SiCp／2024Al铝基复合材料点蚀发生和发展的原位研究

本文研究了碳化硅颗粒的体积分数和介质中的Ｃｌ＾－含量对于ＳｉＣｐ／２０２４Ａｌ铝基复合材料腐蚀性能的影响，用扫描微参比电极测量系统首次显示和跟踪了复合材料点蚀发生及发展的微区动态行为，动电位循环极化法研究表明，ＳｉＣｐ／２０２４Ａｌ复合材料比相应的纯铝基金属有较大的腐蚀敏感性。     

SiC_p/Al合金基复合材料的室温拉伸性能

通过对采用半固态搅拌液态模锻工艺制备的ＳｉＣｐ／Ａｌ 合金基复合材料室温拉伸性能的研究, 分析了这种复合材料屈服强度和极限强度提高的原因, 对颗粒增强复合材料的强化机理进行了探讨; 同时, 采用扫描电子显微镜对材料的拉伸断口进行了观察, 发现复合材料及未增强基体合金的断裂虽均属于塑性断裂与脆性断裂的混合型模式, 但随着ＳｉＣ 颗粒在复合材料中的体积分数的增加, 脆性断裂特征变得更为显著。     

SiCp／Al合金基复合材料的室温拉伸性能

通过对采用半固态搅拌－液态模锻工艺制备的ＳｉＣｐ／Ａｌ合金基复合材料室温拉伸性能的研究，分析了这种复合材料屈服强度和极限强度提高的原因，对颗粒增强复合 经化机理进行了探讨，同时采用扫描电子显微镜对材料的拉伸断口进行了观察，发现复合材料及未增强基体合金的断裂虽均属于塑性断裂与脆性断裂的混合型模式，但随着ＳｉＣ颗粒在复合材料中的体积分数的增加，脆性断裂特征变得更为显著。     

SiC_p/2024Al复合材料阳极氧化膜耐蚀性的电化学阻抗研究

采用电化学阻抗技术研究了碳化硅颗粒增强 ２０２４铝基复合材料（ＳｉＣｐ／２０２４Ａｌ）硫酸阳极氧化膜在 ３．５％ＮａＣｌ水 溶液中的耐蚀性;作为比较,对 ２０２４ Ａｌ的阳极氧化膜耐蚀性也进行了研究 结果表明,ＳｉＣｐ／２０２４Ａｌ复合材料的阳极氧化膜 具有良好的耐 ＮａＣｌ溶液腐蚀的能力,而且重铬酸盐封闭比热水封闭的阳极氧化膜耐蚀性更好．由于氧化膜中出ＳｉＣ颗粒的存在破 坏了氧化膜的完整性和均匀性,故复合材料阳极氧化膜的耐蚀性不如 ２０２４ Ａｌ合金．     

真空压渗铸造铝基电子封装复合材料研究

叙述了真空反压渗透铸造法制取铝基电子封装复合材料的过程；测试了ＳｉＣｐ、镀铜碳短纤维、Ｐ１３０石墨短纤维、Ａｌ２Ｏ３短纤维、磷片石墨、石墨颗粒增强铝硅铸造合金复合材料的密度、孔积率和增强体的体积份数；给出了每种复合材料的金相照片，分析了不同增强体、预制件的制造方法和混杂增强对铝基复合材料的体积份数、孔积率等的影响。     

压渗SiCp／Al电子封装复合材料的研究

采用压渗的方法制取了ＳｉＣ体积分数基本相同、而颗粒大小不同的ＳｉＣｐ／Ａｌ电子装封复合材料。测定热膨胀系数表明，在ＳｉＣ体积分数基本相同时，ＳｉＣ颗粒的大小对ＳｉＣ／Ａｌ复合材料的热膨胀系数影响很大。颗粒和基体界面面积的大小直接影响热应力的大小，从而影响基体的弹塑性行为。     

颗粒增强铝合金叠层复合材料的制备与强度和耐磨性

介绍了ＳｉＣ颗粒增强ＡｌＣｕ合金叠层复合材料的制备方法，研究了叠层复合材料的抗弯强度和增强层的耐磨性与ＳｉＣ颗粒含量的关系。结果表明，ＳｉＣ颗粒体积分数为２０％时该材料的抗弯强度最大，磨损量最小；ＳｉＣ颗粒与基体结合强度及层间宏观应力影响材料的强度性能     

