NiCuNbCr焊料Ti_3Al/GH4169合金氩弧焊接头的组织及性能

采用钨极氩弧焊方法,使用自行设计制备的NiCuNbCr合金作为焊料,实现Ti3Al基合金与GH4169高温合金异种材料之间的焊接。采用扫描电镜(SEM)及能谱分析(XEDS)等方法对接头横截面的微观组织进行分析。结果表明:GH4169/焊缝界面以及焊缝均主要由Ni元素的固溶体组成,其中固溶了Cu,Fe,Cr,Nb几种元素;而焊缝/Ti3Al界面分为3层组织,其相组成从Ti3Al母材到焊缝方向依次为:固溶了Ni和Cu元素的Ti2AlNb相、Al(Ni,Cu)2Ti金属间化合物及(Nb,Ti,Mo)固溶体;(Ni,Nb,Cr)及Ni(Cu,Ti)固溶体;Ni的固溶体,固溶元素为Cu,Nb和Cr。接头的平均室温抗拉强度为140.7MPa。拉伸试样断裂于被焊Ti3Al母材表面的扩散反应层,它主要由固溶了Ni和Cu元素的Ti2AlNb相与Al(Ni,Cu)2Ti金属间化合物组成,该界面是Ti3Al/GH4169接头的薄弱环节。     

层状结构TiAl合金钎焊组织及性能

目的揭示层状结构Ti Al合金薄板采用钎料Ti-Zr-Cu-Ni时,在钎焊过程中的扩散行为,以及钎焊后的组织和力学性能。方法对焊缝及周边区域进行电子扫描(SEM)、能谱分析(EDS)、X射线衍射分析(XRD),明确钎焊过程中的扩散行为以及钎焊接头组织;对钎焊后的层状Ti Al合金进行剪切试验和纳米压痕试验,评价焊缝的力学性能。结果采用Ti-Zr-Cu-Ni钎箔钎焊Ti Al合金板材,Al元素为主要扩散元素,从母材向焊缝进行扩散,在Ti Al合金与钎料界面处生成Ti_3Al金属化合物,在焊缝处生成(Ti,Zr)_2(Cu,Ni)(s,s),Ti_2(Cu,Ni)(s,s),(Ti,Zr)_2Ni(s,s)和α-Ti。焊后接头的剪切强度为252 MPa,裂纹在母材处生成,穿过焊缝扩展到另一侧母材区域发生断裂,焊缝区硬度值高于母材,为12.8 GPa。结论选用Ti-Zr-Cu-Ni钎料在930℃下进行钎焊,能够获得质量良好的接头。     

AlNP/Al复合材料与6061Al低温连接组织演变机理及力学性能EI北大核心CSCD

为了防止在高温下连接电子器件发生破坏,并改善常用的低温SnAgCu钎料对母材25%(体积分数)AlNP/Al复合材料与6061Al合金表面的润湿性,对母材表面进行磁控溅射Ni薄层或Ti/Ni双金属薄层的预金属化处理,再用SnAgCu钎料进行连接,可得到结合良好的接头。双金属化后接头两侧界面组成为母材/Ti-Al/Ti/Ti-Ni/Ni/Ni-Sn-Cu/β-Sn+Ag3Sn。不同元素之间扩散速率的差异导致了界面反应层不同位置的物相成分差异,从镀Ni层向焊缝中心方向,反应层的物相呈(Ni,Cu)3Sn,(Ni,Cu)3Sn2,(Ni,Cu)6Sn5,(Ni,Cu)3Sn4的变化趋势。Ti元素的加入可显著提高镀Ni层与母材的结合力,在250℃下保温1-5 min,钎焊双金属化处理后的母材所得接头抗剪强度可达28-35 MPa,断裂发生在β-Sn基体中。     

铝钎焊接头中Cu元素的扩散行为研究

为了研究Al-Cu共晶合金钎料中Cu元素在钎焊接头中的扩散行为,采用快速凝固技术制备了Al-Cu共晶合金钎料,以纯铝棒料为基体采用对接接头在不同温度下进行了真空钎焊,并利用SEM和EDS对接头进行了研究.研究表明:钎料中Cu原子的扩散以晶界扩散为主,当晶界上Cu原子的浓度达到一定值后开始向晶内扩散,当晶内的Cu原子饱和后又反向扩散到晶界上;钎焊温度过低、保温时间过短时,Cu元素在基体内部不能充分扩散,在基体晶界上产生严重偏析,生成Al-Cu相中最脆的θ相(Al2Cu);提高钎焊温度和保温时间有利于提高Cu元素在Al基体中的扩散,但过高的钎焊温度又导致θ相的重新出现,选取合适的钎焊工艺参数才能获得良好的钎缝.     

