Acoustic backing in 3-D integration of CMUT with front-end electronics

Capacitive micromachined ultrasonic transducers (CMUTs) have shown promising qualities for medical imaging. However, there are still some problems to be investigated, and some challenges to overcome. Acoustic backing is necessary to prevent SAWs excited in the surface of the silicon substrate from affecting the transmit pattern from the array. In addition, echoes resulting from bulk waves in the substrate must be removed. There is growing interest in integrating electronic circuits to do some of the beamforming directly below the transducer array. This may be easier to achieve for CMUTs than for traditional piezoelectric transducers. We will present simulations showing that the thickness of the silicon substrate and thicknesses and acoustic properties of the bonding material must be considered, especially when designing highfrequency transducers. Through simulations, we compare the acoustic properties of 3-D stacks bonded with three different bonding techniques; solid-liquid interdiffusion (SLID) bonding, direct fusion bonding, and anisotropic conductive adhesives (ACA). We look at a CMUT array with a center frequency of 30 MHz and three silicon wafers underneath, having a total silicon thickness of 100 μm. We find that fusion bonding is most beneficial if we want to prevent surface waves from damaging the array response, but SLID and ACA are also promising if bonding layer thicknesses can be reduced.     

CMUTS with dual-electrode structure for improved transmit and receive performance

In this paper, we introduce capacitive micro-machined ultrasonic transducers (CMUTs) with electrically isolated multiple electrodes embedded in the same silicon nitride CMUT membrane. Some of the advantages of this structure are demonstrated using a dual-electrode CMUT with separate transmit and receive electrodes as an example. By locating the transmit electrodes near the edges of a rectangular CMUT membrane, the stable displacement range, hence the maximum pressure amplitude during transmit mode is increased without collapsing the membrane when operated within static collapse voltage range. In the receive mode, the center receive electrode is brought closer to the substrate by biasing the side electrodes, and a higher electromechanical transformer ratio is obtained at low direct current (DC) bias. Therefore, dual-electrode CMUT has an effectively larger gap as compared to conventional CMUT during transmit, and it has an effectively smaller gap during receive. Demonstrative experiments are performed on dual-electrode CMUTs with rectangular membranes with different side and center electrode sizes for transmit and receive measurements. By using the two 4-microm wide side electrodes and an 8-microm wide center electrode on a 20-microm wide membrane, a 6.8 dB increase in maximum output pressure is obtained with side electrode excitation as compared to conventional center electrode. Similarly, the receive performance improvement was demonstrated while reducing the DC bias requirements. Simple finite-element and equivalent circuit-based models were developed to successfully model the behavior of dual-electrode CMUTs. Simulations show that, with simple modifications, more than 10 dB overall sensitivity improvement is feasible with dual-electrode CMUTs with rectangular membranes.     

Characterization of dual-electrode CMUTs: demonstration of improved receive performance and pulse echo operation with dynamic membrane shaping

A 1-D dual-electrode CMUT array for intracardiac echocardiography (ICE) with a center frequency of 8 MHz has been designed, fabricated, and used to demonstrate the potential of dual-electrode CMUTs. Using a dual-electrode CMUT, 9 dB higher receive signal level is obtained over the 6 dB fractional bandwidth as compared with a conventional CMUT with an identical center electrode biased close to its collapse voltage. Because the same device shows a 7.4 dB increase in maximum pressure output, 16.4 dB overall improvement in transduction performance has been achieved as compared with conventional CMUT. A net peak output pressure of 1.6 MPa on the dual-electrode CMUT membrane with tone burst excitation at 12 MHz is also reported. The frequency response of the dual-electrode CMUT is similar to that of a conventional CMUT with the same membrane geometry with about 15% increase in the center frequency. Monostatic operation of dual-electrode CMUTs shows that the high performance of the transducer is applicable in typical pulse-echo imaging mode of operation. With dynamic shaping of the CMUT membrane to optimize the transmit-and-receive modes of operation separately during each pulse-echo cycle, dual-electrode CMUT is a highly competitive alternative to its piezoelectric counterparts.     

