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借助于OM,SEM,TEM及AES和XRD等测试技术和手段,系统地研究和深入探讨了钛(TA2)/钢(A3)爆炸复合界面扩散反应区内的微观组织结构、反应相的形成和生长规律,结果表明:经1173K以下(即TA2的β转变温度以下)热处理,在TA2侧界面形成TiC,它阻碍Fe和Ti互扩散,不能生成Fe_(2)Ti,FeTi.经1223K以上(即在TA2的β转变温度以上)热处理,沿界面生成按抛物线规律长大的层状金属间化合物(Fe2Ti,FeTi);并由于Fe的扩散,在TA2侧Fe的含量高处形成β-Ti或β-Ti+α-Ti组织,而在Fe含量低处形成马氏体转变产物,此外,β转变层也按抛物线规律生长. 相似文献
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用非晶态合金作中间层对Si_3N_4陶瓷进行扩散焊连接 总被引:2,自引:0,他引:2
研制了两种非晶态物质Cu_(50)Ti_(50),Cu_(50)Ti_(50)B作为对Si_3N_4扩散焊连接的中间层材料.研究结果表明:用非晶态作为中间层可改善工艺条件,降低扩散焊温度;非晶态中间层接头比其相应晶态中间层接头的剪切强度有明显提高.其中硼对提高接头剪切强度贡献很大.用非晶态Cu_(50)Ti_(50)B作中间层时,接头强度最高可达340MPa用晶态和非晶态Cu_(50)Ti_(50),Cu_(50)Ti_(50)B作中间层对Si_3N_4进行扩散焊连接的机制是:活性元素Ti向陶瓷界面扩散和富集并与Si_3N_4发生反应生成界面相TiN,TiSi_2等.从而实现连接. 相似文献
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X射线管中95Al2O3和Kovar合金的活性钎焊 总被引:1,自引:0,他引:1
通过润湿性实验,钎焊接头性能实验,系统地研究了95Al2O3和Kovar合金在不同形态Ag-Cu-Ti活性钎料作用下的润湿钎焊机制,实验发现钎焊合金与陶瓷发生了界面反应,生成了Ti3Al,TiAl等相,采用Ag-Cu-5Ti非晶钎料时,接头四点弯曲强度可达270MPa。 相似文献
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Song Ning Liu Chunpeng Department of Metallurgy Kunming University of Science Technology Kunming 《中国有色金属学会会刊》1997,(1)
KINETICSOFINTERACTIONBETWEENCu2SANDCu2OINSOLIDSTATEUNDERNONISOTHERMALCONDITION①SongNing,LiuChunpengDepartmentofMetalurgy,Kunm... 相似文献
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盐类反应制备TiB2/Al—4.5Cu复合材料的研究 总被引:18,自引:3,他引:18
采用K2TiF6和KBF4混合盐反应法制备TiB2/Al-4.5Cu复合材料,通过SEM,XRD及MTS等仪器研究了复合材料的凝固组织和力学性能。增强相TiB2颗粒细小(<2μm),呈近球形,均匀分布于基体之中,起强化和细化基体作用,TiB2颗粒与基体结合好。当K2TiF6和KBF4混合物加入质量为基体的20%时,复合材料的综合性能最好。UTS达352MPa,EL达4.4%,HB达146。 相似文献
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用非晶态合金作中间层对Si3N4陶瓷进行扩散焊连接 总被引:3,自引:0,他引:3
研制了两种非晶态物质Cu50Ti50,Cu50Ti50B作为对Si3N4扩散焊连接的中间层材料,研究结果表明,用非晶态作为中间层可改善工艺条件;降低扩散焊温度;非晶态中间层接头比其相应晶态中以接头的剪切强度有明显提高。其中硼对提高接头剪切强度贡献很大。用非晶态Cu50Ti50B作中间层时,接头强度最高可达340MPa。用晶态和非晶态Cu50Ti50,Cu50Ti50B作中间层对Si3N4进行扩散焊 相似文献
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QCr0.8/TC4偏铜电子束焊接焊缝由熔合区及反应层组成,其中反应层的组织结构、相组成和反应程度是影响接头抗拉强度的主要因素.参考扩散理论,利用Fick第一定律计算了稳态扩散时Cu,Ti两种组元在界面处的扩散通量比.反应层中优先生成CuTi化合物,其在反应层中为连续生成及分布.通过能谱分析得出反应层的组成依次为Cu CuxTi区,CuTi基固溶体区.其中CuxTi为多种化合物的混合,如Cu4Ti,Cu3Ti,Cu2Ti等.由于电子束焊接接头冷却速度极快,TC4侧靠近熔合线处来不及生成第二相化合物,因此反应层处形成的连续金属间化合物CuTi层使该处变得硬脆且残余应力较大,成为影响接头力学性能的主要因素. 相似文献
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填充金属对钛合金与不锈钢电子束焊接的影响(英文) 总被引:1,自引:0,他引:1
采用Ni、V、Cu等填充材料进行钛合金与不锈钢的电子束焊接实验。采用光学显微镜、扫描电镜及X射线衍射对接头的微观组织进行分析。通过抗拉强度和显微硬度评价接头的力学性能,分析讨论填充材料对钛/钢电子束焊接接头微观组织和力学性能的影响。结果表明:填充材料有助于抑制Ti-Fe金属间化合物的产生。所有接头均由固溶体和界面化合物组成。对于不同的填充材料,固溶体和界面化合物种类取决于填充材料与母材之间的冶金反应。对于Ni、V及Cu填充材料,界面化合物分别为Fe2Ti+Ni3Ti+NiTi2,TiFe和Cu2Ti+CuTi+CuTi2。接头抗拉强度主要取决于金属间化合物的脆性。采用Cu填充金属的接头抗拉强度最高,约为234 MPa。 相似文献
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Metallization of the ceramic surfaces of Si3N4 and Al2O3 was carried out in a composite diffusion coating vacuum furnace using a Ti-Cu composite target. The experimental process and influencing factors were discussed. Optical microscope (OM), energy dispersive spectroscopy (EDS), scanning electron microscopy (SEM), X-ray diffusion (XRD) and sound emissive scratch test (SEST) were applied to evaluate the alloy layer formed on the ceramic surface. It was indicated that the diffusion coating alloy layer contained Cu, Ti, Fe, Al and Si etc. XRD result indicated that the diffusion coating alloy layer was composed of CuTi2, Cu, Si2Ti and CuTi, Al2TiO5, Ti3O5. It was found that the diffusion coating alloy layer got bonded with ceramic well, and no spallation occurred under the maximum load of 100N. Deposited Si3N4 ceramic was welded with Q235 and the joining quality was examined. Robust joint was formed between Si3N4 ceramic/Q235. This present method has advantages in high efficiency and low cost and provides a new approach for producing ceramic and metal bond. 相似文献
