模态试验在梁损伤诊断中的应用研究

针对位移模态参数对结构损伤欠敏感，应用应变模态试验技术诊断结构损伤位置和程度。根据模型梁试验，重点比较研究损伤对位移模态、应变模态影响规律及其灵敏程度。得出应变模态对非节点损伤非常敏感，在损伤处附近发生突变，应变值分布也有较明显改变，尤其是跨中损伤第一阶、四分之一跨损伤第三和第二阶。     

板级跌落碰撞下无铅焊点的有限元分析

为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效,采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布.首先建立圆形电路板(PCB)组件的有限元模型,接着用模态试验和有限元模拟相结合的方法确定有限元模型的边界条件和PCB的阻尼参数,然后运用ABAQUS有限元软件模拟PCB组件从三种高度下跌落碰撞过程中BGA封装中无铅焊点的拉应力分布.结果表明:封装最外圈四个拐角焊点的拉应力最大,最大拉应力出现在焊点靠近封装的一侧.由此预测最外圈拐角的焊点最易失效,焊点失效的位置在靠近封装一侧.     

微尺度CSP焊点温振耦合应力应变有限元分析

建立了微尺度芯片尺寸封装(CSP)焊点三维有限元分析模型,对模型进行了热结构耦合分析和温振耦合分析,获得了微尺度CSP焊点应力应变分布结果;对比分析了微尺度CSP焊点与常规尺寸CSP焊点的应力应变分布;分析了不同焊料、焊盘直径和焊点体积对微尺度CSP焊点应力应变的影响。结果表明:温振耦合条件下,微尺度CSP焊点内应力应大于常规尺寸CSP焊点应力应变;在SAC305、SAC387、63Sn37Pb、62Sn36Pb2Ag四种焊点材料中采用SAC387的焊点最大应力最大;焊点最大直径由105μm减小至80μm时,微尺度CSP焊点内应力应变呈现出减小的趋势;焊盘直径由80μm减小至60μm时,微尺度焊点内应力应变呈现出增大的趋势。     

边缘定位胶焊接头的应力应变分布和强度研究

采用强塑性有限元分析和试验研究方法,考察了焊点间距对两种搭接区边缘定位胶焊接头中应力应变分布及接头强度的影响。结果表明：两种接头中两焊点处的应力应变分布基本相同;采用环氧树脂基胶粘剂时,应力变主要分布在搭接区边缘,改变焊点间距基本不影响接头搭接区边缘处的应力应变值;     

微尺度CSP焊点弯振耦合应力应变分析与优化

建立了微尺度芯片尺寸封装(chip scale package, CSP)焊点三维有限元模型,对其进行了弯振复合加载应力应变仿真分析。分析了焊点材料、焊点直径、焊点高度和焊盘直径对微尺度CSP焊点弯振耦合应力应变的影响;选取焊点直径、焊点高度和焊盘直径为设计变量,设计了17组不同水平组合的焊点模型并获取了相应焊点最大弯振耦合应力,采用响应曲面法建立了焊点弯振耦合应力与焊点结构参数的回归方程,结合粒子群算法对焊点结构参数进行了优化。结果表明:焊点材料为SAC387时弯振耦合应力最大,最大弯振耦合应力应变随焊点高度和焊盘直径增大而减小、随焊点直径增大而增大;最优焊点结构参数水平组合为焊点直径0.18 mm、焊点高度0.16 mm和焊盘直径0.15 mm;优化后CSP焊点最大弯振耦合应力下降了8.49%。     

裂纹对空间框架固有频率影响的数值分析

利用有限元方法,对不同位置、不同深度和不同方位裂纹引起的空间框架结构固有频率改变进行了比较分析,将有限元分析得到的梁单元模态应变能力分解为拉压、扭转和弯曲模态应变能,并对结构固有频率改变量随裂纹位置变化的曲线与这些模态应变能分布曲线进行了对比分析。     

高速列车转向架构架应力频率特征分析

建立了转向架构架有限元模型,得到了构架自由模态和约束模态的固有频率及振型变化。根据应变模态分析结果布置应变片,获取了列车线路运行时构架的应力时间历程,通过傅里叶变换得到了构架应力响应的频率分布。     

考虑参数随机性的约束阻尼结构振动特性分析

根据模态应变能理论建立约束阻尼结构有限元模型,基于粘弹性层的厚度和部分材料参数随机性分析,对约束阻尼结构的振动特性进行研究,分析粘弹性层的厚度和部分材料参数的随机性对约束阻尼结构模固有频率和模态损耗因子的影响。研究结果证明粘弹性结构参数随机性分析的必要性,分析方法和得出的相关结论对工程实践有一定参考。     