Ti_3Al和Ti_2AlNb合金扩散连接界面的组织及力学性能

采用直接扩散连接Ti3Al和Ti2AlNb合金,研究了连接压力、连接温度、保温时间等工艺参数对接头界面组织形貌及性能的影响。利用扫描电镜、能谱分析和X射线衍射等方法观察分析了界面组织结构,并测试了接头的力学性能。结果表明:直接固相扩散连接接头的典型组织为Ti3Al/O相+α2相过渡层/富B2层/Ti2AlNb。当连接温度为1000℃,保温时间60min,连接压力为5MPa时获得的接头室温抗剪强度为635MPa,室温抗拉强度为795MPa,均断裂于Ti3Al母材一侧。经1000℃/60min热循环后Ti3Al母材的抗拉强度下降至原始母材的76%。连接温度低于950℃或保温时间小于60min会导致未焊合等缺陷;温度高于1050℃或保温时间超过120min则导致Ti3Al发生相变。     

TiAl合金与高温合金的扩散焊接头组织及性能

采用直接扩散焊和加中间层的扩散焊方法进行了TiAl合金和高温合金异种材料组合的连接实验。在1000℃/20MPa/1h规范下直接扩散焊获得的TiAl/GH2036接头组织中存在大量未焊合的孔洞,接头室温剪切强度平均值仅有16MPa。采用Ti-Zr-Cu-Ni合金作为中间层在935℃加压3MPa保温10min和1h进行了TiAl/GH3536组合接头的液相扩散焊,获得的扩散焊缝中含有Ti3Al,NiTi等多种物相,中间层合金与两侧母材发生作用形成了具有一定厚度的反应层。在935℃/3MPa/1h规范下获得了与两侧母材结合良好的无缺陷扩散焊接头,室温剪切强度达到125MPa。     

添加Ni箔中间层的Mg-Al扩散焊接接头界面结构和力学性能

采用扩散焊接工艺,通过添加Ni箔中间层对镁铝异种金属进行焊接。利用无损检测、电子探针、扫描电镜、万能材料试验机研究了Mg/Ni/Al焊接接头界面的组织结构和力学性能。结果表明:Ni箔中间层可以有效阻止界面处Mg,Al元素的相互扩散,接头界面处没有生成Mg-Al金属间化合物。在焊接温度440℃,保温时间90min时,接头抗剪强度达到最大值20.5MPa。Mg/Ni/Al接头由Al,Ni和Mg,Ni的相互扩散形成,接头界面形成Al-Ni过渡区和Mg-Ni过渡区,界面主要物相分别为Al3Ni2,Al3Ni和Mg2Ni,过渡区厚度随焊接温度升高而增加。     

Ti-61Ni真空钎焊TZM合金接头界面组织与力学性能

目的 研究不同钎焊温度下获得TZM/Ti-61Ni/TZM接头的微观组织演化及力学性能的变化,为获得可靠钎焊接头提供指导.方法 采用电弧熔炼方法制备Ti-61Ni,将以TZM/Ti-61Ni/TZM"三明治"结构装配的试样放入真空炉中进行不同温度(1200～1280℃)下的钎焊连接,利用SEM和EDS等手段分析钎料与母材之间的相互作用,测试接头的力学性能并分析接头断裂行为,研究温度对接头界面组织演化和力学性能的影响.结果 钎缝主要为TiNi相和TiNi3相,钎料中Ti元素向母材扩散形成Mo(s,s)扩散层;钎焊温度升高,钎缝宽度减小,TiNi相减少,钎料对TZM母材的溶蚀加剧;接头的抗剪强度先升高后下降,接头在TZM母材处断裂.结论 采用Ti-61Ni高温钎料实现了TZM合金的可靠连接,接头典型界面组织为TZM/扩散层(Mo(s,s))/TiNi+TiNi3/扩散层(Mo(s,s))/TZM;当钎焊温度为1240℃时,接头的抗剪强度达到最大值,为121 MPa.     

