45钢真空扩散焊接时的界面变形及其作用

通过研究45钢的真空扩散焊接工艺,重点研究了焊接界面在压力作用下的塑性变形,探讨了变形率对焊接质量和工艺制定的影响.结果表明,影响45钢真空扩散焊接质量的一个重要因素是在一定压力下的变形率;当变形率超过临界值后,即焊接界面通过塑性变形达到完全弥合后,温度、压力和保温时间对焊接质量影响不明显.焊后退火可改善焊接界面区组织使强度得到保证,扩散焊接时间缩短.     

扩散连接界面物理接触行为的动态模型

通过把连接初期可能存在的不影响连接进程的空洞排除掉，并把中间层与屈服极限较小的母材一体化，提出了既能真实反映实际表面几何形状及连接时表面间的接触几何特性，又能简化紧密接触与接合面积数学处理过程的扩散连接接头接触界面几何模型。分析了扩散连接过程的重要阶段-物理接触阶段，并建立了相应的接合面积计算模型。利用此模型可以很好地解释扩散连接接头界面不同区域接合强度不同的现象。模型显示，在扩散连接的物理接触过程中，不同区域的接合能力不同，剪切应力对促进界面空洞的塑性变形及弥合发挥着非常重要的作用。     

Ti-17钛合金扩散连接界面特征及接头剪切强度(英文)

研究不同连接时间下Ti-17钛合金扩散连接界面特征及接头剪切强度。结果表明,随着连接时间的延长,连接界面平均空洞尺寸逐渐减小,空洞数量增加至最大值后逐渐减少。具有锯齿状边缘的不规则空洞逐渐转变为具有平滑表面的椭圆形空洞以及细小的圆形空洞。当连接时间为60 min时连接界面上形成了跨连接界面的晶粒。接头剪切强度随着连接时间的延长而增大,当连接时间为60 min时,接头剪切强度达到最大值,为887.4 MPa。尽管塑性变形的作用时间很短,但是对促进空洞闭合以及提高接头剪切强度的作用显著。     

外场处理在镍基高温合金组织控制中的应用

在镍基高温合金的热处理中施加静电场或脉冲电流,研究外场作用下合金组织结构的演化行为及机制。结果表明,静电场处理（EFT）可以促进合金中的空位运动,使合金中孪晶界面比例显著增加;静电场可以促进原子扩散,改变合金中沉淀相形核、长大的热力学及动力学条件。在镍基高温合金的塑性变形过程中进行脉冲电流处理（EPT）,可显著降低合金的塑性变形抗力、提高其塑性变形能力。同时,脉冲电流可以降低合金的再结晶激活能,促进再结晶晶核的形成及长大。     

硬质合金刀具前刀面刀屑粘焊形成及元素扩散理论模型

结合菲克第二定律描述了前刀面刀屑的元素浓度分布,采用半无限长模型,建立考虑温度影响的刀屑元素扩散方程;通过分析切削过程中粘焊的形成过程,利用夹紧件和焊接件在不同温度下的扩散分别近似模拟粘焊未产生和产生时在不同温度下的元素扩散情况,探究温度和粘焊对元素扩散的影响;同时,结合扩散试件在不同温度下的元素浓度分布,采用数据拟合软件进行数据处理及参数的确定。研究表明:粘焊的产生并不影响扩散的最终浓度,但在一定程度上影响扩散的进程;随着温度的升高,扩散速率及扩散距离都有相应地增大。研究结果对于从微观层面揭示原子运动规律,进而提高刀具抗粘结破损性能具有重要意义。     

加热时间对钛合金热自压连接及接头组织性能影响

对不同加热时间下获得的钛合金刚性拘束热自压连接接头进行了连接界面光学显微镜观察,背散射电子衍射组织分析和接头拉伸力学性能测试,分析了加热时间对连接接头界面缺陷、组织和力学性能的影响。同时,利用热弹塑性有限元模型分析了连接中热应力应变演变过程,阐明了加热时间对连接接头界面焊合质量、组织和力学性能影响的原因。结果表明：加热峰值温度相当的情况下,加热时间增加,界面金属高温存在时间和受压应力作用时间以及横向压缩塑性变形增加,促进界面两侧原子扩散,界面未焊合缺陷减少,接头综合力学性能提高。加热时间至300s以上时,可以获得界面焊合质量好,组织均匀,综合力学性能优异的固相连接接头。     