不同填胶方式对细间距器件焊点可靠性影响

为了获得一种较好的填胶方式来增加3D PLUS组件焊点的可靠性,采用非线性有限元分析方法和统一型粘塑性Anand本构方程,分析热循环载荷下无胶、端封、底封三种状况焊点的应力、应变分布情况及危险点位置,得到焊点应力和塑性应变周期性累积叠加并逐渐趋于平缓的规律.比较三种状态下焊点的应力、塑性应变的最大值及其变化规律,分析结果表明底封方式能有效的改善焊点的应力、应变状况.改变底封方式胶粘剂的线膨胀系数,找到线膨胀系数对焊点应力、应变影响规律,选出较优线膨胀系数的胶粘剂.     

无铅焊点在跌落冲击载荷下动态特性研究

针对JEDEC标准板的局限性，设计了一种圆形PCB，建立了无铅焊点三维有限元模型，运用ABAQUS有限元分析软件对设计板在跌落冲击载荷下的动态特性进行模拟仿真，找到了封装中焊点的薄弱环节，得出焊点的应力状况与PCB板的挠曲变形存在一致的对应关系，验证了PCB板在跌落冲击过程中弯曲振动导致的交变应力是焊点破坏的原因。     

热循环条件下SnAgCu/Cu焊点金属间化合物生长及焊点失效行为

研究了热循环过程中SnAgCu/Cu焊点界面金属间化合物的生长规律及焊点疲劳失效行为。提出了热循环条件下金属间化合物生长的等效方程以及焊点界面区不均匀体模型,并用有限元模拟的方法分析了热循环条件下焊点界面区的应力应变场分布及焊点失效模式。研究结果表明:低温极限较低的热循环,对应焊点的寿命较低。焊点的失效表现为钎料与金属间化合物的界面失效,且金属间化合物厚度越大,焊点中的累加塑性功密度越大,焊点越容易失效。     

温度对Cu颗粒增强复合钎料蠕变性能的影响

蠕变性能是影响钎焊接头可靠性的重要指标之一.采用搭接面积为1 mm2的单搭接钎焊接头,在恒定载荷下,测定了Cu颗粒增强锡铅基复合钎料钎焊接头的蠕变寿命,分析并讨论了温度对该复合钎料蠕变寿命的影响.结果表明:Cu颗粒增强的锡铅基复合钎料的蠕变抗力优于传统63Sn37Pb共晶钎料;钎焊接头蠕变寿命随温度的升高而降低,并且温度对复合钎料钎焊接头蠕变寿命的影响较传统63Sn37Pb钎料明显.     

Fracture load prediction of lead-free solder joints

Continuous and discrete SAC305 solder joints of different lengths were made between copper bars under standard surface mount (SMT) processing conditions, and then fractured under mode-I loading. The load-displacement behavior corresponding to crack initiation and the subsequent toughening before ultimate failure were recorded and used to calculate the critical strain energy release rates. The fracture of the discrete solder joints was then simulated using finite elements with two different failure criteria: one in terms of the critical strain energy release rate at initiation, G_ci, and another based on a cohesive zone model at the crack tip (CZM). Both criteria predicted the fracture loads reasonably well. In addition, the CZM was able to predict accurately the overall load-displacement behavior of the discrete joint specimen. It could also predict the load sharing that occurred between neighboring solder joints as a function of joint pitch and adherend stiffness. This has application in the modeling of the strength of solder joint arrays such as those found in ball grid array packages.     

Mixed-mode fracture load prediction in lead-free solder joints

Double cantilever beam (DCB) fracture specimens were made by joining copper bars with both continuous and discrete SAC305 solder layers of different lengths under standard surface mount (SMT) processing conditions. The specimens were then fractured under mode-I and various mixed-mode loading conditions. The loads corresponding to crack initiation in the continuous joints were used to calculate the critical strain energy release rate, J_ci, at the various mode ratios using elastic–plastic finite element analysis (FEA). It was found that the J_ci from the continuous joint DCBs provided a lower bound strength prediction for discrete 2 mm and 5 mm long joints at the various mode ratios. Additionally, these J_ci values calculated from FEA using the measured fracture loads agreed reasonably with J_ci estimated from measured crack opening displacements at crack initiation in both the continuous and discrete joints. Therefore, the critical strain energy release rate as a function of the mode ratio of loading is a promising fracture criterion that can be used to predict the strength of solder joints of arbitrary geometry subject to combined tensile and shear loads.     

