微胶囊铜粉对铜复合浆料性能的影响

为提高铜浆料的导电性,利用微胶囊技术在铜粉表面包覆液体石蜡,增强铜粉的抗氧化性,并添加少量导电性能优异的碳纳米管作为导电增强相,制备碳纳米管-铜复合浆料.利用四探针测试仪、扫描电镜等测试方法研究了液体石蜡含量对包覆铜粉性能的影响以及微胶囊铜粉作为主导电相,碳纳米管作为导电增强相对浆料导电性能的影响.结果表明:液体石蜡包覆含量为4 wt%的微胶囊铜粉具有良好的导电性和抗氧化性,其电导率为44.32%IACS;微胶囊铜粉作为碳纳米管-铜浆料的主导电相,制备浆料膜层电阻率为22.59 mΩ·cm,相比于未包覆的铜粉为主导电相制备的浆料膜层电阻率降低了12.44%;碳纳米管作为导电增强相所制备的浆料相比于纯铜浆料,电阻率降低31.74%.     

碳纳米管对微胶囊铜复合浆料导电性能的影响

为提高铜浆料的导电性能,利用微胶囊技术对铜粉表面做改性处理,添加碳纳米管为导电增强相,制备碳纳米管-微胶囊铜复合浆料。利用四探针测试仪、扫描电子显微镜(SEM) 等研究了微胶囊铜粉的抗氧化性能及碳纳米管的参数、添加量对铜浆料导电性能的影响,分析其导电机理并建立导电相连接模型。研究结果表明:微胶囊化的铜粉具有较好的抗氧化性和导电性。当碳纳米管与铜粉的质量比为4∶[KG-2mm]96时,采用管径1~2 nm,长度5~30 nm的碳纳米管制备的复合浆料的电阻率达到最小值6.05 mΩ·cm,与纯铜浆料相比降低了89.39%。以碳纳米管-铜复合浆料与铜浆料分别制得导电膜,两者相比,前者更平坦、更致密,导电相间的接触更紧密,大量的碳纳米管覆盖在铜粉颗粒表面或填充铜粉颗粒间隙,同时碳纳米管之间相互“吸引”,形成致密的网状结构,在铜粉颗粒之间建立起大量的导电“桥梁”,从而改善了复合浆料的导电性能。     

有机载体对石墨烯-铜复合浆料性能的影响

为提高铜浆的导电性,选用松油醇-乙基纤维素系列有机载体,粒径为10μm的铜粉为主导电相,添加少量石墨烯为导电增强相,熔点为430℃的玻璃粉为粘结剂,按一定质量分数配合比混合制备石墨烯-铜复合浆料。并利用四探针测试仪、扫描电子显微镜(SEM)等分析测试研究有机载体对石墨烯-铜复合浆料性能的影响。结果表明:乙基纤维素、松油醇、消泡剂、硅烷偶联剂、乙酸乙酯的质量分数配合比为4.75∶82.18∶2.57∶5.37∶5.13条件下制得的有机载体性能较好;有机载体用量为20%(wt,质量分数)条件下,制得的石墨烯-铜复合浆料在丝网印刷过程中能够获得平整的印刷结构,具有较小的电阻率,为17.14mΩ·cm;添加少量石墨烯后复合铜浆电阻率比纯铜浆料降低了50.22%。     

石墨烯对微胶囊铜电子浆料导电性能的影响

以丙烯酸树脂作为微胶囊壁材溶液包覆铜粉,石墨烯作为导电增强相,制备了石墨烯-微胶囊铜复合电子浆料。利用金属电导率测试仪、X射线衍射仪、四探针测试仪和扫描电子显微镜分别研究了微胶囊铜粉的电导率及其抗氧化性能,分析了石墨烯对石墨烯-微胶囊铜复合电子浆料导电性能的影响。结果表明:微胶囊铜粉与未包覆铜粉相比,电导率明显提高,且当增重率为4%(wt,质量分数)时,电导率达到最大值41.30%IACS,且不存在CuO或Cu_2O;石墨烯的加入对铜复合电子浆料的导电性能有增强作用,但不同类型石墨烯的增强效果不同,导电性能主要与石墨烯的片径、厚度、纯度相关,其中片径约5μm,厚度为1～5nm的石墨烯纳米片作为导电增强相制备的铜复合电子浆料导电性能最优。     

