振动环境下MEMS加速度计的可靠性评估

在MEMS加速度计加速寿命试验及加速性能退化试验研究的基础上,对MEMS加速度计在振动环境下的可靠性技术进行了研究.通过理论分析MEMS加速度计在振动环境下的失效模式和失效机理,结合具体的试验条件设计了加速度计加速寿命试验及加速性能退化试验方案,并对MEMS加速度计在振动环境下的失效数据分别进行了加速寿命可靠性评估及加速性能退化可靠性评估.研究表明,两种评估方法得到的评估结果基本一致;加速性能退化评估方法适用于MEMS加速度计在振动环境中的可靠性研究,且该方法简捷、正确可行、节省试验费用,为MEMS加速度计在实际应用中提供了重要的参考依据.     

MEMS惯性器件的主要失效模式和失效机理研究

针对微机电系统(MEMS)器件的可靠性问题,通过大量的历史资料调研和失效信息收集等方法,针对微机电系统(MEMS)器件的可靠性问题,对冲击、振动、湿度、温变、辐照和静电放电(ESD)等不同环境应力条件下的MEMS惯性器件典型失效模式及失效机理进行了深入分析和总结,研究结果有利于指导未来MEMS惯性器件的失效分析和可靠性设计.     

MEMS近红外光谱仪微镜驱动控制系统研发

针对微机电系统（MEMS）近红外光谱仪中MEMS微镜驱动系统的耦合与复杂扰动问题,提出了一种基于扰动观测器（DOB）与模型预测控制（MPC）的复合控制结构。通过分析MEMS微镜的驱动工作原理,建立MEMS微镜偏转角与驱动电压的传递函数模型,设计了MPC以消除系统耦合,通过分析系统扰动模型,设计了DOB实现对系统内部与外部扰动的集中监测。仿真研究与实验测试结果表明：基于DOB MPC复合结构的MEMS微镜驱动控制系统,既可以有效抑制系统的外部扰动,又可以抑制由模型失配和变量耦合导致的内部扰动。     

谐振微镜扫描角度同步测量机理研究

微镜振动扫描技术已经较为广泛地应用在激光雷达、光学显示等科技领域。然而这种扫描通常是开环的,缺少对谐振微镜的实时角度同步测量反馈。本文提出一种基于单个光电二极管(PD)作为探测器的FPCB谐振微镜集成角度测量机理,建立了一种在谐波信号驱动下的谐振微镜同步测量模型和理论计算方法。通过对PD信号的测量计算处理,能够对在光学角度60°范围内往复偏转的FPCB微镜进行扫描角度的实时测量监控。通过联合采用PSD与栅格纸实测验证的方法,对谐振响应的相位滞后角度,微镜扫描角度幅值进行了对比验证。结果表明,本测量机理相位滞后误差小于6％。角度幅值误差小于5％,该测量机理有效地解决了扫描微镜实时旋转角度测量与有限空间布置问题,能有效地降低成本。     

基于复合静电驱动结构的硅微机械扭转微镜

为了改善硅微机械扭转微镜的机电耦合特性,降低器件的驱动电压并提高其工作可靠性,提出了几种新颖的基于复合静电驱动结构的硅微机械扭转微镜.提出的硅微机械扭转微镜将垂直扭转梳齿静电驱动结构、侧壁平行板电容静电驱动结构有机结合,实现了两种静电驱动方式的复合驱动,同时设计了内外双镜面结构,通过内外双镜面结构,实现了微镜的差动复合驱动,理论分析、模拟仿真与测试结果表明,通过上述两个方面新颖的设计,新结构显著降低了器件的驱动电压.同时为了提高器件的工作可靠性,在设计折叠梁柔性支撑结构时,将梁的不同位置设计成不同的厚度,对于硅微机械扭转微镜扭转过程中容易疲劳的梁部分加大了其厚度,从而在不影响器件扭转性能的前提下,明显提高了器件的可靠性.利用有限元方法对器件的力学特性和机电耦合特性进行了系统的仿真,获得了影响器件机电特性的关键结构参数.器件基于SOI晶片,采用表面硅工艺与体硅工艺相结合的方式加工制造,采用SOI晶片显著降低了微镜镜面的表面粗糙度,提高了其光反射能力.最后利用原子力显微镜对微镜镜面的表面粗糙度进行了测量和分析,实验结果表面微镜表面具有16nm的表面粗糙度,完全可以满足光学应用的需要.     

