金属薄膜屈服强度的鼓包法表征

本文采用鼓包法研究金属薄膜的屈服强度,对具有圆形自由窗口的镍薄膜一侧施加压力,薄膜受压变形的全场形貌用数字散斑相关法(DSCM)进行测量,并应用板壳理论分析小挠度变形下膜内应力分布情况。结果表明:圆形薄膜受压时首先从边缘开始屈服,从压力-挠度曲线偏离线性关系的临界点得到金属镍膜的屈服强度为467MPa,这和单轴拉伸法测量所得到的屈服强度值吻合较好。     

圆柱型各向异性材料中螺型位错与非理想界面圆形夹杂的干涉效应

研究了圆柱型各向异性材料中螺型位错与含非理想界面圆形夹杂的弹性干涉问题。利用复变函数方法,获得了圆形夹杂和无限大基体区域复势函数的精确级数形式解答。利用Peach-Koehler公式导出作用于螺型位错上的位错力公式。主要讨论了材料各向异性性质与界面非理想性对位错力的影响规律。分析结果表明,界面非理想性吸引位错,而各向异性夹杂排斥各向同性基体材料中的位错。当夹杂的各向异性程度大于基体时,位错在非理想界面附近存在一个平衡位置。当界面非理想程度系数不变时,夹杂各向异性程度系数存在一个临界值改变作用在位错上位错力的方向。     

固溶时间对半固态挤压成形Al-17Si-4Cu-0.5Mg合金组织及力学性能的影响

采用半固态挤压成形工艺制备过共晶Al-17Si-4Cu-0.5Mg合金,研究固溶时间对过共晶Al-17Si-4Cu-0.5Mg合金组织及性能的影响.结果表明,随着固溶时间的增加,Si相出现球化,固溶时间为10 h时,共晶Si的圆整度为0.72.铸态下Si相周围富集较高浓度的Cu元素,固溶1 h后,Cu元素快速固溶到基体中.固溶时间从1 h增加到16 h,在XRD曲线上的θ(Al2 Cu)和Q(Al5 Si6 Cu2 Mg8)相的衍射峰强降低,合金基体中的位错密度大量减少.经180℃,时效处理12 h后,组织中析出针状的θ'相和短棒状的Q'相.随着固溶时间的增加,合金强度值呈现"双峰"现象.固溶1h后,合金的抗拉强度为269 MPa,屈服强度为233 MPa,与未热处理合金相比,抗拉强度和屈服强度分别提高了43.3％和42.7％,合金强度的提高是由于在固溶初期基体中仍有较大的位错密度,时效处理后析出相对位错有较强的钉扎阻碍作用.固溶时间为10 h时,合金的抗拉强度为311 MPa,屈服强度为263 MPa,达到第二个强度峰值,Si相的圆整化和细小析出相的弥散强化作用是形成第二个强度峰的主要原因.     

位错与含裂纹非理想界面圆形夹杂的干涉效应

研究了基体中任意位置的螺型位错与含裂纹非理想界面圆形弹性夹杂的干涉力学问题。运用复变函数的解析延拓技术与奇性主部分析方法,获得了该问题复势函数的一般解答。作为典型例子,求出了非理想圆形界面含一条裂纹时基体和夹杂区域复势函数的封闭形式解。计算了作用在螺型位错上的位错力。讨论了含裂纹的非理想界面以及材料失配对位错力的影响规律。结果表明:与含裂纹理想界面相比,非理想界面对位错力的影响更大,对位错的捕获能力更强。硬夹杂时,可能存在非稳定平衡点,使得非理想界面、界面裂纹和夹杂对位错的作用力为零;软夹杂时,非理想界面、界面裂纹和夹杂则始终吸引位错。     

掺杂类金刚石薄膜制备及其摩擦性能的仿真研究

在分子动力学(Molecular dynamics,MD)仿真中利用高温加热和快速淬火,模拟制备出分别含有Cu或Si夹杂的类金刚石(DLC)薄膜,再通过刚性压头对表面的磨损,研究了夹杂含量(0%～30%)及位置分布(上、中、下)对材料摩擦性能的影响。仿真制备出的DLC薄膜密度为2.79g/cm~3,sp~2、sp~3杂化比例分别为36%、62%。摩擦结果表明,对于含Si-DLC复合薄膜,Si-C原子成键影响了材料中sp~3杂化比例,造成摩擦力随着夹杂含量的增加而下降;含Cu-DLC复合薄膜中Cu与C不成键,但一定量的Cu原子能够积聚造成滚珠效应,其摩擦力随夹杂含量增加先增后减。当两种夹杂仅分布在薄膜被摩擦的表面区域时,摩擦力均随夹杂含量的增加而下降;而分布在薄膜中间或底层时,表面的形变受到结构的阻碍难于传播到稍远的中间位置或最底层,因此,当中间层和最低层的夹杂含量改变时对表面磨擦性能的影响不大。     

