Fluid flow and heat transfer in the evaporating thin film region

The evaporating thin film region is an extended meniscus beyond the apparent contact line at a liquid/solid interface. Thin film evaporation plays a key role in a highly efficient heat pipe. A detailed mathematical model predicting fluid flow and heat transfer through the thin film region is developed. The model considers the effects of inertial force, disjoining pressure, surface tension, and curvature. Utilizing the order analysis, the model is simplified and can be numerically solved for the thin film profile, interfacial temperature, meniscus radius, heat flux distribution, velocity distribution, and mass flow rate in the evaporating thin film region. The prediction shows that while the inertial force can affect the thin film profile, interfacial temperature, meniscus radius, heat flux distribution, velocity distribution, and mass flow rate, in particular, near the non-evaporating region, the effect can be neglected. It is found that a maximum velocity, a maximum heat flux, and a maximum curvature exist for a given superheat, but the locations for these maximum values are different.     

An experimental inquisition of waste heat recovery in electronic component system using concentric tube heat pipe heat exchanger with different working fluids under gravity assistance

In the utilizing of the waste heat in the electronic components meets the power demand and energy utilization for the industries and domestic applications. To meet out this by the understanding and optimization of the waste heat utilization by a compact and cost effective device using heat pipe heat exchanger. This paper states with the design, fabrication, development, and observation of an experimental investigation of the heat pipe introduce in the concentric tube heat exchanger. Working fluids like Methanol, Acetone and heat transport fluid as water. The investigation is further extended by varying the inclination angles, mass flow rates, and temperatures of hot and cold fluid at inlet conditions. The influence of gravitational effect on the heat pipe heat exchanger is conducted for inclination angle from 10° to 80° and the maximum performance is obtained at 60° inclination angle. It is observed while acetone as working fluid there is an increase in 29.75% for effectiveness, 79.81% as heat transfer coefficient, 39.53% as heat transfer rate, 6.70% for Reynold's number and 10.52% decrease in thermal resistance than with methanol. It is concluded that the acetone exhibits better performance when related with methanol as a working fluid. These observations show the suitability of the designed concentric tube heat pipe heat exchanger for the utilization of waste heat dissipation in electronic component system.     

Two-phase simulations of micro heat pipes

A two-phase model of a single micro heat pipe (MHP) and a three-dimensional network of microchannels were simulated using the finite element method. Investigation on the convergence of the models demonstrated that models with higher thermal gradient showed fluctuation with higher amplitude. Furthermore, phase change phenomenon and accumulation of the liquid phase in the sharp corners of the micro heat pipe were modelled. The effective thermal conductivity, pressure and velocity field for both phases along the length of the micro heat pipe were calculated and compared to the literature. In addition, the overloading conditions were simulated and an effective length was defined for the micro heat pipe. Consequently, the influence of liquid filling ratio on the effective length of micro heat pipe was investigated. Finally, a three-dimensional network of microchannels with two-phase flow was simulated where the circulation of the two phases was captured.     

Thermal conductivity measurement of submicrometer-scale silicon dioxide films by an extended micro-Raman method

The micro-Raman method is a noncontact and nondestructive method for thin film thermal conductivity measurements. To apply the micro-Raman method, however, the thickness of the film must be at least tens of micrometers. An analytical heat transfer model is presented in this work to extend the micro-Raman measurement method to measure the thermal conductivity of thin films with submicrometer- or nanometer-scale thickness. The model describes the heat transfer process in the thin film and substrate considering the effects of thin film thickness, interface thermal resistance, thermal conductivity of the thin film and substrate. From this heat transfer model, an analytical expression for the thermal conductivity of the thin film is derived. Experiments were successfully performed to measure the thermal conductivity of 200, 300 and 500 nm thickness silicon dioxide films using the extended micro-Raman measurement method, with results confirming the accuracy and validity of the extended model.     