Comparison of conventional and collapsed region operation of capacitive micromachined ultrasonic transducers

We report experimental results from a comparative study on collapsed region and conventional region operation of capacitive micromachined ultrasonic transducers (CMUTs) fabricated with a wafer bonding technique. Using ultrasonic pulse-echo and pitch-catch measurements, we characterized single elements of 1-D CMUT arrays operating in oil. The experimental results from this study agreed with the simulation results: a CMUT operating in the collapsed region produced a higher maximum output pressure than a CMUT operated in the conventional region at 90% of its collapse voltage (3 kPa/V vs. 16.1 kPa/V at 2.3 MHz). While the pulse-echo fractional bandwidth (126%) was higher in the collapsed region operation than in the conventional operation (117%), the pulse-echo amplitude in collapsed region operation was 11 dB higher than in conventional region operation. Furthermore, within the range of tested bias voltages, the output pressure monotonously increased with increased bias during collapsed region operation. It was also found that in the conventional mode, short AC pulses (larger than the collapse voltage) could be applied without collapsing the membranes. Finally, while no significant difference was observed in reflectivity of the CMUT face between the two regions of operation, hysteretic behavior of the devices was identified in the collapsed region operation.     

Radiation impedance of collapsed capacitive micromachined ultrasonic transducers

The radiation impedance of a capacitive micromachined ultrasonic transducer (CMUT) array is a critical parameter to achieve high performance. In this paper, we present a calculation of the radiation impedance of collapsed, clamped, circular CMUTs both analytically and using finite element method (FEM) simulations. First, we model the radiation impedance of a single collapsed CMUT cell analytically by expressing its velocity profile as a linear combination of special functions for which the generated pressures are known. For an array of collapsed CMUT cells, the mutual impedance between the cells is also taken into account. The radiation impedances for arrays of 7, 19, 37, and 61 circular collapsed CMUT cells for different contact radii are calculated both analytically and by FEM simulations. The radiation resistance of an array reaches a plateau and maintains this level for a wide frequency range. The variation of radiation reactance with respect to frequency indicates an inductance-like behavior in the same frequency range. We find that the peak radiation resistance value is reached at higher kd values in the collapsed case as compared with the uncollapsed case, where k is the wavenumber and d is the center-to-center distance between two neighboring CMUT cells.     

Harmonic reduction in capacitive micromachined ultrasonic transducers by gap feedback linearization

The nonlinear relationship between the electrical input signal and electrostatic force acting on the capacitive micromachined ultrasonic transducer (CMUT) membrane limits its harmonic imaging performance. Several input shaping methods were proposed to compensate for the nonlinearity originating from the electrostatic force's dependence on the square of the applied voltage. Here, we analyze harmonic generation in CMUTs with a time-domain model. The model explains the basis of the input shaping methods and suggests that the nonlinearity resulting from gap dependence of the electrostatic force is also significant. It also suggests that the harmonic distortion in the output pressure can be eliminated by subharmonic ac-only excitation of the CMUT in addition to scaling the input voltage with the instantaneous gap. This gap feedback configuration can be approximated by the simple addition of a series impedance to the CMUT capacitance. We analyze several types of series impedance feedback topologies for gap feedback linearization. We show that for subharmonic ac excitation, although resistive and capacitive impedances result in a trade-off between input voltage and harmonic distortion for a desired pressure output, harmonic generation can be suppressed while increasing the Pa/V transmit sensitivity for proper series inductance and resistance feedback. We experimentally demonstrate the feedback method by reducing harmonic generation by 10 dB for the same output pressure at the fundamental frequency by using a simple series resistor feedback with a CMUT operating at a center frequency of 3 MHz. The proposed methods also allow for utilization of the full CMUT gap for transmit operation and, hence, should be useful in high-intensity ultrasonic applications in addition to harmonic imaging.     

