非贵金属活化氧化铝陶瓷基板化学镀铜研究

提出一种新型的非贵金属活化法辅助二次化学镀的氧化铝陶瓷基板化学镀铜工艺,成功制备了表面完整、分布均匀的铜镀层,进一步通过冷场发射扫描电镜(FE-SEM)做了具体分析。可以发现,经预处理活化之后的氧化铝基板表面产生一定程度的表面缺陷,主要包括不同梯度的台阶,颗粒与颗粒之间的边缘化以及‘地道式’的孔洞。在第一次化学镀铜沉积一定量的铜颗粒之后表面仍存在大量的空隙,即未镀区域。但在二次化学镀工艺之后,表面完全覆盖镀层,其中镀层表面上小的圆球状(2~3μm)铜颗粒夹杂在大的胞状(4~5μm)颗粒之间,整体上为颗粒与颗粒的物理聚集然后通过堆垛而形成的。     

氧化铝陶瓷基板化学镀铜工艺优化

目的化学镀铜是氧化铝陶瓷基板金属化的一种重要手段,为了进一步优化氧化铝陶瓷基板化学镀铜工艺,研究了化学镀铜液配比(尤其是镀液中铜离子和甲醛含量)对氧化铝陶瓷覆铜板微结构和导电性的影响。方法在对氧化铝陶瓷基板经过前期处理后,采用化学镀铜法在基板上镀铜。采用X射线衍射仪、光学显微镜对氧化铝基板上的化学镀铜层物相和形貌进行观察。采用覆层测厚仪、四探针测试仪对化学铜镀层的膜厚和方阻进行测量。结果 XRD结果表明,不同配比镀液得到的化学镀铜层均具有较好的晶化程度,镀液中甲醛和铜含量较低的镀液可制备出晶粒更为细小的化学镀铜层。甲醛和铜离子含量均较高时,沉积速度过快,使镀铜层的均匀性和致密性不佳。但当甲醛含量较高、铜离子含量较低时,沉积速度适中,从而获得了均匀性和致密性较好的镀铜层,同时这种镀层具有良好的导电性。结论采用表面活性化学镀铜工艺,当镀液中甲醛浓度为0.25 mol/L和硫酸铜质量浓度为1.2 g/L时,无需高温热处理,即获得了均匀性和致密性俱佳的铜镀层,可满足覆铜板的使用要求。     

热处理对氮化铝化学镀铜组织性能的影响

目的优化化学镀铜氮化铝(AlN)基板的综合性能,掌握热处理对其镀层致密度、界面结合强度和热导率的作用机理,并对划痕膜层失效行为进行分析。方法采用化学镀铜法实现AlN陶瓷基板表面金属化,对其进行200~500℃热处理。利用X射线衍射仪、扫描电镜、激光导热仪,对Cu-AlN基板的物相结构、显微形貌、热学性能进行分析。采用划痕法对镀层结合力进行评价,并通过划痕形貌对膜层失效行为进行分析。结果未热处理的Cu-AlN基板表面存在鼓泡现象,结合强度为24.7 N,热导率为156.8 W/(m K)。热处理消除了Cu-AlN基板的鼓泡现象,300℃热处理的Cu-AlN基板综合性能优异,表面Cu颗粒分布均匀,结构较为致密,结合强度为32.6 N,热导率达163.8 W/(m K);当500℃热处理时,Cu-AlN基板表面存在氧化现象,形成CuO,结合强度急剧降低为18.5 N,热导率为161.2 W/(m K)。Cu-AlN基板的基膜失效方式为点剥离,随着载荷的增加,点剥离增多,膜层开裂,AlN逐渐裸露,Cu膜层磨损形貌宏观上表现为由塑性变形引起的犁沟磨损,芯部发生拉伸变形,边界呈现卷曲变形。结论对Cu-AlN进行合理热处理,可改善镀层表面组织与致密度,提高结合强度和导热性能。     

LTCC电路基板大面积钎焊接头强度特性和失效分析

采用钎焊工艺对LTCC电路基板与封装载体进行互联,针对大尺寸LTCC电路基板与封装载体钎焊接头的强度特性和失效特征进行了分析。结果表明,LTCC电路基板(焊盘为Au/Pt/Pd)与载体(表面镀层Au 0.5μm)采用Sn63Pb37共晶钎料大面积钎焊后接头的抗剪强度平均值为28.21 MPa,而异常试样的抗剪强度只有平均值的30%。LTCC焊盘较为疏松,内部密布贯穿孔洞,钎焊后锡铅钎料中的Sn元素通过孔洞进入到LTCC焊盘内部,且部分到达LTCC焊盘与LTCC电路基板的界面部位,并在LTCC焊盘内部形成了大面积的非枝晶状的金锡合金AuSn_4。抗剪强度异常试样LTCC焊盘与LTCC电路基板的烧结结合强度相较正常试样低,是导致界面失效、钎焊接头抗剪强度降低的主要原因。     

