滚挂结合的双色镀工艺

介绍了在同一金属零件(如纽扣)上局部镀红古铜、局部镀浅黑镍的双色电镀方法.其工艺流程主要包括:电镀酸铜底色,上油墨,二次电镀亮镍,退油墨,三次电镀枪色,捞色(即在滚筒中用涮色粉、茶籽粉等磨料磨去表面镀层),上保护膜.指出了操作过程中的注意事项.该新型双色电镀方法将挂镀与滚镀有效结合,做到了滚镀镀种的双色效果.     

三元合金的电沉积—1972～1978年间的发展(下)

3.非磁性合金 3.1.Ni—Co与第三金属含Ni,Co的三元合金,已受到重视。一些三元合金体系的镀液成份、操作条件及镀层组成列于表1. 3.1.1.Ni—CO—W 已从焦磷酸盐镀液成功地镀取了Ni—Co—W合金。不搅拌,用镀铂的铜阴极,电流密度为3安/分米~2,时间为118分钟,镀层厚度为25微米。组成为:36～43％Ni,     

第十五讲──电镀用直流电源(二)

总结了无氰碱铜试验与生产中应注意的问题,包括阴、阳离子杂质的影响,采用高纯度化工材料的必要性,提高抗杂质干扰的有效办法,以及锌压铸件滚镀无氰碱铜的特殊性.介绍了HEDP镀铜在工业化滚镀中的成功应用.评价了一价铜盐无氰碱铜初步试验的结果.     

无氰镀铜的实验研究与生产应用进展(二)

总结了无氰碱铜试验与生产中应注意的问题,包括阴、阳离子杂质的影响,采用高纯度化工材料的必要性,提高抗杂质干扰的有效办法,以及锌压铸件滚镀无氰碱铜的特殊性.介绍了HEDP镀铜在工业化滚镀中的成功应用.评价了一价铜盐无氰碱铜初步试验的结果.     

退除铜及黄铜工件上镍镀层的“退镍粉”

介绍了一种退除铜及黄铜工件上镍镀层的退镍粉配方(以配制l kg为例):六水合硫酸镍30 g,硫酸钠435 g,硫氰酸铵30 g,苯并三氮唑5 g,防染盐S(间硝基苯磺酸钠)500 g.退镀液的组成及操作条件为:退镀粉120g/L,浓硫酸60 mL/L,温度25～ 75℃,机械搅拌.退镀流程主要包括化学除油、退铬、退镍和除黑膜.介绍了退镀液的配制及维护方法.     

碱铜一1镀液刷镀工艺研究

碱铜—1镀液俗称碱铜镀液,它是为机械零部件刷镀修复尺寸而研究配制的一种碱性铜镀液,该镀液沉积速度比较快,镀层结晶细密,抗腐性能较好,是目前刷镀技术中应用较多的镀液之一.碱铜—1镀液在机械零部件的修复方面主要用于刷镀尺寸镀层中的复合镀层的夹心镀层;改善材料表面的理化性质和工艺性能的镀层;在一些难镀金属如铸铁材料表面刷镀起镀镀层;刷镀防渗碳渗氮镀层     

焦磷酸盐铜锡合金镀液中铜的分光光度法分析

为了克服EDTA容量法测定焦磷酸盐铜锡合金镀液中铜含量滴定终点不易判断的缺点,制定了分光光度法规程。在碱性条件下用三乙醇胺与铜离子反应生成稳定的蓝色配合物,以水做参比液,在波长680 nm处测定吸光度。镀液中的铁杂质与三乙醇胺生成无色配离子,不干扰铜的测定;镀液中的锡离子、锌杂质和铝杂质均无色,不影响测定;镀液中的焦磷酸钾、葡萄糖酸钠、酒石酸钾钠、氨基乙酸等配位剂对铜离子的配位能力较弱,不影响三乙醇胺与铜的配位反应。该法测定结果的相对平均偏差为0.65%,回收率为98.5%~101.2%。     

锌合金压铸件氰化滚镀铜工艺维护(Ⅰ)(待续)——控制锌杂质的方法

锌合金压铸件氰化滚镀铜镀液中的锌杂质过高影响镀层的质量,研究了用硫化钾沉淀锌去除锌杂质.在日常生产中向镀槽中加1 mL/L氨水,能够加快锌在阴极上的沉积速度,将锌杂质控制在较低的浓度.将氢氧化钠提高到5.0～7.5 g/L,碳酸钠被控制在75 g/L以下.提高镀液中铜离子和游离氰化钠的比值,可加快铜在镀件低电流密度区的...     

