氧氩比和退火温度对AZO薄膜结构与性能的影响

在通氩气和不同比率氧氩混合气体的条件下,利用射频磁控溅射法在玻璃衬底上制备铝(Al)掺杂氧化锌(AZO)薄膜(溅射功率为180W,衬底温度为300℃),并对部分薄膜样品进行400℃或500℃退火处理.采用X射线衍射仪(XRD)、原子力显微镜(AFM)和分光光度计对薄膜的结构、表面形貌和光学性能进行测试研究.结果表明,制备的所有薄膜均呈现(002)晶面择优生长;与氩气溅射相比,当采用氧氩混合气体溅射时,生长的AZO薄膜晶粒尺寸显著增大;退火处理使2类薄膜的表面粗糙度都明显减小,晶粒也有所增大(7%~13%).其中,在氧氩比为1∶2的混合气体中制备的薄膜,经过500℃退火后,晶粒尺寸最大(39.4nm),薄膜表面更平整致密,在可见光区平均透过率接近最大(89.3%).     

微波CVD法低温制备纳米金刚石薄膜

利用甲醇和氢气的混合气体,用微波等离子体CVD方法在480℃下成功地在硅片表面制备出纳米金刚石薄膜,本文研究了甲醇浓度和沉积温度对金刚石膜形貌的影响.通过Raman光谱、原子力显微镜及扫描隧道显微镜对样品的晶粒尺寸及质量进行了表征.研究结果表明:通过提高甲醇浓度和降低沉积温度可以在直径为50 mm的硅片表面沉积高质量的纳米金刚石薄膜,晶粒尺寸大约为10～20 nm,并对低温下沉积高质量的纳米金刚石薄膜的机理进行了讨论.     

微波CVD法低温制备纳米金刚石薄膜

利用甲醇和氢气的混合气体，用微波等离子体CVD方法在480℃下成功地在硅片表面制备出纳米金刚石薄膜，本文研究了甲醇浓度和沉积温度对金刚石膜形貌的影响．通过Raman光谱、原子力显微镜及扫描隧道显微镜对样品的晶粒尺寸及质量进行了表征．研究结果表明：通过提高甲醇浓度和降低沉积温度可以在直径为50mm的硅片表面沉积高质量的纳米金刚石薄膜，晶粒尺寸大约为10～20nm，并对低温下沉积高质量的纳米金刚石薄膜的机理进行了讨论．     

纳米晶Ba(Zr0.2 Ti0.8)O3薄膜的外延生长与介电特性

用脉冲激光沉积工艺在半导体(001)SrTiO3∶ω(Nb)=1.0%单晶基片上,外延生长出Ba(Zr0.2Ti0.8)O3(简称BZT)介电薄膜.在650℃原位退火10 min,薄膜为(001)外延生长的晶粒.薄膜的晶化特征与表面形貌用薄膜X-ray衍射仪和原子力显微镜测量完成.BZT薄膜(002)峰的半峰宽只有0.72°,说明薄膜晶化良好;薄膜的平均晶粒为90 nm,表面均方根粗糙度为4.3 nm,说明薄膜表面平整.在室温、100 kHz和500 kV/cm条件下,BZT的最大介电常数和调谐百分率分别达到317和65%.     

真空蒸镀ITO薄膜退火特性分析

采用真空蒸发镀膜工艺制备了ITO透明导电薄膜,以四探针表面电阻仪测量得薄膜方块电阻为400Ω,用组合式多功能光栅光谱仪测得透光率为80%,利用扫描电镜测得膜厚为103 nm.用XRD分析了薄膜的物相,并用原子力显微镜分析了薄膜的表面形貌及粗糙度.对薄膜进行退火处理,结果表明,随着热处理温度的升高,晶化趋于完整,组织结构逐渐均匀致密,晶粒有所长大.随退火时间的增加,透光率增加,但方块电阻先减小后增加.     

