共查询到19条相似文献,搜索用时 62 毫秒
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MEMS技术的现状和发展趋势 总被引:10,自引:0,他引:10
MEMS技术是一门新兴的技术 ,近年来 ,越来越受到世界各国的重视。主要介绍了MEMS的发展背景、研究内容、特点、现状和发展趋势 相似文献
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用于系统级仿真的MEMS器件宏模型研究现状 总被引:1,自引:0,他引:1
微机电系统(MEMS)的未来在于有稳定数量且不断壮大的新型产品能成功地转化为商品,这关键在于将计算机引入到MEMS设计、制造全过程。阐述了MEMS CAD的复杂性和困难。对MEMS CAD的分层设计思想作了简要介绍,着重对现有的MEMS器件宏模型的建模方法和模型的描述与其国内外研究现状与发展方向进行介绍和总结,认为宏模型研究的重点将是器件非线性特性的有效表达和建模过程自动化的计算机实现,并对今后的研究发展提出一些建议。 相似文献
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微机电系统多场耦合仿真分析 总被引:3,自引:0,他引:3
在微电子机械系统(MEMS)研究和设计中,微系统数值仿真分析是一个重要研究领域.本文对MEMS中多种能量场耦合问题的各种数值仿真分析方法进行了综合评述.分析了该领域目前的研究现状并指出了其今后的发展方向。 相似文献
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MEMS封装技术研究进展与趋势 总被引:4,自引:1,他引:4
介绍了MEMS(microelectromechanicalsystems)封装技术的研究现状和存在的问题,重点介绍了倒装芯片技术(flip chiptechnology简称FCT)、上下球栅阵列封装技术和多芯片模块封装技术三种很有前景的封装技术的特点及其在MEMS领域的应用实例,并且对MEMS封装有可能的发展趋势进行了分析。 相似文献
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文章首先阐述了微电子机械系统(MEMS)技术的基本概念、工艺流程及发展概况;其次,介绍了RF MEMS技术在射频系统中的应用及RF MEMS器件在功耗、体积、质量、性能和成本上的优势;最后重点介绍了RF MEMS技术应用,包括RF MEMS开关、移相器、谐振器和滤波器等典型微波元器件,分析其结构特征、发展现状和相对于传统器件的性能优势,在此基础上展望RF MEMS技术应用前景。 相似文献
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在MEMS加速度计加速寿命试验及加速性能退化试验研究的基础上,对MEMS加速度计在振动环境下的可靠性技术进行了研究.通过理论分析MEMS加速度计在振动环境下的失效模式和失效机理,结合具体的试验条件设计了加速度计加速寿命试验及加速性能退化试验方案,并对MEMS加速度计在振动环境下的失效数据分别进行了加速寿命可靠性评估及加速性能退化可靠性评估.研究表明,两种评估方法得到的评估结果基本一致;加速性能退化评估方法适用于MEMS加速度计在振动环境中的可靠性研究,且该方法简捷、正确可行、节省试验费用,为MEMS加速度计在实际应用中提供了重要的参考依据. 相似文献
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MEMS加速度计的六位置测试法 总被引:4,自引:0,他引:4
主要介绍了MEMS加速度计的六位置测试法,根据MEMS加速度计输出数学模型详细推导了如何得到MEMS加速度计的输出数学模型中的刻度因数、零偏以及安装误差,并在得到其标定系数后将其封装在C函数中进行了验证实验.通过实验数据分析可知,MEMS加速度计的六位置测试法原理简单、易于实现,且精度较高.这种标定法所得到的MEMS加速度计输出能够比较准确地反映其输出,而且MEMS加速度计的线性度有所改善. 相似文献
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MEMS封装是在微电子封装技术基础上发展起来的一项关键的MEMS技术。介绍了MEMS封装技术的功能、特点与分类。在此基础上,重点介绍了键合技术、上下球栅阵列技术、倒装芯片技术、多芯片技术以及3-D技术等几种重要的MEMS封装技术。最后,进一步探讨了MEMS封装的发展趋势及研究方向。 相似文献
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In the past few years, the micro-electromechanical systems (MEMS) industry has exceeded the $1-billion-a-year mark. Some economic forecasters estimate that the industry will surpass $14 billion by the year 2000. The reason for this tremendous growth is the enabling nature of MEMS, which give engineers and researchers the tools to build things that have been impossible or prohibitively expensive with other techniques. MEMS are micron- to millimeter-scale devices that can be fabricated as discrete devices or in large arrays. MEMS borrow much of their technology from integrated circuit (IC) manufacturing, providing three-fold benefits: miniaturization, multiplicity and microelectronics. First, miniaturization of the devices is inherent in the processing techniques. Modern microelectronics fabrication techniques are designed to build submicron-scale devices. By using the same techniques, engineers can easily leverage this technology to produce MEMS that are orders of magnitude smaller than their macroworld counterparts. Second, the use of photolithography techniques makes producing thousands or even millions of copies of a single device easy. Thus, single devices can be arrayed into systems to produce an effect impossible with discrete devices. Finally, because MEMS technology is so similar to IC fabrication technology, MEMS are integrable with microelectronics 相似文献
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Solid-based CAPP for surface micromachined MEMS devices 总被引:1,自引:0,他引:1
Process planning for a MEMS device is almost always conducted manually by the designer to date. As the structures of MEMS devices become more and more complicated, in order to release the designers from the hard and tedious work and speed up the development of MEMS products, such a situation should be changed. In this study, a solid based CAPP method for surface micromachined MEMS device is presented. With this method, a MEMS device is designed with a traditional CAD system, and its process planning is conducted automatically based on the solid model created. The process features with engineering semantics are extracted first. Then, the process layer model is constructed with each process layer of the model being coincident with the fabrication layer of surface micromachining. Finally, the masks are synthesized and the fabrication process is generated. Furthermore, to guarantee the manufacturability of the designed MEMS device, a systematic evaluation method is proposed. The proposed design and CAPP methods enable designers to concentrate on functional and shape design of MEMS devices. 相似文献