随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型

对塑封球栅阵列(PBGA)封装器件Sn37Pb焊点进行了正弦振动、随机振动实验,得到各个载荷下焊点的疲劳寿命结果。建立了三维有限元模型,进行与实验条件一致的有限元分析,计算焊点的应力;将实验结果与有限元计算相结合,并基于Steinberg寿命预测模型,发展了随机振动载荷下焊点疲劳寿命预测方法。结果表明,疲劳寿命模型预测结果与实验结果吻合较好,该方法可应用于PBGA封装焊点在随机振动载荷下的疲劳寿命评估,为PBGA封装器件的设计与使用提供指导。     

High-G drop impact response and failure analysis of a chip packaged printed circuit board

This paper is concerned with constructing a high-G drop impact test condition for investigating the impact-induced failure phenomenon of the solder ball array located in the chip packaged printed circuit board. An impact environment satisfying the JEDEC B service conditions, requiring a 0.5 ms half-sine impact pulse duration with a peak acceleration at 1500 G, were constructed using an instrumented drop tower tester. Fifteen wafer-level CSP chips were installed on a standard printed circuit board (PCB) with a dimension of 132×77×1 mm³. A number of these chip packaged PCB bonded with four different compositions of solder joints with or without lead using the surface-mounted technology (SMT) were studied. During the drop impact tests, the chip packaged PCB circuit was monitored using the multi-event detector system (ETAC) to examine whether circuit fails or not. In addition, the drop impact dynamic response of the PCB and the acceleration at the prescribed location of the drop table were recorded and analyzed. Transient stress responses in the solder joints were provided using the LS-DYNA explicit code. Numerically predicted failure locations of the solder joints are close to those observed from actual drop impact experiments.     

Comparative study on stress–strain hysteresis response of SAC solder joints under thermal cycles

The present study attempts to evaluate the stress-strain hysteresis responses of SAC solder joints in Resistor and FleXBGA144 packages subjected to thermal cyclic loading using several constitutive models. The total deformation of the solder material consists of elastic, rate-independent plastic and rate-dependent creep components. The constitutive models discussed in this study each weighted elastic, plastic and creep deformations differently. At low stresses SAC solder alloys were found to be creep resistant, where at higher stresses, the influence of different microstructures disappears as matrix-creep dominates in this region. Thus, the proper constitutive model requires all the three ingredients of the elastic, the creep, and the time-independent plastic data for different stress levels to effectively predict the hysteresis behavior of the SAC solder alloys. The hysteresis loops predicted by constitutive models were also found in close agreement with the loops generated by FEM for the SAC solder joint subjected to thermal cycling.     

Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability

A comprehensive experimental and numerical study of solder joints for plastic leaded chip carrier (PLCC) 84-Pin, 1.27 mm pitch was carried out. The reliability of solder joints was assessed through accelerated thermal cycling at the temperature range of - 55℃-125℃. The samples were taken out to observe the evolution in microstructure, such as grain coarsening, initiation and propagation of cracks. It was found that the Pb-rich phases segregated gradually and formed a continuous layer adjacent to the intermetallic compound (IMC) layer with increasing the number of thermal cycles, resulting in cracks near the solder/lead interface. The response of stress and strain was studied using nonlinear finite element method (FEM), and the results agreed well with the experimental data.     

Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal aging

The interfacial microstructure of Sn-37Pb solder with immersion Au/electroless Ni-P under bump metallization (UBM) was studied using scanning electron microscopy (SEM) and electron probe micro analyzer (EPMA). A Ni₃Sn₄ intermetallic compound (IMC) layer was formed at the interface between the solder and Ni-P UBM upon reflow. However, after thermal aging, AuSn₄ containing a certain amount of Ni dissolved in it, i.e. (Au,Ni)Sn₄, appeared above the Ni₃Sn₄ layer. The shear force of the joints decreased with the aging period. The decrease of the shear force could be mainly caused by the coarsening effect of the microstructure within the solder, while the decrease after prolonged aging time should be due to the excessively grown IMC layer. A simple computational simulation was employed to interpret the failure mechanism of the shear tested specimens using finite element modeling (FEM). The FEM results explained well the ductile failure mode of the nearly whole tested joints.