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1.
采用预镀过渡层的方法提高钨螺旋线表面无氰镀金薄膜质量,研究了过渡层厚度对镀金层质量的影响。利用带有能量色散光谱仪的扫描电子显微镜对镀层形貌和成分进行了分析。结果表明:预镀层厚度对镀金层质量有影响。预镀层过薄,影响后续镀金层覆盖效果,导致螺旋线表面部分裸露;预镀层过厚,氢炉高温(960℃,0.5 h)处理过程中可形成铜含量较高的Cu-Au合金易熔化,镀金层出现起皮、脱落等现象。沉积时间控制在10 s时可获得适宜厚度的过渡层。  相似文献   

2.
等离子体刻蚀前处理对碳基薄膜结合力的影响   总被引:3,自引:3,他引:0  
目的通过等离子刻蚀处理使基体表面更洁净,从而提高薄膜与基体的结合力。方法采用阳极层离子源,通过不同的离子源功率和处理时间对M50轴承钢样品进行处理,并在处理过的样品表面制备钨掺杂类金刚石薄膜。利用原子力显微镜对等离子刻蚀处理前后的样品表面形貌进行研究,利用Raman光谱分析薄膜的微观结构,利用划痕仪对薄膜与基体的结合力进行研究。结果不同的离子源功率和刻蚀时间,得到了不同的基体微观表面粗糙度;钨掺杂类金钢石薄膜的D峰和G峰分别在1350 cm~(-1)附近和1580 cm~(-1)附近,为典型的类金刚石结构,ID/IG值在1.5左右;未经等离子刻蚀前处理样品的膜/基结合力是23 N;而优化等离子刻蚀前处理参数样品的膜/基结合力高达69 N,最佳的离子源功率和刻蚀时间为2 k W、60 min。结论等离子刻蚀前处理能够有效提高薄膜与基体的结合力。  相似文献   

3.
为了实现钨螺旋线表面镀金薄膜质量可控,研究了无氰电镀过程中工艺参数如电流密度、镀液温度和沉积时间对镀金层质量的影响规律。利用扫描电子显微镜对镀金层形貌进行观察分析。结果表明:电流密度影响镀金薄膜的表面平整度及晶粒大小;镀液温度影响无氰镀液稳定性,从而影响薄膜的表面光泽度及平整度;电沉积时间对镀层覆盖效果影响较大。沉积时间过短,镀层覆盖效果差;时间过长,边角效应严重。沉积时间宜控制在1.5 h内。  相似文献   

4.
前处理工艺对NdFeB表面真空蒸镀Al薄膜结构及性能的影响   总被引:1,自引:1,他引:0  
为了开发烧结钕铁硼磁体表面低损伤、环境友好型镀膜前处理工艺,在分别采用抛光、酸洗(50 s)、吹砂、吹砂+酸洗(5 s)4种不同工艺处理的烧结NdFeB磁体表面真空蒸镀Al薄膜。经不同工艺前处理的NdFeB基体和涂层的形貌采用扫描电子显微镜进行观察;采用拉伸试验对Al涂层和基体之间的结合力进行测试;NdFeB基体的自腐蚀行为采用电化学极化曲线进行表征。结果表明:吹砂前处理后NdFeB基体表面存在一层晶粒损伤层,导致镀Al薄膜试样镀层与基体之间的结合力(9.54 MPa)最差。而采用吹砂+酸洗(5 s)前处理后NdFeB表面镀Al试样镀层与基体之间结合力可达13.58 MPa。酸洗(50 s)及喷砂+酸洗(5 s)前处理后基体试样的自腐蚀电流密度基本相同(21μA·cm~(-2)),仅为抛光及喷砂前处理基体试样的20%。在4种工艺当中,吹砂+酸洗(5 s)前处理工艺获得最高的结合力和优异的耐腐蚀性能。  相似文献   