SiCp尺寸及其体强度对铝基复合材料破坏机制的影响

对粉末冶金法制备的尺寸分别为３,５,１０,２０μｊ的ＳｉＣｐ增强Ａｌ－Ｃｕ基复合材料的拉抻断口及ＥＤＸ成分上尺寸大于１０μｍ时,复合材料的破坏因于ＳｉＣｐ解理形成的裂纹：增强相尺寸为３．５μｍ时,复合材料的破坏则归因为ＳｉＣ－Ａｌ界面撕裂形成空洞和裂纹,拉伸试验表明,小尺寸ＳｉＣｐ增强的复合材料人有拉伸强度及延伸率。     

SiCp增强铝基复合材料的铸造缺陷分析

对搅拌铸造法制备的ＳｉＣｐ增强铝基复合材料铸件产生缺陷的形貌及形成机理进行了分析研究。结果表明,ＳｉＣｐ在Ａｌ液中物理、化学上处于不稳定状态－ＳｉＣｐ和Ａｌ液不浸润,不能作为α－Ａｌ的形核核心;以及ＳｉＣｐ和Ａｌ液能够产生自发反应,是造成该复合材料出现气孔、夹杂、团聚、集聚、偏析和界面杂质等缺陷的主要原因。而搅拌复合和铸造工艺参数不当,则是造成上述缺陷的重要原因。     

颗粒增强名合金叠层复合材料的制备与强度和耐磨性

介绍了ＳｉＣ颗粒增强Ａｌ－Ｃｕ合金叠层复合的制备方法，研究了叠层复合材料的抗弯强增强层的耐磨性与ＳｉＣ颗粒含量的关系。结果表明，ＳｉＣ颗粒体积分数为２０％时该的抗弯强度最大，磨损量最小；ＳｉＣ颗粒与基体结构强度及层间宏观应力影响材料的强度性能。     

Joining of SiCp/Al composites by insert powder layers

Mixed Al-Si, Al-Si-SiC and Al-Si-W powders were employed as insert layers to reactive diffusion bond SiCp/6063 MMC. The results show that SiCp/6063 MMC joints bonded by the insert layer of the mixed Al-Si powder have a dense joining layer with a typical hypoeutectic microstructure. Using mixed Al-Si-SiC powder as insert layer, SiCp/6063 MMC can be reactive diffusion bonded by a composite joint. Because of the SiC segregations, however, there are a number of porous zones in the joining layer, which results in the low shear strength of the joints, even lower than that of joints reactive diffusion bonded by the insert layer of mixed Al-Si powder. The W added into the insert layer of Al-Si-W nearly all reacts with Al to form intermetallic WAl12 during bonding. The reaction between the W and Al facilitates to form a dense joint of high quality, and the formed interrnetallic WAl12 has a reinforcing effect on the joints, which lead to the high shear strength of the joints. In general, under the condition of fixed bonding time （temperature）, the shear strengths of the joints increase as the bonding temperature （time） increases, but tend to a maximum at bonding temperature of 600℃ （time 90 min）.     

Investigation on reactive diffusion bonding of SiCp/6063 MMC by using mixed powders as interlayers

Mixed Al–Si, Al–Cu and Al–Si–SiC powders were used as interlayers to reactive diffusion bond SiCp/6063 MMC. The microstructure and the effects of bonding parameters on the shear strength of SiCp/6063 MMC joints were investigated. The results show that SiCp/6063 MMC joints bonded by using the interlayers of mixed Al–Si, Al–Cu powders have a dense joining layer of high quality. The mass transfer between the bonded materials and the interlayers during bonding leads to the hypoeutectic microstructure of the joining layers. Using mixed Al–Si–SiC powder as an interlayer, SiCp/6063 MMC can be reactive diffusion bonded by a composite joint. Because of the SiC segregation, however, there are a number of porous zones in the joining layer. This is responsible for the low shear strength of the joints, even lower than those reactive diffusion bonded by using the interlayers of mixed Al–Si and Al–Cu powders. Ti added in the interlayer obviously improves the joint strength reactive diffusion bonded by using the mixed Al–Si–SiC powder.     