Volumetric ultrasound imaging using 2-D CMUT arrays

Recently, capacitive micromachined ultrasonic transducers (CMUTs) have emerged as a candidate to overcome the difficulties in the realization of 2-D arrays for real-time 3-D imaging. In this paper, we present the first volumetric images obtained using a 2-D CMUT array. We have fabricated a 128 x 128-element 2-D CMUT array with through-wafer via interconnects and a 420-microm element pitch. As an experimental prototype, a 32 x 64-element portion of the 128 x 128-element array was diced and flip-chip bonded onto a glass fanout chip. This chip provides individual leads from a central 16 x 16-element portion of the array to surrounding bondpads. An 8 x 16-element portion of the array was used in the experiments along with a 128-channel data acquisition system. For imaging phantoms, we used a 2.37-mm diameter steel sphere located 10 mm from the array center and two 12-mm-thick Plexiglas plates located 20 mm and 60 mm from the array. A 4 x 4 group of elements in the middle of the 8 x 16-element array was used in transmit, and the remaining elements were used to receive the echo signals. The echo signal obtained from the spherical target presented a frequency spectrum centered at 4.37 MHz with a 100% fractional bandwidth, whereas the frequency spectrum for the echo signal from the parallel plate phantom was centered at 3.44 MHz with a 91% fractional bandwidth. The images were reconstructed by using RF beamforming and synthetic phased array approaches and visualized by surface rendering and multiplanar slicing techniques. The image of the spherical target has been used to approximate the point spread function of the system and is compared with theoretical expectations. This study experimentally demonstrates that 2-D CMUT arrays can be fabricated with high yield using silicon IC-fabrication processes, individual electrical connections can be provided using through-wafer vias, and flip-chip bonding can be used to integrate these dense 2-D arrays with electronic circuits for practical 3-D imaging applications.     

Capacitive micromachined ultrasonic transducers with diffraction-based integrated optical displacement detection

Capacitive detection limits the performance of capacitive micromachined ultrasonic transducers (CMUTs) by providing poor sensitivity below megahertz frequencies and limiting acoustic power output by imposing constraints on the membrane-substrate gap height. In this paper, an integrated optical interferometric detection method for CMUTs, which provides high displacement sensitivity independent of operation frequency and device capacitance, is reported. The method also enables optoelectronics integration in a small volume and provides optoelectronic isolation between transmit and receive electronics. Implementation of the method involves fabricating CMUTs on transparent substrates and shaping the electrode under each individual CMUT membrane in the form of an optical diffraction grating. Each CMUT membrane thus forms a phase-sensitive optical diffraction grating structure that is used to measure membrane displacements down to 2/spl times/10/sup -4/ /spl Aring///spl radic/Hz level in the dc to 2-MHz range. Test devices are fabricated on quartz substrates, and ultrasonic array imaging in air is performed using a single 4-mm square CMUT consisting of 19/spl times/19 array of membranes operating at 750 kHz.     

Characterization of one-dimensional capacitive micromachined ultrasonic immersion transducer arrays

We report on the characterization of 1D arrays of capacitive micromachined ultrasonic transducers (cMUT). A 275×5600 μm 1D CMUT array element is experimentally characterized, and the results are found to be in agreement with theoretical predictions. As a receiver, the transducer has a 0.28-fm/√Hz displacement sensitivity, and, as a transmitter, it produces 5 kPa/V of output pressure at the transducer surface at 3 MHz with a DC bias of 35 V. The transducer has more than 100% fractional bandwidth around 3 MHz, which makes it suitable for ultrasound imaging. The radiation pattern of isolated single elements, as well as those of array elements are measured, and two major sources of acoustical crosstalk are identified. A weakly dispersive non-leaky interface wave (Stoneley wave) is observed to be propagating at the silicon substrate-fluid interface at a speed close to the speed of sound in the fluid. This wave causes internal reflections, spurious resonance, and radiation from the edges of the silicon substrate. The large lateral component of the particle velocity generated by the membranes at the edge of the cMUT array elements is found to be the source of this interface wave. Lowest order Lamb waves in the silicon substrate are also found to contribute to the crosstalk between elements. These waves are excited at the edges of individual vibrating membranes, where they are anchored to the substrate, and result in a narrowing of the beam profile of the array elements. Several methods, such as trench isolation and wafer thinning, are proposed and implemented to modify the acoustical cross coupling between array elements     