Near-wall effects in micro scale Couette flow and heat transfer in the Maxwell-slip regimes

The effects of modified transport characteristics within an extremely thin layer adjacent to the fluid–solid interfaces are investigated for fully developed laminar micro-scale Couette flows with slip boundary conditions. The wall-adjacent layer effects are incorporated into the continuum-based mathematical model by imposing variable viscosity and thermal conductivity values close to the channel walls, for solving the momentum and energy conservation equations. Analytical expressions for the velocity profiles are derived and are subsequently utilized to obtain the temperature variations within the parallel plate channel, as a function of the significant system parameters. It is revealed that the variations in effective viscosity and thermal conductivity values within the wall-adjacent layer have profound influences on the fluid flow and the heat transfer characteristics within the channel, with an interesting interplay with the wall slip boundary conditions. These effects cannot otherwise be accurately captured by employing classical continuum based models for microscale Couette flows that do not take into account the alterations in effective transport properties within the wall adjacent layers.     

Novel heat dissipation design for light emitting diode applications

The authors offer a new design in support of efficient heat dissipation for light emitting diodes (LEDs). In the first part of this paper we discuss improvements in LED packaging materials and layer assembly, and then describe the addition of a thin layer of electroplated copper to the LED base assembly to reduce thermal resistance and increase thermal diffusion efficiency. Also described is a three-dimensional finite element simulation that we performed to verify the proposed design (0.75, 1, and 3 W LED chip temperatures) and a LED heat transfer behavior analysis. The results indicate that the addition of a 9 mm² electroplated copper layer to the LED base assembly improved LED thermal dissipation by reducing chip temperature by 5°C compared to LEDs without the copper layer packaging. In the second part of this paper we describe (a) our heat pipe system/heat sink design for LED illumination, and (b) experiments in which we changed both working fluid mass and rotation angle to determine their effects on heat pipe cooling. Our results indicate that the most efficient heat dissipation occurred when an added heat pipe was arranged horizontally. Good heat dissipation was observed for heat pipes containing 2.52 g of water (temperature reduced by 50°C). Larger water volumes failed to dissipate additional heat due to the presence of steam inside the pipe.     

Modelling the effective thermal conductivity of compressing structures including contact resistance

A multi-physics simulation-based methodology for estimating the effective conductivity of single or repeated arrays of mechanically deforming structures being compressed between solid planer surfaces is detailed in this work. The proposed methodology utilises Finite Element (FE) simulations to determine the mechanical environment and resulting shape of the deforming structures together with its effective bulk thermal conductivity by simulating the heat transfer through the structure(s). Importantly, the FE model also incorporates the constriction thermal resistance as well as the contact thermal resistance associated with the contact region between the deforming structure(s) and the rigid planer surfaces. The latter is endemically problematic to predict and an approach is proposed which combines accurate multi-physics simulations with precision experiments to estimate the contact resistance in terms of contact pressure on the deforming structure(s). The thermal-mechanical simulation results are compared with experiments for one exemplar geometry verifying the efficacy of the approach. Although illustrated here for determining the effective thermal conductivity, the method is equally valid for determining effective electrical conductivity of deforming electrically conductive structures undergoing compression between rigid planer surfaces.     

基于OpenGL的相贯线切割轨迹的建模与仿真

围绕管材切割中的坡口加工问题,对定角度坡口和变角度坡口进行了分析。建立了圆管相贯线的一般模型,提出了适用于数控切割的坡口角度的计算方法,完成了仿真算法的研究。针对插入式相贯接头,利用VC++和OpenGL完成了仿真程序的编写,实现了具有变角度坡口切割轨迹的仿真。结果表明切割后的主管与支管装配准确,焊接坡口完全符合美国石油协会标准规定的要求。     

