共查询到20条相似文献,搜索用时 140 毫秒
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金刚石纳米颗粒粉体材料作为一种具有超硬特性、化学稳定性、良好导热性和生物相容性等优良性能的重要功能材料,有望在超精密抛光、复合镀工艺、场发射材料、隐身材料、润滑油、涂料、医疗等领域得到广泛应用[1]。目前,金刚石纳米颗粒粉体工业化规模合成的方法有:静压合成金刚石单晶粉碎、动压冲击合成金刚石聚晶和爆轰法合成纳米金刚石团簇。结合应用需求进行金刚石颗粒与形貌的再加工、表面官能化,实现颗粒在应用介质中的均匀与稳定分散,是金刚石纳米 相似文献
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本文研究了炸药爆轰合成的纳米金刚石粉的小颗粒在高温(-1000K)和高压(5.2GPa)条件下的长大行为。将纳米金刚石粉放入特制的模具中压制成小圆片,将纳米金刚石小圆片相互叠加起来放相钼套中,压实,然后将钼套置于石墨套中再放到叶蜡石块中,于高温高压下进行长大实验。实验结果表明,在此高温高压条件下,纳米金刚石粉没有石墨化;纳米金刚石粉的纳米颗粒长大,可长成1微米尺寸的金刚石颗粒(温度为1000K左右),这一现象表明,纳米金刚石颗粒表面的活性使得它可以在较低的温度长成较大的金刚石颗粒。 相似文献
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在对市售纳米金刚石进行适当的机械化学改性、分散及分级,制得粒度分布在150nm 以内、浓度可调、分散稳定、不含污染镀液成分的复合镀用纳米金刚石悬浮液的基础上,研究了工艺条件、纳米金刚石粒度和表面状态、镀液中添加表面活性剂对铬-纳米金刚石复合镀镀层性能的影响。结果表明,常规硬铬电镀工艺同样适合于铬-纳米金刚石复合镀;纳米金刚石团聚体解聚、粒度分布均匀和在镀液中稳定分散是得到高性能镀层的前提条件;颗粒能否在阴极粘附足够长的时间形成强吸附是颗粒沉积的关键,标准镀液中加入纳米金刚石镀层显微硬度反而降低,添加表面活性剂镀液中的复合镀层晶粒明显细化、显微硬度提高可达35%。 相似文献
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纳米颗粒分散方法对电刷镀复合镀层组织及性能的影响 总被引:4,自引:1,他引:4
为了解决镀液中纳米颗粒的团聚问题,采用高能机械化学法对纳米颗粒进行了分散,在扫描电镜、显微硬度计、球-盘式磨损试验机上对比考察了机械搅拌法和高能机械化学分散法对电刷镀液中纳米颗粒分布和复合镀层组织、显微硬度及含磨料油润滑条件下磨损性能的影响.结果表明,高能机械化学分散法较好地解决了纳米颗粒分散的难题,与机械搅拌法相比,高能机械化学分散法制备的电刷镀液中纳米颗粒分散均匀、团聚少、稳定悬浮时间长,复合镀层中纳米颗粒含量高,镀层组织细小、致密,显微硬度高,含磨料油润滑条件下的耐磨性能好. 相似文献
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镍 -纳米氧化铝复合电镀液的制备及影响因素研究 总被引:5,自引:0,他引:5
性质均匀稳定的镍/纳米颗粒复合镀液是制备镍/纳米复合镀层的物质和工艺基础.在瓦特镀镍溶液中加入纳米Al2O3粉末,混合液静置10 h后,因颗粒沉淀而产生不同程度的分层,通过比色法研究了分散剂、分散形式、镀液pH值对纳米Al2O3粉末在镀液中均匀稳定分散的影响.结果表明,在镀液中加入适量的聚羧酸铵、柠檬酸三铵或十六烷基三甲基溴化铵分散剂,并通过超声分散,可得到稳定分散10 h以上的复合电镀液.原子力显微镜分析表明,复合镀液中纳米颗粒的平均尺寸为63 nm,略大于其原料颗粒的尺寸(40 nm),大部分的纳米颗粒在复合镀液中能实现高度分散. 相似文献
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CVD金刚石膜高效超精密抛光技术 总被引:1,自引:0,他引:1
CVD金刚石膜作为光学透射窗口和新一代计算机芯片的材料,其表面必须得到高质量抛光,但是现存方法难以满足既高效又超精密的加工要求.本文提出机械抛光与化学机械抛光相结合的方法.首先,采用固结金刚石磨料抛光盘和游离金刚石磨料两种机械抛光方法对CVD金刚石膜进行粗加工,然后采用化学机械抛光的方法对CVD金刚石膜进行精加工.结果表明,采用游离磨料抛光时材料去除率远比固结磨料高,表面粗糙度最低达到42.2 nm.化学机械抛光方法在CVD金刚石膜的超精密抛光中表现出较大的优势,CVD金刚石膜的表面粗糙度为4.551 nm. 相似文献
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Dynamic friction polishing (DFP) is one of the most promising methods appropriate for polishing CVD diamond film with high efficiency and low cost.By this method CVD diamond film is polished through being simply pressed against a metal disc rotating at a high speed utilizing the thermochemical reaction occurring as a result of dynamic friction between them in the atmosphere.However, the relatively soft materials such as stainless steel, cast iron and nickel alloy widely used for polishing CVD diamond film are easy to wear and adhere to diamond film surface, which may further lead to low efficiency and poor polishing quality.In this paper, FeNiCr matrix-TiC composite used as grinding wheel for polishing CVD diamond film was obtained by combination of mechanical alloying (MA) and spark plasma sintering (SPS).The process of ball milling,composition, density, hardness, high-temperature oxidation resistance and wear resistance of the sintered piece were analyzed.The results show that TiC was introduced in MA-SPS process and had good combination with FeNiCr matrix and even distribution in the matrix.The density of composite can be improved by mechanical alloying.The FeNiCr matrix-TiC composite obtained at 1273 K was found to be superior to at 1173 K sintering in hardness, high-temperature oxidation resistance and wearability.These properties are more favorable than SUS304 for the preparation of high-performance grinding wheel for polishing CVD diamond film. 相似文献