Cu对9Ni钢强度和低温韧性的影响

研究了Cu含量(质量分数)对9Ni钢强度和低温韧性的影响,并结合显微组织观察和精细结构分析了含铜9Ni钢的强韧化机理.结果表明,经过淬火+两相区淬火+回火(QLT)处理,Cu含量由0提高到1.5%,9Ni钢的室温屈服强度和抗拉强度分别提高约150和105 MPa;随着Cu含量的提高-196℃低温冲击功呈现先增加后降低的趋势,Cu含量为1.0%时达到最高值157 J,而所有含铜9Ni钢的冲击功均保持在较高的水平。随着Cu含量的增加,钢中二次回火马氏体增加而铁素体减少;颗粒或短杆棒状Cu析出物在基体上析出,组织强化与析出强化共同使钢的强度提高。同时,Cu的加入提高了二次回火马氏体板条边界上的逆转奥氏体含量,并富集于逆转奥氏体中提高其稳定性,从而提高了钢的低温韧性。     

原位自生TiB2/Al-4.5Cu复合材料微观组织和力学性能

采用混合盐反应法制备TiB2含量分别为0%,2%,5%,8%(质量分数,下同)的TiB2/Al-4.5Cu复合材料,T6热处理后,采用XRD,ICP,OM,SEM,EDS等测试手段和室温拉伸实验进行微观组织观察和力学性能测试。XRD和ICP测试证实,合金体系中仅含α-Al,Al2Cu及TiB2,无Al3Ti,Al2B等反应中间产物。OM和SEM发现,基体材料中α-Al平均晶粒尺寸为167.5μm,而在2%,5%,8%的TiB2/Al-4.5Cu中,其平均晶粒尺寸依次为110.4,87.2,75.2μm,晶粒细化效果显著。TEM观察发现,TiB2颗粒主要分布在晶界处,呈四方和六方结构。室温拉伸实验表明,随着TiB2含量的增加,强度、显微硬度值均呈增加趋势,但伸长率不断下降。当加入8%TiB2时,屈服强度、抗拉强度、弹性模量和显微硬度分别达到356 MPa,416 MPa,92.5GPa和96.5HV,但其伸长率从10.3%降低到4.3%。载荷传递强化、细晶强化、位错增殖强化是TiB2/Al-4.5Cu复合材料力学性能得以大幅提升的影响因素,尤其是在位错增殖强化作用下,TiB2颗粒周边致密分布的位错胞、位错环对强度的提升起到了决定性作用。     

热挤压Mg-3Sn-1Zn-xCu合金的显微组织与力学性能

研究了添加Cu对热挤压Mg-3Sn-1Zn合金显微组织和力学性能的影响。结果表明:添加少量Cu能显著细化热挤压Mg-3Sn-1Zn合金晶粒,同时在合金中形成具有高热稳定性的CuMgZn相,提高了合金的室温及高温强度和塑性。当Cu含量为0.5%时,热挤压Mg-3Sn-1Zn-0.5Cu合金的晶粒最细,为2.8 μm;其强度和塑性最高,室温屈服强度为241 MPa,伸长率为20.3%,150 ℃时屈服强度为128 MPa,室温拉伸力学性能优于挤压态AZ31B合金,高温强度优于铸态AE42合金。     

不同应变率下纳米多晶Cu/Ni薄膜变形行为的分子动力学模拟

用分子动力学方法模拟了纳米多晶Cu/Ni薄膜在不同应变率下进行应变加载时的变形行为与力学性能.结果表明:Cu/Ni薄膜在较高的应变率加载情况下具有较高的屈服极限和应变率敏感性(m).应变率为108s1时Cu/Ni多层膜的界面上产生孔洞,而应变率为1010s-1时纳米多晶Cu薄膜出现碎裂.在较高的应变率加载条件下,Cu,Ni薄膜中FCC,HCP,OTHER原子团分数变化都很显著,而较小应变率时只有Cu薄膜的结构变化明显.模拟结果还表明,应变率增加有利于堆垛层错的形成,但应变率超过某一值时无序原子团增加会阻碍堆垛层错原子团的生长.     