Si3N4陶瓷/Nb/Cu/Ni/Inconel 600界面反应层形成机制研究

观察分析了Si3N4陶瓷/Nb/Cu/Ni/Inconel600界面处反应层的形貌、元素分布、反应层中的相结构、界面反应以及反应层的生长规律,研究了Si3N4陶瓷/Nb/Cu/Ni/Inconel600界面处反应层的形成机制.研究结果表明:在连接过程中,Cu层首先熔化,Nb、Ni向液态Cu中扩散溶解形成Cu-Nb-Ni合金,液态合金中的Nb和Ni向Si3N4表面扩散聚集并与Si3N4反应形成反应层;Si3N4侧的反应层主要物相是NbN和Nb、Ni的硅化物,Ni基合金侧反应相主要是NbNi3和Cu-Ni合金;在连接温度为1403 K的条件下,随着连接时间的增加,界面反应层厚度先快速增加,再缓慢增加.     

中间层Ni对TC4/2A14异种金属搅拌摩擦焊接头组织和性能的影响

目的 添加0.05 mm厚的Ni箔作为中间层,对3 mm厚的TC4钛合金和2A14铝合金进行搅拌摩擦焊,分析Ni对接头力学性能的影响。方法 采用扫描电镜、EDS能谱及XRD衍射等微观表征分析方法,对焊接接头的断口形貌、成分进行分析,探究Ni箔对焊接接头力学性能的影响。结果 由于钛合金和铝合金存在较大的物理化学性能差异,Ti/Al异种金属焊接性较差,界面容易产生TiAl3、TiAl、Ti3Al等金属间化合物,其中脆性相TiAl3对接头性能的影响最大,会导致综合力学性能下降。当加入中间层材料Ni后,由于Ni与Al晶体结构均属于面心立方,因此Ni与Al的扩散系数大于Ti与Al的扩散系数,Ni和Al之间优先形成金属间化合物且弥散分布于焊缝中,从而缩短了Ti与Al之间的相互扩散时间,减少了TiAl3相的生成。结论 在未添加中间层材料时,接头平均抗拉强度为237.3 MPa,约为2A14铝合金母材抗拉强度的56.7%;当添加中间层Ni后,对焊缝中金属间化合物的种类和数量进行了调控,减少了对性能影响最大的TiAl3相的生成,接头平均抗拉强度达到285.3 MPa,为2A14铝合金母材抗拉强度的68%。     

Improvement of Joint Strength of SiCp/Al Metal Matrix Composite in Transient Liquid Phase Bonding Using Cu/Ni/Cu Film Interlayer

The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase （TLP） bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy （SEM） was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.     

Joining of tungsten carbide to nickel by direct diffusion bonding and using a Cu–Zn alloy

The objective of this work was to study various aspects of liquid and solid state diffusion bonding of cylindrical samples of WC (with 6% Co) and commercially pure nickel (99.5%) produced by direct bonding and brazing using a 25 μm thick 70Cu 30Zn (wt%) alloy as joining element. Joining experiments were carried out on WC/Ni and WC/Cu Zn/Ni combinations at temperature of 980 °C using 1, 15, 25 and 35 min holding times in argon (Ar). The results show that it is possible to create a successful joint at temperature and times used. Joining occurred by the formation of a diffusion zone. The joining interface is feasible because it presents a homogeneous interface with no several interfacial cracking and porosity. In both combinations, it can be observed a diffusion of cobalt decreasing in the direction of the metal, as well as, the diffusion of nickel decreasing in the direction of the ceramic.     

