Cf/SiC复合材料与Ti合金的Ag-Cu-Ti-TiC复合钎焊

以Ag-Cu-Ti-TiC复合钎料为中间层,在适当的工艺参数下真空钎焊Cf/SiC复合材料与Ti合金.利用SEM、EDS和XRD分析接头的微观组织结构,利用剪切实验检测接头的力学性能.结果表明:钎焊时,借助液态钎料,复合钎料中的Ti与Cf/SiC复合材料反应,在Cf/SiC复合材料与连接层界面形成Ti-Si-C、Ti-Si和少量TiC化合物的混合反应层;复合钎料中的Cu与Ti合金中的Ti发生互扩散,在连接层与Ti合金界面形成不同成分的Cu-Ti化合物过渡层;钎焊后,形成TiC颗粒强化的致密复合连接层,TiC的加入降低了接头的残余热应力,Cf/SiC/Ag-Cu-Ti-TiC/TC4接头的剪切强度明显高于Cf/SiC/Ag-Cu-Ti/TC4接头的.     

Cf/SiC复合材料与钛合金(Ti-Zr-Cu-Ni)+W复合-扩散连接

采用(Ti-Zr-Cu-Ni)+W复合钎料作为连接层,在连接温度930℃,保温时间5min的工艺参数下真空钎焊Cf/SiC复合材料与钛合金.利用SEM,EDS和XRD分析接头微观组织结构,利用剪切试验测试接头力学性能.结果表明,钎焊时复合钎料中的钛、锆与C/SiC复合材料反应,在Cf/SiC复合材料与连接层界面生成Ti3SiC2,Ti5Si3和少量TiC(ZrC)化合物的混合反应层,连接层的铜、镍与钛合金中的钛发生相互扩散,在连接层与钛合金界面形成Ti-Cu化合物过渡层.对钎焊接头进行900℃,保温60 min扩散处理后,连接层组织达到均一化,母材TC4合金侧过渡层增厚.扩散处理后接头强度为99 MPa,较钎焊接头强度65 MPa提高了52％.     

(Ag-Cu-Ti)+(Ti+C)复合钎料钎焊Cf/SiC复合材料与TC4钛合金

Ag-Cu-Tj复合钎料中加入Ti粉和石墨碳粉作为中间层,在适当的工艺条件下真空钎焊Cf/SiC复合材料与TCA.利用SEM,EDS,XRD分析接头微观组织,利用剪切试验检测接头力学性能.结果表明:钎焊时,复合钎料中的Ti与Cf/SiC复合材料反应,在Cf/SiC复合材料与连接层界面形成由Ti3、SiC2相、Ti5Si3相和少量TiC化合物组成的混合反应层.复合钎料中的Cu与Ti合金中的Ti发生互扩散,在连接层与Ti合金界面形成不同Ti含量的Cu-Ti化合物过渡层.钎焊后,连接层中Ti和石墨碳反应形成的TiC微粒均匀分布在复合连接层中,缓和了接头的热应力.当连接温度为910℃,保温时间为25 min时,可得到接头剪切强度为145 MPa.     

Cf/SiC复合材料与钛合金(Ti-Zr-Cu-Ni)+W复合钎焊分析

在适当的工艺参数下,用(Ti-Zr-Cu-Ni)+W复合钎料真空钎焊Cf/SiC复合材料与钛合金,采用SEM,EDS和XRD分析接头组织结构,利用剪切试验检测接头的力学性能.结果表明,钎焊时复合钎料中的钛、锆与Cf/SiC复合材料反应,在Cf/SiC复合材料与连接层界面生成Ti3SiC2,Ti5Si3和少量TiC(ZrC)化合物的混合反应层,在连接层与钛合金界面形成Ti-Cu化合物扩散层.增强相钨粉能有效缓解接头的残余热应力,提高接头力学性能,在连接温度930℃,保温时间20 min的工艺条件下,增强相钨粉含量为15%(体积分数)时,接头抗剪强度最高为166 MPa.     