焊接温度对Mg/Al扩散焊接头微观组织和性能的影响

采用真空扩散焊在不同焊接温度下对AZ31B镁合金和6061铝合金进行连接。利用光学显微镜（OM）、扫描电镜（SEM）和能谱（EDX）观察Mg/Al异种金属接头的显微组织。结果表明：随着焊接温度的升高,扩散区各层的厚度增加,且组织发生明显变化。440°C时扩散层由Mg2Al3层和Mg17Al12层组成;460和480°C时由Mg2Al3层、Mg17Al12层和Mg17Al12与镁基固溶体的共晶层组成。随着加热温度的升高,高硬度区域显著增多,区域内不同位置的硬度存在明显差别。当焊接温度为440°C时接头的最大抗拉强度为37MPa,脆性断裂发生在Mg17Al12层。     

Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints

In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding processes.The melting points of magnesium(Mg)and copper(Cu)have a significant difference(nearly 400℃)and this may lead to a large difference in the microstructure and joint performance of Mg-Cu joints.However,diffusion bonding can be used to join these alloys without much difficulty.This work analyses the effect of parameters on diffusion layer thickness,hardness and strength of magnesium-copper dissimilar joints.The experiments were conducted using three-factor,five-level,central composite rotatable design matrix.Empirical relationships were developed to predict diffusion layer thickness,hardness and strength using response surface methodology.It is found that bonding temperature has predominant effect on bond characteristics.Joints fabricated at a bonding temperature of 450℃, bonding pressure of 12 MPa and bonding time of 30 min exhibited maximum shear strength and bonding strength of 66 and 81 MPa, respectively.     

Seal spot welding of steel and aluminium alloy by resistance spot welding: dissimilar metal joining of steel and aluminium alloy by Zn insertion

This research concerns a dissimilar metal joining of steel and aluminium (Al) alloys by means of zinc (Zn) insertion. The authors propose a joining concept for achieving strong bonded joints between Zn-coated steel and Al alloys. A eutectic reaction between Zn in the Zn coating and uniform Al–Fe intermetallic compound (IMC) layer at the joint interface, leading to a strong bonded joint. The ultimate aim of this research was to apply this joining concept in the resistance spot welding process for manufacturing vehicle bodies. As a practical issue characteristic to joints of dissimilar metals, anticorrosion measures against electrochemical corrosion must be undertaken. If there is moisture near a joint interface of dissimilar metals, electrochemical erosion will progress. Therefore, a sealing function that could prevent moisture intrusion is required. By applying the above-mentioned welding process to a set of metals with thermosetting resin spread in between, we realized seal spot welding, which not only prevented moisture intrusion but also retained high tensile strength. In this research, first, a cyclic corrosion test was performed on the seal spot-welded joint of galvanized (GI) steel, a steel grade widely distributed in Japan, and Al alloy was bonded by seal spot welding, and the following topics are discussed. Complete removal of sealant from the joint interface is the key to realizing the high tensile stress joint, because remaining sealant will lead to reduction in tensile strength. Therefore, heat generation at the interface was monitored by measuring electrical current and potential difference between the two electrodes, and a precise temperature control was performed. Moreover, the bonding process was clarified by stepwise analysis of the joint interface using optical microscopy, and a guideline for producing strong joints was proposed. And finally, a TEM observation also confirmed that the interface structure of the seal spot-welded joint was the same as joints without the resin; a thin and uniform Al–Fe IMC layer was formed and a strong metallurgical bonding was achieved.     

Al/Ni异种金属超声波点动焊接工艺及界面组织分析

对1060铝合金和N4镍合金异种金属进行了超声波点动焊接,优化了焊接工艺,分析了接头界面组织,焊接接头组织微观形貌和力学性能.结果表明,超声波焊接能够实现1060铝合金和N4镍合金异种金属的有效连接,能够得到韧性和强度都很高的焊接接头;确定了铝镍异种金属超声波焊接的焊接工艺参数为焊接压力25.2~36.0 MPa,焊接时间75~85 ms;当焊接压力为32.4 MPa,焊接时间为85 ms时,抗剪强度超过铝侧母材.焊接接头界面的XRD和EDS分析结果表明,接头界面存在由Al,Ni两种元素互扩散而形成的2 μm厚的反应扩散层.     