5.
铬掺杂碳基自润滑薄膜与铝合金的高温磨损机理   总被引:1,自引:0,他引:1  
为了研究不同结构铬掺杂碳基薄膜在高温下与铝合金的磨损机理,采用非平衡磁控溅射在YT15刀具表面沉积Cr/CrC/DLC单周期和Cr/(CrC-DLC)_n多周期多层膜,在24、200和400℃下与A319和A390铝合金进行摩擦试验。采用扫描电子显微镜、原子力显微镜、纳米压痕仪、拉曼光谱仪、销盘磨损仪对薄膜的形貌结构、力学和摩擦学性能进行测试。研究表明:多周期多层膜结构打断薄膜柱状生长,提高膜基结合力。两种薄膜表面粗糙度和硬度分别为4.3 nm和5.4 nm、9.8 GPa和9.0 GPa。磨球表面转移层由硅、石墨以及剥落的薄膜碎片组成,连续的转移层降低摩擦因数;但随着温度升高,转移层的连续性被破坏,导致摩擦因数升高。在高温摩擦过程中,多周期多层膜磨损逐渐释放出DLC子膜层,通过DLC子膜层的石墨化转变来保持低摩擦因数,提高薄膜寿命。薄膜磨损由室温的磨料磨损转变为高温的粘着磨损和犁沟磨损,其中由于A390含有初晶硅使磨损以犁沟磨损为主。  相似文献   

6.
阴极弧径向不同位置膜层性能分布规律   总被引:2,自引:0,他引:2       下载免费PDF全文
利用阴极弧沉积的方法在201不锈钢基体上制备了TiN薄膜,研究了阴极弧径向不同位置大颗粒、膜厚以及膜层性能的分布规律.分别采用X射线衍射(XRD)和扫描电子显微镜(SEM)分析了膜层的相结构、膜层的表面形貌和截面形貌.研究了镀膜试样和基体在3.5%(质量分数)NaCl溶液中的腐蚀行为,并利用电化学方法分析其抗腐蚀性能,并采用球-盘式摩擦磨损、划痕测试以及微小压痕等方法测试了径向不同位置沉积的TiN薄膜摩擦磨损性能、膜基结合力以及硬度.结果表明,靠近靶材中心的位置,膜层的硬度、厚度最大,电化学腐蚀电位最高,在径向夹角20°处的膜层厚度、硬度最小.在靠近出气位置侧沉积的TiN薄膜大颗粒数目较多,造成表面缺陷增加,TiN薄膜的抗腐蚀性能下降.靠近弧源中心位置沉积的膜层摩擦磨损系数较大,两侧处的膜层摩擦系数较小,膜基结合力与表面形貌和膜层厚度有很大关系.  相似文献   

7.
目的研究在镀铜的铁基引线支架上沉积钨薄膜的工艺及其性能。方法利用真空磁控溅射技术沉积制备钨薄膜层,并用SEM,EDS,XRD等技术对沉积层的组织和性能进行分析。结果在一定的工作气压、温度和沉积时间下,钨沉积层厚度随着溅射功率的增大非线性增加,沉积层均匀性好,组织较致密,与基体结合力较强,沉积层钨原子沿(110)晶面择优生长。沉积层的电阻率小于1.5×10-6Ω·m,电阻温度系数小于0.0052/℃,抗氧化性较好。结论在引线支架表面沉积金属钨可获得组织均匀致密的薄膜,其结合力、导电性、抗氧化性能良好。  相似文献   

8.
采用磁控溅射技术在涂有介质漆的铝合金表面制备纯Al、Ti、Cr过渡层,在过渡层上溅射Zr N薄膜,并用划痕法测量不同复合薄膜的膜基结合力。测试结果表明,制备了过渡层的Zr N薄膜与介质漆间膜基结合力均能得到改善。具有Al过渡层的复合膜层膜基结合力超过50 N,解决了开裂、翘皮、剥落等问题,为提高Zr N薄膜与涂有介质漆的铝合金表面膜基结合力提供有效途径。  相似文献   

9.
气体压强对DLC薄膜微观结构及性能的影响   总被引:1,自引:1,他引:0  
利用等离子体浸没离子注入与沉积设备,在7A04铝合金表面制备类金刚石薄膜,使其表面有较高的硬度和良好的耐磨损性能。分别采用拉曼光谱仪、显微硬度计、纳米划痕仪和摩擦磨损试验机对样品的微观结构、显微硬度、膜基结合力和摩擦磨损性能进行测试。研究了气体压强对薄膜微观结构、显微硬度及摩擦磨损性能的影响。结果表明:在气压为0.2Pa下制备的薄膜与基体结合力达到了26mN,具有良好的耐磨损性能;随着气压的升高,薄膜厚度增加,膜基结合力与耐磨损性能下降。  相似文献   

