A low‐voltage band‐gap reference circuit with second‐order analyses

A new band‐gap reference (BGR) circuit employing sub‐threshold current is proposed for low‐voltage operations. By employing the fraction of V_BE and the sub‐threshold current source, the proposed BGR circuit with chip area of 0.029mm² was fabricated in the standard 0.18µm CMOS triple‐well technology. It generates reference voltage of 170 mV with power consumption of 2.4µW at supply voltage of 1 V. The agreement between simulation and measurement shows that the variations of reference voltage are 1.3 mV for temperatures from ?20 to 100^°C, and 1.1 mV per volt for supply voltage from 0.95 to 2.5 V, respectively. Copyright © 2010 John Wiley & Sons, Ltd.     

A 5‐Gbps low‐power low‐jitter voltage‐mode transmitter with two‐tap pre‐emphasis and impedance calibration in 65‐nm CMOS

A low‐power low‐jitter voltage‐mode (VM) transmitter with two‐tap pre‐emphasis and impedance calibration for high‐speed serial links is presented. Based on a comprehensive analysis of the relationship between impedance, supply current, and pre‐emphasis of the output driver, an impedance control circuit (ICU) is presented to maintain the 50 Ω output impedance and suppress the reflection, a self‐biased regulator is proposed to regulate the power supply, and an edge driver is introduced to speed up the signal transition time. Therefore, the signal integrity (SI) of the transmitter is improved with low power consumption. The whole transmitter is implemented in 65‐nm CMOS technology. It provides an eye height greater than 688 mV at the far end with a root‐mean‐squared jitter of less than 6.99 ps at 5 Gbps. The transmitter consumes 15.2 mA and occupies only 370 μm × 230 μm. © 2016 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.     

A 5‐GHz energy‐efficient tunable pulse generator for ultra‐wideband applications using a variable attenuator for pulse shaping

A new energy‐efficient tunable pulse generator is presented in this paper using 0.13‐µm CMOS technology for short‐range high‐data‐rate 3.1–10.6 GHz ultra‐wideband applications. A ring oscillator consisting of current‐starved CMOS inverters is quickly switched on and off for the duration of the pulse, and the amplitude envelope is shaped with a variable passive CMOS attenuator. The variable passive attenuator is controlled using an impulse that is created by a low‐power glitch generator (CMOS NOR gate). The glitch generator combines the falling edge of the clock and its delayed inverse, allowing the duration of the impulse to be changed over a wide range (500–900 ps) by varying the delay between the edges. The pulses generated with this technique can provide a sharp frequency roll off with high out‐of‐band rejection to help meet the Federal Communications Commission mask. The entire circuit operates in switched mode with a low average power consumption of less than 3.8 mW at 910 MHz pulse repetition frequency or below 4.2 pJ of energy per pulse. It occupies a total area of 725 × 600 µm² including bonding pads and decoupling capacitors, and the active circuit area is only 360 × 200 µm². Copyright © 2011 John Wiley & Sons, Ltd.     

A wide variable‐range CMOS–VCXO for IC

Recently, miniaturization, low power consumption, and high‐frequency stability have been required in crystal oscillators as a frequency source, because of the rapid development of mobile communications, typified by cellular phones. Usually, a VCXO (Voltage Controlled Crystal Oscillator) has been included in PLL. And it has been required that the VCXO should be implemented on a CMOS–IC chip. The oscillating frequency of a traditional VCXO has been controlled by capacitance variation of a varactor diode. But it is difficult to implement the varactor diode on an IC chip. In our previous study, we showed that a transistor VCXO utilizing the MOSFET's Miller capacitance of a variable capacitance circuit had a wide frequency variable range. On the other hand, in a CMOS–VCXO, the Miller capacitance has decreased. Therefore, a wide frequency variable range could not be obtained by utilizing the Miller capacitance in the CMOS–VCXO. In this paper, first, a variable capacitance circuit is realized in order to construct a wide‐variable‐range CMOS–VCXO for IC. The variable capacitance circuit is composed of a MOSFET as a voltage controlled resistance. Next, the CMOS–VCXO is constructed by the variable capacitance circuit and a CMOS crystal oscillator. As a result, we show that the CMOS–VCXO has a wide frequency variable range of about 400 ppm.© 1999 Scripta Technica, Electr Eng Jpn, 130(3): 49–56, 2000     

0.3‐V bulk‐driven programmable gain amplifier in 0.18‐µm CMOS

A new solution for an ultra low voltage bulk‐driven programmable gain amplifier (PGA) is described in the paper. While implemented in a standard n‐well 0.18‐µm complementary metal–oxide–semiconductor (CMOS) process, the circuit operates from 0.3 V supply, and its voltage gain can be regulated from 0 to 18 dB with 6‐dB steps. At minimum gain, the PGA offers nearly rail‐to‐rail input/output swing and the input referred thermal noise of 2.37 μV/Hz^1/2, which results in a 63‐dB dynamic range (DR). Besides, the total power consumption is 96 nW, the signal bandwidth is 2.95 kHz at 5‐pF load capacitance and the third‐order input intercept point (IIP₃) is 1.62 V. The circuit performance was simulated with LTspice. Copyright © 2016 John Wiley & Sons, Ltd.     

