高体积分数SiCp/A356复合材料的显微组织和电导率

铝基复合材料在电子封装领域存在着潜在的应用前景。为获得高体积分数的铝基复合材料,利用压力浸渗法制备了高体积分数SiC颗粒增强A356复合材料(SiC_p/A356),通过金相显微镜、XRD、SEM和EDS等分析手段对其物相、显微结构和电导率进行了表征。结果表明:用该方法制备的SiC_p/A356复合材料组织致密,颗粒分布均匀,界面结合性能较好;SiC增强颗粒与A356基体界面反应控制良好,仅有少量Al4C3脆性相生成。SiC粉体经颗粒表面氧化处理在其表面生成一层SiO_2薄膜,虽抑制了界面反应的发生,但也使复合材料的收缩减小,电阻率增大,导电性能变差。     

碳纤维表面改性增强Fe3Al-Al2O3复合材料的制备及组织性能

采用溶胶-凝胶分散和热压烧结制备了短切碳纤维（CF_s）/Fe₃Al-Al₂O₃复合材料。分别通过电化学镀Cu和化学气相沉积SiC对CF_s表面修饰和改性,研究了Cu镀层和SiC涂层对CF_s/Fe₃Al-Al₂O₃复合材料显微组织、相组成、力学性能及断裂行为的影响。结果表明,未修饰的CF_s在Fe₃Al-Al₂O₃基体中受到严重侵蚀,CF_s/Fe₃Al-Al₂O₃复合材料致密度低,抗弯强度仅为239.0 MPa,与Fe₃Al-Al₂O₃强度相当;表面镀Cu可有效保护CF_s不被侵蚀,同时提高了CF_s/Fe₃Al-Al₂O₃复合材料的烧结致密性和界面结合强度,从而明显提高了复合材料的断裂强度,但断裂过程中纤维拔出较短;CF_s表面沉积SiC的CF_s/Fe₃Al-Al₂O₃复合材料组织均匀致密,表面涂层完整,且与纤维及基体之间结合力相当,断裂过程中,涂层既可随纤维一起拔出基体,也可与CF_s分离而留在基体之中,SiC涂层与纤维及基体之间的弱相互作用很大程度上促进了纤维脱黏和拔出,从而促进CF_s/Fe₃Al-Al₂O₃复合材料韧化所需的渐进破坏机制。      

纤维涂层法制备SiCf/Cu复合材料及其性能分析

为研究纤维涂层法制备SiCf/Cu复合材料的性能特点,通过磁控溅射法先后将Ti6Al4V界面改性层和基体Cu涂层涂覆到SiC纤维表面,并通过真空热压法将被涂覆的纤维制备成SiCf/Cu复合材料.对Ti6Al4V涂层、Cu涂层以及复合材料进行了微观分析,并测试了复合材料的拉伸强度.研究表明,复合材料的Cu基体由致密而细小的晶粒组成;Ti6Al4V提高了纤维/基体界面结合强度,复合材料轴向抗拉强度高达500 MPa,界面脱粘主要发生在纤维表面的碳涂层与纤维之间.     

一种新的β-锂霞石增强铜基复合材料热性能

采用热压烧结工艺成功制备了一种新的β-锂霞石增强铜基复合材料.利用扫描电镜和透射电镜对复合材料的微观组织进行了分析,并对不同体积分数复合材料的致密性,热膨胀性能和热传导性能进行了测试.结果表明:β-锂霞石颗粒在铜基体中分布均匀,界面清晰,不发生界面反应;体积分数对复合材料致密性、热膨胀系数和热导率有明显影响,当β-锂霞石颗粒体积分数超过40%时,复合材料的致密性有明显下降,热膨胀系数在(9～15.4)×10-6/K,同时热导率在50～170W/m·K.     