Thermal-mechanical-noise-based CMUT characterization and sensing

When capacitive micromachined ultrasonic transducers (CMUTs) are monolithically integrated with custom-designed low-noise electronics, the output noise of the system can be dominated by the CMUT thermal-mechanical noise both in air and in immersion even for devices with low capacitance. Because the thermal-mechanical noise can be related to the electrical admittance of the CMUTs, this provides an effective means of device characterization. This approach yields a novel method to test the functionality and uniformity of CMUT arrays and the integrated electronics when a direct connection to CMUT array element terminals is not available. Because these measurements can be performed in air at the wafer level, the approach is suitable for batch manufacturing and testing. We demonstrate this method on the elements of an 800-μm-diameter CMUT-on-CMOS array designed for intravascular imaging in the 10 to 20 MHz range. Noise measurements in air show the expected resonance behavior and spring softening effects. Noise measurements in immersion for the same array provide useful information on both the acoustic cross talk and radiation properties of the CMUT array elements. The good agreement between a CMUT model based on finite difference and boundary element methods and the noise measurements validates the model and indicates that the output noise is indeed dominated by thermal-mechanical noise. The measurement method can be exploited to implement CMUT-based passive sensors to measure immersion medium properties, or other parameters affecting the electro-mechanics of the CMUT structure.     

Capacitive micromachined ultrasonic transducers with piston-shaped membranes: fabrication and experimental characterization

Capacitive micromachined ultrasonic transducers (CMUTs) featuring piston-shaped membranes (piston CMUTs) were developed to improve device performance in terms of transmission efficiency, reception sensitivity, and fractional bandwidth (FBW). A piston CMUT has a relatively flat active moving surface whose membrane motion is closer to ideal piston-type motion compared with a CMUT with uniformly thick membranes (classical CMUT). Piston CMUTs with a more uniform surface displacement profile can achieve high output pressure with a relatively small electrode separation. The improved device capacitance and gap uniformity also enhance detection sensitivity. By adding a center mass to the membrane, a large ratio of second-order resonant frequency to first-order resonant frequency was achieved. This improved the FBW. Piston CMUTs featuring membranes of different geometric shapes were designed and fabricated using wafer bonding. Fabricating piston CMUTs is a more complex process than fabricating CMUTs with uniformly thick membranes. However, no yield loss was observed. These devices achieved ~100% improvement in transduction performance (transmission and reception) over classical CMUTs. For CMUTs with square and rectangular membranes, the FBW increased from ~110% to ~150% and from ~140% to ~175%, respectively, compared with classical CMUTs. The new devices produced a maximum output pressure exceeding 1 MPa at the transducer surface. Performance optimization using geometric membrane shape configurations was the same in both piston CMUTs and classical CMUTs.     

Piezoelectrically actuated flextensional micromachined ultrasound transducers--II: fabrication and experiments

This paper presents novel micromachined two-dimensional array piezoelectrically actuated flextensional transducers that can be used to generate sound in air or water. Micromachining techniques to fabricate these devices are also presented. Individual unimorph array elements consist of a thin piezoelectric annular disk and a thin, fully clamped, circular plate. We manufacture the transducer in two-dimensional arrays using planar silicon micromachining and demonstrate ultrasound transmission in air at 2.85 MHz with 0.15 μm/V peak displacement. The devices have a range of operating resonance frequencies starting from 450 kHz to 4.5 MHz. Such an array could be combined with on-board driving and addressing circuitry for different applications     

A photoacoustic imager with light illumination through an infrared-transparent silicon CMUT array

A novel hardware design and preliminary experimental results for photoacoustic imaging are reported in this paper. This imaging system makes use of an infrared-transparent capacitive micromachined ultrasonic transducer (CMUT) chip for ultrasound reception and illuminates the image target through the CMUT array. The cascaded arrangement between the light source and transducer array allows for a more compact imager head and results in more uniform illumination. Taking advantage of the low optical absorption coefficient of silicon in the near infrared spectrum as well as the broad acoustic bandwidth that CMUTs provide, an infrared-transparent CMUT array has been developed for ultrasound reception. The center frequency of the polysilicon-membrane CMUT devices used in this photoacoustic system is 3.5 MHz, with a fractional bandwidth of 118% in reception mode. The silicon substrate of the CMUT array has been thinned to 100 μm and an antireflection dielectric layer is coated on the back side to improve the infrared-transmission rate. Initial results show that the transmission rate of a 1.06-μm Nd:Yag laser through this CMUT chip is 12%. This transmission rate can be improved if the thickness of silicon substrate and the thin-film dielectrics in the CMUT structure are properly tailored. Imaging of a metal wire phantom using this cascaded photoacoustic imager is demonstrated.     