多元镀层对C/Al热压扩散界面的影响

结合热压扩散工艺和NiCuMn镀层碳纤维，研党了多元镀层时C／AI界面结合性能的影响；分析了镀层含锰量时界面反应的作用机制。采用优化的热压扩散工艺，C／Al复合材料的拉伸强度可以达到180MPa左右。     

激光辐照诱导氧化铝陶瓷基板表面化学镀铜

采用激光辐照处理对Al2O3陶瓷基板进行预处理,经过超声波辅助化学镀在Al2O3陶瓷基板表面成功制备了化学镀铜层。利用场发射扫描电子显微镜(FE-SEM)和能谱(EDS)研究分析了激光辐照预处理前后Al2O3基板表面形貌和Al2O3基板化学镀铜表面以及截面形貌,划痕形貌,并与传统贵金属Pd活化预处理化学镀铜进行对比。试验结果表明:激光辐照处理后Al2O3基板表面出现了大量的微孔和纳米级颗粒凸起,这些表面缺陷易于吸附外来物质成键,实现化学镀铜过程,其中镀层与基底也有较好的结合力;与传统Pd活化预处理化学镀铜对比发现,激光辐照处理避免了繁琐的工艺和贵金属带来的污染,同时生成的化学镀铜层颗粒与颗粒之间融合更好。     

铜-不锈钢真空扩散连接工艺及界面微观结构

采用电镀工艺,在纯铜基体表面制备出约2.74μm的单质Au镀层,在950℃,1MPa压力下实现了铜与不锈钢的真空扩散接合,并与铜-钢直接连接接头进行界面显微结构对比.试验结果表明:在直接连接800℃时结合界面钢侧存在明显的元素沿晶界扩散现象,接头抗剪强度158MPa,约为铜母材强度的86%;添加单质Au镀层中间层时,有...     

金刚石表面镀层在磨具中的作用机理

采用湿法镀（化学镀、电镀）或真空镀（蒸发镀、溅射镀、离子镀）方法，在金刚石表面镀覆一层铜、镍、钛、钼、钨等金属，或者它们的复合镀层。表面镀覆已经与单晶合成、分选、聚晶烧结、气相沉积一起，成为金刚石多品种专用化发展的五条重要途径之一。镀层赋予金刚石所需要的各种特有的物理化学性能，不仅可以提高金刚石颗粒强度以及与结合剂的结合强度，还有对金刚石表面的宏观隔离保护作用和对金刚石结构的微观侧面支撑作用．从而有利于防止金刚石在使用过程中被氧化和石墨化。特别是在树脂结合剂磨具中，镀层的热导率介于金刚石和树脂之间，可以有效地减缓磨削热脉冲对树脂造成的热损伤，从而显著延长其耐用度，使树脂磨具的使用寿命提高50％-100％。     

超高速磨削陶瓷CBN砂轮结合剂的实验研究

本文根据陶瓷结合剂在超高速磨削砂轮中的作用，凭借电子万能实验机、X射线衍射仪、扫描电子显微镜等先进精密仪器对三种结合剂进行了耐火度、抗折强度、膨胀系数、微观形貌、显微硬度和润湿性等性能分析。实验结果表明，1#结合剂的耐火度为890℃；抗折强度达到56．28MPa；膨胀系数在7．0×10^-6／℃左右，其他各项性能也达到相当高的水平；用1#结合剂制备的砂轮条的强度达到63．07MPa，结合剂与磨料结合的微观形貌良好。实验表明，1#结合剂符合低温高强结合剂要求，在陶瓷CBN砂轮制作过程中可以实现低温烧成以减少能耗，降低污染。     