Fe_2(MoO_4)_3/Si_3N_4复合粉末还原过程中的微观组织结构

观测Fe_2(MoO_4)_3和Fe_2(MoO_4)_3/Si_3N_4粉末H_2还原后的微结构特征,研究了其微观组织结构的演变。结果表明:Fe_2(MoO_4)_3还原后转变为20 nm厚的Fe薄层包覆Mo颗粒的微结构;Fe_2(MoO_4)_3/Si_3N_4粉末被还原后转变为两种结构形式颗粒粉末,一种为3-5nm的薄层Fe包覆在Mo颗粒表面粉末,一种为粘附有纳米Fe-Mo氮化物、Si、Mo等颗粒的Si_3N_4粉末。Fe_2(MoO_4)_3/Si_3N_4粉末还原后形成这种微结构的原因是,在还原过程中同时发生了两种反应:一种是Fe_2(MoO_4)_3自身发生分解还原反应,另一种是Fe_2(MoO_4)_3与Si_3N_4颗粒表面发生反应。     

高导热金属基复合材料的热物理性能

分别采用无压浸渗、气压浸渗、内氧化技术制备了高导热Al/SiC、Al/C、Cu/Al2O3复合材料.研究了增强相和界面对这三种复合材料的热导率和热膨胀系数的影响,并对这些性能进行了理论分析和数值模拟.当颗粒尺寸与界面层厚度之比固定时,颗粒尺寸对Al/SiC复合材料热导率影响很小,但界面热导率对其影响很大;Al/SiC复合材料的CTE随温度的升高而增加,随SiO2层厚度的增加而减小;碳纤维中混杂3%SiC颗粒有利于改善纤维的分布,降低Al/C复合材料的缺陷,并提高其热导率;压力加工增加了Cu/Al2O3的致密度,也提高了其热导率;可用Schapery和Kerner模型计算复合材料的热膨胀系数,用Hasselman-Johnson模型计算热导率.     

高体积分数SiC_p/Al-Si复合材料的微观组织与导热性能

通过对SiC颗粒进行表面改性处理,并向Al基体中添加Si元素合金化采用热压烧结方法制备了Al-10Si-50%(质量分数)SiC复合材料,研究了复合材料的微观组织和导热性能。结果表明,复合材料中SiC颗粒在基体中分布均匀,复合材料组织致密;SiC-Al界面清晰、平直,无过渡层和其它附加物,复合材料界面结合良好;复合材料导热性能优异,其热导率可达189W/(m·K),能够满足电子封装材料的日常使用要求。     

石墨表面TiC涂层对高定向石墨/Cu复合材料热导率和抗弯强度的影响

以高温盐浴法对天然鳞片石墨粉体(GF)进行表面TiC镀层处理,然后采用真空热压烧结法制备TiCGF/Cu复合材料,研究了粉体表面涂层和GF体积分数对复合材料微观结构、热导率及抗弯强度的影响。系列测试结果表明:随着GF体积分数的降低以及粉体表面TiC镀层的形成,TiC-GF/Cu复合材料平行于GF片层方向的热导率有所降低,抗弯强度有所提升。其中在GF的体积分数占TiC-GF/Cu复合材料70%时,这种变化最为明显,平行于GF片层方向的TiC-GF/Cu复合材料热导率下降幅度最大,从676W/(m·K)下降到526 W/(m·K)。同时,TiC-GF/Cu复合材料的微观结构进一步说明,GF表面的TiC涂层对GF/Cu复合材料的断裂模型起着重要的作用。     

添加微量Ti 元素对Diamond/Cu复合材料组织及性能的影响

分别采用在Cu基体添加0. 1 wt%的Ti 元素形成Cu₂Ti合金和在Diamond 颗粒表面镀钛(DiamondTi) 的方法, 制备了含Diamond 体积分数为60 %的Diamond/Cu₂Ti 复合材料和DiamondTi/Cu 复合材料。对比分析了Ti 元素对复合材料微观组织、界面结合及性能的影响规律。结果表明: 添加0. 1 wt%Ti 元素能改善Diamond与Cu 的界面结合, 在界面处观察到明显的碳化物反应层; 且以Cu₂Ti合金的方式添加Ti 元素改善界面的效果优于在Diamond 颗粒表面镀Ti 的方式。所制备的Diamond/Cu₂Ti 复合材料的热导率为621 W(m·K) - 1, 而DiamondTi/Cu复合材料的热导率仅为403. 5 W(m·K) -1, 但均高于未添加Ti 制备的Diamond/Cu 复合材料。      