A current‐mode 1kHz/10kHz low‐voltage integrated analogue PLL for lock‐in portable applications

We present a low‐supply voltage (2V) low‐power consumption (500W) analogue phase‐locked loop (PLL), working at two low frequencies (1 and 10kHz), to be used in an integrated lock‐in amplifier. An externally settable control bit allows the switching operation between the two different frequencies. The circuit has been designed in a standard 0.6–m CMOS technology and differs from the standard analogue PLL architectures for the current mode implementation of both the loop filter and of the oscillator. Three different locked waveforms (sinusoidal, triangular, squared) can be obtained at the PLL output. Simulation results, obtained through the use of PSPICE and using accurate transistor models, will be proposed. The pull‐in ranges are about ±250Hz around 1 and ±1.3kHz around 10kHz, with pull‐in times of about 10 and 4ms, respectively. Copyright © 2003 John Wiley & Sons, Ltd.     

A 0.15‐μm CMOS baseband LSI employing sleep mode with clock‐offset compensation for M2M wireless sensor networks

This paper describes a wireless baseband large‐scale integration (LSI) that contains a sleep management circuit. The sleep manager performs the sleep‐clock offset compensation and enables a wireless terminal (WT) with a typical crystal oscillator (XO) to remain in sleep mode for a long period while maintaining synchronization with the access point. Lab experiments show that the sleep period reaches 512 s and that, with intermittent operation, the WT maintains synchronization with the access point for 10 days. The LSI's average current consumption is as low as 11 μA for a 128‐s sleep period. A wakeup detection circuit is also implemented in the LSI. This circuit performs paging control instead of a microprocessor unit (MPU) and this helps to reduce current consumption in the MPU and the flash read only memory (ROM). The single‐chip baseband LSI is fabricated using 0.15‐μm CMOS technology. It is 4.6 mm × 4.2 mm in area and consumes 4.0 μA for sleep operation. © 2015 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.     

Programmable feedforward linearized CMOS OTA for fully differential continuous‐time filter design

In this paper, a feedforward linearization method for programmable CMOS operational transconductance amplifier (OTA) is described. The proposed circuit technique is developed using simple source‐coupled differential pair transconductors, a feedback‐loop amplifier for self‐adjusting transcoductance (g_m) and a linear reference resistor (R). As a result, an efficient linearization of a transfer characteristic of the OTA is obtained. SPICE simulations show that for 0.35µm AMS CMOS process with a single +3V power supply, total harmonic distortion at 1 V_pp and temperature range from ?30 to +90°C is less than ?49.3 dB in comparison with ?35.8 dB without linearization. Moreover, the input voltage range of linear operation is increased. Power consumption of the linearized OTA circuit is 0.86 mW. Finally, the OTA is used to design a third‐order elliptic low‐pass filter in high‐frequency range. The cut‐off frequency of the operational transconductance amplifier‐capacitor (OTA‐C) filter is tunable in the range of 322.6 kHz–10 MHz using the feedforward linearized OTAs with the digitally programmable current mirrors. Copyright © 2009 John Wiley & Sons, Ltd.     

A simulation study of high‐order CMOS hyperbolic‐sine filters

This paper advances the field of externally linear–internally nonlinear (ELIN) filters by introducing a synthesis method that enables the design of high‐order class‐AB sinh filters by means of complementary metal–oxide semiconductor (CMOS) weak‐inversion sinh integrators comprising only one type of devices in their translinear loops. The proposed transistor‐level synthesis approach is demonstrated through the examples of (1) a biquadratic and (2) a fifth‐order filter, and their simulated performance is studied. The biquadratic filter achieves a dynamic range of 94 dB and has a tunable quality factor Q up to the value of 8, whereas its natural frequency can be tuned for four orders of magnitude. Its static power consumption amounts to 6.2 μW for Q = 1 and f_o = 2 kHz. The fifth‐order Chebyshev sinh CMOS filter with a cut‐off frequency of 100 Hz, a pass band ripple of 1 dB, and a power consumption of ~300 nW is compared head‐to‐head with its pseudo‐differential class‐AB CMOS log domain counterpart. The sinh filter achieves similar or better signal‐to‐noise ratio (SNR) and signal‐to‐noise‐plus‐distortion ratio (SNDR) performances with half the capacitor area but at the expense of higher power consumption from the same power supply level. All three presented filter topologies are novel. Cadence design framework simulations have been performed using the commercially available 0.35 µm AMS (austriamicrosystems) process parameters. Copyright © 2013 John Wiley & Sons, Ltd.     

