Role of annealing temperature in the oxide charge distribution in high-$$\kappa $$-based MOS devices: simulation and experiment

The effect of rapid thermal annealing on the oxide charge distribution of Al/HfO\(_2\)/SiO\(_2\)/Si metal–oxide–semiconductor structures are studied using technology computer-aided design (TCAD) simulations and experiments. The simulated electrical characteristics are compared with experimentally obtained data. The interface traps are found to be nonuniform in nature and laterally distributed following a Gaussian profile. The distribution of interface trap charges arises because of spatial electric field variation in the oxide film upon gate bias application. The interface trap density is found to decrease with increase in annealing temperature. It is further observed that, at higher annealing temperature, the fixed oxide charge density increases due to interfacial Hf silicate formation.     

Study of Hf—Al—O High-k Gate Dielectric Thin Films Grown on Si

Ultrathin amorphous films of Hf-aluminate (Hf—Al—O) have been deposited on p-type (100) Si substrates by pulsed-laser deposition. Transmission electron microscopy study revealed that for the films deposited in oxygen ambient with partial pressure of 1 × 10^?3 Pa, the amorphous structure of Hf—Al—O films is stable under rapid thermal annealing at temperatures up to at least 1000°C. Electrical properties have been characterized by means of high-frequency capacitance-voltage measurements at 1 MHz on the metal-oxide-semiconductor (MOS) capacitors using Pt dot electrode. The relative permittivity of the Hf—Al—O dielectric film is calculated approximately to be about 10 and the equivalent oxide thickness to SiO₂ is 30 Å. However, for the Hf—Al—O films deposited in a relatively higher vacuum condition (1 × 10^?4 Pa), islands of Hf silicide formed from interfacial reaction between the films and Si substrates. The formation of Hf silicide was attributed to the presence of Al oxide in the films that altered the Gibbs free energy for the reaction between the Hf atoms in the amorphous Hf—Al—O films and Si under an oxygen deficient condition. X-ray photoelectron spectroscope results suggested that there is Hf silicide formation in the interfacial region.     

Electrical properties of ultrathin HfO2 gate dielectrics on partially strain compensated SiGeC/Si heterostructures

Ultrathin HfO₂ gate dielectrics have been deposited on strained Si_0.69Ge_0.3C_0.01 layers by rf magnetron sputtering. The polycrystalline HfO₂ film with a physical thickness of ∼6.5 nm and an amorphous interfacial layer with a physical thickness of ∼2.5 nm have been observed by high resolution transmission electron microscopy (HRTEM). The electrical properties have been studied using metal-oxide-semiconductor (MOS) structures. The fabricated MOS capacitors on Si_0.69 Ge_0.3C_0.01 show an equivalent oxide thickness (EOT) of 2.9 nm, with a low leakage current density of ∼4.5 × 10 ^{− 7} A/cm² at a gate voltage of –1.0 V. The fixed oxide charge and interface state densities are calculated to be 1.9 × 10¹² cm^{− 2} and 3.3 × 10 ¹¹ cm^{− 2}eV⁻¹, respectively. The temperature dependent gate leakage characteristics has been studied to establish the current transport mechanism in high-k HfO₂ gate dielectric to be Poole–Frenkel one. An improvement in electrical properties of HfO₂ gate dielectrics has been observed after post deposition annealing in O₂ and N₂ environments.     

Characteristics of Bi4Ti3O12 thin films on ITO/glass and Pt/Si substrates prepared by R.F. sputtering and rapid thermal annealing

Bi₄Ti₃O₁₂ thin films are deposited on ITO/glass and Pt/Ti/Si(100) substrates by R.F. magnetron sputtering at room temperature. The films are then heated by a rapid thermal annealing (RTA) process conducted in oxygen atmosphere at temperatures ranging from 550–700^∘C. X-ray diffraction examination reveals that the crystalinity of the films grown on Pt/Ti/Si is better than that of the films grown on ITO/glass under the same fabrication conditions. SEM observation shows that the films grown on Pt/Ti/Si are denser than those grown on ITO/glass substrates. Interactive diffusion between the Bi₄Ti₃O₁₂ film and the ITO film increases with the increase of annealing temperature. The optical transmittance of the thin film annealed at 650^∘C is found to be almost 100% when the effect of the ITO film is excluded. The relative dielectric constants, leakage currents and polarization characteristics of the two films are compared and discussed.     

