低碳钢液相等离子体电解硼碳共渗层生长特性研究

在含有硼砂和甘油的电解液中对Q235低碳钢表面进行液相等离子体电解硼碳二元共渗(PEB/C)处理,研究不同时间条件下PEB/C共渗层的组织形貌,着重探讨了PEB/C二元共渗过程中电解质的分解反应和渗硼层快速生长机理。结果表明,在330V电压条件下,经过6min PEB/C处理后,在样品表面开始生成不连续的岛状硼化物;而经过30min PEB/C处理后,可以形成主要由Fe2B相组成的均匀致密的渗硼层,渗硼层的硬度可以达到1 800HV,厚度约为20μm。PEB/C共渗样品渗硼层的生长过程主要包括共渗初期阶段、生成岛状硼化物阶段和渗硼层均匀生长阶段。     

奥氏体不锈钢渗硼层的形成及其生长动力学过程

用光学显微镜，透射电镜，电子衍射，Ｘ射线衍射研究了奥氏体不锈钢渗硼层的形成及其动力学过程，结果表明，渗层形成过程，先形成含Ｂ固溶体，超过固溶度形成ＦｅＢ，最后形成ＦｅＢ并有Ｆｅ３（ＣＢ）同时存在，渗硼层生长厚度随时间变化关系符合抛物线规律。硼化物形核初期呈粒状，后沿（００２）晶向优先长大呈棒状，对硼化形成（００２）择优取向的原因和不能形成指状生长形貌硼化物层的原因进行了探讨。     

微波渗硼层中FeB的形成机理研究

通过微波处理、X射线衍射和扫描电镜等手段研究了微波场下渗硼层中FeB的形成机理,并与常规渗硼层进行了比较.结果表明,FeB向渗层内部采取(002)晶向取向生长,渗层表面无取向特征,且微波渗硼FeB相的生长不受表面硼化物晶核密度控制.     

气体渗硼工件的表面形貌及其与渗硼层孔洞的关系

利用扫描电子显微镜观察了经不同气体渗硼工艺处理的工件表面,研究了影响工件表面形貌的因素及表面形貌与渗层孔洞的关系。研究表明:恰当的工艺参数使工件表面由规则,细小,均匀的硼化物颗粒构成,否则,工件表面的硼化物颗粒将会粗化,甚至产生一种针状颗粒。本文重点研究了这种针状硼化物的形成机理及其影响因素。此外,表面较光滑的工件往往具有较致密的渗硼层,而粗糙的表面,尤其是表面产生针状硼化物的工件则对应孔洞较多的渗硼层。     

硼对高铬铸铁铸渗层组织和性能的影响

本工作利用自熔铸渗技术在ZG45钢表面复合不同硼含量的高铬铸铁铸渗层,研究了硼对高铬铸铁铸渗层组织和性能的影响.利用相图计算软件Thermo-Calc计算分析了不同硼含量下铸渗层的凝固过程,并采用SEM-EDS、XRD和显微硬度仪对不同成分铸渗层的微观组织和硬度进行分析.结果表明:铸渗层与ZG45钢基体达到冶金结合,在结合界面处未观察到微孔洞、微裂纹等缺陷,获得了厚度为10～12 mm的铸渗层.不含硼的铸渗层组织由α-Fe和α-Fe+M7 C3共晶组织组成.加入微量的硼元素后,铸渗层组织主要由α-Fe与α-Fe+M7 C3+M2 B共晶组织组成,与相图计算结果基本吻合.随着硼含量的增加,共晶组织逐渐细化,M7 C3碳化物含量减少,M2 B型硼化物增多,铸渗层硬度逐渐增加.当硼含量为0.72％(质量分数)时,铸渗层硬度最高达到1190HV.对铸态试样进行淬火+低温回火热处理后,铸渗层共晶硼化物与碳化物发生聚集长大,同时在铸渗层基体中伴有二次相的析出,试样铸渗层的洛氏硬度均有提升.热处理试样冲击磨损实验表明,铸渗层磨损表面主要以切削犁沟、疲劳剥层和剥落坑为主,并有少量微小的凿坑.硼含量为0.72％(质量分数)时,试样的抗冲击磨损性能最佳.     