轧制温度对Al−4.5Cu−1.5Mg−0.5Zr合金显微组织及性能影响

目的 优化加工工艺,改善合金的组织,提高合金的力学性能。方法 采用金相(OM)观察、拉伸试验和X射线衍射,分析在大应变轧制下冷轧结合T6态处理后板材的成形性能,引入Williamson-Hall模型和Taylor函数,分析合金内部位错密度的变化规律及其对力学性能的影响。结果 随着前期轧制温度从350 ℃升高到400 ℃,合金晶粒得到明显细化,再结晶充分,晶粒尺寸细小,晶界处第二相粗大;冷轧后晶粒破碎严重,晶粒的碎化方向与轧制方向垂直;在350 ℃时,合金内部的位错密度为1.62×10¹⁵ m^?2,位错密度对强度的贡献值为219.5 MPa,其抗拉强度最大为602 MPa、屈服强度为512 MPa、伸长率为12.6%。结论 Al?4.5Cu?1.5Mg?0.5Zr合金的晶粒组织明显细化,其力学性能得到提升。     

Auger electron spectroscopy of high-speed-deformed Ni/Cu layers

Ni/Cu double- and multilayers subjected to high-speed deformation were investigated by Auger electron spectroscopy (AES) using depth profiling. Ni and Cu thin films were alternately deposited on a 0.3 mm thick Ni substrate using RF magnetron sputtering. The thickness of the double-layer was 90 nm, while that of the multilayer was 160 nm. High-speed compression was performed using bullet masses from 30.0 to 57.4 g at varying bullet speeds between 16.8 and 48.5 m s⁻¹. The strain rate ranged from 6.7×10⁴ to 8.4×10⁵ s⁻¹. Upon high-speed deformation, the thickness of the Ni/Cu double-layer was reduced to about 80% of its original value. The Cu thin film was compressed to a greater extent relative to the Ni thin film (by about 15%), which may be due to the difference in malleability between the two metals. At a strain rate of 8.4×10⁵ s⁻¹, the Ni/Cu double-layer virtually disappeared. Ni/Cu interdiffusion was enhanced by high-speed deformation. The degree of interdiffusion appeared to be greater at lower strain rates. Cu_0.5Ni_0.5 and Cu_0.75Ni_0.25 thin film alloys formed in the high-speed-deformed multilayer sample, indicating that high-speed compression could potentially be used to prepare thin film metal alloys.     

Effect of Cu addition on microstructures and tensile properties of high-pressure die-casting Al-5.5Mg-0.7Mn alloy

In this study, Cu was added into the high-pressure die-casting Al-5.5Mg-0.7Mn (wt%) alloy to improve the tensile properties. The effects of Cu addition on the microstructures, mechanical properties of the Al-5.5Mg-0.7Mn alloys under both as-cast and T5 treatment conditions have been investigated. Additions of 0.5 wt%, 0.8 wt% and 1.5 wt% Cu can lead to the formation of irregular-shaped Al₂CuMg particles distributed along the grain boundaries in the as-cast alloys. Furthermore, the rest of Cu can dissolve into the matrixes. The lath-shaped Al₂CuMg precipitates with a size of 15–20 nm × 2–4 nm were generated in the T5-treated Al-5.5Mg-0.7Mn-xCu (x = 0.5, 0.8, 1.5 wt%) alloys. The room temperature tensile and yield strengths of alloys increase with increasing the content of Cu. Increasing Cu content results in more Al₂CuMg phase formation along the grain boundaries, which causes more cracks during tensile deformation and lower ductility. Al-5.5Mg-0.7Mn-0.8Cu alloy exhibits excellent comprehensive tensile properties under both as-cast and T5-treated conditions. The yield strength of 179 MPa, the ultimate tensile strength of 303 MPa and the elongation of 8.7% were achieved in the as-cast Al-5.5Mg-0.7Mn-0.8Cu alloy, while the yield strength significantly was improved to 198 MPa after T5 treatment.     

100nm厚铜薄膜的拉伸性能

以聚酰亚胺为基体制备了厚度为100nm的金属铜薄膜，利用基体的高弹性变形测定了铜薄膜的屈服应力，并研究了铜薄膜的形变与断裂行为．结果表明：使用铜薄膜／聚酰亚胺复合体能够测量出铜薄膜的屈服强度，厚度100nm的铜薄膜的屈服强度明显高于厚铜膜的屈服强度，厚度100nm铜薄膜的断裂为Ⅰ型沿晶断裂．超薄铜薄膜较高的屈服强度归因于小尺度材料中纳米量级的薄膜厚度和晶粒对位错运动的约束作用．     

镍包碳纤维填充导电橡胶薄膜的制备及性能

采用喷涂法制备了镍包碳纤维(CF@Ni)填充型柔性导电橡胶薄膜,探究了球形Ni粉颗粒对导电橡胶流动性及导电性的影响,研究了导电CF@Ni/橡胶薄膜的抗折叠性能以及薄膜与铝合金基体之间黏附强度。结果表明:以CF@Ni为主掺杂少量球形Ni的复合填料所制备的导电橡胶薄膜,电阻率在10-1Ω·cm级别;且随Ni粉增加,其电阻率不发生显著变化,但液态导电CF@Ni/橡胶流动性明显提高;喷涂获得的薄膜在0.2 MPa压力经100次折叠周期后,其导电性无明显下降;喷涂薄膜与铝合金基体之间的黏附强度约为0.219 MPa。所制备的导电CF@Ni/橡胶薄膜具有良好的导电性和抗折叠性能,导电橡胶薄膜中CF@Ni起主要导电作用,球形Ni粉不影响薄膜导电性,但在喷涂过程中有"润滑"作用,提高了喷涂效率。     