Optimization of grooved klystron collector design for efficient heat transfer

Klystron microwave amplifiers play a vital role in addressing the increasing demands of high‐average microwave power for strategic applications such as linear accelerators, active denial technologies, radar, and so forth. Typically, klystrons have an efficiency of 50%‐60% that demands an efficient thermal design for dissipating the unused DC power in the form of spent electron beam in collector. Hence, thermal modeling of the collector for efficient heat dissipation is highly critical in design of high average power klystrons. Of several types of design, grooved collector design is widely employed so as to increase the surface area between the collector and coolant and thereby enhance heat transfer. In this article, a mathematical model and design strategy have been demonstrated to obtain the optimum dimensions, that is, height, depth, and width of fins based on film coefficient and Reynolds number. For validation, the dimensions are then simulated in a computational fluid dynamics software (ANSYS‐Fluent) demonstrating excellent agreement with the mathematical modeling. In addition, the optimum choice of grooving method (longitudinal or crossed) for the given power level has also been provided. The demonstrated strategy can also potentially be employed to other devices, which uses groove based design with water as coolant medium such as gyrotrons, plasma devices, and so forth.     

Thin film evaporation in microchannels with interfacial slip

We investigate the role of interfacial slip on evaporation of a thin liquid film in a microfluidic channel. The effective slip mechanism is attributed to the formation of a depleted layer adhering to the substrate–fluid interface, either in a continuum or in a rarefied gas regime, as a consequence of intricate hydrophobic interactions in the narrow confinement. We appeal to the fundamental principles of conservation in relating the evaporation mechanisms with fluid flow and heat transfer over interfacial scales. We obtain semi-analytical solutions of the pertinent governing equations, with coupled heat and mass transfer boundary conditions at the liquid–vapor interface. We observe that a general consequence of interfacial slip is to elongate the liquid film, thereby leading to a film thickening effect. Thicker liquid films, in turn, result in lower heat transfer rates from the wall to liquid film, and consequently lower mass transfer rates from the liquid film to the vapor phase. Nevertheless, the total mass of evaporation (or equivalently, the net heat transfer) turns out to be higher in case of interfacial slip due to the longer film length. We also develop significant physical insights on the implications of the relative thickness of the depleted layer with reference to characteristic length scales of the microfluidic channel on the evaporation process, under combined influences of the capillary pressure, disjoining pressure, and the driving temperature differential for the interfacial transport.     

Conjugate heat transfer through nano scale porous media to optimize vacuum insulation panels with lattice Boltzmann methods

Due to reduced thermal conductivity, vacuum insulation panels (VIPs) provide significant thermal insulation performance. Our novel vacuum panels operate at reduced pressure and are filled with a powder of precipitated silicic acid to further hinder convection and provide static stability against atmospheric pressure. To obtain an in depth understanding of heat transfer mechanisms, their interactions and their dependencies inside VIPs, detailed microscale simulations are conducted.Particle characteristics for silica are used with a discrete element method (DEM) simulation, using open source software Yade-DEM, to generate a periodic compressed packing of precipitated silicic acid particles. This aggregate packing is then imported into OpenLB (openlb.net) as a fully resolved geometry, and used to study the effects on heat transfer at the microscale. A three dimensional Lattice Boltzmann method (LBM) for conjugated heat transfer is implemented with open source software OpenLB, which is extended to include radiative heat transport. The infrared intensity distribution is solved and coupled with the temperature through the emissivity, absorption and scattering of the studied media using the radiative transfer equation by means of LBM. This new holistic approach provides a distinct advantage over similar porous media approaches by providing direct control and tuning of particle packing characteristics such as aggregate size, shape and pore size distributions and studying their influence directly on conduction and radiation independently. Our aim is to generate one holistic tool which can be used to generate silica geometry and then simulate automatically the thermal conductivity through the generated geometry.     