"相变-扩散钎焊(T/DB)"新工艺及其接头界面形貌

为减小相变超塑性扩散连接的循环次数,提出了一种新型焊接工艺"相变-液相扩散焊(T/DB)",即在待焊母材间预先放入液相扩散焊用的中间层,然后按传统相变超塑性扩散连接工艺施焊,但要求温度循环的峰值温度须同时大于母材的相变点与中间层的熔点.试验以低碳钢为母材,以镍基非晶箔带(BNi2)为中间层,进行了低碳钢的相变-扩散钎焊(循环3次)与液相扩散焊接(1200℃×3 min)的对比试验.结果表明相变-液相扩散焊所需温度循环次数少,接头无界面空洞,其接合线呈非平面状;而液相扩散焊接头的接合线较平直.分析认为,界面的起伏是母材的适度溶解与超塑性流变共同作用的结果;非平面状界面有利于增大金属-金属接触面积及扩散通道的面积,为获得合格接头做出了相应贡献.     

AA6061铝合金超声波金属焊接计算分析模型

实现AA6061铝合金超声波金属焊接有效连接的关键机制是表面效应和体积效应。表面效应是焊接接头界面的摩擦;而体积效应存在于整个焊接过程中,影响了金属工件成形应力和形变。基于超声波焊接的关键机制建立了AA6061铝合金的材料模型和界面接触摩擦模型,依托ABAQUS有限元软件进行了铝合金超声波焊接的热-机耦合数值模拟分析。结果表明:与超声焊极相接触的铝合金界面产生最高温度和剧烈塑性变形,但低于母材熔点温度值。当焊极压力175 MPa,振幅8.4μm,加载时间60 ms时,界面最高温升至357.5℃,随着超声焊极压力持续增加铝合金表面发生粘焊。     

塑性变形连接工艺对TC17合金/TC4合金连接界面组织与力学性能的影响EI北大核心CSCD

采用塑性变形连接方法制备了TC17合金/TC4合金连接接头,通过金相显微镜(OM)和扫描电子显微镜(SEM)等微观组织表征方法及单向剪切试验,研究了不同连接参数下TC17合金/TC4合金连接界面的微观组织与力学性能,分析了其内在联系,并探究了空洞组织的演化机制。结果表明:连接压力和连接温度对TC17合金/TC4合金连接界面的空洞演化、界面结合率和剪切强度影响更为显著。由于TC17合金/TC4合金连接界面塑性流动和原子扩散的协同作用,连接界面接触面积增大,界面处产生较大的局部应变,空洞由短棒状转变为椭圆形再变为圆形,并逐渐减小直至消失,从而使界面结合率提高,剪切强度增大。     

2B06及7B04铝合金扩散连接数值模拟研究

针对2B06铝合金及7B04铝合金扩散连接变形及焊合率控制难题，在有限元软件ABAQUS中构建扩散连接变形有限元仿真模型及扩散连接界面孔洞闭合有限元仿真模型，研究不同扩散温度、加载压力及时间下的两种铝合金扩散连接厚度压缩变形及界面连接过程，最终确立一组优化的工艺参数。模拟结果表明：选择扩散连接温度500～510℃、加载压力4 MPa,能够在3～10 h内实现扩散连接界面孔洞的完全闭合。通过工艺试验得到扩散连接最佳工艺参数，证明模拟结果合理。     

扩散连接接头行为数值模拟的发展现状

扩散连接技术是一门边缘科学,涉及材料、扩散、相变、界面反应、接头应力应变等各种行为,工艺参数多,虽然已经进行了大量的试验研究,但却对各种材料的连接机理尚未有明确的认识,为此人们试图借助于计算技术,对接头行为进行数值模拟,以便找到共同规律,对扩散连接过程及质量进行预测与实时控制。本文主要内容就是概括地介绍了国内外关于扩散连接接头行为数值模拟的发展现状;主要包括界面孔洞消失过程、接头元素扩散与反应层的形成、接头变形与应力行为的数值模拟,以使人们能够定性或半定量的分析扩散连接因素对接头性能的影响。     