室温变形对渗硼速度和硼化物层相结构的影响

研究了室温变形对渗硼速度和硼化物层相结构的影响。结果表明,随变形度增加,层深增加,并在某一变形度下达到极大值,而后随变形度增加,层深逐渐减小。渗硼温度、时间不同,将引起最佳变形度层深增加幅度发生变化。在渗剂中含B_4C低的(低渗速),室温变形提高渗速的作用比较大,而含B_4C高的(高渗速)则室温变形提高渗速的作用明显减小。随室温变形度增加,渗层中FeB相含量降低,从而改善了渗层脆性。室温变形提高硼扩散速度的作用,与高温下保留较高的位错密度有密切关系;较小的初始晶粒与较高的晶界迁移速率也是提高其扩散速度的重要因素。     

TA2熔盐电解法渗硼的研究现状及展望

钛及其合金作为21世纪重要的结构材料,具有抗腐蚀、熔点高、密度小、比强度高、无磁性及生物相容性等优点,但表面硬度低、耐磨性差、摩擦系数大,严重限制了其应用范围.熔盐电解法渗硼作为一种金属表面改性技术,具有成本低廉、效果明显等优点,可有效提高钛及其合金的表面硬度和耐磨性.综述了熔盐电解法渗硼的研究现状,从渗硼的工艺参数、机理、热力学和动力学方面进行了分析.综合双相硼化物(TiB和TiB2)渗层的生长动力学的研究结论,可以看出渗硼问题的核心就是活性B原子在固相的扩散,因此研究近相变温度下B原子的扩散行为对渗硼过程尤为重要.     

渗硼层与渗氮层深度的测定

以H13钢的渗氮层和渗硼层为例，借助于光学显微镜、扫描电镜(SEM)、显微硬度计和X射线衍射(XRD)，分析了两者组织形态和硬度梯度上的差别，指出了两者渗层深度不同的界定标准。即渗硼层厚度的测量不能将过渡层记入渗硼层厚度，而应采用硼化物齿峰和齿谷的统计算术平均值得到渗硼层厚度。     

不锈钢/高硼不锈钢层状复合材料组织变化

为了解决高硼不锈钢材料变形难度大、易开裂、塑性低等问题,采用复合浇铸-热轧变形工艺,制备了以难变形金属高硼不锈钢为中间层的层状复合板,研究了复合材料在铸造、热轧和固溶处理各阶段的组织特点及芯层中硼化物的相组成规律.结果表明:含硼质量分数2%～2.5%的复合板芯层的铸态组织主要以共晶组织形式凝固,含硼较高的芯层铸态组织除以共晶组织形式凝固外,还形成大块的含有Cr2B和Fe2B的过共晶硼化物相;热变形使共晶硼化物发生破碎、细化,但过共晶硼化物的体积形状变化不大;固溶处理使覆层中细小的二次析出物明显减少,这有利于复合板的力学性能,但芯层中硼化物的形貌、数量及尺寸变化不大.     

抽拉速度对Ti-48Al-8Nb合金定向凝固组织的影响

采用Bridgeman定向凝固设备成功制备了Ti-48Al-8Nb(原子分数,%)合金定向凝固试样,分析了不同抽拉速度对柱状晶形貌及过渡区、稳态区和淬火区凝固组织的影响。实验结果表明:在不同抽拉速度下,柱晶沿抽拉方向生长良好,柱状晶内部片层取向一致,与生长方向呈45°、90°夹角;当抽拉速度为8μm/s时,固液界面以胞状形貌向前推进,抽拉速度增大到15μm/s时固液界面开始向树枝状生长转化,随着抽拉速度进一步增大,二次枝晶间距逐渐变小,组织明显细化,片层间距显著减小;组织中与生长方向垂直的片层组织所占比例随抽拉速度增大而增加。     