动载下轴向槽道热管传热分析

研究超音速飞机气动加热管温度优化控制问题,热管是超音速战斗机机翼热防护中减少机翼与背景环境温差的传热元件,而目前关于动载下热管传热流动特性的研究报道较少.为了建立热传导的控制数学模型,在分析热管工作机制的基础上,建立了轴向槽道热管液相和气相传热流动数学模型.通过有限体积法分别计算出气液相模型,利用不可压缩层流模型推导出了稳态下热管中两相的壁面温度分布情况,了解到旋转产生的离心力对气相的传热影响很小,对液相区的影响较大.通过仿真比较,仿真温度分布和的实验数据基本一致,满足工程要求.为热管在机翼热防护中的优化传热奠定基础.     

降膜蒸发过程的数值模拟和传热传质分析

利用CFD软件对逆流降膜蒸发过程进行了实验模拟研究,研究了速度边界层、热边界层和浓度边界层的变化对降膜蒸发传热传质特性的影响规律;通过建立一维逆流降膜蒸发的数学方程编程求解出了对流传热传质的Nu数和Sh数,利用Fluent软件模拟出的实验结果采用回归分析得出了气液流量比Raw、流道的长宽比αL、空气进口无量纲温度θai以及空气进口Re数与Nu数、Sh数之间的无量纲关系式,可为降膜蒸发换热器的设计提供参考。     

Capillary driven movement of gas bubbles in tapered structures

This article presents a study on the capillary driven movement of gas bubbles confined in tapered channel configurations. These configurations can be used to transport growing gas bubbles in micro fluidic systems in a passive way, i.e. without external actuation. A typical application is the passive degassing of CO₂ in micro direct methanol fuel cells (μDMFC). Here, a one-dimensional model for the bubble movement in wide tapered channels is derived and calibrated by experimental observations. The movement of gas bubbles is modelled on straight trajectories based on a balance of forces. The bubble geometry is considered as three dimensional. In the development of the model, the effects of surface tension, inertia, viscosity, dynamic contact angle and thin film deposition are considered. It is found that in addition to viscous dissipation, the dynamics related to the contact line—dynamic contact angle and thin film deposition—are essential to describe the gas bubble’s movement. Nevertheless, it was also found that both of these effects, as modelled within this work, have similar impact and are hard to distinguish. The model was calibrated against experiments in a parameter range relevant for the application of travelling gas bubbles in passive degassing structures for μDMFCs.     

MEMS-based resonant heat engine: scaling analysis

In this article, a scaling model of a MEMS-based resonant heat engine is presented. The engine is an external combustion engine made of a cavity encapsulated between two thin membranes. The cavity is filled with a saturated liquid–vapor mixture working fluid. Both model and experiment are used to investigate issues related to scaling of the engine. The results of the scaling analysis suggest that the performance of the engine is determined by three major factors: geometry of the engine, speed of operation, and thermal-physical properties of engine components. Larger engine volumes, working fluids with higher latent evaporation property, slower engine speeds, and compliant expander structure are desirable. In experiments, the expander membrane material and thickness, and the thickness of engine cavity are varied. The experimental measurements show that the velocity amplitude of the expander membrane increases by approximately a factor of 20 when more compliant structure with less thermal inertia is used.     

Size effect on heat transfer in micro gas sensors

Gas gap is usually used as an important thermal insulation in micro gas sensors to reduce the heating power. The heat transport through the gap consists of two parts, heat conduction by air and thermal radiation between surfaces. It is usually regarded that thermal radiation through the gap is negligible compared with conductive heat transfer by air. This work investigates the heat transport by thermal radiation and heat conduction through a broad size range of gas gaps from one nanometer to dozens of micrometers. The result shows that thermal radiation is the major way of heat transfer when the gap is less than 20 nm, which will result in unexpected high energy consumption in the process of minimization. The equivalent thermal conductivity of thermal radiation is computed and a partition map is depicted to demonstrate the relative importance of radiation and conduction on different gap scales under dissimilar surface temperatures. A practical gas sensor heated by a micro hotplate (MHP) is thermally analyzed. The calculation shows that extra energy consumption comes forth as the gap distance reduces to several tens of nanometers.     

