺碳B4C的烧结致密化过程。根据烧结温度和保温时间对线收缩率的影响。得出了它们的烧结动力学方程;由特征指数n值对比研究了它们的烧结致密机制。纯B4C的烧结致密机制为体扩散和晶界扩散,而掺碳B4C的烧结机制主要为晶界扩散,因此,掺碳对B4C起到了活化烧结的作用,在2160℃烧结45min,掺碳B4C烧结后相对密度大于90％,掺入的碳除了固溶于B4C晶格中之外,其它均以游离石墨形式存在,不形成新相。掺碳还导致B4C晶粒尺寸大大减小。     

液相烧结氧化铝陶瓷及其烧结动力学分析

研究了CuO TiO2复相添加剂对Al2O3陶瓷烧结性能、显微结构的影响以及添加剂形成液相时Al2O3陶瓷的烧结动力学.结果显示:添加剂的加入明显地促进了Al2O3陶瓷的烧结致密度.添加剂含量对致密有明显影响,含量越高,烧结速率越快.当添加剂(CuO TiO2)为2%(质量分数),CuO/TiO2质量比为1/2时,Al2O3样品致密度最高.添加剂的存在使Al2O3晶粒发生较快生长,晶粒形貌为等轴状.通过等温烧结动力学,确定掺杂Al2O3陶瓷烧结激活能为25.2kJ/mol,表明可能是氧离子和铝离子在液相中的扩散作用控制了烧结过程.     

先进陶瓷材料快速烧结技术发展现状及趋势

快速烧结技术在节省时间和能源方面的巨大优势使其成为一直以来的研究热点。近几十年来,快速烧结技术(如火花等离子烧结、闪电烧结、选区激光烧结、感应烧结、微波烧结和传统烧结装置中的快速烧结等)的发展,使陶瓷材料的快速烧结成为可能。本文综述了近20年来先进陶瓷领域中的快速烧结技术和烧结机理,并对火花等离子烧结中直流脉冲电流和机械压力对微观结构、材料性能和烧结机理的影响进行了深入分析和总结。同时指出,快速烧结技术今后的发展一方面是对烧结机理的进一步研究并应用到先进陶瓷材料的制备中,另一方面是解决快速烧结技术工业化生产中大尺寸、大批量生产的难题。     

微波烧结ZTA陶瓷的影响因素

通过改进混合加热模式,实现了ZTA陶瓷微波烧结。材料的类型及配比直接影响微波烧结的升温速率;输入功率的提高有助于提高烧结速率;辅助加热体的老化现象降低微波烧结速率;微波烧结过程中应避免出现热剧变现象。     

Thermodynamical evaluation,microstructural characterization and mechanical properties of B4C–TiB2 nanocomposite produced by in-situ reaction of Nano-TiO2

This work discusses the pressureless sintering of a boron carbide-titanium diboride (B₄C– TiB₂) nanocomposite via in-situ reaction of the boron carbide/titanium dioxide/carbon system. Attempting to sinter pure boron carbide leads to poor mechanical properties. In this work, the effect of adding TiO₂ to B₄C on mechanical properties of the boron carbide was investigated. Thermodynamic simulations were performed with HSC chemistry software to determine the phases which were most likely to form during the sintering process. The reaction thermodynamics suggested that during the sintering process, formation of TiB₂ occurs preferentially over formation of TiC. For examination of the microstructural evolution of the samples, Scanning Electron Microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS) were utilized. The density, porosity, Young's modulus, microhardness and fracture toughness of the specimens were compared. Optimum properties were achieved by adding 10 wt% TiO₂. In the sample possessing 10 wt% TiO₂, the relative density, Young's modulus, hardness and fracture toughness were 94.26%, 428 GPa, 23.04 GPa and 5.19 MPa m^0.5, respectively, and the porosity was decreased to 5.73%. Furthermore, phase analysis via XRD confirmed that the final product was free of unreacted TiO₂ or carbon.     

Flash sintering of ceramics

Flash sintering is a novel densification technology for ceramics, which allows a dramatic reduction of processing time and temperature. It represents a promising sintering route to reduce economic, energetic and environmental costs associated to firing. Moreover, it allows to develop peculiar and out-of-equilibrium microstructures.The flash process is complex and unusual, including different simultaneous physical and chemical phenomena and their understanding, explanation and implementation require an interdisciplinary approach from physics, to chemistry and engineering. In spite of the intensive work of several researchers, there is still a wide debate as for the predominant mechanisms responsible for flash sintering process.In the present review, the most significant and appealing mechanisms proposed for explaining the “flash” event are analyzed and discussed, with the aim to point out the level of knowledge reached so far and identify, at least, possible shared theories useful to propose future scientific activities and potential technological implementations.     

Rapid Reactive Synthesis and Sintering of Submicron TiC/SiC Composites through Spark Plasma Sintering

Submicrometer TiC/SiC composites were fabricated by a rapid reactive sintering process through spark plasma sintering (SPS) technique using the carbon, titanium, and nanosized-SiC powders without any additive. It was found that the composite could be sintered in a relatively short time (8 min at 1480°C) to 97.9% of theoretical density. After sintering, the phase constituents and microstructures of the samples were analyzed by X-ray diffraction techniques and observed by scanning electron microscopy. The effect of nanosized and microsized SiC additives on the microstructure of TiC/SiC composites was investigated.