高速MEMS扫描微镜动态变形特性研究

扭转镜面的动态形变是影响显示成像用MEMS扫描微镜光学分辨率的主导因素,研究了高速转动的MEMS扫描微镜的动态形变特性,得到了相关有用的结论。结果表明当MEMS扫描微镜镜面几何尺寸一定时,如果要获得系统衍射极限光学分辨率,需要对转动频率,扭转角度和镜面厚度进行优化设计和选择,简单通过增加镜面厚度保证光学分辨率的方法不利于MEMS扫描微镜综合性能的改善和提高。     

振动抑制与能量俘获专刊序

工程系统中梁结构经常处于各种激励的作用下,因而梁结构在这种环境下不可避免地发生着各种各样的强迫振动.在梁结构发生振动的过程中,其自身会受到的温度、湿度、电磁场、裂纹等众多内外部因素的影响,而众多内外部因素就构成梁的多物理场耦合环境.在多场耦合环境下,Green函数法作为一种解析方法在研究梁的多场耦合振动问题方面具有优势,有利于讨论力、电、热、裂纹等因素作用下梁的振动特性和多场耦合特性.Green函数法相比于模态叠加法,优点在于能够得到完整且精度较高的解析解,具有收敛性好,运算快的特点.本文主要阐述Green函数在梁的强迫振动、热力耦合振动、力电耦合振动、裂纹梁振动等研究问题上取得了大量的理论和工程研究成果.本文以裂纹为内因,热、力、电为外因进行分类,阐述了在内外因影响下梁的强迫振动问题Green函数解的研究现状,从而让读者进一步系统性的了解Green函数法在振动领域中的广泛应用,以及了解该方法本身的特色和优势奠定基础.     

MEMS微悬臂梁在冲击下的粘附失效预测*

MEMS(Micro-electronics Mechanical System)的可靠性已经成为它能否成功地实现商品化的一个重要问题.多晶硅微悬臂梁是MEMS中的一个基本结构,阐述了多晶硅微悬臂梁的粘附失效机理,并利用宏观机械中的理论和可靠性分析方法对表面微加工的多晶硅微悬臂梁的粘附可靠性进行预测,建立了在外载荷下的粘附可靠度预测模型,并利用该模型具体分析了微梁尺寸及外界湿度对可靠度的影响.     

激光雷达在无人驾驶环境感知中的应用

激光雷达是实现无人驾驶环境感知的重要传感器,特别是通过与相机和毫米波雷达等实现感知信息融合之后,适用于复杂交通环境感知,可以检测交通环境中的不同目标,包括道路、可行驶区域、行驶环境中行人和车辆、交通信号灯和交通标志等交通要素。本文通过激光雷达的技术描述,介绍它在环境感知中的重要作用,分析了激光雷达标定及测试等技术基础,分析了激光雷达在环境感知中的应用,可以为相关技术应用提供参考。     

MEMS扫描镜温度可靠性测试

温度是MEMS扫描镜的一个重要失效因素。研究温度对MEMS扫描镜振幅的影响,再通过温度冲击试验和高低温存储试验测试温度对MEMS扫描镜可靠性的影响,分析扫描镜在试验中是否失效和失效的原因。试验结果表明:高温对MEMS扫描镜外框架和镜面振幅无影响,低温对MEMS扫描镜外框架振幅影响较大,增幅达12.3%,对镜面振幅无影响;低温存储由于水汽凝结会导致MEMS扫描镜失效,高温存储对MEMS扫描镜可靠性无影响。     