Design and analysis of power‐CMOS‐gate‐based switched‐capacitor DC–DC converter with step‐down and step‐up modes

A unified multi‐stage power‐CMOS‐transmission‐gate‐based quasi‐switched‐capacitor (QSC) DC–DC converter is proposed to integrate both step‐down and step‐up modes all in one circuit configuration for low‐power applications. In this paper, by using power‐CMOS‐transmission‐gate as a bi‐directional switch, the various topologies for step‐down and step‐up modes can be integrated in the same circuit configuration, and the configuration does not require any inductive elements, so the IC fabrication is promising for realization. In addition, both large‐signal state‐space equation and small‐signal transfer function are derived by state‐space averaging technique, and expressed all in one unified formulation for both modes. Based on the unified model, it is all presented for control design and theoretical analysis, including steady‐state output and power, power efficiency, maximum voltage conversion ratio, maximum power efficiency, maximum output power, output voltage ripple percentage, capacitance selection, closed‐loop control and stability, etc. Finally, a multi‐stage QSC DC–DC converter with step‐down and step‐up modes is made in circuit layout by PSPICE tool, and some topics are discussed, including (1) voltage conversion, output ripple percentage, and power efficiency, (2) output robustness against source noises and (3) regulation capability of converter with loading variation. The simulated results are illustrated to show the efficacy of the unified configuration proposed. Copyright © 2003 John Wiley & Sons, Ltd.     

A single‐bit continuous‐time delta‐sigma modulator using clock‐jitter and inter‐symbol‐interference suppression technique

This paper presents a technique for mitigating two well‐known DAC non‐idealities in continuous‐time delta‐sigma modulators (CTDSMs), particularly in wide‐band and low over‐sampling‐ratio (OSR) cases. This technique employs a special digital‐to‐analog convertor (DAC) waveform, called modified return‐to‐zero (MRZ), to reduce the time uncertainty effect because of the jittered clock at the sampling time instances and eliminate the effect of inter‐symbol‐interference (ISI) which degrades the modulator performance, especially when non‐return‐to‐zero (NRZ) DAC waveform is chosen in the modulator design. A third‐order single‐bit CTDSM is designed based on the proposed technique and step‐by‐step design procedure at circuit and system levels, considering clock jitter and ISI, is explained. Circuit simulations in 180‐nm CMOS technology show that in the presence of circuit non‐idealities which generate jitter and asymmetrical rise and fall times in the DAC current pulse, signal‐to‐noise‐distortion‐ratio (SNDR) of the proposed modulator is higher than the conventional modulator with NRZ waveform by about 10 dB. In these simulations, clock jitter standard deviation is 0.3% of the sampling period (T_S) and the difference between fall/rise times in the DAC current pulse is 4%T_S. Simulated at 600‐MHz sampling frequency (f_S) with an oversampling ratio (OSR) of 24, SNDR figure of merit (FOM_SNDR) of the proposed modulator in 180‐nm CMOS is 300 fj/conversion. Copyright © 2016 John Wiley & Sons, Ltd.     

An ultra‐thin oxide sub‐1 V CMOS bandgap voltage reference

This paper presents a sub‐1 V CMOS bandgap voltage reference that accounts for the presence of direct tunneling‐induced gate current. This current increases exponentially with decreasing oxide thickness and is especially prevalent in traditional (non‐high‐κ/metal gate) ultra‐thin oxide CMOS technologies (t_ox < 3 nm), where it invalidates the simplifying design assumption of infinite gate resistance. The developed reference (average temperature coefficient, T_{C_AVG}, of 22.5 ppm/°C) overcomes direct tunneling by employing circuit techniques that minimize, balance, and cancel its effects. It is compared to a thick‐oxide voltage reference (T_{C_AVG} = 14.0 ppm/°C) as a means of demonstrating that ultra‐thin oxide MOSFETs can achieve performance similar to that of more expensive thick(er) oxide MOSFETs and that they can be used to design the analog component of a mixed‐signal system. The reference was investigated in a 65 nm CMOS technology with a nominal V_DD of 1 V and a physical oxide thickness of 1.25 nm. Copyright © 2013 John Wiley & Sons, Ltd.     

