CVD温度对钨沉积层组织性能的影响

以WF6和H2为反应气体,采用化学气相沉积法在纯铜基体上沉积出难熔金属钨涂层.分析研究了沉积温度对沉积层组织、结构、表面形貌及涂层致密度、硬度、耐磨性能的影响.试验结果表明:随着温度升高,沉积速率加快,涂层组织逐渐由柱状晶转变为树枝晶,表面粗糙度显著增加,膜层致密度、硬度下降,耐磨性降低.化学气相沉积钨的最佳工艺温度范围为550～650℃.     

基体表面粗糙度对激光沉积不锈钢形貌、组织及性能的影响

目的研究基体待沉积表面粗糙度的变化对激光沉积之后沉积层质量(宏观形貌、微观组织和力学性能)的影响,从而获得形貌、组织及性能优良的沉积层。方法采用316L不锈钢粉末,在不同表面粗糙度状态下P20钢基体表面分别进行单道单层、薄壁、多道搭接及块体沉积实验,获得测试分析所需沉积层,基于OM、SEM以及拉伸试验对沉积层组织性能进行分析。结果单道单层时,相对于铣削基体表面沉积层,喷砂基体表面沉积层的熔高、熔深增加幅度达到了100%,而熔宽增加较平缓;单道薄壁时,在前5层的沉积中,喷砂基体表面沉积高度增长达到2.5mm,铣削表面沉积高度仅为前者一半,喷砂基体上沉积层内部孔隙率仅为铣削基体的31%;多道搭接时,随着粗糙度的增大,沉积层截面纵向尺寸H的内部增长范围持续变大,而横向尺寸L范围保持稳定。喷砂基体表面沉积层的σ_b为540.93 MPa,而铣削基体上的σ_b为523.12 MPa。结论随着基体表面粗糙度的增加,沉积过程中陷光效应相应增强,单道单层沉积层的宏观形貌尺寸随之增大。对于薄壁沉积,基体粗糙度对薄壁高度的影响主要集中在前5层,粗糙度的增大使得沉积高度生长加快,内部孔隙率减小。多道搭接时,粗糙度越大,熔高熔深方向的尺寸变化越大,沉积层内部枝晶更加粗大,且不均匀。沉积层内部的抗拉强度随粗糙度的增大而提升。     

H13钢表面电火花沉积Nb涂层组织与性能研究

目的提高H13钢表面的力学性能和耐蚀性,延长模具的使用寿命。方法用Nb棒作为电极,氩气作为保护气体,通过电火花沉积技术在H13钢表面制备Nb沉积层。利用扫描电子显微镜分析沉积层的表面形貌、显微结构及磨痕形貌,利用X射线衍射仪分析沉积层的相组成,利用能谱仪分析沉积层的元素分布,采用显微硬度计和磨损试验机测试沉积层的显微硬度和耐磨性,采用电化学工作站对沉积层进行耐蚀性测试。结果 Nb电火花沉积层表面呈橘皮状,具有一定的粗糙度,主要由Fe_2Nb和Fe_(0.2)Nb_(0.8)等相组成。沉积层截面组织连续、致密,无明显缺陷,强化层内存在大量的微晶组织和非晶组织。Nb涂层与基体发生了元素的相互扩散和冶金结合的过程。沉积层显微硬度高达642HV,为基体的3.2倍。在同等磨损条件下,Nb沉积层磨损失重约为基体的1/3,磨痕较浅。沉积层在3.5%NaCl溶液中的电化学自腐蚀电位比基体提高了113 mV,自腐蚀电流密度显著降低。结论在H13钢表面电火花沉积Nb涂层,可有效提高其表面的显微硬度、耐磨性和耐蚀性,从而延长模具的使用寿命。     

基板温度对EB-PVD ZrO2涂层微观组织及残余应力的影响

采用电子束物理气相沉积(EB-PVD)技术在不锈钢基板上沉积ZrO2涂层.研究基板温度对涂层微观组织和残余应力的影响.结果表明:沉积的涂层均为t-ZrO2结构,涂层表面平整致密;随着基板温度的升高,涂层表面颗粒逐渐长大,表面粗糙度增大;涂层残余应力也随着基板温度的升高而增加,当基板温度为1000 ℃时,涂层残余应力的增量最大,ZrO2涂层的残余应力主要是由于涂层与基板热膨胀系数差别而产生的热应力引起.     

