氧化锆陶瓷旋转超声加工脆塑转变特性研究

目的揭示旋转超声振动对硬脆材料脆塑转变特性及工艺参数对材料脆塑转变临界切削深度的影响规律。方法以氧化锆陶瓷为研究对象,在硬脆材料压痕断裂试验基础上,从理论上分析了超声振动加工硬脆材料脆塑转变的临界条件,并进行了纵向振动及纵扭共振形式的旋转超声振动划痕与普通划痕对比试验。结果在相同试验条件下,超声振动划痕较普通划痕有较高的材料脆塑转变临界切削深度。适当地增大超声能量,纵扭共振比纵向振动具有更大的脆塑转变临界切削深度值;而随着进给速度的增大,纵向振动比纵扭共振具有更大的材料脆塑转变临界切削深度。结论通过不同划痕条件的对比,超声振动能有效提高氧化锆陶瓷的脆塑转变临界切削深度,增大塑性域加工范围,提高材料表面加工质量,验证了理论分析的正确性。     

高速铣削模具钢3Cr2NiMo表面粗糙度试验研究

采用单因素试验法和正交试验法,在高速加工中心上对模具钢3Cr2NiMo进行切削试验,通过改变影响加工过程的切削参数:主轴转速、进给速度、轴向切削深度和径向切削深度,研究了影响工件加工表面粗糙度值程度的因素。结果表明:增大机床的主轴转速,粗糙度值显著降低,而增大进给速度、轴向铣削深度,粗糙度值增大,但增大的幅度不同,径向铣削深度的影响不明显。     

钨合金的磨削加工去除机理

目的 解决钨合金磨削加工去除机理不明晰的问题。方法 基于单磨粒刻划有限元仿真、单磨粒刻划和磨削加工实验，探究钨合金的磨削加工去除机理。结果 在刻划过程中，划痕的不同位置材料的去除特性存在显著差异。在单颗粒刻划切入端，材料依次发生了塑性变形、隆起、微裂纹，再到钨相与黏结相的混杂交融。在划痕中段以材料去除为主，出现了材料微卷起和材料卷起现象，沿着刻划方向卷起现象越来越严重。在划痕切出端，划痕边缘和尾部均出现了“飞边”现象，且相较于切入端，切出端的形貌较差，实验与仿真吻合。此外，在不同相位处，材料的去除特性也存在一定不同。在钨相区域，同时存在脆性特征和塑性特征。在黏结相区域，刻划深度较浅时主要呈现塑性变形、塑性流动等特征，刻划中端深度较大时主要呈现与钨相的混杂和交融。在钨相与黏结相的相界处，相邻钨颗粒呈现不同的损伤或去除特征，且相界会阻断特征形貌的传递。最后，磨削后的钨合金表面存在单颗粒刻划痕上出现的所有去除特征，与单颗粒划痕的去除特征吻合。不同的是，磨削后划痕底部出现了区域性和放射状的裂纹。结论 钨合金的两相特性使得磨削表面的去除特征较复杂，存在塑性变形、微裂纹、微卷起、卷起、裂纹和两相交...     

基于不同纳米划痕顺序的6H-SiC单晶片材料去除机理研究

通过微纳米力学测试系统对6H-SiC单晶片(0001)晶面进行不同间距和不同顺序的纳米刻划试验,并用摩擦力传感器、超景深显微系统和三维形貌仪对产生的划痕的划痕横截面轮廓曲线、划痕深度、摩擦力以及表面形貌进行分析,研究单晶片刻划过程中不同划痕间距和划痕顺序下的材料去除过程。结果表明:当静载荷为100 mN时,不同划痕间距影响单晶片表面的横截面轮廓和平均摩擦力。随着划痕间距增大,2条划痕之间的深度差逐渐减小,划痕2的平均摩擦力逐渐减小并接近划痕1的;当划痕间距为14 μm时,最大划痕深度为-183.4 nm,平均摩擦力为18.8 mN。划痕顺序对表面形态和材料去除影响显著,当静载荷为90 mN,划痕间距为6 μm和8 μm时,非顺序划痕的表面材料堆积较少,表面粗糙度值更低,表面质量较好。当划痕间距为6 μm时,0～180 mN的动载荷均匀加载下顺序划痕末端表面的材料破碎情况严重,而非顺序划痕则在一定程度上能减少晶片划痕的裂纹程度;顺序划痕中的最大摩擦力为76.8 mN,大于非顺序划痕中的最大摩擦力63.3 mN,非顺序划痕更有助于实现SiC晶片的塑性加工,提高其表面加工质量。      