纳米晶Ba（Zr0．2Ti0．8）O3薄膜的外延生长与介电特性

用脉冲激光沉积工艺在半导体（001）SrTiO3：ω（Nb）=1．0％单晶基片上,外延生长出Ba（Zr0.2Ti0.8）O3（简称BZT）介电薄膜．在650℃原位退火10min,薄膜为（001）外延生长的晶粒．薄膜的晶化特征与表面形貌用薄膜X-ray衍射仪和原子力显微镜测量完成．BZT薄膜（002）峰的半峰宽只有0．72°,说明薄膜晶化良好;薄膜的平均晶粒为90nm,表面均方根粗糙度为4．3nm,说明薄膜表面平整．在室温、100kHz和500kV／cm条件下,BZT的最大介电常数和调谐百分率分别达到317和65％．     

溶胶—凝胶法制备掺铝氧化锌薄膜及微观形貌研究

利用溶胶—凝胶旋涂技术在玻璃衬底上制备了不同铝掺杂量ZnO薄膜,再利用氮气气氛在500℃条件下对样品进行热处理。利用X射线衍射仪(XRD)、扫描探针显微镜(SPM)和紫外一可见光谱仪对薄膜结构形貌及光学性能进行分析表征。结果表明,所制薄膜具有六方纤锌矿结构,且随着掺杂量的变化,薄膜择优取向发生转变;薄膜可见光透过率与掺杂量呈负相关关系,掺杂量越高,可见光透过率越低;SPM结果显示在2.at%铝掺杂量下的样品表面出现柱状结构形貌,且晶粒粒度最小,表面粗糙度最低,表明薄膜表面形貌形成过程与铝掺杂量密切相关。     

磁控溅射法生长ZnO薄膜的结构和表面形貌特性

采用射频磁控溅射方法,在Si（111）和玻璃基片上制备ZnO薄膜。研究衬底温度和基片类型对薄膜结构、表面形貌的影响。结果显示,所有ZnO薄膜沿c轴择优生长,同种基片类型上生长的薄膜,随着衬底温度升高,（002）衍射峰强度和表面粗糙度增高;相同衬底温度下生长的ZnO薄膜,Si基片上制备的薄膜（002）衍射峰强度和表面粗糙度小于玻璃片上的。基片类型影响薄膜应力状态,玻璃片上制备的ZnO薄膜处于张应变状态,Si基片上的薄膜处于压应变状态;对于同种基片类型上生长的ZnO薄膜,衬底温度升高,应力减小。Si衬底上、300℃下沉积的薄膜颗粒尺寸分布呈正态。     

Li掺杂对ZnO薄膜发光特性的影响

为研究碱金属Li掺杂ZnO薄膜的结构及光学性能,利用射频磁控溅射法（RF）在si基片上制备ZnO薄膜和Zn1-LixO薄膜,通过x射线衍射、原子力显微镜和光致发光对薄膜进行测试．研究结果表明：基片温度为450℃时,（002）峰成为薄膜的主要衍射峰;掺入碱金属Li后,薄膜表面颗粒依然均匀;Li掺杂量在5％～15％变化时,带间跃迁峰发生明显红移现象,各发光峰的强度呈抛物线形式变化．     

原子力显微镜在ZAO薄膜表征中的应用

利用磁控溅射法在溅射功率分别为30,50,80,100W条件下制备ZAO薄膜,并通过原子力显微镜(AFM)、X射线衍射(XRD)谱对制得的薄膜样品进行表面形貌、结构特性和黏附性能进行研究。XRD结果表明,随着溅射功率的增加,ZAO薄膜呈现了明显的(002)择优取向,结晶质量获得提高。通过原子力显微镜对样品的二维、三维以及剖面线图进行分析。随着溅射功率增大,薄膜样品表面较均匀致密,晶粒生长较充分,结晶质量较高,粗糙度和黏附力均增大。     

离子轰击对HDPE膜表面性能的影响

采用真空镀膜机中的轰击设备,在低真空度下对高密度聚乙烯（HDPE）膜进行离子轰击,通过原子力显微镜（AFM）、接触角测试仪及衰减全反射-傅里叶变换红外光谱仪（ATR-FTIR）对膜表面性能进行表征,采用胶带法对得到的真空蒸镀复合膜（Ag／HDPE）进行镀层与基材间粘接牢度的测试．结果表明,随着轰击时间的延长,HDPE膜的表面粗糙度、表面羰基指数和极性都随之增加;轰击预处理后的HDPE基膜与无机Ag镀层间的粘接牢度得到很大程度的提高．     

Study on the characterization and technology of Cu thin-film temperature sensor fabricated on aluminum alloy