Dynamic characteristics of a coupled journal and thrust hydrodynamic bearing in a HDD spindle system due to its groove location

 This research numerically analyzes the dynamic characteristics of a coupled journal and thrust hydrodynamic bearing due to its groove location which has the static load due to the weight of a rotor in the axial direction and the dynamic load due to its mass unbalance in the radial direction. The Reynolds equation is transformed to solve a plain member rotating type of journal bearing (PMRJ), a grooved member rotating type of journal bearing (GMRJ), a plain member rotating type of thrust bearing (PMRT), and a grooved member rotating type of thrust bearing (GMRT). FEM is used to solve the Reynolds equations in order to calculate the pressure distribution in a fluid film. Reaction forces and friction torque are obtained by integrating the pressure and shear stress along the fluid film, respectively. Dynamic behaviors, such as whirl radius or axial displacement of a rotor, are determined by solving its nonlinear equations of motion with the Runge–Kutta method. This research shows that the groove location affects the pressure distribution in the fluid film and consequently the dynamic performance of a HDD spindle system. Received: 5 July 2001/Accepted: 17 October 2001     

Evaporative heat transfer characteristics of industrial safety helmets

Thermal discomfort is one of the major complaints from the wearers of industrial safety helmets. While studies have been reported on dry heat transfer (conduction, convection and radiation) in safety helmets, the investigation of wet heat dissipating (evaporation) properties has not been found in the literature. To evaluate experimentally the evaporative heat transfer characteristics of industrial safety helmets, a method was developed to simulate sweating of a human head on a thermal head manikin, and to use this manikin to assess the wet heat transfer of five industrial safety helmets. A thermal head manikin was covered with a form-fitting cotton stocking to simulate 'skin'. The skin was wetted with distilled water to simulate 'sweating'. A form-fitting perforated polyethylene film was used to cover the wetted stocking to control the skin wettedness at two levels, 0.64 and 1.0. Experiments were conducted in a climatic chamber, under the following conditions: the ambient temperature = head manikin surface temperature = 34 +/- 0.5 degrees C; ambient relative humidity 30% and 60%. Also, the effects of wind and a simulated solar heat load were investigated. The five helmets showed statistically significant difference in evaporative heat transfer under the experimental conditions. Skin wettedness, ambient humidity, wind and solar heat showed significant effects on evaporative heat transfer. These effects were different for the different helmets.     

滴状冷凝传热的理论模型与计算

滴状冷凝传机理已有一些报道，作者提出了一个新的观点并建立了一个计算滴状冷凝传热的新模型，模型通过计算液滴之间的液膜传热和液滴传热并结合液滴分布，获得了滴状冷凝的总传热系数。该模型仅含少量几个主要参数，如温差，液膜厚度，脱离液膜半径及液滴尺寸分布，滴状冷凝的传热系数和热通量的理论计算结果与文献值符合较好，说明该模型能较好地描述滴状冷凝传热的实际行为。     

SnO_2-ZnO复合膜特性研究

用真空蒸发的方法,在1.33×10-3Pa的真空中,蒸发SnO2,ZnO获得超微粒结构的SnO2-ZnO复合膜。当复合膜中ZnO质量分数为20%时,SnO2-ZnO复合膜对乙醇气体的灵敏度为40,膜的方电阻值也较低,为0.01×103Ω/□。复合膜经热处理后,其电学性能也得到改善,当温度t=600℃时,ZnO质量分数为20%的SnO2-ZnO复合膜热处理后,其膜对乙醇气体有较高的选择性,灵敏度为60。当t=400℃时,对掺有Sb2O5质量分数为450×10-6,ZnO质量分数为20%的SnO2-ZnO复合膜进行热处理,其方电阻仅为0.003×103Ω/□,具有优良的导电性能。