Low‐power,low‐area preamplifier for ultra high‐speed multi‐channel optical communication system

A novel circuit technique was applied to the design of a preamplifier for ultra high‐speed short‐distance parallel optical communication system in standard 180‐nm CMOS technology. This circuit is featured by low power, low area as well as high gain bandwidth product, and suited for applications in low‐cost process. The restraint on voltage headroom as bottleneck in traditionally adopted regulated cascode configuration has been fundamentally analyzed and lifted by feed‐forward common gate stage to achieve high gain bandwidth product under limited f_T and strict power restriction. Complex poles were carefully assigned to further attain bandwidth extension without sacrifice on power, noise, and chip area. No additional peaking techniques and subsequent gain‐boosting stages are adopted, which makes the design simple and favorable in low‐cost high‐density multi‐channel optical communication system. The preamplifier provides a trans‐impedance gain of up to 52 dBΩ and a 3‐dB bandwidth of 8.4 GHz. Operating under a 1.8‐V supply, the power dissipation is 8 mW, and the chip area is only 0.075×0.08 mm. The measured average input‐referred noise–current spectral density is . Copyright © 2011 John Wiley & Sons, Ltd.     

Wide‐band dual‐resonance capacitive cross‐coupled divide‐by‐5 injection‐locked frequency divider

A wide locking range divide‐by‐5 injection‐locked frequency divider (ILFD) is proposed and was implemented in the TSMC 0.18‐μm 1P6M CMOS process. Conventional divide‐by‐5 ILFD has limited locking range. The proposed divide‐by‐5 ILFD is based on a capacitive cross‐coupled voltage‐controlled oscillator (VCO) with a dual‐resonance resonator, which is implemented in the divide‐by‐5 ILFD to obtain a wide overlapped locking range. At the drain‐source bias V_DD of 0.9 V and at the incident power of 0 dBm, the measured locking range of the divide‐by‐5 ILFD is 3.2 GHz, from the incident frequency 9.4 to 12.6 GHz, the percentage is 29.09%. The core power consumption is 2.98 mW. The die area is 0.987 × 1.096 mm².     

Wide‐band aperture array using a four‐channel manifold‐type planar multiplexer and digital 2‐D IIR filterbank

Emerging wide‐band communications and spectrum‐sensing systems demand support for multiple electronically scanned beams while maintaining a frequency independent, constant far‐field beam width. Realizing existing phased‐array technology on a digital scale is computationally intensive. Moreover, digitizing wide‐band signals at Nyquist rate requires complex high‐speed analog‐to‐digital converters (ADCs), which is challenging for real developments driven by the current ADC technology. A low‐complexity alternative proposed in this paper is the use of radio‐frequency (RF) channelizers for spectrum division followed by sub‐sampling of the RF sub‐bands, which results in extensive reduction of the necessary ADC operative frequency. The RF‐channelized array signals are directionally filtered using 2‐D digital filterbanks. This mixed‐domain RF/digital aperture array allows sub‐sampling, without utilizing multi‐rate 2‐D systolic arrays, which are difficult to realize in practice. Simulated examples showing 14–19 dB of rejection of wide‐band interference and noise for a processed bandwidth of 1.6 GHz are demonstrated. The sampling rate is 400 MHz. The proposed VLSI hardware uses a single‐phase clock signal of 400 MHz. Prototype hardware realizations and measurement using 65‐nm Xilinx field‐programmable gate arrays, as well as Cadence RTL synthesis results including gate counts, area‐time complexity, and dynamic power consumption for a 45‐nm CMOS circuit operating at B _DC = 1.1 V, are presented. Copyright © 2016 John Wiley & Sons, Ltd.     

A waveform generator circuit for extra low‐frequency CMOS micro‐power applications

This paper presents a novel low‐power CMOS extra low‐frequency (ELF) waveform generator based on an operational trans‐conductance amplifier (OTA). The generator has been designed and fabricated using 2.5‐V devices available in 130‐nm IBM CMOS technology with a ±1.2‐V voltage supply. Using the same topology, two sets of device dimensions and circuit components are designed and fabricated for comparing relative performance, silicon area and power dissipation. The first design consumes 691 μW, while the second design consumes 943 μW using the same voltage supply. This low‐power performance enables the circuit to be used in many micro‐power applications. ELF oscillation is achieved for the two designs being around 3.95 Hz and 3.90 Hz, respectively, with negligible waveform distortion. The measured frequencies agree well with the simulation results. The first design is found to provide overall optimal performance compared to the second design at the expense of higher silicon area. Copyright © 2015 John Wiley & Sons, Ltd.     