化学镀铜聚酰亚胺基板的导电性与电磁屏蔽效能分析

目的通过化学镀铜技术,在聚酰亚胺基板表面沉积电导率高且致密均匀的薄铜层。方法采用以硫酸铜为铜源的甲醛溶液体系,在预处理后的聚酰亚胺薄膜表面沉积铜层。通过原子力显微镜和接触角测试仪对预处理前后的聚酰亚胺基板表面粗糙度进行分析,通过扫描电子显微镜对铜层表面微观形貌进行观察,通过四探针测试仪和法兰同轴测试仪分别测试所制备铜层的方阻及屏蔽效能。结果聚酰亚胺基板与水的接触角由预处理前的38°减小至预处理后的27°,化学镀铜层微观形貌致密、均匀。方阻随镀层厚度增加而减小,具有优异的导电性。屏蔽效能测试表明,在100 k Hz~12 GHz时,镀铜聚酰亚胺基板最高屏蔽效能达到55 d B。结论通过简单基板预处理与控制镀铜时间,可以在聚酰亚胺基板上沉积综合性能优良的薄铜层,且屏蔽效能可达商用标准。     

Effect of Substrate Temperature on Cold-Gas-Sprayed Coatings on Ceramic Substrates

This study focuses on cold-gas-sprayed deposition of metallic coatings onto ceramic substrates for application in power electronics. In order to achieve the required surface activation for bonding, the substrate is heated during spraying. The effects of substrate temperature on bond strength and coating properties are investigated for cold-gas-sprayed coatings of copper and aluminum on Al₂O₃. It is found that the adhesion strengths of the cold-gas-sprayed coatings and that of the single-impacting particles increase with the increasing temperature and roughness of the substrate. Coatings sprayed on heated substrates show relatively low compressive stresses and low hardness, while their electrical conductivity reaches high values of over 90% IACS. Overall, a higher substrate temperature is found to improve the coating properties significantly.     

Ion Beam Enhanced Adhesion of Metal/Ceramic Systems

Based on the electronic theory recently proposed by the author for metal-ceramic interactions, the physicalorigin of the ion beam enhanced adhesion of non-reactive metal / ceramic systems was outlined for the firsttime. It has been shown that the ion beam enhanced adhesion is attributed to the enhancement of the chemicalbonding between metal and ceramic. The copper / sapphire system was chosen as a typical example for demon-strations.     

等离子表面处理对低粗糙度铜箔与树脂界面结合性能的影响

目的 通过等离子处理提高高频高速印刷电路板（Printed Circuit Board,PCB）基板中低粗糙度铜箔与树脂的结合力。方法 采用大气等离子处理对环氧树脂和聚苯醚树脂进行表面改性,电沉积粗化处理得到低粗糙度铜箔,将处理后的铜箔/树脂热压制成PCB基板,通过扫描电子显微镜（SEM）、激光共聚焦显微镜（LSM）、X射线光电子能谱（XPS）、剥离强度测试等分析测试手段,系统地研究了等离子处理对铜箔/树脂界面结合力的影响。结果 等离子处理后的树脂表面形貌未发生明显变化,对表面化学状态的分析表明表面产生了更多的有利于黏合的活性基团。等离子处理的环氧树脂和聚苯醚树脂样品的剥离强度分别为0.86N/mm和0.63N/mm,相比于未处理样品,结合力分别提高了43%和50%。此外,有无等离子处理的铜箔/树脂界面剥离断裂后的表面形貌特征显现出明显的差别,这一差别与等离子处理后表面化学状态的改变相关。具体而言,等离子处理的铜箔/环氧树脂剥离样品,树脂侧残留更多的铜微粒;等离子处理的铜箔/聚苯醚树脂样品,倾向于从树脂侧断裂,且铜微粒间隙中残留较多的树脂。结论 等离子处理能够有效提高低粗糙度铜箔与环氧...     

Metallization of Thin Al2O3 Layers in Power Electronics Using Cold Gas Spraying

A successful combination of insulating substrates with conducting metal coatings produced by cold spraying could open new industrial application areas like the fabrication of power electronic components. For minimizing the number of industrial process steps, insulating ceramic layers should ideally be processed by thermal spray techniques. Thus, this study investigates the impact behavior and coating formation of ductile metallic feedstock powders onto brittle ceramic coatings. With respect to high electrical conductivity of the metallic lines and good electrical insulation of the ceramic interlayer, copper was cold gas sprayed on previously thermally sprayed Al₂O₃ coatings. Successful cold coating formation requires different strategies for the activation of the ceramic layer to increase adhesion and to avoid brittle failure. These both can be achieved either by applying a bondcoat on the ceramic layer or using heated substrates during the cold spray process.     