工艺参数对电火花沉积非晶层表面质量的影响

以Zr_(55)Al_(10)Ni_5Cu_(30)非晶态合金棒为电极,利用电火花沉积技术在ZL101铝合金表面制备了Zr基合金涂层。研究了充电电容、工作电压和频率对沉积层厚度和表面粗糙度的影响,并优化了工艺参数。结果表明,随着电容、电压和频率增大,沉积层厚度增大。随着电容、电压的增大,沉积层的粗糙度增加;随沉积频率提高,沉积层粗糙度减小。通过优化的工艺参数制备的沉积层的表面较致密、均匀,厚度约为38μm,表面粗糙度Ra为3μm。     

SCH13钢表面微弧火花沉积Stellite合金

采用高能微弧火花沉积技术在SCH13钢表面制备Stellite合金涂层.利用扫描电子显微镜、能谱仪、X射线衍射仪对沉积层的显微组织形貌、成分及结构进行分析,并对微弧火花单脉冲沉积斑的形成与生长机制进行重点研究.结果表明,高能微弧火花作用下Stellite合金单脉冲沉积斑呈飞溅状,大量单脉冲斑的不断叠加最终形成具有一定厚度的沉积涂层.微弧火花沉积层依附于基体的界面以柱晶组织呈外延生长,并与基体形成良好的冶金结合,涂层稀释率较低,主要由γ-Co固溶体和铬的碳化物组成.随着工作电压的增加,沉积层显微组织略有粗化,其平均硬度较Stellite合金电极材料有显著提高.     

不同沉积温度下CrCN涂层的力学性能

使用磁控溅射技术在304不锈钢表面制备CrCN涂层,研究了沉积温度(200、250、300、350和400 ℃)对涂层结构及力学性能的影响。研究表明,沉积温度为250 ℃时,涂层的晶粒尺寸及表面粗糙度最大,但随着沉积温度的进一步升高,涂层的晶粒逐渐细化,表面粗糙度明显下降;同时涂层硬度伴随沉积温度的升高出现先增大后减少的趋势,沉积温度为350 ℃时,薄膜具有最高的硬度(22.85 GPa),抗弹性形变和抗塑性形变能力最好,体现出优异的力学性能。     

电火花沉积FeCoCrNiCu高熵合金涂层的组织结构与耐蚀性

目的 通过在45Mn2钢表面进行电火花沉积FeCoCrNiCu高熵合金涂层,改变其表面性能。方法 采用真空吸铸法制备直径为3 mm的FeCoCrNiCu高熵合金电极,采用电火花沉积技术,在45Mn2钢表面制备高熵合金沉积层。通过X射线衍射仪（XRD）、光学显微镜（OM）、扫描电子显微镜（SEM）等分析研究沉积层的相组成、表面形貌、表面粗糙度和显微组织。通过三电极体系对涂层进行极化曲线和电化学阻抗谱（EIS）测试,分析其在3.5%NaCl溶液中的电化学腐蚀行为。结果 制备的FeCoCrNiCu涂层连续、均匀,具有简单的FCC结构,表面呈银灰色橘皮状,厚度约为25 μm。涂层表面凸凹不平,为典型的“溅射状”花样形貌,表面粗糙度均方根偏差Rq约为4 μm。极化曲线表明,高熵沉积层自腐蚀电位为-0.548 V,较45Mn2基材正移约180 mV,腐蚀电流密度为1.59 μA/cm2,约为基材的1/6。电化学阻抗谱EIS测试结果显示,FeCoCrNiCu高熵合金沉积层较45Mn2基材具有更大的容抗弧半径和极化电阻,其模拟电路可以用R(Q(R(QR)))表示。结论 电火花沉积技术是一种极具发展潜力的高熵合金涂层制备技术,制备的FeCoCrNiCu高熵合金涂层可有效提高基材的耐蚀性能。     

