基底旋转速度对射频溅射法制备Al掺杂ZnO薄膜结构和性能的影响（英文）

采用射频溅射法于室温在玻璃基底上制备了铝掺杂ZnO(AZO)薄膜,研究了基底旋转速度(ωS)对薄膜形态、结构、光学和电学性质的影响。扫描电子显微镜横向图片显示,通过基底旋转能够产生致密的柱状结构。原子力显微镜图像表明,基底旋转状态下形成的样品其表面颗粒比基体静止状态下的颗粒小且致密,从而导致细小的晶粒尺寸。XRD结果表明,所有薄膜均为六方纤锌矿结构,c轴择优取向且分布有拉应力。紫外可见光区平均透光率在90%以上。当ωS=0 r/min时,电阻率处于最低值(8.5×10~(-3)?·cm),载流子浓度为1.8×10~(20)cm~(-3),霍尔迁移率为4.19 cm~2/(V·s)。对于其他样品,基底旋转会引起载流子浓度和霍尔迁移率的变化,从而导致电阻率增加。结果表明:基底旋转速度对AZO薄膜的形貌、结构、光学和电学性能存在较大影响。     

硼源浓度对纳米金刚石薄膜掺硼的影响

目的研究纳米金刚石薄膜生长掺硼的内在机理,实现对该过程的精确控制。方法采用微波等离子体化学气相沉积法,以氢气稀释的乙硼烷为硼源,进行纳米金刚石薄膜的生长过程掺硼实验,研究硼源浓度对掺硼纳米金刚石薄膜晶粒尺寸、表面粗糙度、表面电阻和表面硼原子浓度的影响。结果随着硼源浓度的增加,纳米金刚石薄膜的表面粗糙度和晶粒尺寸增大,表面电阻则先下降,而后趋于平衡。结论纳米金刚石薄膜掺硼后,表面电导性能可获得改善,表面粗糙度和晶粒尺寸则会增大。在700℃条件下掺硼15 min,最佳的硼源浓度(以硼烷占总气体流量的百分比计)为0.02%。     

SiC靶功率密度对无氢掺硅类金刚石薄膜摩擦学性能的影响

采用直流磁控溅射石墨靶、中频磁控溅射碳化硅靶以及离子源辅助的复合沉积技术,制备出膜层质量优异、摩擦因数和磨损率较低的具有不同Si含量的无氢掺硅类金刚石薄膜。使用XPS、拉曼光谱仪、台阶仪、纳米硬度计、SEM、EDS以及球盘式摩擦磨损试验仪测试并表征薄膜的微观结构、力学性能和摩擦学性能。研究表明,该技术能够成功制备出无氢掺硅类金刚石薄膜;随着SiC靶功率密度的增加,薄膜中Si的含量和sp3键的含量逐渐增加,其纳米硬度和弹性模量先增大后减小,摩擦因数由0.277降低至0.066,但其磨损率从6.29×10-11 mm3/Nm增加至1.45×10-9 mm3/Nm;当SiC靶功率密度为1.37W/cm2时,薄膜的纳米硬度与弹性模量分别达到最大值16.82GPa和250.2GPa。     

PECVD法制备掺硼纳米金刚石薄膜的工艺研究进展

首先详细介绍了金刚石作为半导体材料的优异性能,然后从应用角度阐述了NCD薄膜掺B后形成半导体材料的优势,接着探讨了影响NCD薄膜性能(电性能、光学性能、生物性能等)的主要工艺条件(包括硼源种类、掺硼浓度、衬底温度、后处理)。研究发现,大多数研究者都采用液态和气态硼源,而固态硼源由于很难液化且浓度不易控制而不常被采用,掺B后NCD薄膜的电阻率急剧下降,紫外波段下透过率可达51%,磁阻效应变好。另外衬底温度对BD-NCD薄膜的质量以及性能都有影响,衬底温度太高,非晶碳含量增加,金刚石质量下降;衬底温度太低,能够进入NCD晶界或晶粒的有效硼原子减少,影响其电学性能、光学性能,在最佳衬底温度工艺下的电导率可达22.3 S/cm,而在电化学性能方面,其电化学窗口可达3.3 V。而选择合适的硼源浓度对BD-NCD的电性能、光学性能、生物性能也非常关键,硼源浓度过大,BD-NCD表面粗糙度和晶粒尺寸增大;硼源浓度过小,产生空穴进行导电的B原子就少,在合适硼源浓度工艺条件下其载流子浓度可达1021 cm-3,折射率可达2.45。还有研究者对BD-NCD薄膜进行后处理工艺(退火、等离子体处理等),发现后处理对其电性能也有一定的影响。因此,选择合适的工艺对生长质量高、性能优异的NCD薄膜尤为重要。最后对BD-NCD薄膜的发展以及后续研究方向进行了展望和期待。     