Improvement of Dielectric and Interface Properties of CeO2 Buffer Layer by Using the Metal Seed Layer and N2 Plasma Treatment

In this paper, we investigated the feasibility of cerium oxide (CeO₂) films as buffers layer of MFIS (metal ferroelectric insulator semiconductor) type capacitors. CeO₂ layer were prepared by a two-step process of a low temperature film growth and subsequent RTA (rapid thermal annealing) treatment. By applying a cerium (Ce) metal seed layer of 4 nm, unwanted SiO₂ layer generation was successfully suppressed at the interface between the buffer layer and the Si substrate. After N₂ plasma treatment, the leakage current was reduced by about 2-orders. By employing a N₂ plasma treatment, we were able to successfully obtain good properties at the interface between the buffer layer and the Si substrate.     

Study of nanocrystal TiO2 thin films by thermal annealing

The amorphous films were annealed in a wide temperature range (250–1000^∘C) and film properties of TiO₂ thin films were studied. Nano-sized anatase polycrystallites had been induced by thermal annealing for the films annealed at and above 300^∘C as confirmed by X-ray diffraction. Strong LO-phonon Raman modes, especially B_1g (395 cm⁻¹) and E _g (636 cm⁻¹) in Raman spectra and the absorption peak at 436 cm⁻¹ in absorbance spectra by Fourier transform infrared spectroscopy also indicated the existence of anatase phase in crystalline thin films. In addition, with the increase of the annealing temperature, the wettability of the film surface was enhanced as shown by the decrease of water contact angle from over 90^∘ to less than 40^∘. Moreover, upon UV laser irradiation on film surface, the water contact angle saturated at 10^∘ indicative of a highly hydrophilic surface for all the films, which arose from the dissociative adsorption of water molecules on the defect sits of the surface generated by the photocatalysis reactions of TiO₂. This behavior makes the film a good potential candidate for self-clean coatings.     

Improvement of the thermal and chemical stability of Al doped ZnO films

To improve the stability of sputter-deposited ZnO:Al (AZO) films at high temperature above 300^∘C, an amorphous Zn-Sn-O (ZTO) film was deposited on the top of AZO films as an protective layer by co-sputtering of pure ZnO and SnO₂ targets. Amorphous ZTO films had resistivity in the range from 10⁻² to 10⁻³ Ωcm and were stable up to temperature of 400^∘C. Heat treatments of bare AZO films in the atmosphere at 400^∘C resulted in a dramatic increase in the resistivity accompanied by substantial decrease in carrier concentration and Hall mobility. The AZO films covered with the ZTO film showed remarkable improvement in thermal stability for subsequent heat treatments in the temperature range from 200 to 400^∘C in the atmosphere as well as chemical stability in weak acidic solution. X-ray photoelectron spectroscopy analysis showed that the improvement was attained by ZTO layer acting as diffusion barrier of oxygens and/or water vapors.     

Preparation and electrical properties of 0.4Pb(Zn1/3Nb2/3)O3-0.6Pb(Zr0.4Ti0.6)O3 thin films by 2-step annealing method

Films of (1−x)Pb(Zn_1/3Nb_2/3)O₃-xPb(Zr_0.4Ti_0.6) O₃ (x = 0.6, 40PZN-60PZT) were deposited on Pt/TiO₂/ SiO₂/Si substrate through spin coating. Using a combination of homogeneous precursor solution preparation and two-step pyrolysis process, we were able to obtain the 40PZN-60PZT thin films of perovskite phase virtually without pyrochlore phase precipitation after annealing above 650^∘C. But since annealing done at the high temperatures for extended time can cause diffusion of Pt, TiO₂ and Si, and precipitation of nonstoichiometric PbO, we adopted 2-step annealing method to circumvent these problems. The 2-step annealed films show dense microstructure than the 1-step films annealed at higher temperature. Furthermore, the root-mean-square surface roughness of 220 nm thick films which are annealed at 720^∘C for 1 min and then annealed at 650^∘C for 5 min was found to be 3.9 nm by atomic force microscopy as compared to the 12 nm surface roughness of the film annealed only at 720^∘C for 5 min. The electrical properties of 2-step annealed films are virtually same and those of the 1-step annealed films annealed at high temperature. The film 2-step annealed at 720^∘C for brief 1 min and with subsequent annealing at 650^∘C for 5 min showed a saturated hysteresis loop at an applied voltage of 5 V with remanent polarization (P _r) and coercive voltage (V _c) of 25.3 μC/cm² and 0.66 V respectively. The leakage current density was lower than 10⁻⁵A/cm² at an applied voltage of 5 V.     