分散介质对热解碳表面电泳沉积羟基磷灰石涂层的影响

为寻找适合于热解碳表面电泳沉积羟基磷灰石涂层的分散介质,借助于SEM、XRD和自动生化分析仪研究了不同非水分散介质对电泳沉积涂层的影响。结果表明,分散介质的种类对电泳沉积层的强度及附着能力有很大的影响,采用乙二醇作为分散介质可以显著地提高电泳沉积层的强度和附着能力。分散介质的粘度影响电泳沉积速度,采用粘度较高的乙二醇作为分散介质时,提高温度可显著提高电泳沉积速度。羟基磷灰石在乙二醇中的溶解度显著高于在乙醇和正丁醇中的溶解度,羟基磷灰石在分散介质中的溶解度越高,越容易导致电泳沉积层中羟基磷灰石颗粒的团聚,当烧结温度高于1 000℃时,沉积层中颗粒的团聚对涂层烧结性能没有明显影响。电泳沉积分散介质不会影响羟基磷灰石粉末的晶体结构。     

镁合金电火花沉积改性层性能及组织结构的研究

应用电火花沉积设备在AZ91D镁合金表面沉积纯铝涂层进行表面改性处理,研究了电火花沉积工艺参数以及前处理对沉积改性层性能和组织结构的影响;并结合扫描电镜、中性盐雾试验等研究手段对镁合金改性涂层的微观表面形貌、截面形貌、腐蚀情况以及显微硬度进行了分析和对比;同时,也对镁合金表面沉积纯铝涂层的沉积机理和沉积层改善基体耐腐蚀性、硬度进行分析与讨论。研究结果表明:电火花沉积工艺参数及预处理对AZ91D镁合金表面沉积纯铝涂层的组织结构、微观形貌特点有重要影响;电火花沉积工艺参数的降低以及沉积前对母材和电极的预热处理,涂层表面显微硬度较基材有了较大程度的提高;同时,强化层组织结构均匀致密、涂层厚度适中、涂层内部裂纹孔洞等缺陷明显降低,与镁合金基材相比,表现出较好的耐腐蚀性能。     

强流脉冲电子束照射下40Cr的表面形貌及XRD分析

利用强流脉冲电子束(HCPEB)技术对40Cr材料表面改性进行正交实验。利用光学显微镜和扫描电镜(SEM)进行材料表面的观察,获得表面熔坑形貌和密度随照射参数的变化规律,同时研究熔坑形貌和分布对材料表面粗糙度的影响。利用X射线衍射(XRD)对试样的表面进行分析对比,研究参数对40Cr改性表面组织的影响。结果表明:合理地选用电子束参数,能够有效降低材料的表面粗糙度;当靶距较远、轰击次数较多时,加速电压对表面处理结果的影响程度比较明显,材料表面出现新的FeCr0.29Ni0.16C0.06奥氏体成分。     

Plasma enhanced CVD of fluorocarbon films by low-pressure dielectric barrier discharge

Low-pressure dielectric barrier discharge (DBD) plasmas have been used to deposit polymerized fluorocarbon (FC) films on silicon substrates. The effects of discharge pressure and frequency of power supply on the film quality have been systematically investigated. The deposited films were characterized by scanning electron microscopy, atomic force microscopy, X-ray photoelectron spectroscopy, and static contact angle measurements. Experimental results show that FC films with a less crosslinked structure may be deposited at a relatively high pressure. Increasing the frequency of power supply leads to a significant increase in the deposition rate. All deposited FC films with a uniform microstructure show the hydrophobic property. Decreasing the frequency of power supply or increasing the deposition pressure results in the deposition of FC films with the extremely low surface roughness. The relationship between plasma parameters and the analyzed properties of deposited FC films is discussed.     