铜电子浆料的制备及性能

本文采用微米级铜粉为导电填料,抗坏血酸为还原剂,聚乙烯吡咯烷酮为分散剂,环氧树脂为基料,聚酰胺树脂为固化剂,制备获得空气中低温固化铜电子浆料。利用X射线衍射仪、金相显微镜、四探针电阻测试仪、粘度测试仪等对电子浆料各性能进行了表征。实验结果表明,当铜粉与有机载体的比例为85∶15时,在烘箱中75℃烘干得到的导电铜膜性能最佳,电阻率为3.627×10-3Ω·cm,空隙较少,样品表面较为平整,导电性较稳定。     

烧结温度对铜复合电子浆料烧结膜组织和性能的影响

烧结温度和玻璃粉熔点对铜复合电子浆料烧结膜的性能有重要影响。本文选用熔点为430℃的玻璃粉作为复合电子浆料的粘结相,采用四探针测试仪、扫描电镜(SEM)等方法研究了不同烧结温度下导电铜膜的电阻率及其微观结构。结果表明460℃烧结时,玻璃液粘度适中,能完全润湿、包覆铜粉,且铜粉能均匀悬浮在玻璃液中,制得的导电膜平整、致密,导电通道多,因而导电性能较好,同时玻璃液凝固、收缩使膜层与基体之间获得良好的附着力和抗老化性能。     

水泥基纳米石墨复合材料的电磁屏蔽性能

以纳米石墨微片作为导电填料,水泥作为基体,制备高导电性复合材料,研究其电磁屏蔽等性能.探讨纳米石墨微片、含水量、龄期对复合材料的导电性及电磁屏蔽效能的影响.结果表明,质量分数为15%的纳米石墨微片制得的复合材料的性能为最佳,其体积电阻率为22.3Ω·cm,电磁屏蔽效能达到22.60dB(1.5GHz).     

硼硅酸凝胶包覆层对铜粉抗氧化性和导电性的影响

铜电子浆料作为银电子浆料最为理想的替代材料,其越来越受到人们青睐,但铜的性质活泼,极易被氧化.为解决铜电子浆料在高温烧结时铜粉易被氧化的问题,以无水乙醇、正硅酸乙酯、硼酸三丁酯为原料制作SiO_2-B_2O_3溶胶,用SiO_2-B_2O_3溶胶对经过盐酸酸洗过的铜粉进行包覆,将包覆后的铜粉制成浆料并印刷到陶瓷模板上,600℃烧结制备得到铜导电膜层.通过四探针测试仪测试铜导电膜层的电导率,利用扫描电子显微镜(SEM)观察不同量溶胶包覆的铜粉的表面形貌,采用X射线衍射仪(XRD)及热重分析仪(TGA)考察溶胶包覆铜粉700℃烧结后的氧化情况.结果表明,在m(SiO_2-B_2O_3)∶m(Cu)=10%时,硼硅酸溶胶恰好均匀包覆铜粉而无多余溶胶堆积铜粉之间,此时铜导电膜层导电性能最好,其相对电导率为57%;铜粉700℃高温烧结后几乎没有被氧化,铜粉表面仅有极少量的氧化亚铜生成.实验结果证明,在合适的硼硅酸溶胶包覆率下,铜粉在700℃以下具有良好的抗氧化性,铜导电膜层也具有良好的导电性能.     