ZnGa2O4 thin films fabricated by Sol-gel spinning coating process

ZnGa₂O₄ thin film phosphors have been synthesized on ITO coated glass and soda-lime glass at a firing temperature of 500^∘C and an annealing temperature of 500^∘C and 600^∘C via a chemical solution method using Zinc acetate dihydrate, Gallium nitrate hydrate and 2-methoxiethanol as a solution. XRD patterns of the film phosphors synthesized showed the peaks of ZnGa₂O₄ crystalline phases. AFM surface morphologies of the ZnGa₂O₄ thin film phosphors revealed marked differences according to an annealing temperature of 500^∘C and 600^∘C under an annealing atmosphere (3% H₂/Ar). On the other hand, the sheet resistance of ZnGa₂O₄ thin film phosphors, which were measured by four-point probe instrument, was approximately 5.76 Ω /square and 7.86 Ω /square with annealing temperature, respectively. The ZnGa₂O₄ thin film phosphors exhibited blue emission spectra with peak wavelength of 434 nm and 436 nm by ultra-violet excitation around 230 nm.     

Dielectric properties of ZnNb2 O 6 -TiO 2 mixture thin films

ZnNb₂O₆-TiO₂ mixture thin films with multilayer structures were fabricated via a sol-gel spin coating process. TiO₂ layers were deposited on the pre-crystallized ZnNb₂O₆ layers in order to suppress the formation of the ixiolite phase which always forms in the bulk system. The phase constitution of the thin films, confirmed by X-ray diffraction (XRD), could be controlled by the annealing temperatures, which, in turn, influenced the dielectric properties of the thin films. TiO₂ layers crystallized as the anatase phase and then transformed to the rutile phase at temperatures higher than 725^∘C. Dielectric constants of the mixture thin films, measured at 1 MHz with an MIM (metal-insulator-metal) structure, increased from 27 to 41 with dielectric losses below 0.005 as the annealing temperature increased from 700^∘C to 900^∘C. The increase in the dielectric constants was understood to originate from the increasing amounts of the rutile phase. Temperature coefficients of capacitance (TCC) were also measured between 25^∘C and 125^∘C, which showed a decreasing manner from positive values to negative values with increasing annealing temperatures. When annealed at 850^∘C, the TCC of the thin films could be tuned to be approximately 0 ppm/^oC with dielectric constant and dielectric loss of 36 and 0.002, respectively.     

Optical Properties of LiTaO3 Thin films crystallized by RTA processes

High-performance pyroelectric infrared detectors have been fabricated using Lithium tantalite (LiTaO₃) thin films deposited on Pt(111)/Ti/SiO₂/Si(100) substrates by diol-based sol-gel method and rapid thermal annealing (RTA) technique. The dielectric and pyroelectric properties of IR detectors of LiTaO₃ thin films crystallized by conventional and RTA processes are investigated. Experimental results reveal that the heating rate will influence strongly on dielectricity and pyroelectricity of LiTaO₃ thin films. The voltage responsivities (Rv) measured at 80 Hz increase from 5496 to 8455 V/W and the specific detecivities (D^∗) measured at 300 Hz increase from 1.94 × 10⁸ to 2.38 × 10⁸ cmHz^1/2/W with an increase of heating rate from 600 to 1800^∘C/min. However, the voltage responsivity and the specific detecivity decrease with heating rate in excess of 1800^∘C/min. The results show that the LiTaO₃ thin film detector with a heating rate of 1800^∘C/min exists both the maximums of voltage responsivity and specific detecivity.     