HEDP一次镀铜

根据HEDP与铜离子的摩尔比,逐步提高HEDP与铜离子的含量,发现HEDP在180～250克/升、铜盐在40～60克/升范围内,其沉积速度、镀层质量及镀液性能均比较理想.在选择主盐上,我们发现硫酸铜比碱式碳酸铜好,溶液配制方便,价廉而货源广.将一根处理好的锯条放在此镀液中几昼夜后也没有置换铜产生.实践证明:用HEDP做络合剂,以硫酸铜为主盐,镀液稳定,可以一次镀得要求厚度的铜层.     

镀镍液中硫酸镍分析误差的消除

镀镍溶液中的硫酸镍的分析,常用EDTA络合滴定法,分析误差较大。原因大多是镀液中的杂质过多所引起。据分析镀镍液中的杂质及其来源有以下几个方面:铜镀液和镀件铜底层被镀液溶解引进的Cu~(2+),镍阳极不纯,所含的铅在镀液中积累的pb~(2+),镀件掉     

The preparation of Cu-coated Al2O3 composite powders by electroless plating

Cu-coated Al₂O₃ composite powders were synthesized by using the electroless plating method. The influence of the components proportion and the pH value of the plating solution on the Cu layer were analyzed with XRD and SEM. The results showed that the proportion of the plating solution components plays an important role for synthesizing the Al₂O₃/Cu composite powders. The content of copper in the composite powders could be effectively controlled by adjusting the content of copper sulfate and formaldehyde in the plating solution. Furthermore, the pretreatment of the Al₂O₃ powders is also a key factor to form a uniform Cu layer coating Al₂O₃ particles. The optimum technical parameters for producing Al₂O₃/Cu composite powders with uniform Cu coat were obtained.     

钨粉表面化学镀铜沉积过程中的开路电位

采用电化学工作站测试了化学镀铜液中钨片及钨粉压片表面开路电位的变化规律,并对化学镀铜钨片及铜包钨复合粉进行了分析. 结果表明,刚浸入化学镀铜液时,钨粉开路电位约为-600 mV,经微增、速降过程后短时达到稳定电位(约-870 mV),之后再迅速升高,300 s时基本达到稳态沉积电位(约-690 mV),此时,铜单膜层包覆基本完成. EDTA×2Na与TART复合络合剂通过调节钨粉表面电荷分布促进铜包覆反应,微量(≤10 mg/L)添加剂2,2￠-联吡啶能有效抑制镀层中Cu2O生成,改善镀层质量.     

铜粉处理酸性镀铜溶液中氯离子的机理

阐明了用铜粉处理酸性镀铜溶液中氯离子的机理,理论分析和实验表明,在酸性镀铜溶液中,Cu2+离子与铜粉反应生成Cu+离子,同时氯离子与Cu+离子反应生成氯化亚铜沉淀.向镀液中加铜粉1g/L,氯离子的起始质量浓度为174mg/L时,氯离子的去除率为58.9%,而向镀液中加锌粉1g/L,氯离子的去除率为47.0%,用铜粉处理...     