TiC增强Cf/SiC复合材料与钛合金钎焊接头工艺分析

采用Ag-Cu-Ti-（Ti＋C）混合粉末作钎料,在适当的工艺参数下真空钎焊Cf/SiC复合材料与钛合金,利用SEM,EDS和XRD分析接头微观组织结构,利用剪切试验检测接头力学性能.结果表明,钎焊后钎料中的钛与Cf/SiC复合材料发生反应,接头中主要包括TiC,Ti3SiC2,Ti5Si3,Ag,TiCu,Ti3Cu4和Ti2Cu等反应产物,形成石墨与钛原位合成TiC强化的致密复合连接层.TiC的形成缓解了接头的残余热应力,并且提高了接头的高温性能.接头室温、500℃和800℃高温抗剪强度分别达到145,70,39 MPa,明显高于Cf/SiC/Ag-Cu-Ti/TC4钎焊接头.     

AgCuTi-Al钎焊C_f/SiC与TC4接头分析

采用AgCuTi-Al混合粉末作为中间层,在适当的工艺参数下真空钎焊Cf/SiC复合材料和钛合金,利用扫描电镜,能谱仪和X射线衍射对接头的微观组织结构进行分析,利用剪切试验测定接头的力学性能.结果表明,在钎焊过程中,钎料中的钛与Cf/SiC复合材料中的基体SiC,碳纤维发生反应,在Cf/SiC复合材料侧形成了TiC,T...     

TiNiNb钎焊Cf/SiC与TC4接头组织结构

文中在钎焊温度980℃、钎焊时间15 min的条件下,采用Ti_54.8Ni_34.4Nb_10.8（原子分数,%）共晶合金粉末真空钎焊C_f/SiC复合材料与TC4钛合金.用SEM,EDS及差热分析法（DTA）观察测定了钎料组织、成分及熔点,分析了钎焊接头的微观组织结构.结果表明,Ti_54.8Ni_34.4Nb_10.8共晶钎料由Ti₂Ni及Ti（Nb,Ni）化合物组成,实际熔点为935℃.钎焊过程中,Ti和Nb元素与复合材料反应形成TiC和NbC混合反应层;钎料中的镍与TC4中的镍发生互扩散,在TC4钛合金侧形成扩散层;连接层由弥散分布的Ti（Nb,Ni）化合物和Ti₂Ni相组成.C_f/SiC与连接层界面为接头最薄弱环节,此处易形成裂纹.     

Cf/SiC复合材料与钛合金Ag-Cu-Ti活性钎焊

采用Ag-Cu-Ti活性钎料真空钎焊Cf/SiC与钛合金,利用扫描电镜、能谱仪和X射线衍射对钎焊接头组织结构进行分析,利用剪切试验检测接头力学性能.结果表明,接头反应产物主要有TiC,Ti3SiC2,Ti5Si3,Ag,TiCu,Ti3Cu4和Ti2Cu.在Cf/SiC复合材料附近形成TiC+ Ti3SiC2/Ti5S...     

Cu-Ti-C反应复合-扩散连接Cf/SiC复合材料和TC4钛合金接头的组织结构

用Cu粉、Ti粉、石墨粉组成的混合粉末连接Cf/SiC陶瓷基复合材料和TC4钛合金,采用X射线衍射、扫描电镜和能谱仪对接头组织结构进行分析.结果表明:在Cu-(15～30)Ti(ω,%)粉末中加入适量石墨粉作钎料,经900～950℃、5～30 min真空钎焊,获得了完整的原位合成TiC增强的复合接头.通过在连接层中原位合成一定体积分数TiC可以明显降低接头热应力.钎料石墨颗粒中的C元素和液相连接层中Ti元素发生相互扩散,形成了残余石墨颗粒周围的TiC反应层和分布在连接层中的TiC颗粒.反应速率主要受C元素由石墨颗粒向液相连接层的扩散速率所控制.     

Cf/SiC复合材料与304不锈钢钎焊接头组织与性能

采用Ti-Zr-Be活性钎料作为连接层,在一定工艺参数下真空钎焊Cf/SiC复合材料和304不锈钢.利用SEM,EDS,XRD和俄歇谱仪分析接头微观组织结构,利用剪切试验检测接头力学性能,分析了工艺参数对接头抗剪强度的影响.结果表明,在复合材料附近形成ZrC+Ti C+Be2C/Ti-Si反应层,连接层中主要包含Fe Zr2,锆基固溶体,Be Ti,Ti-Zr固溶体等反应产物,304不锈钢附近形成Fe Ti/αFe反应层.在连接温度为950℃,连接时间为60min时,接头室温抗剪强度最高为109.3 MPa,断裂位置为Cf/SiC复合材料与中间层连接界面靠近复合材料端.     