硫分压对光吸收层CuInS2薄膜性能的影响

在不同硫分压r (r=Sn/[N2+Sn])下,采用Cu-In预制膜硫化法制备了CuInS2薄膜.用扫描电子显微镜、X射线衍射仪、霍尔测试仪、紫外-可见光分光光度计对薄膜的表面形貌、结构、电学、光学性能进行了表征分析.结果表明:随着r增加,薄膜的结晶质量提高,当r＝1/2时,晶粒大小如一,粒度保持在1 μm左右,沿[112]晶向择优生长,载流子浓度为5.6×1016 cm-3,光学带隙在1.53 eV左右.     

磁控溅射Al-Fe-Sn 薄膜的电输运性能

在电子工业中,为了制备低电阻率的Al合金薄膜,需要对薄膜进行退火。虽然材料的电阻率与其电输运性能密切相关,然而目前为止,对于铝合金薄膜的电输运性能研究甚少。 本文首先利用TEM对于磁控溅射铝合金薄膜的结构,特别是与基底界面处的结构进行了表征。在此基础上,利用霍尔效应测试了解界面状态的变化对于霍尔载流子浓度及迁移率的影响。 我们实验的结果表明, 在退火的过程中,薄膜与下层基底之间通过扩散过程形成紧密接触,从而使得合金薄膜同时具有较高的载流子浓度以及载流子迁移率。最后,利用一个新提出的能带模型,解释所观察到的界面变化对于电导率的影响。     

溅射条件对ZnO:Al薄膜生长和性能的影响（英文）

采用中频磁控溅射法在玻璃基体上制备Al掺杂ZnO薄膜(AZO),分别利用扫描电子显微镜(SEM)、原子力显微镜(AFM)、X射线衍射仪(XRD)、分光光度计及霍尔测试系统研究不同沉积条件如样品台转速和靶-基距离对薄膜光学、电学、微观形貌及晶体结构的影响。XRD结果表明,所有AZO薄膜都呈c轴择优取向,薄膜的结晶度随着样品台转速的增大而降低,且晶粒呈非平衡状态生长。而在不同的靶-基距离时,薄膜具有相似的微观结构和表面形貌。当样品台转速为0、靶-基距离为7 cm时,AZO薄膜的光电性能最好,载流子浓度和霍尔迁移率分别为5.9×1020 cm-3和13.1 cm2/(V·s)。研究结果表明,样品台转速是影响AZO膜的结构和性能的主要因素。     

ILGAR法CuInS2薄膜制备中的化学计量控制

采用离子层气相反应法(ILGAR)法,以CuCl、InCl3为原料,C2H5OH为溶剂,H2S为硫源在常温下合成了CuInS2薄膜,建立了前驱体溶液中[Cu]/[In]比与薄膜化学计量之间的关系.利用X-ray光电子能谱仪(XPS),X-ray衍射仪(XRD)、扫描电镜(S EM)、可见-紫外分光光度计(UV-Vis)和霍尔测试系统(HALL)等技术表征了不同化学计量下CIS薄膜的相组成、结构形貌、薄膜生长、光学和电学性质.试验表明,薄膜中Cu/In与溶液中[Cu]/[In]呈线性变化,并伴随有立方闪锌矿结构→黄铜矿结构晶型转变过程;当0.94≤Cu/In≤1.27时,测定出CIS薄膜为单相,表面较致密、均匀、附着性好;薄膜的光吸收系数高于104 cm-1,禁带宽度Eg在1.27 eV～1.35 eV之间,表面暗电阻随Cu/In的增加从102Ω·cm降为10-1 Ω.cm,载流子浓度在1016cm-3～1017cm-3.     