低温银包铜粉电子浆料的制备及性能研究

以银包铜粉和环氧树脂、固化剂、偶联剂、消泡剂为原料制备了低温银包铜电子浆料。采用丝网印刷将银包铜粉电子浆料印刷到玻璃片上,通过金相显微镜、万用表对固化后的试样微观和性能进行了表征。结果表明,当银包铜粉质量含量为50%,固化温度为70℃,固化时间为20min,流平时间为20min时,通过80目丝网印刷后制得的银包铜导电膜层导电性最佳为1.2Ω,在自然条件下放置120天电阻的变化率仅为23.1%,导电膜层图案完整光滑且具有良好的抗老化性能。     

Cu-30%Ag复合纳米粉的制备及其导电性能

用气-液两相稳定法在H2＋He混合气氛中制备了Cu-30%（质量分数）Ag复合纳米粉,并用制备的复合纳米粉作为导电相配制了导电浆料。用XRD、HRTEM、DSC-TG、红外光谱、化学分析、氧含量分析和电阻率测定等手段研究了粉体的相结构、表面组成、形貌、粒度、氧化特性和导电性。结果表明制备的复合纳米颗粒具有壳核结构,核为纳米Cu-30%（质量分数）Ag,壳为二乙二醇丁醚醋酸酯分子层和氧化层双层结构,粉体的粒度分布为10～60nm。在空气中,包覆在复合纳米粒子表面的二乙二醇丁醚醋酸酯分子在200℃左右脱附。在温度低于200℃时,气-液两相稳定法制备的复合纳米粉的抗氧化能力比气相稳定法制备的复合纳米粉的抗氧化能力好。Cu-30%（质量分数）Ag复合纳米粉导电浆料在烧结温度200℃、保温时间50min、真空度为5Pa条件下可获得电阻率为（1.56～3.92）×10-4Ω.cm的导电膜。     

High copper loading metal organic decomposition paste for printed electronics

A screen-printable metal organic decomposition (MOD) paste with a high copper loading has been developed. Copper precursor (copper hydroxide and copper formate) and copper flasks are used as copper sources in the paste. The copper precursor is reduced to copper nanoparticles during sintering at a temperature of 200 °C for 3 min and forms a conductive film, whereas the copper flakes are added to increase the conductivity of the printed film. The optimal formulation of the screen-printing MOD paste was obtained with a copper hydroxide to formic acid ratio of 0.875 and by adding copper flakes to reach a total copper loading of 30 wt%. The printed film after sintering had a sheet resistance of 39 mΩ/sq and a volume resistivity of 21 μΩ cm.     

Submicron Cu@glass core-shell powders for the preparation of conductive thick films on ceramic substrates

Coating Cu powders with glasses to form a core-shell structure provides an important route to achieve uniform distribution of glass components in Cu pastes for the fabrication of various electronic devices. In this study, submicron Cu powders are synthesized via a chemical solution method at first, and then coated with Bi-Si-B-Zn-Al glass by a sol-gel method to form submicron Cu@glass core-shell powders which are then prepared into Cu pastes with different glass contents. The Cu@glass pastes are printed on alumina ceramic substrates and sintered at temperatures ranging from 600 to 800 °C to form conductive thick films. Enhanced anti-oxidation properties are observed for the Cu@glass core-shell powders. The Cu pastes can be sintered into conductive films with a good electric conductivity and adhesion strength on alumina substrate at a relatively low temperature of 600 °C. A low resistivity of 3.0 µΩ cm is achieved for the sintered Cu film with a glass content of 6 wt%. The glass shells are observed to transform into uniformly distributed glass phases which provide advantages for the formation of Cu-grain conductive pathway at a low sintering temperature.     