MEMS陀螺仪在恶劣高温环境下提供准确的惯性检测

越来越多的应用需要从处于高温环境中的传感器收集数据。相比同等的分立式传感器,MEMS通常更小巧,功耗和成本都更低。此外,它们还可以在同样大小的半导体封装内集成信号调理电路。除了可以提供高精度倾斜(倾角)测量,还需要更加灵活和自由,以准确测量系统在严苛环境应用下的移动,在这些环境下,最终产品可能遭受冲击、振动和剧烈移动。这种类型的滥用会导致系统过度磨损和提前出现故障,由此产生高额的维护或停机成本。为了满足这一需求,开发了一款集成信号调理功能的高温MEMS陀螺仪,此传感器即使在冲击和振动环境下也能实现准确的角速率(转速)测量,且额定工作温度高达175℃。     

Reliability of MEMS: A perspective on failure mechanisms,improvement solutions and best practices at development level

Reliability of MEMS (MicroElectroMechanical-Systems) devices is a crucial aspect as it can discriminate the successful from partially or totally missed reaching of Microsystem technology based market products. However, the topic of MEMS reliability is significantly articulated, as it comprises numerous physics of failure and diverse failure mechanisms. Thereafter, it requires a pronounced sensitivity related to the actual operation conditions (environmental and functional) of the Microsystem device within the final application. In other words, reliability of MEMS is nowadays regarded as a standalone transversal discipline that must be seriously taken into account already from the early design phase. The purpose of this paper is to provide the reader at first with basic knowledge around the concept of reliability. Thereafter, the most relevant physics of failure and failure mechanisms typical of MEMS are grouped and briefly discussed, with specific attention to their employment in the field of displays. A synthetic review of valuable solutions to improve specific reliability aspects of MEMS devices for diverse applications is then proposed to the reader. Eventually, a brief discussion focused on best practices to address properly reliability during the whole development chain of innovative MEMS based products completes the contribution. It is a belief of the author that the particular blend of topics and aspects reported in the following pages, as well as the attitude of considering reliability as a transversal discipline of science, contribute to provide this contribution with an important benefit if compared to the reviews on reliability of MEMS previously published in literature.     

Rotary electrostatic micromirror switches using wafer-scale processing and assembly

The design, micromachining process, wafer-scale assembly, and experimental characterization of our rotary electrostatic micromirrors for optical switching applications are reported in this paper. Some of the proposed microelectromechanical systems (MEMS) optical switches utilize surface-micromachined thin films as the reflection micromirrors which might result in optical degradation due to dynamic warping. Some of these devices fabricated by bulk micromachining highly rely on a delicate post-assembly process to assemble the micromirrors onto the top of MEMS actuators. In this research, we focus on developing rotary electrostatic micromirror switches without the requirement of delicate post-assembly processes. We use the spin-on-glass, which is used as an intermediate layer in a 280°C low-temperature wafer-bonding process, to fabricate our rotary optical switches with a wafer-scale assembly process. The rotary electrostatic actuator and the vertical micromirror are fabricated simultaneously by the same deep RIE process in our design. We have successfully demonstrated the rotary electrostatic micromirror switches via the wafer-scale assembly process with a yield rate of above 70%. Experimental results show that our rotary vertical micromirrors rotate about 1.5° under an applied voltage of 150 V for steady-state measurements. For dynamic measurements, the rotary vertical micromirrors rotate about 3.6° under an applied voltage of 30 V at the resonant frequency. The first vibration mode of our rotary switch is an in-plane rotational mode and appears around 3.4 kHz, which is characterized via a Polytec laser doppler vibrometer.

