铜基引线框架材料的研究与发展

引线框架材料是半导体元器件和集成电路封装的主要材料之一，其主要功能为电路连接、散热、机械支撑等。随着IC向高密度、小型化、大功率、低成本方向发展，集成电路I/O数目增多、引脚间距减小，对引线框架材料提出了高强度、高导电、高导热等多方面性能上的要求。由于拥有良好的导电导热性能，铜合金已成为主要的引线框架材料。本文对电子封装铜合金引线框架材料的性能要求、国内外研究与发展等进行了综述。     

集成电路用金属铜基引线框架和电子封装材料研究进展

针对集成电路向高密度、小型化、多功能化发展，介绍了国内外传统的和以铜为基复合新型的引线框架和电子封装材料的性能、研究、生产现状以及存在的问题，同时展望了铜合金及其复合的引线框架和电子封装材料的发展趋势。     

引线框架材料的研究发展现状

引线框架材料是半导体元器件和集成电路封装的主要材料之一,其主要功能为电路连接、散热、机械支撑等作用.随着IC向高密度、小型化、低成本方向的发展,对引线框架材料提出了高强度、高导电、高导热等多方面性能上的要求.由于拥有良好的导热性能,铜合金已成为主要的引线框架材料.对电子封装引线框架材料的性能要求、设计理论以及国内外研究发展现状等进行了综述.     

铜合金引线框架材料的发展*

介绍了国内外铜合金框架材料研究,生产现状,叙述了开发高强,高导铜合金的基本原理及制备方法,半对国内外高强,高导铜合金的研究和开发应用情况进行了综合,同时评述了铜合金引线框架材料的发展动向。     

自恢复保险丝的封装工艺

选择改性环氧树脂作聚乙烯／炭黑自恢复保险丝的封装材料，研究了封装对保险丝热特性的影响，封装层影响芯料的散热能力，当通过电流足够大时，封装对保险丝的动作时间几乎没有影响，当通过电流较小时，封装层在120℃（聚乙烯熔点）下固化的保险丝由于封装层与芯料之间存在一定的空隙，芯料散热能力变差，且芯料的热膨胀可以顺利进行，动作时间变短。因此，保险丝封装应在芯料达到最大热膨胀的温度下进行。     

表面宏微观处理对塑料粘结NdFeB永磁性能的影响

本文研究了偶联剂处理ＮｄＦｅＢ磁粉及环氧树脂涂层对塑料粘结ＮｄＦｅＢ永磁体性能的影响，结果表明：（１）ＫＨ５５０包覆处理ＮｄＦｅＢ磁粉可改善ＮｄＦｅＢ磁粉的抗氧化性，提高塑料粘结ＮｄＦｅＢ的磁性能和压缩强度；（２）用偶联剂微观保护ＮｄＦｅＢ磁粉和环氧树脂涂层宏观保护相结合的办法可显著地提高塑料粘结ＮｄＦｅＢ永磁体的耐蚀性和抗高温氧化性。     

表面宏微处理对塑料粘结NdFeB永磁性能的影响

本文研究了偶联剂处理ＮｄＦｅＢ磁粉及环氧树脂涂层对塑料粘结ＮｄＦｅＢ永磁体性能的影响，结果表明：（１）ＫＨ５５０包覆处理ＮｄＦｅＢ磁粉可改善Ｎｄ－ＦｅＢ磁粉的抗氧化性，提高塑料粘结ＮｄＦｅＢ的磁性能和压缩强度；（２）用偶联剂微观保护ＮｄＦｅＢ磁粉和环氧树脂涂层宏观保护相结合的办法可显著地提高塑料粘结ＮｄＦｅＢ永磁体的耐蚀性和抗高温氧化性     