10.
采用射频磁控溅射方法在Al2O3陶瓷基底上淀积厚度为500 nm的Cu膜,并将其于真空热处理炉中采用30℃/min和5℃/min两个升温速率升温至400℃退火处理2h,研究了退火升温速度对铜膜表面形貌、电阻率及附着力的影响.结果表明:退火热处理使Cu薄膜表面粗糙度增加,铜膜电阻率降低,膜-基结合力增强.且30℃/min快速升温较5℃/min缓慢升温退火热处理,Cu薄膜表面粗糙度低,Cu薄膜表面电阻率低,膜-基结合力差.利用自由电子气理论和扩散理论对退火热处理过程引起的性能变化进行了分析解释.  相似文献   

11.
Thin film type materials are widely used in high-tech industries including electronics, photonics and even machine tools. Often, knowledge of the thermal properties of thin films is needed to assess reliability through thermal stress analysis when the thin film type materials are applied to functional electronic parts. Only a few methods have been developed for thermal conductivity measurement of a thin film on a substrate. In this study Cu thin films were processed on the borosilicate glass substrate of prismatic bar shape using sputtering. Two Cu coated surfaces of specimens were brought into contact to maintain the insulated boundary conditions. The temperature distributions were measured from the back surface of the substrate using radiation thermometry. The thermal conductivities of the Cu thin films were measured and found to be much lower than those of bulk materials. The measured thermal conductivities were found to be closely related to the microstructures of the Cu thin films.  相似文献   

12.
工艺条件对溅射薄膜附着性的影响   总被引:3,自引:0,他引:3  
溅射薄膜材料应用很广泛,其中薄膜的附着性是影响薄膜材料质量的重要因素,膜/基界面结合强度是制约薄膜材料实际应用的关键之一。本文综述了关于溅射薄膜附着性能的研究进展,总结了影响附着性的主要工艺因素,为改善薄膜质量提供参考依据。  相似文献   

13.
粘着、摩擦和磨损是影响微/纳机电器件稳定性和寿命的关键因素。利用浸渍-提拉法在硅基底上制备了两种具有单、双咪唑环阳离子结构的离子液体薄膜。采用热重分析仪评价了离子液体的热稳定性。利用原子力显微镜测定了薄膜的表面形貌和纳米摩擦学性能。利用球-盘式摩擦试验机考察了载荷和频率对薄膜的微摩擦学性质的影响。对比分析了基于不同阳离子结构的薄膜的微/纳摩擦学性能。结果表明:两种离子液体薄膜的纳米摩擦力随着原子力针尖扫描频率的增加而增加,且[BMIM]PF6薄膜的摩擦力低于2[BMIM]PF6薄膜。此外,[BMIM]PF6薄膜的微摩擦系数低于2[BMIM]PF6。因此,离子液体的阳离子结构对其作为薄膜的微/纳摩擦学性能有重要影响。  相似文献   

14.
利用非平衡分子动力学模拟方法研究了单晶Ge薄膜的厚度以及温度对其面向热导率的影响规律。针对单晶Ge薄膜的结构特点和导热机制,采用Stillinger-Weber势能模型描述Ge粒子间的相互作用,并且建立面向稳态热传导模型。模拟结果显示,单晶Ge薄膜面向热导率具有明显尺寸效应,随薄膜厚度的增加而增大,随温度的升高而减小。与法向热导率的模拟结果进行比较,证明单晶Ge薄膜热导率具有各向异性的特点。  相似文献   

15.
The reliability of thin film systems is important to the continued development of microelectronics, micro-electromechanical systems, and conventional industries. Most often, the reliability of devices in these systems is tied to the ability of the films to remain adhered to substrates during the component lifetime. This research summary looks at the aging of gold thin films and their subsequent fracture from silicon substrates. The mechanical integrity of these films, controlled by the adhesion energy of the interface, is shown to be influenced by strain relaxation and diffusion.  相似文献   