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Novel analog pulse‐width‐modulated 15‐μm SiGe micromirrors

Abstract— A novel six‐electrode SiGe micromirror pixel enabling analog pulse‐width modulation (PWM) in display applications is presented. Instead of utilizing bitplanes, arbitrary duty cycles can be realized, resulting in an analog gray‐level distribution. This eliminates the posterization (contouring) effect that is typical for digital micromirrors. Moreover, the pixel design does not require the incorporation of electronic comparators and the gamma compensation can be processed externally. Two out of the six electrodes are used as landing electrodes. The other four attracting electrodes are driven by two anti‐phase saw‐tooth signals and two fixed analog voltage signals. By applying this signal scheme, the duty cycle of the mirror is modulated in an analog manner. Test vehicles were manufactured where SiGe is the microelectromechanical systems (MEMS) material. The use of SiGe as a structural layer is advantageous to build MEMS since the CMOS and MEMS layers can be deposited in a monolithic manner. Measurements using a Laser Doppier Vibrometer (LDV) have confirmed the feasibility of analog PWM for 15‐μm SiGe micromirrors.     

A new measurement microphone based on MEMS technology

This paper presents a new type of measurement microphone that is based on MEMS technology. The silicon chip design and fabrication are discussed, as well as the specially developed packaging technology. The microphones are tested on a number of key parameters for measurement microphones: sensitivity, noise level, frequency response, and immunity to disturbing environmental parameters, such as temperature changes, humidity, static pressure variations, and vibration. A sensitivity of 22 mV/Pa (-33 dB re. 1 V/Pa), and a noise level of 23 dB(A) were measured. The noise level is 7 dB lower than state-of-the-art 1/4-inch measurement microphones. A good uniformity on sensitivity and frequency response has been measured. The sensitivity to temperature changes, humidity, static pressure variations and vibrations is fully comparable to the traditional measurement microphones. This paper shows that high-quality measurement microphones can be made using MEMS technology, with a superior noise performance.     

Characterization of Stiction Accrual in a MEMS

Stiction remains one of the chief reliability concerns for microelectromechanical systems (MEMS) devices. In this paper, we quantify and analyze the rate of accrual of stiction in a standard MEMS device under a set of controlled temperature and humidity splits. An accelerated aging system was employed to more rapidly induce stiction in the MEMS. Optical characterization techniques were used to study the progression of stiction. The stiction accrual was quantified in terms of stiction equivalent energy, which provides compensation for mechanical fatigue in the devices due to long periods of operation. The fastest accrual of stiction was seen in the 90degC, 80% relative humidity (RH) split with approximately 80% of the MEMS elements failing within 4.4 times 10⁹ cycles (10 h) with 2.7 times 10^-14 Joules of stiction equivalent energy while the 60degC, 20% RH showed the least stiction accrual rate with less than 2% failure for 2.26 times 10¹² cycles (1500 h). In general, the stiction was seen to increase with an increase in humidity while mechanical fatigue showed an increase with an increase in temperature. Atomic force microscopy topography imaging was used to assess physical wear at the contacting areas. The results revealed that there were not any discernable changes in the surface profile due to long periods of actuation.     

Scanning micromirrors fabricated by an SOI/SOI wafer-bonding process

MEMS scanning micromirrors have been proposed to steer a modulated laser beam in order to establish secure optical links between rapidly moving platforms. An SOI/SOI wafer-bonding process has been developed to fabricate scanning micromirrors using lateral actuation. The process is an extension of established SOI technology and can be used to fabricate stacked high-aspect-ratio structures with well-controlled thicknesses. Fabricated one-axis micromirrors scan up to 21.8/spl deg/ optically under a dc actuation voltage of 75.0 V, and have a resonant frequency of 3.6 kHz. Fabricated two-axis micromirrors scan up to 15.9/spl deg/ optically on the inner axis at 71.8 V and 13.2/spl deg/ on the outer axis at 71.2 V. The micromirrors are observed to be quite durable and resistant to shocks. Torsional beams with T-shaped cross sections are introduced to replace rectangular torsional beams in two-axis MEMS micromirrors, in order to reduce the cross-coupling between the two axial rotations. Fabricated bidirectional two-axis micromirrors scan up to /spl plusmn/7/spl deg/ on the outer-axis and from -3/spl deg/ to 7/spl deg/ on the inner-axis under dc actuation.