工程陶瓷预压应力下超声振动辅助划痕实验研究

目的结合超声振动加工方法,探究工程陶瓷预压应力加工过程的工件表面损伤特性。方法建立预压应力下工程陶瓷超声振动辅助加工过程的工程学模型,结合Al_2O_3陶瓷划痕过程的离散元仿真结果和实验结果进行分析,采用扫描电镜对加工表面进行观察,使用三向动态压电测力仪测量划痕力。结果预压应力下超声振动辅助划痕过程能够去除沟槽边缘处的材料堆积,并且划痕沟槽边缘破碎呈现周期性。当预压应力为200 MPa、理论划痕深度为10μm时,普通划痕深度为7.58μm,宽度107.5μm,超声振动辅助划痕深度为8.55μm,宽度为143.5μm。结合仿真结果,超声振动辅助划痕过程可减小划痕沟槽的径向裂纹数量,增大径向裂纹深度。同时,两种划痕过程动态切向力出现明显差异,超声振动辅助划痕过程动态切向力较小,变化相对平稳。结论超声振动辅助加工过程可以减小工程陶瓷预压应力加工过程的切削力,提高材料加工效率。     

金刚石磨粒超声振动刻划BK7玻璃的亚表面损伤研究

针对光学玻璃磨削加工中出现的加工困难、工件表面质量较差以及工件内部损伤严重等问题，提出超声振动辅助加工方法对BK7玻璃进行刻划，研究超声振动功率、刻划速度和刻划深度对亚表面裂纹的影响规律。研究结果表明:超声刻划相比于普通刻划，亚表面裂纹深度最大下降了19.7%；随着刻划速度的增大，刻划后沟槽底部的亚表面裂纹最大深度逐渐增大；随着沟槽截取深度的增加，亚表面裂纹最大深度整体上呈逐渐上升的趋势并出现明显的分级情况。      

工艺参数对单晶硅超精密加工切削力的影响

为了了解单晶硅超精密车削过程中不同切削参数及刀具前角对切削力的影响,利用单晶金刚石车刀对单晶硅进行单因素变量超精密车削试验。试验结果表明:进给量f和切削深度a_p对X、Y、Z方向的切削力F均有增大的趋势;而在切削速度v_c增加时,各方向的F逐渐减小;切削前角减小时,切削力反而增大。通过各因素对切削力F的变化幅值可以得到,对F影响较大的参数为a_p及f。选取最佳组合参数对单晶硅进行超精密切削试验,得到极为光滑的表面。     

铝合金6063薄壁件周铣加工变形误差试验研究

分析薄壁类零件铣削加工的工艺特点;针对薄壁构件周铣加工中的变形误差,采用正交试验法,在立式加工中心上进行铝合金6063周铣切削试验,研究进给速度、径向切削深度、轴向切削深度对加工误差的影响规律,为合理选用切削参数、减少加工变形、提高零件质量提供了可靠依据。     

高速干铣削高强钢铣削力及表面粗糙度研究

选用PVD—TiAlN-TiN硬质合金涂层刀具,进行高速干铣削AISI4340高强钢正交试验,研究铣削力及加工表面粗糙度随切削参数的变化,并建立铣削力及加工表面粗糙度与切削参数之间的经验模型。分析结果表明:每齿进给量和铣削速度对主切削力Fz影响较大,径向切削深度对加工表面粗糙度Ra影响较小。建立的铣削力及加工表面粗糙度经验模型,经过检验,相对误差较小。涂层刀具高速铣削AISI4340钢时,采用较小的轴向切削深度和每齿进给量以及较大的铣削速度和径向切削深度有利于得到较小的铣削力和加工表面粗糙度。     