16.
LiCoO2 thin films, which can be used as a cathode material in microbatteries, were deposited using radio frequency (r.f.) magnetron sputtering system from a LiCoO2 target and in an O2+Ar atmosphere.The films were characterized by various methods such as XRD, SEM and AFM.The LiCoO2 films were annealed in air at 300, 500, 700 and 800 ℃ respectively.The effect of the annealing temperature on the structure, the surface morphology and the electrochemical properties of the films were investigated.The LiCoO2 thin film deposited at room temperature is amorphous and has smaller grain size.With increasing of annealing temperature, the crystallinity of the films is promoted.When the annealing temperature increases to 700 ℃, the films have a perfect crystalline LiCoO2 phase.The LiCoO2 thin film without annealing has no discharge plateau and small discharge capacity (about 27 μAh·cm-2μm).The discharge capacity increases with the increasing of annealing temperature and reaches 47 μAh·cm-2μm for the film annealed with 700 ℃, which also shows the typical discharge plateau of 3.9 V.The cycle performance of LiCoO2 thin films of as grown and annealed at different temperatures were studied.In the case of the film without thermal treatment, the capacity fading is much faster than that of the film annealed at different temperature, showing about 40% capacity loss only after 25 cycles.However, in the case of the film annealed at 700 ℃, the capacity reaches to steady state gradually and maintained constantly with cycling.After 25 times cycling, the discharge capacity of the film annealed at 700 ℃ decreases to about 36.9 μAh·cm-2·μm, only 0.8% capacity loss per cycle.  相似文献   

17.
In this work, CrZrAlN thin films with various Al contents were synthesized with an unbalanced magnetron sputtering technique using segment targets. Microstructure, surface morphology, and film hardness were investigated as functions of the Al content; X-ray diffraction, atomic force microscopy, and a microhardness tester were used to carry out the investigations. The thermal stability of the films as a function of the Al content was evaluated by annealing the films at temperatures up to 500 °C for 30 min in air. The synthesized CrZrAlN thin films with Al content from 0 to 12.9 at.% consisted mainly of the crystalline NaCl B1 fcc solid solution phase. With the addition of Al to the CrZrN thin film, the microstructure of the film changed from dense and compact to a columnar structure, and the preferred orientation of the films changed from (111) to (200) plane. The hardness of the film decreased slightly as the Al content increased, and the thermal stability of the CrZrAlN thin films deteriorated. The columnar microstructure in the CrZrAlN thin film is believed to provide a fast route for oxygen to diffuse, resulting in a poor oxidation resistance of the film. Contrary to expectations, the addition of Al to the CrZrN thin film did not improve the oxidation resistance of the film. A way to break the columnar microstructure of the CrZrAlN thin film should be developed in order to improve the oxidation resistance of the film.  相似文献   

18.
IN the last twenty years,amorphous carbon film due toits particular diamond-like performance has beenattracting much attention.As the deposition process isgradually perfected,the DLC film,with highmechanical hardness,chemical inertness,opticaltransparency,and its wide band gap,is becoming thefocus of thin film area I1>21.At present,DLC film haswidespread applications for its peculiarities ofdecoration and function,such as optical windows,magnetic storage disks,biomedical coatings,micro-elec…  相似文献   

19.
研究热处理温度对镀镍钴钢带微观结构和拉伸性能的影响。通过原位扫描电子显微镜观察镀镍钴钢带在拉伸变形过程中表面形貌的变化。结果表明:热处理后,镀镍钴钢带在镀层与基底之间形成镍/钴/铁扩散层,随着热处理温度的升高,钢带的伸长率逐渐增大;当热处理温度为 650 ℃时,镀镍钴钢带的伸长率最大,为 46%,抗拉强度和屈服强度适中。在拉伸变形过程中,镀镍钴钢带在热处理前、后呈现出不同的变形过程。未进行热处理的样品在拉伸变形过程中,表面形成裂纹,裂纹的扩展导致最终断裂;而热处理后,钢带在拉伸过程中表面没有裂纹的产生,孔洞的出现、生长和扩展而导致的最终断裂。这表明,适当的热处理有利于提高材料的韧性,改善其力学性能。  相似文献   

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