Calculation and measurement of electromechanical coupling coefficient of capacitive micromachined ultrasonic transducers

The electromechanical coupling coefficient is an important figure of merit of ultrasonic transducers. The transducer bandwidth is determined by the electromechanical coupling efficiency. The coupling coefficient is, by definition, the ratio of delivered mechanical energy to the stored total energy in the transducer. In this paper, we present the calculation and measurement of coupling coefficient for capacitive micromachined ultrasonic transducers (CMUTs). The finite element method (FEM) is used for our calculations, and the FEM results are compared with the analytical results obtained with parallel plate approximation. The effect of series and parallel capacitances in the CMUT also is investigated. The FEM calculations of the CMUT indicate that the electromechanical coupling coefficient is independent of any series capacitance that may exist in the structure. The series capacitance, however, alters the collapse voltage of the membrane. The parallel parasitic capacitance that may exist in a CMUT or is external to the transducer reduces the coupling coefficient at a given bias voltage. At the collapse, regardless of the parasitics, the coupling coefficient reaches unity. Our experimental measurements confirm a coupling coefficient of 0.85 before collapse, and measurements are in agreement with theory.     

Experimental characterization of collapse-mode CMUT operation

This paper reports on the experimental characterization of collapse-mode operation of capacitive micromachined ultrasonic transducers (CMUTs). CMUTs are conventionally operated by applying a direct current (DC) bias voltage less than the collapse voltage of the membrane, so that the membrane is deflected toward the bottom electrode. In the conventional regime, there is no contact between the membrane and the substrate; the maximum alternating current (AC) displacement occurs at the center of the membrane. In collapse-mode operation, the DC bias voltage is first increased beyond the collapse voltage, then reduced without releasing the collapsed membrane. In collapse-mode operation, the center of the membrane is always in contact with the substrate. In the case of a circular membrane, the maximum AC displacement occurs along the ring formed between the center and the edge of the membrane. The experimental characterization presented in this paper includes impedance measurements in air, pulse-echo experiments in immersion, and one-way optical displacement measurements in immersion for both conventional and collapse-mode operations. A 205-microm x 205-microm 2-D CMUT array element composed of circular silicon nitride membranes is used in the experiments. In pulse-echo experiments, a custom integrated circuit (IC) comprising a pulse driver, a transmit/receive switch, a wideband low-noise preamplifier, and a line driver is used. By reducing the parasitic capacitance, the use of a custom IC enables pulse-echo measurements at high frequencies with a very small transducer. By comparing frequency response and efficiency of the transducer in conventional and collapse regimes, experimental results show that a collapsed membrane can be used to generate and detect ultrasound more efficiently than a membrane operated in the conventional mode. Furthermore, the center frequency of the collapsed membrane can be changed by varying the applied DC voltage. In this study, the center frequency of a collapsed transducer in immersion is shown to vary from 20 MHz to 28 MHz with applied DC bias; the same transducer operates at 10 MHz in the conventional mode. In conventional mode, the maximum peak-to-peak pressure is 370 kPa on the transducer surface for a 40-ns, 25-V unipolar pulse excitation. In collapse mode, a 25-ns, 25-V unipolar pulse generates 590 kPa pressure at the surface of the transducer.     

Finite element modeling and experimental characterization of crosstalk in 1-D CMUT arrays