High‐tuning‐range CMOS band‐pass IF filter based on a low‐Q cascaded biquad optimization technique

A design procedure for high‐order continuous‐time intermediate‐frequency band‐pass filters based on the cascade of low‐Q biquadratic cells is presented. The approach is well suited for integrated‐circuit fabrication, as it takes into account the maximum capacitance spread dictated by the available technology and maximum acceptable sensitivity to component variations. A trade‐off between noise and maximum linear range is also met. A novel, wide‐tuning‐range transconductor topology is also described. Based on these results, a 10‐pole band‐pass filter for a code division multiple‐access satellite receiver has been designed and tested. The filter provides tunable center frequency (f₀) from 10 to 70 MHz and exhibits a 28‐MHz bandwidth around f₀ = 70 MHz with more than 39‐dB attenuation at f₀/2 and 2f₀. Third‐order harmonic rejection is higher than 60 dB for a 1‐Vpp 70‐MHz input, and equivalent output noise is lower than 1 mV_rms. The circuit is fabricated in a 0.25‐µm complementary metal oxide semiconductor process, and the core consumes 12 mA from a 2.5‐V supply, offering the best current/pole ratio figure. The die area resulted to be 0.9 × 1.1 mm². Copyright © 2014 John Wiley & Sons, Ltd.     

Subharmonic injection‐locking and self‐oscillating mixing

Subharmonic injection‐locking and self‐oscillating mixing functions of a modified Colpitts oscillator operating at 1 GHz are reported. The injection‐locking circuit, using a GaAs FET, is described theoretically and experimentally. Phase noise, power consumption and conversion gain measurements indicate that the proposed design is attractive for low‐cost, low‐power consumption front‐ends. Copyright © 2008 John Wiley & Sons, Ltd.     

A 0.008‐mm2, 35‐μW, 8.87‐ps‐resolution CMOS time‐to‐digital converter using dual‐slope architecture

This paper presents a high resolution time‐to‐digital converter (TDC) for low‐area applications. To achieve both high resolution and low circuit area, we propose a dual‐slope voltage‐domain TDC, which is composed of a time‐to‐voltage converter (TVC) and an analog‐to‐digital converter (ADC). In the TVC, a current source and a capacitor are used to make the circuit as simple as possible. For the same reason, a single‐slope ADC, which is commonly used for compact area ADC applications, is adapted and optimized. Because the main non‐linearity occurs in the current source of the TVC and the ramp generator of the ADC, a double gain‐boosting current source is applied to overcome the low output impedance of the current source in the sub‐100‐nm CMOS process. The prototype TDC is implemented using a 65‐nm CMOS process, and occupies only 0.008 mm². The measurement result shows a dynamic range with an 8‐bit 8.86‐ps resolution and an integrated non‐linearity of ±1.25 LSB. Copyright © 2016 John Wiley & Sons, Ltd.     

Switched‐capacitor‐voltage‐multiplier boost DC–AC inverter with adaptive stages

A multistage switched‐capacitor‐voltage‐multiplier inverter (SCVMI) is proposed with a variable‐conversion‐ratio phase generator and a sinusoidal pulse‐width‐modulation controller for boost DC–AC conversion and high‐efficiency regulation. Its power unit contains: SCVM booster and H‐bridge. The SCVM booster includes two m_c‐stage switched‐capacitor cells and two n_c‐stage switched‐capacitor cells in the interleaving operation to realize DC–DC boost gain of m_c × n_c at most. Here, the variable‐conversion‐ratio phase generator is suggested and adopted to change the running stage number and topological path for a suitable gain level of m × n (m = 1, 2, ?,m_c, n = 1, 2, ?,n_c) to improve efficiency, especially for the lower AC output. The H‐bridge is employed for DC–AC conversion, where four switches are controlled by sinusoidal pulse‐width‐modulation not only for full‐wave output but also for output regulation as well as robustness to source/loading variation. Some theoretical analysis and design include: SCVMI model, steady‐state/dynamic analysis, conversion ratio, power efficiency, stability, capacitance selection, output filter, and control design. Finally, the closed‐loop SCVMI is simulated, and the hardware circuit is implemented and tested. All the results are illustrated to show the efficacy of this scheme. Copyright © 2011 John Wiley & Sons, Ltd.