一种测定酸性镀铜熔液中氯离子含量的方法

介绍了一种酸性镀铜液中氯离子的测定方法,分析了镀液成分,镀液温度及其它离子对测量结果的影响。     

Cementation-induced recovery of self-assembled ultrafine copper powders from spent etching solutions of printed circuit boards

Ultrafine copper powders have been recovered from spent etching solutions of printed circuit boards by cementation on helical-form iron scrap chips. The tested solution is an ammoniacal copper solution containing 135 g/l copper with minor impurities. The influences of contact time, temperature, pH, initial copper concentration and Fe stoichiometry on the yield, purity and grain size and shape of the precipitated copper powders were studied. Ultrafine self-assembled copper nanocubes with high purity of about > 99% was obtained at temperature 25 °C, time 20 min, pH 2, Fe stoichiometry 1X and initial copper concentration 20 g/l Cu. It was proposed that the precipitation of copper from the solution involved two main processes: (1) adsorption of copper ions on the surface of the iron chips due to the iron oxides present on it and (2) cementation of copper ions onto the metallic iron contained in the chips. Scrap iron chips is seen to be an effective material for copper powder recovery from spent etching solutions in a pure and fine form.     

溶剂萃取法从化学镀铜废液中回收铜

采用溶剂萃取法研究了从含强络合剂的化学镀铜废液中回收铜的可行性，结果表明：从含酒石酸钾钠的化学镀铜废液萃取铜时，采用LIX54萃取剂，在pH值为6－10之间，铜的萃取率大于99％，然后通过反萃，可以得到能回用于化学镀铜生产线的硫酸铜溶液。     

Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface

Interfacial voiding in solder joints formed with Sn–Ag–Cu solder alloys and electroplated Cu was examined as a function of the plating solution chemistry and parameters. Galvanostatic Cu plating of ~10 μm thick Cu films was performed in a commercially available plating solution, and in model generic plating solutions. Analysis of the current voltage behavior along with Secondary Ion Mass Spectrometry studies of organic impurity content of two plated and a wrought copper samples, yielded a conclusion that for certain chemistry solutions (e.g., H₂SO₄ + CuSO₄ + Cl^? + PEG) and current density ranges above 2.5 mA cm^?2, organic impurities were incorporated into the growing Cu. Solder joints were produced with a variety of electroplated Cu samples. These joints were, then, annealed at a temperature of 175 °C for 1 week, cross sectioned and examined. In general, it was observed that interfacial voiding in laboratory electroplated Cu layers was qualitatively similar to the unexplained voiding observed in some industrially plated Cu products. More specifically, it was found that the propensity for voiding could be correlated with specific electroplating parameters that in turn were associated with significant incorporation of organic impurities in the Cu deposit.     

陶瓷化学镀铜沉积速度及镀层外观的研究

探讨了硫酸铜质量浓度、络合剂质量浓度比例、甲醛质量浓度、稀土质量浓度及温度变化对陶瓷表面化学镀铜的沉积速率和镀铜层微观形貌的影响。结果表明:随着硫酸铜质量浓度的增加、温度的升高和络合比的降低,化学镀铜的沉积速率提高,但镀液稳定性有所降低;增加甲醛或稀土含量,镀速先升高后下降,有一个最佳值。加入稀土Ce细化了铜颗粒,铜在基体表面的沉积变得均匀,当ρ(硫酸铈)为0.8g/L时,镀铜层平整细密、孔洞较少。     

HEDP镀铜液在铜电极上的电化学行为

采用测量开路电位-时间曲线和阴极极化曲线的方法,研究了铜电极上HEDP镀铜的电化学行为.结果表明,HEDP体系的溶液组成与温度都会影响铜电极的稳定开路电位,电镀铜过程的阴极极化(镀层结晶质量)与极化度(镀液分散能力).溶液中HEDP浓度升高,则稳定开路电位变负,阴极极化和极化度增大,有利于电沉积铜的电极过程.溶液pH升高时,稳定开路电位变负,电沉积铜的阴极极化增大.溶液温度降低时,电沉积铜的阴极极化增大.阴极极化较小时的极化度较大,且随pH的升高或温度的降低而明显增大.     

镀镍溶液中铜杂质的分析方法

利用铜试剂与Cu2+生成黄棕色络合物的特效显色反应,用分光光度法测定镀镍溶液中的铜杂质.用EDTA掩蔽镍离子和铁离子,在氨碱性条件下显色,显色液pH≈9.2.以镀液底色作参比,在λ=450 nm处测定.实验表明,测定结果的相对平均偏差为2%,能够满足监控镀镍溶液中铜杂质的要求.