Formation mechanisms of high quality diffusion bonded martensitic stainless steel joints

Abstract

Diffusion bonding of martensitic stainless steel was conducted at different times. Based on the interface characteristic and shear strength, bonding mechanisms were discussed. Results showed that the bonding quality was controlled by void shrinkage and interface grain boundary migration. Large voids with scraggly edges changed to small voids with smooth edges, leading to an increase in interface bonding ratio. Two cases of interface grain boundary migration were revealed: interface grain boundary migration at the triple junction induced by the reduction in grain boundary energy and strain induced interface grain boundary migration resulted from the stored energy. Owing to the void shrinkage and interface grain boundary migration, the shear strength of the joint matched that of the base material.     

Isothermal superplastic solid state bonding of 40Cr and Cr12MoV steels based on surface modification

Based on the feasibility of isothermal superplastic solid state bonding of 40Cr and Cr12MoV steels, the surfaces of both steels to be bonded were ultra-fined through high frequency hardening, then the superplastic solid state bonding were conducted, the microstructure and fracture surface of bonded joint were observed and analysed, and bonding mechanisms was researched. The experimental results show that with the sample surfaces of 40Cr and Cr12MoV steels after the high frequency hardening, under the prepressing stress of 56.6 MPa, initial strain rate of 1.5×10~(-2) min~(-1) and at the bonding temperature of 800-820℃, the superplastic solid state bonding can be carried out in about 3.5min, and the joint strength is up to that of 40Cr steel base metal and the radial expansion ratio of the joint does not exceed 6%. The superplastic solid state bonding parameter of both steels is within the ranges of the isothermal compressive superplastic deformation of Cr12MoV steel, and the deformation in Cr12MoV steel side near the interfacial zone of joint presents the characteristic of superplasticity. In bonding process, the atoms in two sides of joint interface have diffused each other.     

Research on Transient Liquid Phase Diffusion Bonding of Steel Sandwich Panels Under Small Plastic Deformation

Plastic deformation was newly introduced in transient liquid phase (TLP) diffusion bonding of steel sandwich panels. The effect of plastic deformation on bonding strength was investigated through lab experiments. It was assumed that three factors, including newly generated metal surface area, deformation heat, and lattice distortion, contribute to the acceleration of interface atoms diffusion and increase of diffusion coefficients. A numerical model of isothermal solidification time was developed for TLP bonding process under plastic deformation and applied to carbon steel sandwich panels bonding with copper interlayer. A reasonable isothermal solidification time was obtained when an effective diffusion coefficient was used. Based on lab experiments, the effects of plastic deformation on interlayer film thickness and isothermal solidification time were studied through theoretical calculation with the new model. The evolution of interlayer film thickness indicates a good agreement between the calculation and experimental measurement. The results show that the isothermal solidification time is obviously reduced due to the effect of plastic deformation. Furthermore, a new steel sandwich cooling panel for heat exchanger was fabricated by TLP diffusion bonding under 13.1% plastic deformation. The test results suggest that a steel sandwich panel of inequidistant fin structure can provide enhanced heat transfer efficiency.     

核电设备用钢20MoNiMn内部空洞愈合过程分析

通过热物理模拟试验获得20MoNiMn钢在不同变形条件下的真实应力一应变曲线,将数据导入到有限元软件DEFORM一3D中数值模拟20MoNiMn铜内部空洞愈合过程。结果表明,空洞闭合是由球形空洞到椭球形空洞,从椭球形空洞的两长轴端开始闭合,并随着压下量的增加逐渐向心部扩展达到完全闭合。闭合后的空洞裂隙需要在高温下的原子扩散和再结晶才能焊合。当压下量为6．35mm时,坯料中有85．4％的区域发生了完全动态再结晶,空洞裂隙周围原子充分扩散和再结晶,最终达到闭合后的空洞裂隙焊合。     

The Effect of Substrate Surface Oxides on the Bonding of NiCr Alloy Particles HVAF Thermally Sprayed onto Aluminum Substrates

The effect of substrate surface oxides on splat-substrate bonding was investigated by thermally spraying NiCr particles onto aluminum substrates with surface oxide layers grown hydrothermally and electrochemically. Cross sections of bonded solid and molten splats revealed substantial deformation of both the substrate and the surface oxide. In spite of the substantial substrate deformation, there was no significant loss of the surface oxide material and there was no observed diffusion of the substrate oxide into the NiCr particle or vice versa. For solid splats, the substrate oxide was still present over the entire splat-substrate interface, however for molten splats, the oxide had been penetrated in several locations allowing close proximity of the splat metal to the substrate metal. These results strengthen the theory that oxide layers impede bonding and that successful bonding occurs only when the surface oxide is substantially deformed or disrupted to produce mechanically interlocking features at the interface.     