Conductivity improvement of silver flakes filled electrical conductive adhesives via introducing silver–graphene nanocomposites

In this study, silver–graphene nanocomposites (SGNs) were successfully prepared by spontaneous reduction of silver ions and graphene oxide. Silver nanoparticles (about 30 nm) with narrow size distribution were distributed randomly on the surface of graphene. Different amounts of SGNs were introduced into silver flakes filled electrical conductive adhesives (ECAs) to study the effect of SGNs on the properties of the ECAs. The results showed that the volume resistivity of the ECAs decreased first and then increased with the increase of weight ratios of SGNs to silver flakes. While the weight ratio of SGNs to silver flakes was 20:80 (%), the resistivity reached the lowest value of 2.37 × 10^?4 Ω cm. The lap shear strength decreased with the increase of the content ration of SGNs. And when the weight ratio of SGNs to silver flakes was 20:80 (%), the lap shear strength of ECA was about 10 MPa. According to the thermogravimetric analysis, the addition of SGNs can cause a slight decrease in the thermal stability of the ECA. In summary, SGNs are the promising candidates for the conductivity improvement of silver flakes filled electrical conductive adhesives.     

A simple, low-cost approach to prepare flexible highly conductive polymer composites by in situ reduction of silver carboxylate for flexible electronic applications

In recent years, efforts to prepare flexible highly conductive polymer composites at low temperatures for flexible electronic applications have increased significantly. Here, we describe a novel approach for the preparation of flexible highly conductive polymer composites (resistivity: 2.5 × 10⁻⁵ Ω cm) at a low temperature (150 °C), enabling the wide use of low cost, flexible substrates such as paper and polyethylene terephthalate (PET). The approach involves (i) in situ reduction of silver carboxylate on the surface of silver flakes by a flexible epoxy (diglycidyl ether of polypropylene glycol) to form highly surface reactive nano/submicron-sized particles; (ii) the in situ formed nano/submicron-sized particles facilitate the sintering between silver flakes during curing. Morphology and Raman studies indicated that the improved electrical conductivity was the result of sintering and direct metal-metal contacts between silver flakes. This approach developed for the preparation of flexible highly conductive polymer composites offers significant advantages, including simple low temperature processing, low cost, low viscosity, suitability for low-cost jet dispensing technologies, flexibility while maintaining high conductivity, and tunable mechanical properties. The developed flexible highly conductive materials with these advantages are attractive for current and emerging flexible electronic applications.     

Highly conductive, printable and stretchable composite films of carbon nanotubes and silver

Conductive films that are both stretchable and flexible could have applications in electronic devices, sensors, actuators and speakers. A substantial amount of research has been carried out on conductive polymer composites, metal electrode-integrated rubber substrates and materials based on carbon nanotubes and graphene. Here we present highly conductive, printable and stretchable hybrid composites composed of micrometre-sized silver flakes and multiwalled carbon nanotubes decorated with self-assembled silver nanoparticles. The nanotubes were used as one-dimensional, flexible and conductive scaffolds to construct effective electrical networks among the silver flakes. The nanocomposites, which included polyvinylidenefluoride copolymer, were created with a hot-rolling technique, and the maximum conductivities of the hybrid silver-nanotube composites were 5,710 S cm?1 at 0% strain and 20 S cm?1 at 140% strain, at which point the film ruptured. Three-dimensional percolation theory reveals that Poisson's ratio for the composite is a key parameter in determining how the conductivity changes upon stretching.     

球状纳米二氧化钛/石墨烯复合材料的合成及导电性能

采用改进的水热法制备二氧化钛/石墨烯(TiO2/G)复合导电材料,并研究水热温度以及石墨烯用量对TiO2/G复合材料导电性的影响。利用傅里叶变换红外(FTIR)光谱、X射线衍射(XRD)、扫描电镜(SEM)、透射电镜(TEM)和电化学阻抗谱等测试手段对复合材料的结构,微观形貌以及导电性能进行表征,并确定最佳的水热温度以及石墨烯的最佳添加量。结果表明:石墨烯添加量为5%(质量分数),水热温度为160℃,TiO2/G复合材料的导电性最佳,其电阻率为13.46Ω·cm。复合材料中TiO2纳米颗粒为球状的锐钛矿相,直径为100~200nm左右,且均匀生长在石墨烯片层表面。其中,TiO2纳米颗粒生长于石墨烯片层上,有效地阻止石墨烯片层的聚集,有利于石墨烯片层间形成导电网络,提高电子迁移效率,赋予二氧化钛复合材料优异的导电性能。     