Diffusionslöten von Aluminium mittels PVD applizierter Lotzusatzwerkstoffe

Diffusion brazing of aluminium by PVD applied filler metals Diffusion brazing of aluminium and aluminium alloys precoated with filler metal components enables fluxless wetting and obtains braze joints of high strength at moderate brazing temperatures. Previously deposited components of filler metals on the base materials as thin film, using Arc‐PVD‐process lead during a subsequently diffusion brazing process to the formation of a local liquid phase (transient liquid phase). The liquid phase is formed from the deposited thin film material and the base material and is solidified isotherm due to diffusion procedures. In doing so braze joints of higher melting point than brazing temperature can be realised. In this work, vacuum brazing of the two systems, Al‐Cu and Al‐Cu‐Si have been investigated. Cu and Al‐Cu‐Si were deposited on the base material using Arc‐PVD‐process. The base materials were pure aluminum and EN‐AW6060. Metallographic and scanning electron microscope analyses proved that the braze seam area after the completed diffusion brazing process shows similar structure and composition as the base material.     

Diffusion bonding of Zr55Cu30Ni5Al10 bulk metallic glass to Cu with Al as transition layer

In this work we demonstrate the diffusion bonding of Zr₅₅Cu₃₀Ni₅Al₁₀ bulk metallic glass (BMG) to aluminum and copper alloy. The process parameters including temperature, pressure and time are investigated experimentally, and we obtain appropriate ones for accomplishing diffusion bonding of the BMG to aluminum alloy successfully. Then we present a two-step diffusion bonding process to bond the BMG to copper alloy by using aluminum alloy as transition layers, and achieve a five-layer bonded joint of BMG/Al/Cu/Al/BMG. The mechanical properties of the multilayer joint are examined. The hardness of the BMG in the joint is enhanced while the bending strength decreases significantly compared with the as-received BMG. Besides, the crystalline metals alleviate and block the extension of cracks in the BMG, which results in the joint fracturing in an explosion-proof glass manner, dissimilar to rupturing in a catastrophic manner that is always happened in the BMGs. Therefore, diffusion bonding of BMG to crystalline metals is a promising way to extend its application.     

Transient liquid phase bonding of magnesium alloy (Mg – 3Al – 1Zn) using copper interlayer

Abstract

The mechanism, microstructure and mechanical properties of transient liquid phase (TLP) bonded magnesium alloy (Mg – 3Al – 1Zn) joints using copper interlayers in an argon atmosphere have been investigated. The formation process of the TLP joint comprises a number of stages: plastic deformation and solid state diffusion, dissolution of the interlayer and base metal, isothermal solidification and homogenisation. The composition profiles and microstructures of the joint depend on the bonding time at a temperature of 530°C. With an increase in bonding time from 10 to 60 min, the concentration of copper and the amount of CuMg₂ compound in the joint decrease. For longer bonding times, the most pronounced features of the joint are composition homogenisation, grain coarsening and elimination of the bond line within the joint centre. The presence of brittle CuMg₂ and grain coarsening of the joint are the main reasons for impairing the joint shear strength. A joint shear strength of 70.2 MPa, which is 85.2% of the base metal strength (82.4 MPa), can be achieved by bonding at 530°C for 30 min.     

T2纯铜/2024铝合金爆炸焊接接头界面结构及性能

为研究铜铝异种金属爆炸焊接头界面形成机理,采用爆炸焊对T2纯铜和2024铝合金进行了焊接.通过光学显微镜、扫描电镜、X射线衍射、万能材料试验机和纳米压痕仪,对T2/2024复合板结合界面的显微组织、成分分布和力学性能进行了测试分析.结果表明:T2/2024合金爆炸复合板结合界面呈波状结合,结合界面主要由平直界面、波状界面和局部熔化层界面构成;靠近结合界面处,基体金属发生塑性变形,晶粒细化;反应层主要成分为AlCu和Al_2Cu的混合物.复合板拉剪试验表明,T2/2024合金爆炸复合板平均结合强度为67 MPa,纳米压痕测试反应层平均硬度可达8 GPa.     

Developing Temperature–Time and Pressure–Time diagrams for diffusion bonding AZ80 magnesium and AA6061 aluminium alloys

The principal difficulty when joining magnesium (Mg) and aluminium (Al) lies in the existence of formation of oxide films and brittle intermetallic in the bond region. However diffusion bonding can be used to join these alloys without much difficulty. In this investigation, an attempt was made to develop Temperature–Time and Pressure–Time diagrams for diffusion bonding of AZ80 magnesium (Mg) and AA6061 aluminium (Al) dissimilar materials. The bonding quality of the joints was checked by microstructure analysis and lap shear tensile testing. Based on the results Temperature–Time and Pressure–Time diagrams were constructed. These diagrams will act as reference maps for selecting appropriate diffusion bonding process parameters to join AZ80 magnesium alloy and AA6061 aluminium alloy without trial experiments.     