Crosstalk is the coupling of energy between the elements of an ultrasonic transducer array. This coupling degrades the performance of transducers in applications such as medical imaging and therapeutics. In this paper, we present an experimental demonstration of guided interface waves in capacitive micromachined ultrasonic transducers (CMUTs). We compare the experimental results to finite element calculations using a commercial package (LS-DYNA) for a 1-D CMUT array operating in the conventional and collapsed modes. An element in the middle of the array was excited with a unipolar voltage pulse, and the displacements were measured using a laser interferometer along the center line of the array elements immersed in soybean oil. We repeated the measurements for an identical CMUT array covered with a 4.5-microm polydimethylsiloxane (PDMS) layer. The main crosstalk mechanism is the dispersive guided modes propagating in the fluid-solid interface. Although the transmitter element had a center frequency of 5.8 MHz with a 130% fractional bandwidth in the conventional operation, the dispersive guided mode was observed with the maximum amplitude at a frequency of 2.1 MHz, and had a cut-off frequency of 4 MHz. In the collapsed operation, the dispersive guided mode was observed with the maximum amplitude at a frequency of 4.0 MHz, and had a cut-off frequency of 10 MHz. Crosstalk level was lower in the collapsed operation (-39 dB) than in the conventional operation (-24.4 dB). The coverage of the PDMS did not significantly affect the crosstalk level, but reduced the phase velocity for both operation modes. Lamb wave modes, A0 and S0, were also observed with crosstalk levels of -40 dB and -65 dB, respectively. We observed excellent agreement between the finite element and the experimental results.     

Design of a MEMS discretized hyperbolic paraboloid geometry ultrasonic sensor microarray

Design of a discretized hyperbolic paraboloid geometry beamforming array of capacitive micromachined ultrasonic transducers (CMUT) has been presented. The array can intrinsically provide a broadband constant beamwidth beamforming capability without any microelectronic signal processing. A mathematical model has been developed and verified to characterize the array response. A design methodology has been presented that enables determination of the array's physical dimensions and CMUT modeling in a straightforward manner. Developed methodology has been used to design two discretized hyperbolic paraboloid geometry beamforming CMUT arrays: one in the 2.3 MHz to 5.2 MHz frequency range and another in the 113 kHz to 167 kHz frequency range. CMUTs have been designed using a cross-verification method that involves lumped element modeling, 3-D electromechanical finite element analysis (FEA), and microfabrication simulation. The developed array has the potential to be used in real-time automotive collision-avoidance applications, medical diagnostic imaging and therapeutic applications, and industrial sensing.     

A surface micromachined electrostatic ultrasonic air transducer

Airborne ultrasound has many applications such as, ranging, nondestructive evaluation, gas flow measurement, and acoustic microscopy. This paper investigates the generation and detection of ultrasound in air at a few MHz. Conventional plane piston lead zirconium titanate (PZT) based transducers perform poorly for this application due to the lack of proper matching layer materials. Electrostatic, or capacitive, transducers promise higher efficiency and broader bandwidth performance. The device structure in this work consists of a capacitor where one plate is a circular silicon nitride membrane coated with gold and the other is a rigid silicon substrate. By applying a voltage between the membrane and the silicon substrate, an electrostatic force is exerted on the membrane which sets it in motion, thus generating a sound wave in air. Presented here is an electrical equivalent circuit model for electrostatic transducers which is based on the early work of Mason (1942). The electrostatic transducers were designed and constructed for operation at 1.8 and 4.6 MHz. The transducers were fabricated using standard micromachining techniques. An optical interferometer was used to measure the peak displacement of the 1.8 MHz electrostatic transducer at 230 Å/V. A transmit-receive system was built using two electrostatic transducers. The system had a signal to noise ratio of 34 dB at a transducer separation of 1 cm. Each transducer had a 3-dB bandwidth of 20%, and a one-way insertion loss of 26 dB. There is excellent agreement between the measured device performance and theoretical predictions     

Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays

Integration of front-end electronics with 2D capacitive micromachined ultrasonic transducer (CMUT) arrays has been a challenging issue due to the small element size and large channel count. We present design and verification of a front-end drive-readout integrated circuit for 3D ultrasonic imaging using 2D CMUT arrays. The circuit cell dedicated to a single CMUT array element consists of a high-voltage pulser and a low-noise readout amplifier. To analyze the circuit cell together with the CMUT element, we developed an electrical CMUT model with parameters derived through finite element analysis, and performed both the pre- and postlayout verification. An experimental chip consisting of 4 X 4 array of the designed circuit cells, each cell occupying a 200 X 200 microm2 area, was formed for the initial test studies and scheduled for fabrication in 0.8 microm, 50 V CMOS technology. The designed circuit is suitable for integration with CMUT arrays through flip-chip bonding and the CMUT-on-CMOS process.