Al2O3热压陶瓷激光辅助切削温度场分布与切削深度

建立Al2O3热压陶瓷激光辅助切削准稳态传热模型,采用有限差分方法,利用MATLAB软件,结合材料的受热软化特性,计算得到工件的温度场分布,并由此确定不同激光参数（激光功率、光束移动速度和光斑半径1下的切削深度。模拟计算发现工件表面等温线为卵圆形,横截面呈抛物线型,纵截面呈对称分布形式,而计算确定工件横、纵截面1000K等温线所对应的深度值为加工时合适的切削深度;通过对比分析发现：不同参数下温度场计算确定的切削深度值与实验值较吻合,采用较高的激光功率、较低的激光移动速度和工件表面受辐照激光光斑半径有利于切削区域材料的充分软化,从而获得较大的切削深度。     

基于纳米划刻实验的单晶锗切削机理的研究

本文选用 Berkovich 压头,使用纳米压痕仪对单晶锗进行了变载荷纳米刻划试验,利用SEM观测了刻划过程中沟槽表面形貌特征,将划刻过程中材料的去除机制分为延性域、脆塑转变域和脆性域三个阶段,并分析了在各个阶段的力学特征。根据断裂力学理论,以切向力的首次下降作为脆塑转变发生点,由此获得单晶锗脆塑转变的临界载荷及临界深度,并分析了裂纹的产生与扩展过程。对于纳米划刻过程中法向力、切向力、摩擦因数与划刻深度的函数关系进行非线性拟合,由相关系数的计算结果表明,划刻力与划刻深度之间存在强相关性。基于赫兹接触理论计算单晶锗划刻过程中临界弹塑转变深度,其大小为1.33 nm。基于脆朔转变临界载荷,建立了表征单晶锗材料脆塑转变临界深度的表达式,结果表明其脆塑转变临界深度为561 nm。由此对于单晶锗划刻过程中不同阶段确立了量化区分方法。     

高体积分数SiCp/Al复合材料超声辅助划切微观去除机理

目的 揭示高体积分数SiC_p/Al复合材料在超声辅助加工条件下的材料去除机理。方法 采用SiC_p/Al复合材料的超声辅助划切试验,探究划切参数变化对超声振幅、划切力及摩擦因数的影响规律,并通过扫描电子显微镜和激光共聚焦显微镜对划痕表面微观形貌进行观察,分析单点金刚石磨粒工具超声辅助划切材料去除的特点。结果 随着划切深度从0.01 mm增加到0.05 mm,电流值逐渐降低,电流值变化量从12 mA增加到25m A,超声振幅逐渐衰减,金刚石压头的轴向冲击作用减弱。划切深度和划切速度的增加使切向挤压切削作用增强,划切力和摩擦因数增大。在材料去除过程中,碳化硅颗粒存在破碎成小颗粒、剪切断裂破碎和拔出等多种去除形式,铝基体出现明显的塑性流动和涂覆现象,并形成切削沟槽外侧堆积。结论 当切削深度和进给速度较小时,材料去除主要是在轴向的高频振动冲击作用下完成,材料表面加工质量较好;当切削深度和进给速度逐渐增大时,材料去除是在轴向冲击破碎和切向挤压切削共同作用下完成,材料表面加工质量逐渐降低。     

Crack initiation in relation to the tool edge radius and cutting conditions in nanoscale cutting of silicon

In cutting of brittle materials, experimentally it was observed that there is a ductile–brittle transition when the undeformed chip thickness is increased from smaller to larger than the tool cutting edge radius of the zero rake angle. However, how the crack is initiated in the ductile–brittle mode transition as the undeformed chip thickness is increased from smaller to larger than the tool cutting edge radius has not been fully understood. In this study, the crack initiation in the ductile–brittle mode transition as the undeformed chip thickness is increased from smaller to larger than the tool cutting edge radius has been simulated using the Molecular Dynamics (MD) method on nanoscale cutting of monocrystalline silicon with a non-zero edge radius tool, from which, for the first time, a peak deformation zone in the chip formation zone has been found in the transition from ductile mode to brittle mode cutting. The results show that as the undeformed chip thickness is larger than the cutting edge radius, in the chip formation zone there is a peak deformation depth in association with the connecting point of tool edge arc and the rake face, and there is a crack initiation zone in the undeformed workpiece next to the peak deformation zone, in which the material is tensile stressed and the tensile stress is perpendicular to the direction from the connecting point to the peak. As the undeformed chip thickness is smaller than the cutting edge radius, there is no deformation peak in the chip formation zone, and thus there is no crack initiation zone formed in the undeformed workpiece. This finding explains well the ductile–brittle transition as the undeformed chip thickness increases from smaller to larger than the tool cutting edge radius.     