Comparison of Hafnium Precursors for the MOCVD of HfO2 for Gate Dielectric Applications

Hafnium oxide films were deposited on Si (100) substrates using metal-organic chemical vapor deposition (MOCVD) and evaluated for gate dielectric applications. For this study, two types of precursors were tested: an oxygenated one, Hf butoxide-mmp, and an oxygen-free one, Hf diethyl-amide. Depositions were carried out in the temperature range of 350–650°C. However, the discussion is focused on amorphous films. The films were compared on the basis of growth rate, phase development, density, interface characteristics, and electrical properties. A similar amorphous to polycrystalline phase transition temperature was found for both precursors. For low deposition temperatures the growth rate for the amide precursor was significantly higher than for the butoxide-mmp precursor and films prepared with the amide precursor contained a lower carbon impurity content than with the butoxide-mmp one. The dielectric constant was slightly higher for amorphous HfO₂ deposited from the amide precursor than for the butoxide-mmp one. Only in respect to the trap density does the butoxide precursor seem advantageous.     

Structural and electrical properties of Sb-doped p-type ZnO thin films fabricated by RF magnetron sputtering

We investigated the Sb-doping effects on ZnO thin film using RF (radio frequency) magnetron sputtering and RTA (rapid thermal annealing). The structural and electrical properties of the thin films were measured by X-ray diffraction, SEM (scanning electron microscope), and Hall effect measurement. Thin films were deposited at a high temperature of 800°C in order to improve the crystal quality and were annealed for a short time of only 3 min. The structural properties of undoped and Sb-doped films were considerably improved by increasing oxygen content in the Ar-O₂ gas mixture. Sb-doping also significantly decreased the electron concentration, making the films p-type. However, the crystallinity and surface roughness of the films degraded and the mobility decreased while increasing Sb-doping content, likely as a result of the formation of smaller grain size. From this study, we observed the transition to the p-type behavior at 1.5 at.% of Sb. The thin film deposited with this doping level showed a hole concentration of 4.412?×?10¹⁷ cm^?3 and thus is considered applicable to p-type ZnO thin film.     

Crystallinity and photocatalytic activity of liquid phase deposited TiO2 films

Anatase TiO₂ films were deposited on glass substrates at 50 and 200^∘C to investigate the effect of growth temperature on the photocatalytic acitivity of the films. It was observed that the films grown at 200^∘C were composed of columnar crystallites and were more porous than the films grown at 50^∘C which had more compact structures. Also, the film crystallinity increased from 75 to 90% if the higher growth temperature was used. Despite the higher crystallinity, it was observed that for crystallinities between 60 and 90%, the photocatalytic behavior of the films was more significantly affected by changes in the surface area.     

Preparation of hafnium oxide thin films by sol–gel method

Hafnium oxide (HfO₂) films were grown on SiO₂/Si substrates by a sol–gel method, and their crystalline structure, microstructure and electrical properties were investigated. X-ray diffraction analysis indicated that the monoclinic HfO₂ films could be obtained by annealing at 500 °C. A transmission electron microscopy (TEM) image showed that the films were grown as a spherulite grain structure with a mean grain size of approximately 15 nm. The dielectric constant of the HfO₂ films of 300 nm was approximately 21.6, and the current–voltage measurements showed that the leakage current density of the HfO₂ films was approximately 1.14?×?10^?5 A/cm² at an applied electric field of 100 kV/cm. The sol–gel method-fabricated HfO₂ films are concluded to be feasible for MEMS applications, such as capacitive-type MEMS switches.     

Scaling Effect on the Dielectric Constant in Ba(Ti x Zr1−x )O3 Thin Films

Recent work on PZT and BST thin films reveal a thickness dependence of the dielectric constant for a film thickness below 100 nm. This effect is commonly attributed to an interfacial layer between the electrode and the dielectric film (dead layer). In this contribution we report on the influence of the film thickness on the dielectric constant of Ba(Ti_xZr_{1 – x})O₃ thin films with different Zr-contents (x = 0–30 at.%). The films were prepared by chemical solution deposition (CSD) with thickness between 30 and 350 nm.The electrical characterization was performed in a temperature range between 25 and 200C. Results were interpreted with respect to the formation of a serial dead layer capacitance.     