先驱体浸渍裂解结合化学气相渗透工艺下二维半和三维织构SiC/SiC复合材料的结构与性能

通过先驱体浸渍裂解工艺结合化学气相渗透工艺(PIP+CVI)制备了二维半(2.5D)和三维(3D)编织结构的碳化硅纤维增强碳化硅基(SiC/SiC)复合材料,对两者的密度、热导率、力学性能以及微观结构等进行了测试分析。结果表明,PIP+CVI工艺制备的SiC/SiC复合材料具有较低的密度(1.98~2.43g·cm-3)和热导率(0.85~2.08 W·m~(-1)·K~(-1)),初期CVI纤维涂层能够提高纤维-基体界面剪切强度(~141.0 MPa),从而提高SiC/SiC复合材料的力学性能,后期CVI整体涂层明显提高了2.5DSiC/SiC复合材料的密度、热导率和力学性能,对3DSiC/SiC复合材料性能的影响不明显。     

Rolling of cast Al‐SiCp particulate metal matrix composites and strip mechanical properties

Thermomechanical physical simulation is applied to get the optimum hot rolling parameters of aluminium silicon carbide composites. Wrought Al 6061 and 6082 – Silicon carbide particulate (SiCp) metal matrix composite strips are prepared by stir‐casting followed by sequential rolling assisted with intermediate heat treatment to allow crystallization recovery and further processing. SiCp are used in two microgrit grades; namely F500 and F800. The reinforcing particulates are used after surface oxidation and 0.3% Mg is added during melting and stirring for loss substitution. With the pre‐treatments applied, SiCp are successfully inserted in the Al matrix, better wetting between particles and matrix, better particles distribution, less agglomeration and minimized reactions between SiC particles. Thermo‐mechanical simulation as a tool for physical simulation indicates that rolling at 450°C using a rate of 1 s^–1 rate represent suitable rolling conditions. Successive hot rolling resulted in decreasing void percent and SiCp agglomeration. Hence, enhanced mechanical properties are achieved.     

Manufacturing Titanium Metal Matrix Composites by Consolidating Matrix Coated Fibres

1.IntroductionTitanium metal matrix composites(TiMMCs)rein-forced by continuous SiC fibre are being developed foraerospace applications in several countries,including theUSA,UK,France and China.TiMMCs possess excellentcombination of specific strength,stiffness,fatigue andcreep resistance at elevated temperatures which may al-low remarkable reduction in component weight[1].Own-ing to the active nature of Ti,several solid-state process-ing techniques have been developed to date for manu-f…     

Formation of Cu Nanodots on Diamond Surface to Improve Heat Transfer in Cu/D Composites

Diamond‐dispersed copper matrix (Cu/D) composite materials with different interfacial configurations are fabricated through powder metallurgy and their thermal performances are evaluated. An innovative solution to chemically bond copper (Cu) to diamond (D) has been investigated and compared to the traditional Cu/D bonding process involving carbide‐forming additives such as boron (B) or chromium (Cr). The proposed solution consists of coating diamond reinforcements with Cu particles through a gas–solid nucleation and growth process. The Cu particle‐coating acts as a chemical bonding agent at the Cu–D interface during hot pressing, leading to cohesive and thermally conductive Cu/D composites with no carbide‐forming additives. Investigation of the microstructure of the Cu/D materials through scanning electron microscopy, transmission electron microscopy, and atomic force microscopy analyses is coupled with thermal performance evaluations through thermal diffusivity, dilatometry, and thermal cycling. Cu/D composites fabricated with 40 vol% of Cu‐coated diamonds exhibit a thermal conductivity of 475 W m^?1 K^?1 and a thermal expansion coefficient of 12 × 10^?6 °C^?1. These promising thermal performances are superior to that of B‐carbide‐bonded Cu/D composites and similar to that of Cr‐carbide‐bonded Cu/D composites fabricated in this study. Moreover, the Cu/D composites fabricated with Cu‐coated diamonds exhibit higher thermal cycling resistance than carbide‐bonded materials, which are affected by the brittleness of the carbide interphase upon repeated heating and cooling cycles. The as‐developed materials can be applicable as heat spreaders for thermal management of power electronic packages. The copper‐carbon chemical bonding solution proposed in this article may also be found interesting to other areas of electronic packaging, such as brazing solders, direct bonded copper substrates, and polymer coatings.