纳米Ag链的制备及其在聚氨酯基柔性导电复合材料中的应用

针对柔性聚合物基导电复合材料的导电性差和柔性差这2个关键问题,分别从导电填料的柔性化及降低填料含量2方面着手,以脱氧核糖核酸（DNA）大分子链作为模板,制备了大小均一、链状排列的柔性纳米Ag链及纳米Ag链填充的聚氨酯基柔性导电复合材料。利用SEM对纳米Ag链/Ag包Cu粉/聚氨酯导电复合材料的界面结构进行了表征,探讨了纳米Ag链/Ag包Cu粉/聚氨酯导电复合材料导电性及柔性的机制。研究发现:保持导电填料总质量分数为76%、纳米Ag链的质量分数为4%时,纳米Ag链/Ag包Cu粉/聚氨酯导电复合材料的电阻率及形变前后的电阻变化比值达到最佳值,分别为2.13×10-4 Ω·cm和3.6;当以纳米Ag链为单一填料时,制得的纳米Ag链/聚氨酯导电复合材料具有优异的柔性;泡沫法制备的纳米Ag链/聚氨酯导电复合材料可以在低填料质量分数时达到更高的导电性,当纳米Ag链质量分数为60%时,方阻为56 Ω/sq,低于共混法制备的填料质量分数为65%时的纳米Ag链/聚氨酯导电复合材料（98 Ω/sq）。      

Microstructure and electrical property of copper films on a flexible substrate formed by an organic ink with 9.6 % of Cu content

An organic copper ink with 9.6 wt% of Cu content derived from a short carbon chain organic copper precursor was successfully applied on a modified PI substrate and easily formed a favorable conductive copper film by self-reduction in the sintering process, which showed excellent conductivity. The effects of sintering temperature and time on the microstructure and conductivity action of the copper films were studied by XRD, EDS and SEM and electrical measurements, respectively. The sheet resistance and resistivity were determined to be as low as 0.11 Ω/□ and 2.2 × 10^?5 Ω·cm. The conduction mechanism is discussed in terms of the percolation theory.     

Enhancement of thermal and electrical conductivities of cyanoacrylate by addition of carbon based nanofillers

Nanocomposites with addition of graphite nanoparticles, multi-walled carbon nanotubes (MWCNTs), and graphene in cyanoacrylate from 0.1 to 0.5 or 0.6 vol% were fabricated. The influences of morphology towards thermal and electrical conductivities of cyanoacrylate nanocomposites were studied. Microstructure based on field emission scanning electron microscopy and transmission electron microscopy images indicated that nanofillers have unique morphologies which affect the thermal and electrical conductivities of nanocomposites. The maximum thermal conductivity values were measured at 0.3195 and 0.3500 W/mK for 0.4 vol% of MWCNTs/cyanoacrylate and 0.5 vol% of graphene/cyanoacrylate nanocomposite, respectively. These values were improved as high as 204 and 233% as compared with the thermal conductivity of neat cyanoacrylate. Nanocomposites with 0.2 vol% MWCNTs/cyanoacrylate fulfilled the requirement for ESD protection material with surface resistivity of 6.52?×?10⁶ Ω/sq and volume resistivity of 6.97?×?10⁹ Ω m. On the other hand, 0.5 vol% MWCNTs/cyanoacrylate nanocomposite can be used as electrical conductive adhesive. Compared with graphene and graphite nanofillers, MWCNTs is the best filler to be used in cyanoacrylate for improvement in thermal and electrical conductivity enhancement at low filler loading.