微量Al添加对铜基大块非晶合金性能的影响

为了进一步提高铜基大块非晶合金的玻璃形成能力及力学性能,采用添加微量Al元素的方法对块体非晶合金Cu52.5Ti30Zr11.5Ni6进行了成分优化.热分析与X射线衍射结果显示,随着微量Al的添加,液相线温度从非晶合金Cu52.5Ti30Zr11.5Ni6的1150 K逐步降低到Cu50.5Ti30Zr11.5Ni6Al2的1134 K,临界直径相应的从5 mm提高到6 mm.大块非晶Cu50.5Ti30Zr11.5Ni6Al2的压缩断裂强度达到2286 MPa,比经典的铜基非晶合金Cu47Ti34Zr11Ni8提高约100 MPa,表明微量Al的添加在有效提高玻璃形成能力的同时,强度也略有提高.     

钛合金表面微弧氧化纳米防污涂层及性能研究

利用微弧氧化技术,在Ti-6Al-3Nb-2Zr合金表面成功制备出纳米防污陶瓷涂层。采用扫描电镜、透射电镜和光学显微镜分析了纳米防污涂层的表面形貌、微观形态和氧化层厚度,采用X射线光电子能谱和X射线能谱仪对防污涂层的元素价态和化学组成进行了分析,采用WS-1型划痕试验机和数字万用表研究了涂层的结合强度和绝缘性,并采用TE66微磨损试验机和进行天然海水挂片试验考察了涂层的摩擦学性能和防污性能。结果表明:防污涂层厚度可达到20μm以上,涂层有非晶和20—50 nm纳米晶TiO2及Cu2O构成,膜基结合强度达到50 MPa,涂层绝缘性和耐磨性良好,防污性能得到明显改善,挂片6个月后涂层表面仅有少量海生物附着,而裸钛合金样品挂片3个月后则完全被海生物附着。     

Measurement of yield strength of thin metal film

Based on measurement of the load-depth curve in nanoindentation, the yield strength of thin metal film on Si substrate can be determined with the model of finite element analysis. An example is given of thin Cu film and the result shows that the yield strength thus determined can eventually reflect changes of processing condition both in deposition and in post-treatment. The yield strength and its variation can be explained in terms of grain orientation and grain size.     

SEM in-situ investigation on failure of nanometallic film/substrate structures under three-point bending loading

Three-point bending tests on nanocrystalline Cu or Cu/Ni-film/Cu-substrate samples were conducted in-situ with scanning electron microscopy (SEM) observations. The SEM in-situ observations show undulation deformation of the surface of thin film, as the thin film fractures easily at the concave–convex points of deformation and multi-cracks appear on the surface of the thin film in a periodic fashion. The critical wavelength of undulation is calculated based on experimental observations, which are comparable with the theoretical predictions. For the Cu/Ni multi-layered films/substrate structures, the micro-cracking pattern depends on the interfacial strength between the film and the substrate, rather than the interfacial strength between the layers of films.     

Ni（OH）2水热氢还原制备超细Ni粉

采用ＮｉＳＯ４加过量碱制取的Ｎｉ（ＯＨ）２水浆（ｐＨ１２－１３），经氢还原￣３０ｍｉｎ制得平均粒度２０ｎｍ以下的Ｎｉ粉。碱是否过量对Ｎｉ粉粒度影响较大；催化剂和温度对反应速度也有较大影响。氢还原反应机制不是液相中的Ｎｉ离子还原，而昌Ｎｉ（ＯＨ）２固体微粒与活性氢之间的反应。     

Theoretical explanation of Ag/Cu and Cu/Ni nanoscale multilayers softening

Relationship between metallic multilayers hardness and monolayer thickness has been investigated and explained for electroplated Ag/Cu and Cu/Ni multilayers using a modified Thomas-Fermi-Dirac electron theory. Experiments reveal that the peak hardness of Ag/Cu multilayers occurs at the monolayer thickness of about 25 nm, while the peak hardness of Cu/Ni multilayers occurs at about 50 nm. Critical monolayer thickness corresponding to the peak hardness is approximated by the grain size limit of stable dislocations in Ag crystals for the Ag/Cu multilayers and in Cu crystals for Cu/Ni multilayers. Grains size limits are calculated based on a modified Thomas-Fermi-Dirac electron theory. Developed relationship between the critical monolayer thickness and the grains size limit helps understand nanoscale metallic multilayers softening.