水下搅拌摩擦焊对铝/铜接头组织与性能的影响

目的 采用搅拌摩擦焊,对比分析大气环境和水下环境下铝/铜接头的组织与性能,以期获得力学性能更优异的铝/铜焊接接头。方法 利用搅拌摩擦焊,在焊接速度为40 mm/min、旋转速度为1 000 r/min的条件下,分别在大气环境和水下环境下对厚度为9 mm的6061铝合金板和T2纯铜板进行焊接。然后,对铝/铜界面、焊核区进行扫描电镜及能谱分析,并对铝/铜界面及焊核区进行物相分析,确定产物相组成。最后,对铝/铜试样进行拉伸及硬度检测。结果 铝/铜接头均无裂纹、气孔等缺陷。铜颗粒弥散分布在焊核区,铝/铜界面形成金属间化合物层。水下搅拌摩擦焊下界面元素扩散距离明显变短,且金属间化合物厚度更薄。铝/铜接头的金属间化合物为AlCu和Al4Cu9。大气环境焊接下接头的抗拉强度为130.6 MPa,断裂方式为脆性断裂;水下焊接下接头的抗拉强度为199.5 MPa,断裂方式为韧性断裂。水下环境下的接头硬度值更高,其中热影响区的硬度最低值约为65HV。结论 水下搅拌摩擦焊铝/铜接头无裂纹、气孔等缺陷。组织上,水下搅拌摩擦焊的铝/铜接头界面元素扩散距离更短,硬脆的金属间化合物更少;性能上,水下搅拌摩擦焊的铝/铜接头强度更高,抗拉强度达到199.5 MPa,达到母材的74.4%。     

Joining molybdenum to aluminium by diffusion bonding

The joining of molybdenum to aluminium and aluminium-copper alloy using diffusion bonding has been investigated. Bond strengths have been measured by means of a simple shear jig and the joint microstructures characterized by electron microscopy and electron-probe microanalysis. Successful joints were produced by using a copper foil interlayer to form a eutectic liquid during the bonding process which helped disrupt the oxide film on aluminium and promote metal diffusion across the joint interface. When bonding commercial-purity aluminium to molybdenum, the iron present as an impurity caused a ternary eutectic liquid to form and, after solidification of the liquid phase, a thin film of Al₇Cu₂Fe was left behind on the aluminium. Failure of this joint occurred at a shear stress of 75 MPa, with the fracture path contained within the aluminium. With super-purity aluminium, a binary eutectic liquid was produced and the ensuing interface reaction resulted in a multi-layered structure of molybdenum-containing phases. The bond failed at the molybdenum interface at a stress of 40 MPa. When bonding aluminium-copper alloy to molybdenum without a copper interlayer, general melting at the interface via eutectic phase formation did not occur and the interface showed only localized reaction. The joint failed by separation from the molybdenum, at a stress of 25 MPa. When, however, a copper interlayer was used, fairly thick regions of multi-layered molybdenum intermetallics formed and the remaining surface was covered by a layer of Al₇Cu₂Mo phase. Failure of this joint occurred at a stress of 70 MPa, mainly by separation at the molybdenum interface.     

Study of the Interface between Steel Insert and Aluminum Casting in EPC

The effective surface treatment method for steel insert composited with Al base metal by expendable pattern casting （EPC） process and the bonding interface between steel insert and Al base metal were investigated.It was found that Zn plating on steel insert was effective on improving the bonding property between steel insert and Al base metal in EPC process.Zn is thought to promote the formation of diffusion layer.But almost none content of Zn was observed in the boundary which had been plated on the steel insert.A diffusion layer consisting of Al,Si and Fe was formed at the insert/alloy interface and its hardness was higher than the steel insert as matter of course Al base metal.This layer turned out to be intermetallic compounds of Al-Si-Fe system.Higher pouring temperature promoted the diffusion of Fe into Al alloy,so Fe content in intermetallic layers increased at higher pouring temperature.The layer nearest to steel disappeared due to applied pressure.