Joining of Cf/SiC Composite and TC4 Using Ag-Al-Ti Active Brazing Alloy

Carbon fiber reinforced SiC (C_f/SiC) composite was successfully joined to TC4 with Ag-Al-Ti alloy powder by brazing. Microstructures of the brazed joints were investigated by scanning electron microscope, energy dispersive spectrometer, and x-ray diffraction. The mechanical properties of the brazed joints were measured by mechanical testing machine. The results showed that the brazed joint mainly consists of TiC, Ti₃SiC₂, Ti₅Si₃, Ag, TiAl, and Ti₃Al reaction products. TiC + Ti₃SiC₂/Ti₅Si₃ + TiAl reaction layers are formed near C_f/SiC composite while TiAl/Ti₃Al/Ti + Ti₃Al reaction layers are formed near TC4. The thickness of reaction layers of the brazed joint increases with the increased brazing temperature or holding time. The maximum room temperature and 500 °C shear strengths of the joints brazed at brazing temperature 930 °C for holding time 20 min are 84 and 40 MPa, respectively.     

Interfacial Behavior and Its Effect on Mechanical Properties of C<Subscript>f</Subscript>/SiC Composite/TiAl6V4 Joint Brazed with TiZrCuNi

In order to characterize the interfacial behavior of brazed joints and offer theoretical basis for the applications of TiZrCuNi-based composite fillers, C_f/SiC composite and TC4 were brazed by TiZrCuNi filler, and the microstructures of joints versus temperature and versus holding time were systematically studied in this paper. The mechanical properties of brazed joints were measured and analyzed. The results showed that Ti(Zr)C, Ti₅Si₃, Ti₂Cu, TiNi, TiZrCu₂, Ti₂(Cu,Ni) and Ti(s,s) were the predominant compounds in the joints. Brazing temperature had a distinct effect on the microstructures of joints: with the increase of brazing temperature, the structure of brazed joints was reduced from four parts to three parts, and the wavy reaction layer became continuous and much thicker. While holding time had a similar but weaker effect on microstructures: with the extension of holding time, the reaction layer became thicker, but it was difficult to induce the decrease in the structural parts of joint. The thickness of reaction layer determined the mechanical properties of joints. The results were beneficial for the selection of reinforced phases and the design of composite fillers to obtain better mechanical performances. When the brazing temperature was 940 °C and the holding time was 25 min, the maximum shear strength of brazed joints attained a value of 143.2 MPa.     

Ag-Cu+WC复合钎料钎焊ZrO2陶瓷和TC4合金

采用新型Ag-Cu+WC复合钎料进行ZrO₂陶瓷和TC4合金钎焊连接,探究了接头界面组织及形成机制,分析了钎焊温度对接头界面结构和力学性能的影响. 结果表明,接头界面典型结构为ZrO₂/TiO+Cu₃Ti₃O/TiCu+TiC+W+Ag_(s,s)+Cu_(s,s)/TiCu₂/TiCu/Ti₂Cu/TC4. 钎焊过程中,WC颗粒与Ti发生反应,原位生成TiC和W增强相,为Ti-Cu金属间化合物、Ag基和Cu基固溶体提供了形核质点,同时抑制了脆性Ti-Cu金属间化合物的生长,优化了接头的微观组织和力学性能. 随钎焊温度的升高,接头反应层的厚度逐渐增加,WC颗粒与Ti的反应程度增强. 当钎焊温度890 ℃、保温10 min时,复合钎料所得接头抗剪强度达到最高值82.1 MPa,对比Ag-Cu钎料所得接头抗剪强度提高了57.3%.     

Al2O3/SUS304 Brazing via AgCuTi-W Composite as Active Filler

Alumina ceramic (α-Al₂O₃) was brazed to stainless steel (SUS304) using an Ag-Cu-Ti + W composite filler and a traditional active brazing filler alloy (CuSil-ABA). Then, the effects of the presence of W particles and of the brazing parameters on the microstructures and mechanical properties of the brazed joints were investigated. The maximum tensile strength of the joints obtained using Ag-Cu-Ti + W composite filler was 13.2 MPa, which is similar to that obtained using CuSil-ABA filler (13.5 MPa). When the joint was brazed at 930 °C for 30 min, the tensile strengths decreased for both kinds of fillers, although the strength was slightly higher for the Ag-Cu-Ti + W composite filler than for the Ag-Cu-Ti filler. The interfacial microstructure results show that the Ti reacts with W to form a Ti-W-O compound in the brazing alloy. When there are more W particles in the brazing alloy, the thickness of the Ti _X O _Y reaction layer near the alumina ceramic decreases. Moreover, W particles added to the brazing alloy can reduce the coefficient of thermal expansion of the brazing alloy, which results in lower residual stress between the Al₂O₃ and SUS304 in the brazing joints and thus yields higher tensile strengths as compared to those obtained using the CuSil-ABA brazing alloy.     

