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1.
在酸性化学镀镍磷合金镀液中添加稀土元素(La、Pr、Nd),研究了其对镀速的影响。对镀层进行了XRD分析,用SEM观测表面形貌,EDX分析镀层组成,并进行了耐腐蚀极化曲线测定。结果表明在镀液中添加稀土离子能显著降低镀速,甚至完全终止Ni-P的沉积。镀液中添加稀土时,镀层中不含稀土元素,镀层仍为非晶态结构,但P含量略有降低,镀层的表面形貌发生了变化。镀液中含稀土(La、Pr、Nd)时,所得镀层在3.5%NaCl溶液中的自腐蚀电位降低,腐蚀电流密度增大,耐腐蚀性降低。  相似文献   

2.
Bath decomposition is a major problem in the electroless nickel (EN) plating system. Although the stabilization mechanism is far from being fully understood, bath stabilizers are normally added to extend the bath life in a viable EN plating solution. In this study, the effects of Cd2+ as a stabilizer on the plating rate, bath stability, and phosphorus content, corrosion resistance and microstructure of the deposits were investigated. The deposited films were examined using a scanning electron microscope (SEM) equipped with energy dispersive X-ray (EDX) spectroscopy and the X-ray photo spectroscopy (XPS). The electronic tunneling mechanism was used to elucidate the effect of the Cd2+ stabilizer on the plating system theoretically. The results calculated from theoretical method agreed well with the experimental data.  相似文献   

3.
稀土对电沉积Ni-P合金镀层显微组织的影响   总被引:9,自引:0,他引:9  
研究了在镀液中添加稀土元素后Ni P合金镀层显微组织的变化。X射线衍射及透射电镜分析结果表明 ,在镀液中添加一定量的稀土元素 ,明显地促进了Ni P合金微晶组织向非晶态组织转变 ,从而提高Ni P合金镀层的耐蚀性。电化学极化曲线测试结果表明 ,稀土元素能够促进电沉积过程的阴极极化。由于稀土离子的特性吸附抑制了合金原子在电极界面的正常形核 ,因而促进了非晶组织的形成。  相似文献   

4.
D. Liu  L. Zhou  J. Yu  Y. Yan  K. Lee 《工业材料与腐蚀》2011,62(10):926-931
Electroless Ni–PTFE–P coatings have been successfully deposited on the surface of mild steel shaft from plating baths containing various concentrations of rare earth metal cerium (RE Ce). Surface morphology, Ce fraction, and thickness of the coatings were characterized by scanning electron microscope, inductively coupled plasma optical emission spectrometry, and reflection optical microscope, respectively. Salt spray test was used to determine the corrosion resistance of the coating. Results revealed that structure, compactness, and deposition rate of the Ni–PTFE–P coatings were increased significantly by addition of a small amount of RE Ce (10–20 ppm) to the plating bath. Electroless Ni–PTFE–P coating deposited from plating baths with 20 ppm Ce shows the highest corrosion resistance, owing to its high compactness and thickness. Deposition rate and corrosion resistance of the Ni–PTFE–P coating were deteriorated greatly as concentration of RE Ce in the plating baths exceeds 100 ppm.  相似文献   

5.
Through adding the chlorides of La and Ce into Ni-P coelectrodeposition bath, the effects of rare earth (RE) elements on the performances of the bath have been investigated by hull cell tests, far and near cathodes tests, and so on. It is shown that the optimum contents of CeCl3, LaCl3 and their mixture are all 2 g/L. The bright zones of the Ni-P coelectrodeposition bath are greatly widened by the addition of RE, and this effect is more obvious in the low current density range. By the addition of RE, the current efficiency of the Ni-P coelectrodeposition bath is greatly increased. The results also show that RE elements can improve the dispersing capacity of the bath. It can be theoretically deduced that RE ions improve the cathodic polarization degree of Ni-P codeposition. This deduction has been confirmed by the cathodic polarization curves measured in the baths.  相似文献   