Boriding kinetics of H13 steel

It is known that boriding has been employed to increase the service life of parts such as orifices; ingot molds, and dies for hot forming made of AISI H13 steel. In this study, case properties and kinetics of borided AISI H13 steel have been investigated by conducting a series of experiments in Ekabor-I powders at the process temperature of 1073, 1173 and 1273 K for periods of 1-5 h. The presence of borides FeB and Fe₂B of steel substrate was confirmed by optical microscopy and scanning electron microscopy (SEM). The results of this study indicated that the morphology of the boride layer has a smooth and compact morphology, and its hardness was found to be in the range of 1650-2000 HV. Transition zone observed between the hard boride coating and the matrix was relatively softer than the substrate. The kinetics of boriding shows a parabolic relationship between layer thickness and process time, and the calculated activation energy for the process is 186.2 kJ/mol. Moreover, boriding parameter BOP, which is only a function of boride layer thickness and activation energy, has been suggested for the prediction of layer thickness in boriding of AISI H13. There is a reasonable correlation between the progress of boride layer thickness and proposed time-temperature-compensated parameter. Similar findings have been found when it is applied to another steels including tool and low alloy steels, as well as Armco iron.     

Hard iron boride (Fe2B) on 99.97 wt% pure iron

Some properties such as hardness and fracture toughness of boride formed on the 99.97 wt% pure iron were investigated. Boronizing was carried out in a solid medium, consisting of Ekabor powders of 5% B₄C as donor, 5% KBF₄ as an activator and 90% SiC as diluent at 800 °C for 2, 4 and 8 h. The dominant phase formed on the substrate was found to be Fe₂B that had a finger-like shape morphology. The hardness of boride on the 99.97% pure iron was over 1700HVN, while the hardness of pure iron was about 130HVN. It was found that the fracture toughness of boride formed on surfaces of 99.97% pure iron, depending on the process time, ranged from 3.59 to 3.83 MPa m^1/2. Depending on process time and temperature, the depth of the boride layer ranges from 22 to 43 μm, leading to a diffusion-controlled process.     

An investigation on boriding kinetics of AISI 316 stainless steel

Boronizing was performed by using a solid medium of Ekabor powders at 1073, 1148 and 1223 K for 2, 4 and 8 h. After boronizing, the major dominant phase was found to be Fe₂B and the minors were CrB and Ni₂B. Boride coating resulted in smooth and dense feature confirmed by optical and SEM. The thickness of boride layer varied from 7 to 87 μm depending on the process time and temperature. Boride layer has a hardness of over 1700 HVN, while the substrate's hardness was about 180 HVN. The growth kinetics of boride layer was found to obey a parabolic rate demonstrating a solid diffusion limited process. The kinetic rates for different process times were plotted by using Arrhenius equation. From this measurement, the activation energy of boride growth for this study was determined as 199 kJ/mol. In addition, the possibility of predicting the iso-thickness of boride layer variation was studied and an empirical relationship between process parameters and boride layer thickness was established. EDS studies showed that Cr concentrated in the coating layer and Ni and Fe concentrated in the substrate.     

槽电压对纯铁表面液相等离子体电解硼碳氮三元共渗层摩擦磨损性能的影响

利用液相等离子体电解渗技术分别在340,360V和380V槽电压下对纯铁进行硼碳氮三元共渗(PEB/C/N)表面处理。分析纯铁表面PEB/C/N共渗层的形貌、成分、相组成和显微硬度分布。采用球-盘摩擦磨损仪评估槽电压对渗层摩擦磨损性能的影响,并分析渗层与ZrO_2球对磨时磨损机理。纯铁表面的PEB/C/N三元共渗层厚度随着放电电压升高而增大,最高硬度也相应增加。380V处理1h后硼碳氮三元共渗层中渗硼层和过渡层厚度分别达到26μm和34μm,渗层最高硬度可以达到2318HV。硼碳氮三元共渗层的磨损率仅为纯铁基体的1/10。硼碳氮共渗处理大幅度降低纯铁的摩擦因数和磨损率,但不同槽电压下制备的PEB/C/N共渗层的摩擦因数和磨损率变化较小。     

Effect of Yttria content and alumina addition on the formation of a textured microstructure during the surface nitridation of Yttria-stabilized tetragonal zirconia polycrystals (Y-TZP)