EFFECTS OF PZT BUFFER LAYERS ON PZFNT FERROELECTRIC THIN FILMS

ABSTRACT

PZFNT thin films were fabricated on 5-inch Pt/Ti/SiO₂/Si and PZT/Pt/Ti/SiO₂/Si substrates by RF magnetron sputtering method and rapid thermal annealing process. By investigating the two thin films at various annealing temperatures, the results show that the annealing temperature of PZFNT thin films without PZT buffer layers is about 730°C, which is higher than that of PZFNT films with PZT buffer layers. By use of PZT buffer layers, the annealing temperature of PZFNT films is decreased greatly, and the dielectric and ferroelectric properties are improved. In the optimum process, the thin films with PZT buffer layers have a dielectric constant of 1199 and dielectric loss of 3.0% at 1 KHz. The remanent polarization and coercive field of the thin films are 21.1 μC/cm² and 53.5 KV/cm respectively. The films have the significant potential for FRAM and pyroelectric infrared detectors.     

Development of ferroelectric Pb(ZrxTi1−x)O3 thin films by metallo-organic decomposition process and rapid thermal annealing

Polycrystalline Pb(Zr_0.5Ti_0.5)O₃ thin films with good ferroelectric properties have been prepared by metallo-organic decomposition (MOD) process, using acetate-based precursors, and followed by two different kinds of annealing process, independently, including oven annealing and rapid thermal annealing (RTA). The experimental procedures were described for the films deposited on Pt-coated silicon substrates. There were distinct differences between oven annealing and RTA process, in terms of structures, morphologies, and electrical properties of the films. The films with RTA process showed denser and smoother surface, finer grain sizes, and much higher dielectric constant (1200–1400), remnant polarization of 30–35 μC/cm² and lower coercive field of 65–85 kv/cm in the entire annealing temperature range of this study. At an annealing temperature of 550°C, RTA processed films showed identical XRD patterns of perovskite phase and clear ferroelectricity; however, it was not possible to realize the perovskite structure and ferroelectricity in the films oven-annealed at that temperature. These acetate-derived PZT films with RTA process were reproducible, showed high quality in uniformity and homogeneity.     

Calculation of the intrinsic dead layers thicknesses from Au/Ba0.5Sr0.5TiO3/Pt thin film capacitors

Ferroelectric Ba_0.5Sr_0.5TiO₃ (BST) films were prepared on Pt/Ti/SiO₂/Si substrates by the sol-gel process. The films were spin-coated at 2000 rpm for 30 secs and then pyrolysed for 5 mins at the temperature of 350^∘C. This coating procedure was repeated for 3, 4, 5 and 6 times to obtain BST films with different thicknesses. After coating the films with the desired repetition times, the films were finally annealed in a conventional furnace at temperatures ranging from 600^∘C to 800^∘C with a 50^∘C interval in between. The films obtained with an annealing procedure of 750^∘C were polycrystalline with the presence of an impurity BaCO₃ phase. The capacitance and leakage current were measured and used to extract information on the metal-BST interface. With the series capacitance model and modified Schottky emission equation, the thickness of the dead layers for Au/BST and Pt/BST interfaces were calculated to be less than 6 nm and 5 nm, respectively.     

The Rutile Phase of TiO2/Graphene Films: Sol–Gel Method,Phase Transition,Photocatalytic Properties

Abstract

TiO₂ materials are of great interest in different applications because of the controllable preparation of different structures. In this paper, the TiO₂ and TiO₂/graphene films with different phase structure and inserted graphene layer between Cu substrate and TiO₂ film were prepared by sol–gel method at different annealing temperatures, and then used as catalysts for photo-degradation of methylene blue (MB) dye solution under ultraviolet irradiation using 15?W of ultraviolet lamp. The effects of annealing temperature and graphene layer on the phase structure, morphology, chemical composition, binding energy level, and photocatalytic performance of TiO₂ films were studied in details. XRD results reveal that the anatase phase of TiO₂ films transfers to rutile phase with the increase in annealing temperature, and the introducing of graphene film layer can accelerate the phase transformation of anatase to rutile and improve the crystallization quality of TiO₂ films. It is found that the MB degradation efficiency of TiO₂ and TiO₂/graphene films is enhanced with the increasing annealed temperature, which shows that the existence of rutile phase, well crystalline quality and the better dispersion of the TiO₂ particles are helpful in photocatalytic behavior. In addition, compared to the rutile phase TiO₂ film, the rutile phase TiO₂/graphene films at annealed temperatures of 900?°C exhibit much higher photocatalytic activity due to the introduction of graphene films.