钨铜/铍青铜异质钎焊界面组织与性能

采用BAg56CuZnSn,BAg50ZnCdCuNi和BAg49ZnCuMnNi银钎料实施了钨铜合金/铍青铜异质材料接头的感应钎焊连接,研究了其钎焊界面组织与力学性能.结果表明,3种银钎料均能获得完好界面钎焊接头,钎料与钨铜和铍青铜形成较好冶金结合.钎料与铍青铜界面冶金结合充分,形成明显互扩散区.钎料与钨铜钎焊界面清晰,且钎料向钨铜近界面区域形成明显扩散渗入现象.强度测试表明,BAg49ZnCuMnNi钎焊接头强度最高,达到250 MPa,接头断裂均发生在钨铜侧钎焊界面.分析表明,钎料向钨铜渗入明显促进界面结合,钎料中添加镍,由于镍与钨的扩散互溶进一步提高界面冶金结合,Mn元素添加明显细化钎缝晶粒,接头强度显著提升.     

Optimizing Diffusion Bonding Parameters in AA6061-T6 Aluminum and AZ80 Magnesium Alloy Dissimilar Joints

The main difficulty when joining magnesium (Mg) and aluminum (Al) alloys by fusion welding lies in the formation of oxide films and brittle intermetallic in the bond region which affects the integrity of the joints. However, diffusion bonding is a suitable process to join these two materials as no such characteristic defects are produced at the joints. The diffusion bonding process parameters such as bonding temperature, bonding pressure, holding time, and surface roughness of the specimen play a major role in determining the joint strength. In this investigation, an attempt was made to develop empirical relationships to predict the strengths of diffusion bonded AZ80 magnesium and AA6061 aluminum alloys dissimilar joints from the process parameters based on central composite factorial design. Response surface methodology was applied to optimize the process parameters to attain the maximum shear strength and bonding strength of the joint. From this investigation, it was found that the bonds produced with the temperature of 405.87?°C, pressure of 7.87?MPa, holding time of 29.02?min and surface roughness of 0.10???m exhibited maximum shear strength and bonding strength of 57.70 and 76.90?MPa, respectively. The intermetallic formation at the interface was identified.     

Analyzing the Effect of Diffusion Bonding Process Parameters on Bond Characteristics of Mg-Al Dissimilar Joints

The principle difficulty when joining magnesium (Mg)-aluminium (Al) lies in the existence of formation of oxide films and brittle intermetallic in the bond region. However, diffusion bonding can be used to join these alloys without much difficulty. Temperature, pressure, and holding time are the three main variables which govern the integrity of a diffusion bond. This paper focuses on the effect of these parameters on diffusion layer thickness, hardness and strength of AZ31B magnesium-AA2024 aluminium dissimilar joints. The experiments were conducted based on three factors, five-level, and central composite rotatable design with full replications technique. Empirical relationships were developed to predict diffusion layer thickness, hardness and strength using response surface methodology. From this investigation, it is found that bonding temperature has predominant effect on bond characteristics.     

铝合金与树脂基复合材料连接技术综述

在航空航天、海洋运输和车辆制造等领域,制造材料朝着轻量化、复合化和高性能化的方向发展。由于铝合金和树脂基复合材料具有高比模量和高比强度等优点,其复合结构的连接技术也受到越来越多的关注。本文针对铝合金与树脂基复合材料连接技术的连接机理和影响因素进行综述。目前,铝合金和树脂基复合材料的连接方法主要为螺栓连接、铆接、胶接、注塑连接和焊接。其中螺栓连接和铆接工艺简单,但孔洞易产生应力集中;胶接成本低,但界面的抗冲击和抗剥离强度较低;注塑连接周期短,但强度有限;焊接自动化程度高,但设备昂贵。最后本文基于当前研究成果,指出高性能、高可靠性的铝合金与树脂基复合材料接头进一步的研究发展方向。