含偶氮苯基团的二元胺固化环氧树脂的研究

引言 热固性环氧树脂复合材料由于具有独特的性能而常被应用于高性能应用领域。环氧树脂通常具有卓越的性能：耐热、耐潮、耐化学腐蚀，高韧性，绝缘和高机械强度，以及对多种基质良好的粘接性。环氧树脂具有的多种优异性能使之在诸多领域得到了广泛的应用：表面包覆，粘合剂，涂料，复合材料，层压板，半导体的封装材料，     

用于半导体封装的聚苯硫醚

电子元件早期多采用金属和陶瓷等气密封装。最近,由于树脂特性的提高和成本降低,塑料封装就占了主导地位。目前,塑料封装材料的主流是环氧树脂,但因环氧树脂系热固性树脂,在成型方法上存在着许多问题,诸如浇口流道部的树脂不可重复使用,要清除毛边,成型周期长以及需要后固化等等。为了克服这些缺陷,研究用热塑性树脂来封装电子元件。下面谈谈用PPS树脂封装电子元件的可能性。     

铜基引线框架材料研究进展

引线框架是集成电路中极为关键的部件之一,其主要功能是支撑芯片、散失工作热量和连接外部电路等。铜合金以其优良的性能成为重要的引线框架材料。本文综述了铜基引线框架的国内外研究现状,并重点介绍了在Cu-Ni-Si合金中加入微量合金元素P、Cr、Ag的微合金化研究成果。     

The influence of alloy composition on microstructure and tensile behaviour of copper-lead alloys

Lead is a soft metal that possesses excellent antifriction and lubricating characteristics and is a desired addition to alloys which find use in friction-critical and low-load-bearing applications. The influence of alloy composition on microstructure, tensile properties and quasi-static fracture behaviour has been studied. Alloy composition, that is, lead content, was observed to have an influence on the size and distribution of lead globules in the copper matrix. The yield strength, ultimate tensile strength and elastic modulus of the alloy decreased with increase in lead content. The ductility of the alloys showed an improvement with increase in lead content. The influence of lead content on quasi-static fracture is discussed in detail.     

Joining and wetting of CaO-stabilized ZrO2 with Al-Cu alloys

The contact angles of molten Al-Cu alloys on CaO-stabilized ZrO₂ have been measured using a sessile drop technique at 1373 K under a vacuum. The work of adhesion, W _ad, of an alloy against ZrO₂ was evaluated from the equilibrium contact angle of the alloy. The W _ad values Al-Cu alloys with copper contents up to 10 at% are the same or slightly higher than the value of 1.25 J m^–2 for pure aluminium. On further increase in copper content, W _ad gradually decreases to 0.8 J m^–2 for pure copper at 1373 K. The general trend in the work of adhesion against copper content of Al-Cu alloys is in accordance with the copper-content dependence of the joining strength of ZrO₂ joints brazed with the Al-Cu alloys. A ZrO₂ joint brazed with Al-1.7 at% Cu filler provides the maximum fracture strength of 105 MPa at room temperature, and this improved strength of ZrO₂ is maintained at elevated temperatures up to 773 K. The joining strength of a ZrO₂ joint brazed with an Al-Cu alloy is dominated by the mechanical properties of the alloy in addition to the wettability of the alloy against ZrO₂.     

An investigation into the tribological performance of Physical Vapour Deposition (PVD) coatings on high thermal conductivity Cu-alloy substrates and the effect of an intermediate electroless Ni-P layer prior to PVD treatment