     

Wear improvement of sol–gel silica coatings on A380/SiCp aluminium composite substrate by diode laser sintering

In this investigation, a high power diode laser (HPDL) was used to induce the microstructural refinement on the surface of a SiC particulate (SiCp) reinforced Al-based metal matrix composite (A380/SiC/20p) and, at the same time, to the sintering of a sol–gel ceramic layer deposited on the surface of the mentioned substrate. The purely inorganic silica ceramic coating was synthesised through the organic sol–gel route, using tetraethoxysilane (TEOS) as alkoxide precursor and the dip-coating as the deposition technique on the surface of the A380/SiC/20p composite. Optimisation of the laser parameters led to homogeneous and free of cracking coatings and also to the refinement of the surface microstructure of the substrate by means of the dissolution of the intermetallic precipitates, the decrease in the aluminium dendrites size and a better distribution of the silicon carbide particles. Unlubricated pin-on-disc wear tests confirmed the increase (89% in terms of specific wear rate drop) in the wear resistance of the coated substrates treated by the HPDL.     

溶胶-凝胶法在3D-SiC陶瓷表面浸涂Al_2O_3薄膜的研究

以无机盐Al(NO_3)_3·9H_2O为先驱体、水为溶剂,加入不同浓度的胶溶剂HNO_3,采用溶胶-凝胶(Solgel)法制备了勃姆石(γ-AlOOH)溶胶.分别以溶液下降法和真空浸渍法在三维网络碳化硅陶瓷骨架(3D-SiC)表面浸涂γ-AlOOH溶胶,采用不同烧结制度在3D-SiC表面生成了Al_2O_3薄膜.采用X射线衍射仪(XRD)、红外光谱仪(IR)和扫描电子显微镜(SEM)分析了薄膜的物相和显微结构,并检测了薄膜的抗热震性.结果表明,采用真空浸渍法在3D-SiC表面浸涂加入浓度0.22mol/L HNO_3制备的γ-AlOOH溶胶能烧结形成致密平整的Al_2O_3薄膜.升高烧结温度,Al_2O_3晶粒长大,900℃时薄膜最致密且能观测到玻璃态显微结构.薄膜的抗热震性随烧结温度升高而提高.     

Copper Plating on SiCp by Cooling Crystallization and Its Effects on the Spreading and Infiltration of AlSi12 Alloy Melt

A new cooling crystallization method is applied to plate copper on SiCp. Cu(NO₃)₂·3H₂O is crystallized on SiCp by decreasing the solution temperature, and is heat-treated to obtain CuO coating which is finally reduced to copper coating. Based on the optimizing of SiCp content and CuO reduction temperature, the effects of copper plating on SiCp on the spreading and infiltration of AlSi12 alloy melt are studied. The results show that the optimum coating effect is achieved when the SiCp content is 11.63% and the reduction temperature of CuO is 475 °C. The spreading area of AlSi12 alloy melt on the 15 μm copper-coated SiCp increases by 53.27% compared to the uncoated SiCp when holds at 950 °C for 20 min, indicating that copper plating has a significant improvement on the wettability of AlSi12 melt and SiCp. Additionally, infiltration preparation of copper-plated SiCp/Al alloy composites is achieved at a pressure of 0.3 MPa, but not under pressureless conditions. The main reason for this is the granular Cu on SiCp cannot form a complete Cu film. Therefore, the formation of complete Cu films on SiCp is presumed to be an important development direction for solving the problem of infiltration preparing ultrathick SiCp/Al composites.     