CuCr_(1-x)Mg_xO_2(0≤x≤0.09)薄膜的光电性能

采用射频磁控溅射方法,在石英衬底上制备Mg掺杂的CuCrO2薄膜。通过XRD、紫外吸收光谱及电学性能的测量表征该系列薄膜样品的结构与光电性能。结果表明:退火处理后所有薄膜样品的结晶性良好,均为3R型铜铁矿结构;薄膜的电导率随掺杂量的增加而增大。当x=0.09时,样品的室温电导率可达6.16×10-2S/cm,比未掺杂的CuCrO2提高近400倍,且霍耳测试表明所制备的薄膜为p型导电体。电导率随温度变化关系表明:薄膜样品在200～300K的温度范围内均很好地符合Arrhenius热激活规律;当x=0.09时,最低激活能仅为0.034eV。薄膜的可见光透过率与光学带隙宽度均随掺杂量的增加而减小。     

不同掺铁方式对TiO2薄膜光催化活性的影响

采用溶胶凝胶工艺在普通玻璃表面制备出表面掺铁与体相掺铁的TiO2 薄膜。运用SEM ,XRD和AES等技术研究了复合薄膜的表面特征。以光催化降解甲基橙溶液为模型反应 ,表征薄膜的光催化活性。结果表明 :体相掺铁时 ,薄膜的最佳n(Fe) /n(Ti)为 0 .12 %;表面掺铁时 ,薄膜的最佳n(Fe) /n(Ti)为 1.5 %。表面掺铁薄膜的最佳光催化表观速率常数比体相掺铁的最佳值要高 1.5倍。并从载流子分离效率等方面进行了机理探讨。     

Properties of multilayer gallium and aluminum doped ZnO(GZO/AZO) transparent thin films deposited by pulsed laser deposition process

Multilayer gallium and aluminum doped ZnO (GZO/AZO) films were fabricated by alternative deposition of Ga-doped zinc oxide(GZO) and Al-doped zinc oxide(AZO) thin film by using pulsed laser deposition(PLD) process. The electrical and optical properties of these GZO/AZO thin films were investigated and compared with those of GZO and AZO thin films. The GZO/AZO (1:1) thin film deposited at 400 °C shows the electrical resistivity of 4.18×10^?4 ωcm, an electron concentration of 7.5×10²⁰/cm³, and carrier mobility of 25.4 cm²/(V·s). The optical transmittances of GZO/AZO thin films are over 85%. The optical band gap energy of GZO/AZO thin films linearly decreases with increasing the Al ratio.     

Effect of substrate rotation speed on structure and properties of Al-doped ZnO thin films prepared by rf-sputtering

Al-doped ZnO (AZO) thin films were deposited on glass substrates by rf-sputtering at room temperature. The effects of substrate rotation speed (ω_S) on the morphological, structural, optical and electrical properties were investigated. SEM transversal images show that the substrate rotation produces dense columnar structures which were found to be better defined under substrate rotation. AFM images show that the surface particles of the samples formed under substrate rotation are smaller and denser than those of a stationary one, leading to smaller grain sizes. XRD results show that all films have hexagonal wurtzite structure and preferred c-axis orientation with a tensile stress along the c-axis. The average optical transmittance was above 90% in UV-Vis region. The lowest resistivity value (8.5×10^?3 Ω·cm) was achieved at ω_S=0 r/min, with a carrier concentration of 1.8×10²⁰ cm^?3, and a Hall mobility of 4.19 cm²/(V·s). For all other samples, the substrate rotation induced changes in the carrier concentration and Hall mobility which resulted in the increasing of electrical resistivity. These results indicate that the morphology, structure, optical and electrical properties of the AZO thin films are strongly affected by the substrate rotation speed.     

Low-energy ion beam treatment of α-Al<Subscript>2</Subscript>O<Subscript>3</Subscript>(0001) and improvement of photoluminescence of ZnO thin films

A low energy N₂ ^? ion beam impinged on a α-Al₂O₃(0001) single crystal surface in the range of fluence 5×10¹⁵/cm²?1×10¹⁸/cm² at room temperature. After ion bombardment, chemical bonding on the modified sapphire surface was investigated by x-ray photoelectron spectroscopy. Below a fluence of 1×10¹⁵/cm², only a non-bonded N1s peak at the binding energy 398.7 eV was found, but further irradiation up to 2×10¹⁷/cm² induced Al?O?N bonding at around 403 eV. The occurrence of Al?N bonding was identified at ion fluence higher than 5×10¹⁷/cm² at 396.6 eV. II–VI ZnO thin films were grown on an untreated/ion-beam-induced sapphire surface by pulsed laser deposition (PLD) for the investigation of the modified-substrate effect on photoluminescence. The ZnO films grown on modified sapphire containing Al?O?N bonding only, and both Al?O?N and Al?N bonding showed a significant reduction of the peak related to deep-level defects in photoluminescence. These results are explained in terms of the formation of Al?N?O and Al?O?N layers and relaxation of the interfacial strain between Al₂O₃ and ZnO.     