Microstructure and mechanical performance of brazed joints of Cf/SiC composite and Ti alloy using Ag–Cu–Ti–W

Abstract

C_f/SiC composite was brazed to Ti alloy using interlayer of Ag–Cu–Ti–W mixed powder. The effects of W content and brazing parameters on the microstructure and properties of the brazed joints were investigated. The results show that W grains mainly distribute in Ag phase in the brazing layer and provide the effects of reinforcement and lowering residual thermal stress on the joint. The room temperature and 500°C shear strengths of the joints performed at 500°C for 30 min with Ag–Cu–Ti–50W (vol.-%) are remarkably higher than the optimal strengths of the joints brazed with Ag–Cu–Ti.     

采用Ag-Cu-In-Ti钎料真空钎焊SiO2f/SiO2复合陶瓷与铌

设计了Ag-(15~26)Cu-(13~20)In-(3.1~6.9)Ti活性钎料,分别在780℃/20 min,780℃/40 min和800℃/10 min三种参数下实现了SiO_2f/SiO₂复合材料与铌的连接,分析了接头微观组织,测试了接头室温抗剪强度.其中800℃/10 min钎焊参数下的接头平均抗剪强度最高,达到21.6 MPa;微观分析结果表明,接头中靠近SiO_2f/SiO₂母材界面处形成了厚度约为2μm的连续扩散反应层,靠近铌的界面钎料与母材也形成了良好的结合.该钎焊参数下接头界面物相依次为:SiO_2f/SiO₂→TiO+TiSi₂→TiO+Cu₃Ti→Ag(s, s)+Ag₃In+Cu(s, s)→Nb.     

Infrared brazing of Ti50Ni50 shape memory alloy using gold-based braze alloys

Infrared brazing Ti₅₀Ni₅₀ shape memory alloy using pure Au and Au-20Cu as the fillers has been investigated. The Au-rich and Au₄Ti phases, and Au₂TiNi, AuCu and Ni₃Ti phases are formed in the brazed joints using Au filler and Au-20Cu filler, respectively. The bending test shows the shape memory effect of brazed joint using Au filler is superior to that using Au-20Cu filler because the detrimental AuCu and Ni₃Ti phases exist in the latter case.     

Ti活度对Al2O3/AgCuTi/Fe-Ni-Co钎焊接头机械性能和微观组织结构的影响

采用AgCuTi钎料实现了Al₂O₃陶瓷与Fe-Co-Ni合金的钎焊连接,并调查了不同钛含量的钎料对Al₂O₃/AgCuTi/Fe-Ni-Co钎焊接头机械性能和微观组织结构的影响。扫描电子显微镜(SEM), X射线能量色散光谱仪(EDS), X射线衍射仪(XRD)及电子万能试验机用于分析钎焊接头的机械性能和微观组织结构,结果表明:钛含量的增加明显提高AgCuTi钎料与Al₂O₃陶瓷的相互作用,在Al₂O₃/Ag-Cu-Ti界面生成一层由Ti-Al 和 Ti-O化合物组成的反应层。Al₂O₃/AgCuTi/Fe-Ni-Co钎焊接头的抗拉强度随钛含量的增加而增加,当钛含量提高到8wt.%时,抗拉强度达到最大值78Mpa。通过微观组织结构分析发现,采用AgCu4Ti在890℃保温5min的条件下可以获得较好的钎焊接头,典型接头的微观组织结构为Al₂O₃/TiAl+Ti₃O₅/NiTi+Cu₃Ti+Ag(s,s)/Ag(s,s)+Cu(s,s)+(Cu,Ni)/Fe-Ni-Co。采用AgCu8Ti获得的钎焊接头的界面反应层与AgCu4Ti差异不大,但反应层稍微增厚,并伴有TiO和Ti3Al在Al₂O₃/Ag-Cu-Ti界面生成。