Numerical study on mechanism of explosive welding

Abstract

Explosive welding technology has been widely used in industrial production. However, there is always a controversy on the mechanism of explosive bonding, whether explosive welding should belong to a kind of mature welding such as a fusion welding or a solid phase welding. Based on the observation and analysis of the metallographs at interfaces, various opinions are proposed by different authors. This paper investigated the various mechanisms of the wavy interface formation in explosive welding and tried to determine a more reasonable one by using smoothed particle hydrodynamics method. The numerical analysis results show that explosive welding is a unique and complex kind of welding. In general cases, high pressure and melted particles can be found in the collision area at the interface. A version, in which explosive welding is a combination of diffusion bonding, fusion bonding and pressure welding, is considered as a more reasonable one.     

Interface evolution of TiAl／Ti6242 transient liquid phase joint using Ti, Cu foils as insert metals

The interface evolution of TiAl/Ti6242 joint produced by transient liquid phase(TLP) bonding with Ti,Cu foils as insert metals was investigated. The results show that the surface oxide layer on TiAI plays a very important role in the formation process of the joint. A ‘bridge‘ effect is observed because of the presence of the oxide layer on the surface of TiAl. The diffusion behavior of Cu atoms in TiAl is strongly controlled by the vacancies beneath the surface of TiAl. Based on the interface diffusion and interface wettability, a mechanism for the effect of bonding pressure, bonding temperature, holding time and stacking sequence of the insert foils on the joint formation process were proposed.     

40Cr/Q345B双金属热压缩组织演变与界面结合机制

对40Cr/Q345B双金属材料在变形温度为1000、1050、1100和1150℃,变形前保温时间为30和60 min,压下量为50%、65%和80%的条件下进行热压缩复合实验,研究其界面结合行为。借助光学显微镜和能谱仪,研究界面的组织演变及元素扩散规律,利用显微硬度仪分析界面处的显微硬度分布,揭示双金属界面的结合机理。结果表明:在变形温度为1000~1150℃时,变形温度升高有利于40Cr/Q345B双金属的界面结合;压下量从50%增加至65%,促进了界面结合,但压下量为80%时,过高的变形量会影响界面两侧基体的协调性能,从而降低界面的结合强度;此外,变形前保温时间为30 min,有利于界面结合。随着保温时间的增加,基体的晶粒尺寸变大、显微硬度降低,界面处的显微硬度最低,为150 HV;随变形温度的升高,界面处的显微硬度提高,最高为185 HV。40Cr/Q345B双金属热压缩过程中的元素扩散以Cr为主,在变形前保温时间为30 min、变形温度为1150℃下,压下量为50%时的扩散距离约为3.7μm,其结合机制主要为冶金结合。     

Effect of clad ratio on interfacial microstructure and properties of cladding billets via direct-chill casting process

Numerical simulation and experiments were introduced to develop AA4045/AA3003 cladding billets with different clad-ratios. The temperature fields, microstructures and mechanical properties near interface were investigated in detail. The results show that cladding billets with different clad-ratios were fabricated successfully. Si and Mn elements diffused across the bonding interface and formed diffusion layer. With the increase of clad-layer thickness, the interfacial region transforms from semisolid–solid state to liquid–solid state and the diffusion layer increased from 10 to 25 μm. The hardness at interface is higher than that of AA3003 side but lower than that of the other side. The bonding strength increased with the clad-layer thickness, attributing to solution strengthening due to elements diffusion. The cladding billets were extruded into clad pipe by indirect extrusion process after homogenization. The clad pipe remained the interfacial characteristics of as-cast cladding billet and the heredity of clad-ratio during deformation was testified.