Effects of Dissimilar Alumina Particulates on Microstructure and Properties of Cold-Sprayed Alumina/A380 Composite Coatings

In this study,alumina/A380 composite coatings were fabricated by cold spray.The influence of alumina particulates' morphology(spherical and irregular) and content on the deposition behavior of the coatings(including surface roughness,surface residual stress,cross-sectional microstructure and microhardness) was investigated.Results revealed that the spherical alumina mainly shows micro-tamping effect during deposition,which result in remarkable low surface roughness and porosity of the coatings.In addition,very low deposition efficiency and good interfacial bonding between the coating and the substrate were achieved.For irregular alumina particles,the embedding of ceramic particulates in the coating was dominant during deposition process,resulting in high retention in the final deposit.However,it showed limited influence on porosity,surface roughness and interfacial bonding of the deposit.The coatings containing irregular alumina particulates exhibited much higher microhardness than those containing spherical alumina due to the higher load-bearing capacity of deposited alumina.     

靶电流对非平衡磁控溅射制备无氢碳膜结构与性能的影响

利用非平衡磁控溅射(UBMS)技术在硅基片上制备了无氢碳膜,并采用Raman光谱、X射线衍射、傅立叶变换光谱等手段对不同靶电流下沉积的薄膜的微观结构、沉积速率、粗糙度、表面接触角及红外透过率进行了研究.试验结果表明:随着靶电流的增大,薄膜的沉积速率增大,薄膜中sp3键含量增加,薄膜表面接触角增大,红外透过率增大;而薄膜的粗糙度随靶电流增加而减小.靶电流是影响非平衡磁控溅射制备无氢碳膜结构与性能的1个主要因素.     

Three-dimensional Monte-Carlo computer simulation of grain growth in electro-plated pure Ni

A Monte-Carlo computer simulation code was developed to study grain growth characteristics during thin film deposition. The simulation algorithm was based on the minimization of the sum of the anisotropic surface energy and grain boundary energy. The average grain size and the surface roughness of the plated layer increased rapidly with the thickness of deposition, but the rate of the increase diminished with large thickness. In the simulation, it was found that the surface energy term dominated over the grain boundary energy term and consequently a strong {111} fiber texture was predicted. To verify the results of the computer simulation, an experiment was conducted to electro-deposit pure Ni on a Cu substrate. The thickness dependence of the microstructure, particularly roughness and grain size, was consistent with the prediction by the simulation. The roughness increased with thickness in the initial period but became saturated in the later period. Increasing the current density during electro-plating or increasing the deposition rate in the computer simulation randomized the texture and refined the grain size, which was attributed to insufficient diffusion at the specimen surface. In the experiment a pronounced {100} texture was found due to hydrogen adsorption. Minimization of hydrogen adsorption by strong agitation or by addition of boric acid decreased the intensity of the {100} texture substantially, confirming the rationale based on the hydrogen adsorption. This article is based on a presentation made in the 2003 Korea-Japan symposium on the “Current Issues on Phase Transformations”, held at Marriott Hotel, Busan, Korea, November 21, 2003, which was organized by the Phase Transformation Committee of the Korean Institute of Metals and Materials.     