Effects of atomic layer deposition temperatures on structural and electrical properties of ZnO films and its thin film transistors

Organic-inorganic thin film transistors (OITFTs) with Al/ZnO/PVP structure on Si substrate were fabricated and studied as to their structural and electrical properties. PVP (poly-4-vinylphenol) organic gate insulator was coated on Si substrate by spin coating method. The ZnO was deposited as an active layer by using the atomic layer deposition (ALD) method on PVP/Si substrate at various temperatures ranging from 80 to 140 °C. The structural and electrical properties of ZnO thin films were analyzed by X-ray diffraction and by hall-effect measurement system for optimum process of the OITFT. The grain size and carrier concentration of ZnO films increased, and the resistivity decreased as the deposition temperature increased from 80 to 140 °C. The field effect mobility, on/off current ratio and threshold voltage of OITFTs with ZnO active layer deposited at 100 °C were found to be 0.37 cm²/V·s, 5×10² and 5 V, respectively.     

Filtered vacuum arc deposition of undoped and doped ZnO thin films: Electrical, optical, and structural properties

Filtered vacuum (cathodic) arc deposition (FVAD, FCVD) of metallic and ceramic thin films at low substrate temperature (50-400 °C) is realized by magnetically directing vacuum arc produced, highly ionized, and energetic plasma beam onto substrates, obtaining high quality coatings at high deposition rates. The plasma beam is magnetically filtered to remove macroparticles that are also produced by the arc. The deposited films are usually characterized by their good optical quality and high adhesion to the substrate. Transparent and electrically conducting (TCO) thin films of ZnO, SnO₂, In₂O₃:Sn (ITO), ZnO:Al (AZO), ZnO:Ga, ZnO:Sb, ZnO:Mg and several types of zinc-stannate oxides (ZnSnO₃, Zn₂SnO₄), which could be used in solar cells, optoelectronic devices, and as gas sensors, have been successfully deposited by FVAD using pure or alloyed zinc cathodes. The oxides are obtained by operating the system with oxygen background at low pressure. Post-deposition treatment has also been applied to improve the properties of TCO films.The deposition rate of FVAD ZnO and ZnO:M thin films, where M is a doping or alloying metal, is in the range of 0.2-15 nm/s. The films are generally nonstoichiometric, polycrystalline n-type semiconductors. In most cases, ZnO films have a wurtzite structure. FVAD of p-type ZnO has also been achieved by Sb doping. The electrical conductivity of as-deposited n-type thin ZnO film is in the range 0.2-6 × 10^− 5 Ω m, carrier electron density is 10²³-2 × 10²⁶ m^− 3, and electron mobility is in the range 10-40 cm²/V s, depending on the deposition parameters: arc current, oxygen pressure, substrate bias, and substrate temperature. As the energy band gap of FVAD ZnO films is ∼ 3.3 eV and its extinction coefficient (k) in the visible and near-IR range is smaller than 0.02, the optical transmission of 500 nm thick ZnO film is ∼ 0.90.     

Preparation and characterization of ZnO/Cu/ZnO transparent conductive films

ZnO/Cu/ZnO transparent conductive thin films were prepared by RF sputtering deposition of ZnO target and DC sputtering deposition of Cu target on n-type (001) Si and glass substrates at room temperature. The morphology, structure, optical, and electrical properties of the multilayer films were characterized by field emission scanning electron microscope (FESEM), X-ray diffraction (XRD), UV/Vis spectrophotometer, and Hall effect measurement system. The influence of Cu layer thickness and the oxygen pressure in sputtering atmosphere on the film properties were studied. ZnO/Cu/ZnO transparent conductive film fabricated in pure Ar atmosphere with 10 nm Cu layer thickness has the best performance: resistivity of 2.3×10-4 Ω·cm, carrier concentration of 6.44×1016cm-2 , mobility of 4.51cm2·(V·s)-1 , and acceptable average transmittance of 80 % in the visible range. The transmittance and conductivity of the films fabricated with oxygen are lower than those of the films fabricated without oxygen, which indicates that oxygen atmosphere does not improve the optical and electrical properties of ZnO/Cu/ ZnO films.     