In the present study,anodic films on aluminium alloy was used as the dielectric layer for Cu thinfilm temperature sensor,and then Cu film was deposited by unbalanced magnetron sputtering ion plating as the sensitive layer.Microstructure and surface morphologies of Cu film were investigated by optical microscope（OM）,atomic force microscope（AFM） and scanning electron microscope（SEM）.Electrical properties of Cu thin-film temperature sensor were tested by four-point probe technique and Digit Multimeter.The results showed that the surface roughness of anodic films can be reduced from Ra 58.096 nm to Ra 16.335 nm by proper polishing.Continual Cu stripes can be obtained both on polished anodic alumina film and smooth alumina wafer by etching after Cu film annealing.The resistivity of Cu films before and after 300 ℃ as well as 400 ℃ annealing are 12.48 mΩ·cm,5.48 mΩ·cm and 4.83 mΩ·cm,respectively.The resistances of Cu thin-film temperature sensor in 70 ℃ and 0 ℃ are 946.5 Ω and 761.15 Ω respectively.The temperature coefficient of resistivity（TCR） of the sensor is 3479 × 10^{- 6} /℃.     

Surface and electrical properties of NiCr thin films prepared by DC magnetron sputtering

Several batches of NiCr alloy thin films with different thickness were prepared in a multi-targets magnetron sputtering apparatus by changing sputtering time while keeping sputtering target power of Ni and Cr fixed. Then the as-deposited films were characterized by energy-dispersive X-Ray spectrometer （EDX）, Atomic Force Microscope （AFM） and four-point probe （FPP） to measure surface grain size, roughness and sheet resistance. The film thickness was measured by Alpha-Step IQ Profilers. The thickness dependence of surface roughness, lateral grain size and resistivity was also studied. The experimental results show that the grain size increases with film thickness and the surface roughness reaches the order of nanometer at all film thickness. The as-deposited film resistivity decreases with film thickness.     

Er／Yb／Al掺杂ZnO薄膜的结构与形貌研究

采用射频磁控溅射技术在室温下Si衬底上制备了ZnO薄膜和Er／Yb／Al掺杂的ZnO薄膜。通过对XRD的结构分析表明：未掺杂ZnO薄膜沿c取向性生长,掺杂ZnO薄膜偏离了正常生长,变为（102）取向性生长的纳米多晶结构;Er／Yb／Al掺杂的ZnO薄膜的晶粒尺寸随着Er元素含量的增多而减小。经AFM对其形貌分析表明：Er^3＋、Yb^3＋、Al^3＋的掺入引起了ZnO薄膜晶格场变化,使薄膜表面粗糙度变大。     

Nanodiamond films deposited at moderate temperature on pure titanium substrate pretreated by ultrasonic scratching in diamond powder suspension

Nanocrystalline diamond （NCD） film deposition on pure titanium and Ti alloys is extraordinarily difficult because of the high diffusion coefficient of carbon in Ti, the large mismatch in their thermal expansion coefficients, the complex nature of the interlayer formed during diamond deposition, and the difficulty to achieve very high nucleation density. In this investigation, NCD films were successfully deposited on pure Ti substrate by using a novel substrate pretreatment of ultrasonic scratching in a diamond powder-ethanol suspension and by a two-step process at moderate temperature. It was shown that by scratching with a 30-μm diamond suspension for 1 h, followed by a 10-h diamond deposition, a continuous NCD film was obtained with an average grain size of about 200 nm. Detailed experimental results on the preparation, characterization, and successful deposition of the NCD films on Ti were discussed.     

Preparation and characterization of nano-crystalline diamond films on glass substrate

Adherent nano diamond films were successfully deposited on glass substrate by microwave plasma assisted CVD method in H2-CH4 and Ar-CH4 environment. Raman, AFM (Atomic Force Microscope), TEM (Transmission Electron Microscope), FTIR, and Nano Indentation techniques were used for characterization of the obtained nano diamond films. It was found that the average grain size was less than 100 nm with a surface roughness value as low as 2 nm. The nano diamond films were found to have excellent transparency in visible and IR spectrum range, and were as hard as natural diamond. Experimental results were presented. Mechanisms for nano diamond film deposition were discussed.     

K掺杂p型ZnO薄膜的制备及其表征

以ⅠA族元素钾(K)作为掺杂剂,利用射频磁控溅射沉积技术,在单晶Si(111)衬底上成功生长了K:p-ZnO薄膜．采用Hall测试仪、X射线衍射、原子力显微镜和X射线光电谱等测试分析技术,对其结构和电学性能进行了研究．结果显示,该p-ZnO薄膜呈现良好的(002)单重择优生长特性,当衬底温度为500℃,氧分压为30％时表面粗糙度仅为89.05nm,其相应的空穴浓度为5.45×10¹⁷/cm³,迁移率为1.96cm^2/(V·s),电阻率为5.91Ω·cm,具有较好的结晶质量和电性能．