加热温度对Al-Si涂层热成形钢组织及性能的影响

利用粗糙度仪、扫描电镜、硬度计、辉光放电原子发射光谱仪等检测方法,研究分析了热冲压成形工艺过程中的加热温度对Al-Si涂层22MnB5热成形钢组织及性能的影响。结果表明,随着加热温度的升高,Fe沿垂直于表面方向由热成形钢基体向Al-Si涂层表面的迁移量逐渐增大,O沿垂直于表面方向由Al-Si涂层表面向热成形钢基体的迁移量逐渐增大,且迁移的最大深度约为2.80 μm。Fe沿垂直于表面方向由热成形钢基体向Al-Si涂层表面的迁移量直接决定了Fe-Al-Si相的形态、生成位置及界面结合层厚度。随着加热温度的升高,Al-Si涂层表面粗糙度R_a、峰值计数R_pc值先增大后减小;当加热温度为930 ℃时,涂层表面粗糙度R_a达到最大值1.89 μm,峰值计数R_pc值达到最大值218。随着加热温度的升高,Al-Si涂层总厚度从27.78 μm增加至40.46 μm,界面结合层厚度从1.08 μm增加至15.11 μm。当加热温度为930 ℃时,热成形钢基体的硬度达到最大值505 HV0.2。     

Microstructure and properties of indium tin oxide thin films deposited by RF-magnetron sputtering

Tin-doped indium oxide （ITO） thin films were prepared using conventional radio frequency （RF） planar magnetron sputtering equipped with IR irradiation using a ceramic target of In2O3/SnO2 with a mass ratio of 1：1 at various IR irradiation temperatures T1 （from room temperature to 400℃）. The refractive index, deposited ratio, and resistivity are functions of the sputtering Ar gas pressure. The microstructure of ITO thin films is related to IR T1, the crystalline seeds appear at T1= 300℃, and the films are amorphous at the temperature ranging from 27℃ to 400℃. AFM investigation shows that the roughness value of peak-valley of ITO thin film （Rp-v） and the surface microstructure of rio thin films have a close relation with T1. The IR irradiation results in a widening value of band-gap energy due to Burstein-Moss effect and the maximum visible transmittance shifts toward a shorter wavelength along with a decrease in the film＇s refractive index. The plasma wavelength and the refractive index of ITO thin films are relative to the T1. XPS investigation shows that the photoelectrolytic properties can be deteriorated by the sub-oxides. The deterioration can be decreased by increasing the oxygen flow rote （fo2）, and the mole ratio of Sn/In in the samples reduces with an increase info2.     

厚度对HVOF喷涂WC-12Co涂层结构的影响

利用HVOF制备了WC-12C0涂层,喷涂原始粉末为微纳米复合粉,涂层的厚度分别为0.5,1,2,3,4 mm。采用扫描电镜(SEM)、X射线衍射仪(XRD)分析了涂层的显微结构和相组成,并对涂层的孔隙率进行了测量。结果表明,厚度对涂层的表面形貌与表面粗糙度无明显的影响,但对截面显微结构有较大影响,厚度小于1 mm的涂层沿厚度方向显微结构无明显变化,而厚度大于1 mm的涂层中部组织比较致密,孔隙率小,涂层与基体结合区域及近表面区域组织较为疏松。所有涂层均出现了分解与脱碳,涂层越厚分解越严重,出现的W_2C和Co_3W_3C相越多。     

Nd-Fe-B薄膜的磁控溅射法制备与组织结构

对直流磁控溅射法制备Nd-Fe-B薄膜工艺进行了研究.在不同的溅射功率、溅射气压、溅射时间等条件下制备薄膜,并对薄膜进行了AFM、XRD分析.结果表明,Nd-Fe-B薄膜的沉积速率、表面形貌及相结构与溅射功率、溅射气压、溅射时间密切相关.薄膜的沉积速率随磁控溅射功率的增加而增加,薄膜表面晶粒尺寸和表面粗糙度随溅射功率增加而增大.沉积速率随溅射气压的升高先增大后减小.低功率溅射时,薄膜中出现α-Fe、Nd2Fe14B相相对较少,随溅射功率增加,α-Fe相消失,Nd2Fe14B相增多.综合考虑各种因素,最佳溅射功率为100～130 W.