Structural,electrical and optical properties of p-type transparent conducting SnO2:Al film derived from thermal diffusion of Al/SnO2/Al multilayer thin films

Highly transparent, p-type conducting SnO₂:Al films derived from thermal diffusion of a sandwich structure Al/SnO₂/Al multilayer thin films deposited on quartz substrate have been prepared by direct current and radio-frequency magnetron sputtering using Al and SnO₂ targets. The deposited films were annealed at various temperatures for different durations. The effect of thermal diffusing temperature and time on the structural, electrical and optical performances of SnO₂:Al films has been studied. X-ray diffraction results show that all p-type conducting films possessed polycrystalline SnO₂ with tetragonal rutile structure. Hall-effect results indicate that 450 °C for 4 h were the optimum annealing parameters for p-type SnO₂:Al films, resulting in a relatively high hole concentration of 7.2 × 10¹⁸ cm^?3 and a low resistivity of 0.81 Ω cm. The transmission of the p-type SnO₂:Al films was above 80%.     

RF magnetron sputtered ITO:Zr thin films for the high efficiency a-Si:H/c-Si heterojunction solar cells

ITO and ITO:Zr films with various thicknesses were prepared on glass substrates by RF magnetron sputtering. We observed a decrease in sheet resistance with increasing film thickness that in good agreement with Fuchs-Sondheimer theory. The ITO films doped with ZrO₂ (～0.2 wt%) showed improvement in some of the electrical and optical properties of ITO films. The surface roughness of ITO:Zr films increased with increasing film thickness. ITO:Zr films with thickness of 120 nm showed highest work function of 5.13 eV, as estimated from XPS data. The ITO:Zr films were employed as front electrodes in HIT solar cells; the best device performance was found to be: V_oc = 710 mV, J_sc = 34.44 mA/cm², FF = 74.8%, η = 18.30% at a thickness of 120 nm. A maximum quantum efficiency (QE) of 89% was recorded for HIT solar cells at a wavelength of 700 nm for 120 nm thick ITO:Zr films.     

SnS / ZnO 叠层太阳能电池的制备及性能研究

目的获得光电性能较佳的Sn S/Zn O叠层太阳能电池。方法通过磁控溅射法,采用不同的溅射参数在FTO玻璃上制备Sn S和Zn O薄膜,研究Sn S和Zn O薄膜的晶体结构、表面形貌和光学性能,最终获得制备叠层太阳能电池的最佳方案。结果沉积Sn S薄膜的溅射功率、沉积时间、工作气压为28W,40 min,2.5 Pa和36 W,25 min,2.3 Pa时,获得的两种Sn S薄膜均在(111)晶面具有良好的择优取向,晶粒较大,表面致密光滑,禁带宽度分别为1.48,1.83 e V。沉积Zn O薄膜的溅射功率、溅射时间、工作气压为100 W,10 min,2.5 Pa时,Zn O薄膜的结晶性能更优,透过率更大,适合作为太阳能电池的n层。以宽禁带Sn S(1.83 e V)为外p型吸收层,窄禁带宽度Sn S(1.48 e V)为内p型吸收层制备的FTO/n-Zn O/p-Sn S(1.83 e V)/n-Zn O/p-Sn S(1.48 e V)/Al叠层太阳能电池,其光电转化效率为0.108%,短路电流为0.90 m A,开路电压为0.40 V。结论制得的叠层太阳能电池性能较传统单层太阳能电池更优。     

X-ray photoelectron spectrum of Fe2+ state in iron oxides

As a standard for identification of iron oxides by X-ray photoelectron spectroscopy, Fe²⁺ spectra are extracted from mixed Fe 2p_3/2 spectra of Fe³⁺, Fe³⁺ and metallic states. The peaks of Fe²⁺ spectra are all located at binding energy of 708·5 eV. The width of Fe²⁺ spectrum seems to be dependent on crystallinity, and is 2·2 eV for a bulk crystalline oxide and 2·9 eV for an amorphous thin film under instrumental condition with FWHM of 1·3 eV for Au 4f_7/2.