纯铜表面热化学反应陶瓷涂层耐磨性研究

在工业纯铜表面分别用料浆法和热化学反应法制备陶瓷涂层,陶瓷涂层骨料为Al_2O_3、TiO_2和ZnO,粘接剂为钠水玻璃.研究了该涂层与基体的结合强度、涂层的抗热震性能、耐磨性,用SEM观察了涂层表面和截面的形貌.用X射线衍射法分析了涂层的相组成.结果表明,热化学反应法制备的陶瓷涂层热同化后,涂层内有NiAl_2O_4、Al_2SiO_5,新相.且这新相增加了涂层与基体的结合强度.热化学反应法制备的陶瓷涂层磨粒磨损和粘着磨损的相对耐磨性分别是基体的11.26倍和7.97倍.     

连铸结晶器铜板磨损的原因分析

通过对结晶器铜板与保护渣颗粒微元体接触点模型分析,并结合摩擦与磨损黏附理论分析实际生产中铜板受磨损的影响因素.进而通过改善保护渣的性能与铜板镀层,来延长结晶器铜板的寿命,提高铸坯质量.     

PZT高频陶瓷表面金属化薄膜及其结构

采用磁控溅射与真空蒸发工艺相对比的方法,分析了不同金属化薄膜及其结构对薄膜与PZT陶瓷的结合力和器件高频电学性能的影响.实验表明Cu-Ni+Ag薄膜可以改善陶瓷与金属的结合和减少反浸润发生,显著提高结合力,从而改善器件的电学性能.分析表明结合力是影响高频压电陶瓷电学性能的一个重要因素,实验得到了优化的金属化薄膜成分和结构,同时提出了相应的溅射工艺.     

Adhesion of Ceramic Coating on Thin and Smooth Metal Substrate: A Novel Approach with a Nanostructured Ceramic Interlayer

The adhesion of plasma-sprayed coating is, to a large extent, controlled by the cleanness and roughness of the surface on which the coating is deposited. So, most of the plasma spray procedures involve surface pretreatment by grit-blasting to adapt the roughness of the surface to the size of the impacting particles. This preparation process brings about compressive stresses that make it inappropriate for thin substrates. The present works aim to elaborate a thick ceramic coating (about 0.5?mm thick) on a thin metal substrate (1?mm thick) with a smooth surface (Ra of about 0.4???m). The coating system is intended for use in a Generation-IV nuclear energy system. It must exhibit a good adhesion between the ceramic topcoat and the smooth metal substrate to meet the specifications of the application. Our approach consisted of depositing the ceramic topcoat by air plasma spraying on a few micrometers thick ceramic layer made by suspension plasma spraying. This nanostructured layer played the role of a bond coat for the topcoat and made it possible to deposit it on the as-received substrate. The adhesion of the nanostructured layer was measured by the Vickers indentation cracking technique and that of the ceramic duplex coating system by tensile test.     

过程参数对悬浮微珠摩擦辅助脉冲电铸铜表面形貌的影响

为了改善传统酸性硫酸盐电铸铜的表面质量,提出了空心悬浮微珠摩擦辅助的脉冲电铸铜工艺。使空心微珠悬浮于卧式放置阴极上部,不断摩擦和撞击阴极表面,并结合脉冲电铸,提高电铸层表面质量。研究了脉冲频率、占空比、平均电流密度和阴极转速对摩擦辅助电铸铜表面形貌的影响。结果发现:在空心悬浮微珠的影响下,使用低脉冲频率、高占空比、较大的平均电流密度及较低的转速范围,更能发挥悬浮微珠的摩擦作用,细化晶粒。     

New method for producing power electronic circuit boards by cold-gas spraying and investigation of adhesion mechanisms

Ceramic substrates for power electronic circuits or integrated components are usually metallised by cost-intensive thermal processes. Simple, flexible and cost-effective solutions are increasingly demanded for integrated power electronic devices. Cold gas spraying (CGS) can deliver these demands. It is employed to produce dense, well adherent and oxide free coatings with properties comparable to the respective bulk material. The CGS-metallisation of non-conductive parts for power electronic devices permits a direct assembly and contacting of semi-conductors.Industrially available Al₂O₃ substrates are first CGS-coated with aluminium, which acts as an adhesive layer. In a second step, the aluminium layer is coated with copper, which exhibits good electric properties. The conductive structure on the ceramic is achieved by using a laser cut steel template, which allows for a minimal circuit width of about 250 μm.In order to clarify the adhesion mechanisms of cold-gas sprayed aluminium on alumina coated samples were subjected to micro-structural characterisation with scanning electron microscopy (SEM), scanning transmission electron microscopy (STEM) and electron backscatter diffraction (EBSD).