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单晶金刚石因具有最高的硬度和最低的摩擦系数常被用来制备超精密刀具,而表面粗糙度是影响刀具寿命的重要指标.提出采用机械研磨结合化学辅助机械抛光的组合工艺抛光单晶金刚石.实验优化并确定的加工工艺如下:先用5μm和2μm金刚石粉研磨单晶金刚石表面,然后采用化学机械的方法去除机械研磨带来的损伤.用该工艺抛光单晶金刚石,表面粗糙度Ra可达0.8 nm(测量区域70μm×53μm).表面拉曼光谱分析表明化学机械抛光的表面只有1 332 cm-1拉曼峰. 相似文献
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Jessica M. Werrell Soumen Mandal Evan L. H. Thomas Emmanuel B. Brousseau Ryan Lewis Paola Borri 《Science and Technology of Advanced Materials》2013,14(1):654-663
Nanocrystalline diamond (NCD) thin films grown by chemical vapour deposition have an intrinsic surface roughness, which hinders the development and performance of the films’ various applications. Traditional methods of diamond polishing are not effective on NCD thin films. Films either shatter due to the combination of wafer bow and high mechanical pressures or produce uneven surfaces, which has led to the adaptation of the chemical mechanical polishing (CMP) technique for NCD films. This process is poorly understood and in need of optimisation. To compare the effect of slurry composition and pH upon polishing rates, a series of NCD thin films have been polished for three hours using a Logitech Ltd. Tribo CMP System in conjunction with a polyester/polyurethane polishing cloth and six different slurries. The reduction in surface roughness was measured hourly using an atomic force microscope. The final surface chemistry was examined using X-ray photoelectron spectroscopy and a scanning electron microscope. It was found that of all the various properties of the slurries, including pH and composition, the particle size was the determining factor for the polishing rate. The smaller particles polishing at a greater rate than the larger ones. 相似文献
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Diamond is one of the hardest and most difficult to polish materials. In this paper, the polishing of {111} and {100} single crystal diamond surfaces by standard chemical mechanical polishing, as used in the silicon industry, is demonstrated. A Logitech Tribo Chemical Mechanical Polishing system with Logitech SF1 Syton and a polyurethane/polyester polishing pad was used. A reduction in roughness from 0.92 to 0.23 nm root mean square and 0.31 to 0.09 nm rms for {100} and {111} samples respectively was observed. 相似文献
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This study explores the effect of particle size and surfactant on the chemical mechanical polishing (CMP) of glass using colloidal silica-based slurry. It was found that the material removal rate strongly depends on the particle size and the types of surfactants and that the rms roughness was independent of particle size and correlated to surfactants. On the basis of polishing results, it was concluded that the main polishing mechanism was changed from indentation mechanism to surface-area mechanism, with the variation of particle size. In addition, the molecular structure, charge type, and lubricating effect of the surfactants play an important role in the dispersion of abrasive particles and in the CMP performance. 相似文献