6.
添加稀土元素对Ni-P/PVDF化学复合镀层耐蚀性的影响   总被引:1,自引:0,他引:1  
在化学镀Ni-P/PVDF合金镀液中添加稀土元素Y3+和La3+制备Ni-P/PVDF(RE)复合镀层,用电化学腐蚀测试系统测试复合镀层的耐蚀性,研究了稀土元素的添加量对镀层耐蚀性能的影响。结果表明,在基础镀液中加入适量稀土元素后,所获得的Ni-P/PVDF(RE)复合镀层的晶粒较Ni-P/PVDF镀层更为细小,表面更加均匀和致密;镀层的耐蚀性随着稀土元素加入量的增加呈现先增强后减弱的趋势;在稀土元素的添加量为0.1g/L时,复合镀层的耐蚀性最好。在PVDF微粒和稀土元素的共同影响下,进一步提高Ni-P/PVDF(RE)镀层的耐蚀性。  相似文献   

7.
本文以获得含铁量为20%的镍铁合金镀层的电镀工艺为基础,在简单硫酸盐镀液中,全面系统地研究了稀土添加剂对该体系镇渡性能的影响。结果表明:(1)稀土有稳定镀液、减少Fe~(3+)的作用;(2)稀土可扩大获得光亮镀层的电流密度范围;(3)稀土可明显提高镀液分散能力和阴极电流效率,促使阴极极化增大;(4)稀土的最佳添加量为0.2-0.5g/L。文中还阐明了稀土的作用机理。  相似文献   

8.
《金属精饰学会汇刊》2013,91(4):215-219
Abstract

Electroless copper deposition is widely used for printed circuit applications. A new bath based on copper methane sulphonate replacing copper sulphate, EDTA and paraformaldehyde has been developed, which is very useful for plating on non-conductors and through hole plating in printed circuit manufacturing processes. The new bath has a higher rate of deposition of 3·3 μm h?1 than the conventional sulphate bath (with a rate of 1·5 μm h?1) and the bath stability and the quality of the deposits are very good. Scanning electron microscopy, X-ray diffraction and atomic force microscopy studies have been carried out and the crystallite size of the copper is measured to be 134 nm with a preferred orientation of 200 planes. The deposit obtained is pure copper and the surface roughness is of the order of 10 nm.  相似文献   

9.
表面活性剂在陶瓷化学镀铜工艺中的作用   总被引:2,自引:0,他引:2  
通过研究在镀液中添加十六烷基三甲基溴化铵(CTAB)、十二烷基硫酸钠(SDS)和吐温-80三种表面活性剂对化学镀铜沉积速率和镀液稳定性的影响,确定出三种添加剂的最优添加浓度。通过扫描电镜、能谱分析仪和X射线衍射仪,对镀层表面形貌、组成成分以及晶体结构分别进行研究。并通过线性伏安扫描法,研究了添加不同表面活性剂镀液的电化学行为。结果表明:表面活性剂可以提高化学镀铜的沉积速率和镀液稳定性。CTAB、SDS和吐温-80的最优添加浓度分别为1mg/L、20mg/L和5mg/L。加入SDS后,由于沉积速率过大,使得镀层颗粒变大。加入CTAB和吐温-80可以细化镀层的颗粒且更加致密。添加不同的表面活性剂后,镀层的晶粒尺寸没有太大改变,含铜量均为100%且镀层的晶粒呈现面心立方晶体结构。表面活性剂主要通过影响甲醛的氧化反应影响化学镀铜过程。  相似文献   

10.
稀土添加剂对快速镍刷镀层的影响   总被引:3,自引:0,他引:3  
研究了稀土元素铈对快速镍电刷镀工艺及镀层的影响。结果表明,镀液中硫酸铈加入量为0.3-0.6g/l时,稀土元素可以提高镀层沉积速度,改善镀层表面质量,降低镀层孔隙率,提高镀层硬度,但不降低镀液稳定性和镀层结合力。同时指出,镀层质量的提高是由于稀土元素使镀层的内部组织结构产生了变化。  相似文献   

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