The use of high thermal conductivity copper alloys in plastic injection moulds provides the benefit of rapid moulding cycles through effective heat transfer. However, copper alloys are relatively soft and wear rapidly so manufacturers are now developing copper alloys with increased hardness and wear resistance. Their wear resistance can be further improved by the deposition of hard coatings such as electroplated chromium, electroless nickel and Physical Vapour Deposition (PVD) coatings. In this paper, the tribological performance of three proprietary high-strength Cu alloys (Ampcoloy® 940, Ampcoloy® 944 and Ampcoloy® 83) coated with PVD CrN and CrAlN coatings has been evaluated. A medium phosphorous content electroless Ni-P (ENi-P) plated layer was also deposited as a pre-treatment to PVD CrN and CrAlN coatings to increase the load support. The effect of this intermediate ENi-P layer was also evaluated. Surface roughness and instrumented hardness measurements were used to characterise all coated systems in both plated (i.e. with the intermediate ENi-P coating) and standard (i.e. unplated) conditions. Scratch tests were also performed to evaluate the effect of the ENi-P on PVD coating adhesion to Cu alloy substrates. The tribological behaviour of PVD-coated Cu alloy systems was evaluated by pin-on-disc wear tests and ball-on-plate impact tests. Results demonstrate that the ENi-P layer improves the load support for PVD coatings on Cu alloys, thereby improving their tribological performance. However, for PVD-coated Cu alloys in the standard condition, the Cu alloy substrate type plays an important role in the tribological performance of PVD coatings. For instance, PVD CrN coatings were more suited to a certain Cu alloy type whilst CrAlN to the other two types.     

高强高导铜合金的研究状况

高强高导电铜合金是一类具有优良综合性能的功能材料和结构材料,被广泛应用于电子、机械等领域,本文阐述了高强高导铜合金的研究现状,系统介绍了此类合金的强化机理、制备方法及组织和性能特点,并且分析了稀土的作用机制及对该类铜合金性能的影响,最后展望了该类合金的发展前景。     

Cyclic oxidation of copper doped Ti-48Al-2Cr-2Nb

The widespread use of titanium aluminide alloys will require effective joining techniques for primary fabrication and repair. One such technique is Transient Liquid Phase (TLP) bonding, which has been used to join titanium aluminide alloys. A successful TLP bonding process uses a copper-containing composite interlayer and thus introduces a small amount of copper into the alloy. Although even relatively small alloying additions can be detrimental to the oxidation resistance of titanium aluminide alloys, the amount of copper added to the alloy during the TLP bonding process has previously been shown to be neutral or beneficial to the isothermal oxidation resistance of the alloy. In this paper, a small amount of copper introduced during TLP bonding is shown to have no detrimental effect on the cyclic oxidation of Ti-48 at% Al-2 at% Cr-2 at% Nb.     

Aging Strengthening in Rapidly Solidified Cu-Cr-Sn- Zn Alloy

It is known that the strength of alloys can be successfully improved by rapid solidification. The paper presents a process where Cu-Cr-Sn-Zn lead frame alloy is produced by rapid solidification and aging. The microcrystalline structure of rapidly solidified Cu-Cr-Sn-Zn alloy is smaller grain structure examined by optical metallography. The effects of aging processes on the microstructure and properties of the lead frame alloy were investigated. Aged at 500°C for 15 min the fine coherent precipitates Cr dist...     

引线框架铜合金精轧薄板表面起皮剥落的数值分析

运用弹塑性有限元方法的平面应变分析模型，依据引线框架Cu-Fe-P合金精轧后表面起皮剥落处的显微组织特征，研究了Cu基体和Fe相颗粒界面附近的应力应变场分布。研究表明：铜基体与铁相的塑性行为及应力应变分布具有明显的不均匀性．界面区强烈的应力集中易造成界面开裂；精轧前Fe相周围的微裂纹在精轧变形时将进一步发展，直至发生引线框架扳材表面起皮剥落破坏。应避免热轧板坯中出现较大Fe颗粒。     

优化耐磨含铝铜基合金的组织与性能研究

对优化设计得到的新型耐磨铜合金的力学性能进行了试验研究。试验结果表明，该种铜合金的耐磨性有明显提高，硬度和抗拉强度均优于某些铜合金，而伸长率却不降低。运用扫描电镜和俄歇电子能谱等分析方法对其显微组织和相结构进行了研究。结果发现，优化铜基合金组织中含有较多的硬质点、减摩相和细化的组织，这些都对提高铜合金的耐磨性十分有利。