The condition for the production of a textured microstructure was investigated in the process of nitridation of yttria-stabilized zirconia. The nitrided surface layer was composed of either columnar or equiaxed cubic grains. The amount of the cubic phase in the matrix, which was determined by yttria content and the sintering temperature, was the principal parameter that affected the morphology of the nitrided layer. With the increase in the cubic phase in the matrix, the chances of finding columnar grains decreased. The driving force of growth, which was provided by the free energy difference determined by the phase and grain size, decreased with the increase in the cubic phase in the matrix, and eventually led to the suppression of the growth of columnar grains. The cubic zirconia in the matrix also played the role of a transient pinning center due to its chemistry and lattice parameter that were dissimilar to those of the columnar grain. Such role of the cubic phase could be mimicked by the introduction of Al₂O₃ particles as an intended pinning center. With the introduction of the pinning center, the growth rate of the texture was suppressed and equiaxed grains appeared at the front of the texture. Therefore, by preparing the matrix with the utmost tetragonal phase, successful texturing of zirconia during nitridation could be achieved.     

Mössbauer and metallographic analysis of borided surface layers on Armco iron

Armco iron samples boronized at 850 and 1000° C in crystalline boron powder have been studied. Scattering and transmission Mössbauer measurements, supported by optical and electron scanning metallography and by X-ray diffraction analysis, enabled the surface phases to be identified, the multi-layer structure of the coatings to be defined and the average thickness of each layer to be measured. In addition to an inner Fe₂B layer and to an intermediate FeB layer, the presence of an outer layer of a third phase richer in boron that FeB has been ascertained in the boride coatings. The morphology of the reaction products and their mechanical consistency have also been examined and discussed.     

Magnetic anisotropy and morphology of Fe epitaxial layers grown on MgO/InAs heterostructures

In-plane magnetic anisotropy and the corresponding morphology of Fe epitaxial layers have been investigated with respect to underlying MgO growth temperature when epitaxial Fe/MgO layers are grown on InAs (001) substrates. Coexistence of three-dimensional Fe islands with strong in-plane textures along <110> and (100) is observed on 4 nm thick MgO layers grown on 200 degrees C, leading to the absence of magnetic anisotropy. Meanwhile, the partially relaxed MgO layers grown above 300 degrees C give rise to two-dimensional Fe layers with cubic magnetic anisotropy. The higher MgO growth temperature accelerates the two-dimensional layer formation of the subsequent Fe as well as the advent of cubic anisotropy by reducing underlying strain within the MgO layer.     

高温合金GH4169电子束熔丝增材制造工艺研究

目的 研究GH4169合金电子束熔丝增材制造过程中电子束流参数的选择方法及组织特征.方法 在其他工艺参数不变的条件下,分析电子束流的大小对单层成形形貌的影响,寻找最佳电子束流参数值;采用光学显微观察增材制造GH4169合金柱状晶组织.结果 获得了不同电子束流条件下,单熔覆层表面形貌、横截面形貌、熔覆宽度和高度数据,以及GH4169合金柱状晶形貌.结论 在一定范围内,随着电子束流值增加,熔覆层宽度增加而高度减小,但电子束流增加到一定值时,熔覆宽度及高度的变化幅度明显降低,在综合考虑熔覆层表面形貌和横截面形貌的基础上确定了电子束流最佳参数值;增材制造GH4169合金组织为沿沉积高度方向外延生长的柱状晶,柱状晶方向与竖直方向呈现出一定的偏角.     

Effects of Deposition Rate on Microstructure of CoCrPt-SiO$_2$Granular Longitudinal Media for Tape Applications

The microstructure of sputtered CoCrPt-SiO$_2$media for tape applications was investigated under different deposition rates. Plan-view and high-resolution cross-sectional TEMs were used to observe the media growth morphology and oxide phase separation behavior. Additionally, time-dependent magnetic property measurements were used for switching volume determination. Although plan-view TEM images suggested well-isolated, small grains, cross-sectional TEM images and switching volume measurements revealed magnetic interconnection between the apparent “grains” visible in the plan-view images. When the deposition rate was reduced from 0.28 to 0.05 nm/s, TEM images showed larger features in plan-view, which is consistent with greater time for atomic motion on the surface before burial. It was also observed in cross-sectional TEM images that columnar growth at the higher rate changed to spheres of metal in an SiO$_2$matrix at low deposition rate.