Material removal behavior in ultrasonic-assisted scratching of SiC ceramics with a single diamond tool

Ultrasonic-assisted grinding (UAG) has been extensively employed in manufacturing industries for processing hard and brittle materials. However, its potential has not been sufficiently developed because the material removal mechanism in UAG has not been elucidated. This paper focuses on the material removal mechanism in the UAG of silicon carbide (SiC) ceramics by investigating the material removal behaviors in ultrasonic-assisted scratching (UAS) of SiC ceramics. The UAS test was conducted on an NC (Numerical Control) surface grinder connected to a self-designed ultrasonic unit; a single diamond tool was fixed onto the end-face of the ultrasonic unit to achieve an ultrasonic vibration (UV). Conventional scratching (CS) test was also carried out on the same experimental rig but without UV for comparison. During testing, the material deformation/fracture behavior and the scratching forces were investigated. The experimental results show that (1) there are two scratching modes in the UAS process depending on actual depth of cut: an intermittent mode and a continuous mode; (2) the mean groove depth in UAS is much bigger than that in CS, indicating that the cutting ability of the tool was significantly improved by the assistance of the UV; (3) the critical depth of cut is increased by 56.25% once UV is applied; the stiffness of the experiment setup is improved in the UAS compared to CS; the UV in y-direction strongly contributes to the material removal, whereas the UV in z-direction only results in variation of the cutting trace and hardly contributes to the material removal in the UAS process; (4) in UAS, the scratching forces sinusoidally fluctuate with the same period as that of the UV of the tool when the material removal is in ductile mode, when the material removal is in brittle mode, the forces heavily vary but the period is different from that of the UV of the tool; (5) the cutting efficiency of the tool is improved by the assistance of the UV. The impact and cutting action at the tool tip on the machining surface are the main factors contributing to the material removal. The observed features were rationalized by analyzing kinematic characteristics of the tool and material removal mechanism in UAS. This study confirms that UAG is a highly effective processing method for machining hard and brittle materials.     

Digital microscope observation of the initial stage of cutting monocrystalline silicon

Digital microscope (DM) for local zooming of finite element solutions has been proposed and applied to cutting simulation of monocrystalline silicon with no preexisting defect. The DM has revealed that cutting performance is strongly dependent on the size of a workpiece. The DM has also revealed that a microcrack appears instantaneously for any depth of cut around a cutting edge but its evolution to a macrocrack depends on the depth of cut. A critical depth of cut for macrocrack evolution can be estimated on the basis of data obtained using the DM.     

单晶硅切片加工技术研究进展

单晶硅切片加工是集成电路产业和光伏产业的重要环节，其加工方式和加工质量直接影响到晶片的出片率、晶圆衬底和光伏太阳能电池板的生产成本。随着晶片尺寸的不断增大，线锯切片技术已成为目前单晶硅片的主流切片加工技术。为实现单晶硅片高效、精密、低裂纹损伤的切片加工，阐述了线锯切片技术的分类及其加工特点，总结了金刚石线锯切片加工机理的研究现状，探讨了对金刚石线锯切片加工过程的微观分析，概括了单晶硅切片加工引起的裂纹损伤及其抑制措施，指出了单晶硅切片加工技术的发展趋势和面临的挑战。      

硅晶片金刚石线切割的表面特征及其力学性能

分析了金刚石线切割硅晶片的表面形貌和断裂性能,并在此基础上探讨金刚石线切割原理以及一些技术挑战。金刚石线切割具有表面粗糙度低,硅片厚度均匀等优点,但却存在断裂强度各项异性。与切割划痕垂直方向的力学性能很高,然而与划痕平行方向的力学性能较低,这种性能差异是由表面单方向裂纹引起的,其裂纹的产生又与切割机理密切有关。金刚石线切割属于二体磨料磨损,其切割方式通常为塑性划痕,加之有少量脆性剥落。由于切割线的柔性,以及金刚石磨粒大小、形态、及分布的差异,切割过程则会出现切割的不连续性和不稳定性,并由此引起一些较大的表面裂纹。此外,划痕沟槽局部还会出现非晶态结构。提高金刚石线切割性能应从切割线磨粒角度来考虑。