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采用AgCu28钎料实现了TC4钛合金与QCr0.8铬青铜的真空钎焊,利用SEM, EDS以及XRD等分析方法确定TC4/AgCu/QCr0.8接头的典型界面结构为TC4钛合金/CuTi +Cu3Ti2 +CuTi2/Ag(s,s) +Cu4Ti/Ag(s,s)+Cu(s,s)/QCr0.8铬青铜. 研究了工艺参数对接头组织和性能的影响. 结果表明,随着钎焊温度和保温时间的增加,钎缝中银铜共晶组织减少,钛铜化合物增多. 接头抗剪强度随钎焊温度的升高先增加后降低,在钎焊工艺参数为890 ℃/0 min时,获得最大抗剪强度449 MPa.保温时间的延长使得接头脆性钛铜化合物增多,接头性能下降,因此随保温时间延长接头抗剪强度显著降低. 相似文献
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通过预置Ti/Cu非对称中间层对Ti(C,N)基金属陶瓷与40Cr钢进行了液-固扩散焊复合连接试验,重点研究了界面组织、接头强度及其影响因素.结果表明,通过预置Ti/Cu非对称中间层液-固扩散焊,能够分别实现Ti(C,N)基金属陶瓷与铜箔,以及铜箔与40Cr钢之间的冶金结合;Ti(C,N)基金属陶瓷界面物相呈梯度分布,形成Ti(C,N)基金属陶瓷/TiAl2/Ti2Cu/TiCu/铜箔结构;Ti(C,N)基金属陶瓷一侧靠近界面区域存在较大的焊接残余拉应力,以及脆弱的TiAl2金属间化合物层,是制约焊接接头强度的关键因素;单纯以铜箔为中间层,采用常规固相扩散焊连接Ti(C,N)基金属陶瓷,即使在加热温度1 223 K、压力20 MPa条件下,也难以实现Ti(C,N)基金属陶瓷与铜箔的有效连接. 相似文献
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The diffusion bonding was carried out to join Ti alloy (Ti-6Al-4V) and tin-bronze (ZQSn10-10) with Ni and Ni Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). The results show that when the interlayer is Ni or Ni Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds (Cu3Ti, CuTi etc.). But the Ni-Ti intermetallic compounds (NiTi, Ni3Ti) are formed on the Ti-6Al-4V/Ni interface. When the interlayer is Ni, the optimum bonding parameters are 830℃/10 MPa/30min. And when the interlayer is Ni Cu, the optimum bonding parameters are 850℃/10MPa/20min. With the optimum bonding parameters, the tensile strength of the joints with Ni and Ni Cu interlayer both are 155.8MPa, which is 65 percent of the strength of ZQSn10-10 base metal. 相似文献
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Ti/Cu/Ti部分瞬间液相连接Si_3N_4的界面反应和连接强度 总被引:2,自引:0,他引:2
用Ti/Cu/Ti多层中间层在 12 73K进行氮化硅陶瓷部分瞬间液相连接 ,实验考察了保温时间对连接强度的影响。用SEM ,EPMA和XRD对连接界面进行微观分析 ,并用扩散路径理论 ,研究了界面反应产物的形成过程。结果表明 :在连接过程中 ,Cu与Ti相互扩散 ,形成Ti活度较高的液相 ,并与氮化硅发生反应 ,在界面形成Si3N4 /TiN/Ti5Si3 Ti5Si4 TiSi2 /TiSi2 Cu3Ti2 (Si) /Cu的梯度层。保温时间主要是通过影响接头反应层厚度和残余热应力大小而影响接头的连接强度 相似文献
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The surface of pure copper alloyed with Ti using double glow discharge process was investigated. The morphology, structure and forming mechanism of the Cu-Ti alloying layer were analyzed. The microhardness and wear resistance of the Cu-Ti alloying layer were measured, and compared with those of pure copper. The results in-dicate that the surface of copper activated by Ar and Ti ions bombardment is favorable to absorption and diffusion of Ti element. In current experimental temperature, as the Ti content increases, the liquid phase occurs between the deposited layer and diffused layer, which makes the Ti ions and atoms easy to dissolve and the thickness of Cu-Ti al-loying layer increase rapidly. After cooling, the structure of the alloying layer is composed of CuTi, Cu4Ti and Cu(Ti) solid solution. The solid solution strengthening and precipitation strengthening effects of Ti result in high surface hardness and wear resistance. 相似文献