SiCp/Al复合材料微弧氧化膜的组织结构及性能

采用微弧氧化技术对SiC体积分数分别为17vol%和55vol%的两种SiCp/Al复合材料进行处理。分析了两种材料微弧氧化膜的组织、形貌、相组成,测定了膜层的粗糙度、显微硬度、结合力,考察了膜层的耐磨和耐蚀性。结果表明:SiC的含量对SiCp/Al复合材料微弧氧化膜的表面形貌、粗糙度、相组成、结合力及摩擦磨损性能均有影响。17vol%SiCp/2009Al复合材料的微弧氧化膜较55vol%SiCp/6061Al复合材料更平整,微孔大小更均匀。55vol%SiCp/6061Al复合材料的微弧氧化膜的粗糙度(3.308 μm)比17vol%SiCp/2009Al复合材料(2.140 μm)大,表面熔融物堆积更多。两种材料的微弧氧化膜中均含有Al、Si、O、C、W等元素。55vol%SiCp/6061Al复合材料的微弧氧化膜中Mullite(SiO₂-Al₂O₃)相、α-Al₂O₃相、β-Al₂O₃相较多。17vol%SiCp/2009Al复合材料的微弧氧化膜的结合(38.55 N)较55vol%SiCp/6061Al(11.5 N)复合材料好。55vol%SiCp/6061Al复合材料的微弧氧化膜摩擦系数较大,磨损较严重。微弧氧化处理能有效改善两种SiCp/Al复合材料的耐蚀性。      

Sol‐gel derived C‐SiC composites for re‐entry structures

Composites of carbon fibers, fabrics, or their precursors as reinforcement, and sol‐gel‐derived silicon carbide as matrix, have been developed, aiming at high‐temperature stable ceramics that can be utilized for re‐entry structures. These composites are produced via the sol‐gel process, starting with a sol‐gel reaction of a mixture of silane precursors. The sol‐gel‐derived resin is cast onto the reinforcement fibers/fabrics mat (carbon or its precursors) to produce a ‘green’ composite that is being cured. The ‘green’ composite is converted into a C‐SiC composite via a gradual heat‐pressure process under inert atmosphere, during which the organic substituents on the silicon atoms undergo internal oxidative pyrolysis via the schematic reaction: (SiRO_3/2)_n → SiC + CO₂ + H₂O The composition of the resultant silicon‐oxi‐carbide is tailorable via modifying the composition of the sol‐gel reactants. The reinforcement, when made of carbon precursors, is converted into carbon during the heat‐and‐pressure processing as well. The C‐SiC composites thus derived exhibit superior thermal stability and comparable thermal conductivity, combined with good mechanical strength features and failure resistance, which render them greatly applicable for re‐entry shielding, heat‐exchange pipes, and the like.     

A study of silica coatings on the surface of carbon or graphite fiber and the interface in a carbon/magnesium composite

A study has been made of the method of depositing a silicon dioxide coating on the surface of carbon or graphite fibers and of the interface in C/Mg composites manufactured by vacuum pressure infiltration: the mechanical properties of the materials were also studied. For the coating process, the fibers were passed through a toluene solution containing a silicon-based organometallic compound and chloride, following which hydrolysis and pyrolysis of the organometallic compound occurred to form a thin and uniform silicon dioxide coating on the surface of the fibers. The air-stable silicon dioxide coating facilitates wetting and bonding between carbon or graphite fibers and liquid magnesium. The carbon- and graphite-fiber-reinforced magnesium composites were fabricated by vacuum/pressure infiltration processing. Special attention was focused on analysis of the structure of the coating which was deposited by the solution immersion process with the aid of analytic instruments such as SEM, EDAX, TEM, XPS and SAM. Manufacturing processes of C/Mg composites, the interface chemical reaction, and the mechanical properties were also studied.     

SiC fibre-reinforced lithium aluminosilicate matrix composites fabricated by the Sol-Gel process

SiC fibre-reinforced lithium aluminosilicate (LAS) matrix composites were fabricated by (i) the hydrolysis-condensation reaction of relevant metal alkoxides, and (ii) the non-aqueous condensation route using diphenylsilanediol. Optimum reaction conditions of LAS sol formation for thin coating applications in the hydrolysis-condensation route were derived from rheological measurements. The SiC fibre-LAS composite fabricated by the hydrolysis-condensation route shows a uniform microstructure. The debonding/fibre pullout was more pronounced in the niobium-doped composites. The fracture toughness,K _1c, also increased from 11 MPa m^1/2 for the undoped composite to 16 MPa m^1/2 for the 5 wt% Nb-doped composite, suggesting that the fibre pullout contributes significantly to the toughening of SiC fibre-LAS composites. The crystallization of matrix at high temperatures (after hot pressing at 800C) eroded SiC fibres internally. This was attributed to the diffusion of aluminium atoms into the fibre, forming aluminium carbide above 1200C.