Thermal cooling enhancement techniques for electronic components

Due to highly effective thermal spreaders, the vapor chambers have been widely applied on the electronic cooling. An effective thermal spreader can achieve more uniform heat flux distribution and thus enhance heat dissipation of heat sinks. This work investigates the thermal performance characteristics plate-fin vapor chamber. Parametric studies including different operating operation of CPU, coolant types, working fluids, filled ratios, flow direction of coolants, heat sink configurations, and the effect of the relevant parameters on the cooling performance in terms of the thermal resistance was considered and discussed. The results showed that the relevant parameters have a significant influence on the thermal resistance of the vapor chamber.     

Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink

With the rapid development of the information technology (IT) industry, the heat flux in integrated circuit (IC) chips cooled by air has almost reached its limit about 100 W/cm². Some applications in high technologies require heat fluxes well beyond such a limitation. Therefore the search of a more efficient cooling technology becomes one of the bottleneck problems of the further development of IT industry. The microchannel flow geometry offers large surface area of heat transfer and a high convective heat transfer coefficient. However, it has been hard to implement because of its very high pressure head required to pump the coolant fluid though the channels. A normal channel could not give high heat flux although the pressure drop is very small. A minichannel can be used in heat sink with a quite high heat flux and a mild pressure loss. A minichannel heat sink with bottom size of 20 mm × 20 mm is analyzed numerically for the single-phase laminar flow of water as coolant through small hydraulic diameters and a constant heat flux boundary condition is assumed. The effects of channel dimensions, channel wall thickness, bottom thickness and inlet velocity on the pressure drop, thermal resistance and the maximum allowable heat flux are presented. The results indicate that a narrow and deep channel with thin bottom thickness and relatively thin channel wall thickness results in improved heat transfer performance with a relatively high but acceptable pressure drop. A nearly-optimized configuration of heat sink is found which can cool a chip with heat flux of 256 W/cm² at the pumping power of 0.205 W. The nearly-optimized configuration is verified by an orthogonal design. The simulated thermal resistance agrees quite well with the result of conventional correlations method with the maximum difference of 12%.     

Fluid flow and heat transfer characteristics of low temperature two-phase micro-channel heat sinks – Part 1: Experimental methods and flow visualization results

A new cooling scheme is proposed where the primary working fluid flowing through a micro-channel heat sink is pre-cooled to low temperature using an indirect refrigeration cooling system. Cooling performance was explored using HFE 7100 as working fluid and four different micro-channel sizes. High-speed video imaging was employed to help explain the complex interrelated influences of hydraulic diameter, micro-channel width, mass velocity and subcooling on cooling performance. Unlike most prior two-phase micro-channel heat sink studies, which involved annular film evaporation due high void fraction, the low coolant temperatures used in this study produced subcooled flow boiling conditions. Decreasing coolant temperature delayed the onset of boiling, reduced bubble size and coalescence effects, and enhanced CHF. Heat fluxes in excess of 700 W/cm² could be managed without burnout. Premature CHF occurred at low mass velocities and was caused by vapor flow reversal toward the inlet plenum. This form of CHF was eliminated by decreasing coolant temperature and/or increasing flow rate.     

Thermal characteristics of tree-shaped microchannel nets with/without loops

Several tree-shaped microchannel networks with/without loops are numerically examined and compared for application in cooling of electronic components. The physical model of microchannel electronic cooling system is set up with tree-shaped networks. The tree-shaped microchannel nets are embedded in a disk-shaped heat sink, which is attached to a chip to remove the heat dissipated by a chip. The effects of total branching level and loops on the thermal and flow performances of heat sink system are investigated numerically. Results show that tree-shaped nets with loops provide a great advantage when the structure experiences accidental damage to one or more channel segments since the loop assures continuity of coolant flow. Under blockage of some branches, the channel networks only experience an increase of pressure drop while maintaining the capability to remove the heat generated by the chip.     

Analysis of heat transfer characteristics of double-layered microchannel heat sink

Numerical analysis is performed to examine the heat transfer characteristics of a double-layered microchannel heat sink. The three-dimensional governing equations are solved by the finite volume method. The effects of substrate materials, coolants, and geometric parameters such as channel number, channel width ratio, channel aspect ratio, substrate thickness, and pumping power on the temperature distribution, pressure drop, and thermal resistance are discussed. Predictions show that the heat transfer performance of the heat sink is improved for a system with substrate materials having a higher thermal conductivity ratio. A coolant with high thermal conductivity and low dynamic viscosity also enhances the heat transfer performance. The pressure drop decreases with the channel aspect ratio and channel width ratio. Further, the thermal resistance of the microchannel heat sink can be minimized by optimizing the geometric parameters. Finally, the results show that for the same geometric dimensions, the thermal performance of the double-layered microchannel heat sink is better than that of the single-layered one, by an average of 6.3%.     

Parameter study of a porous solar-based propane steam reformer using computational fluid dynamics and response surface methodology

Solar-driven steam reforming of fossil fuels is a promising renewable method for hydrogen production that reduces emissions compared with traditional approaches such as combustion-based technologies. In the present study, a steady-state computational fluid dynamic (CFD) model is developed to investigate a porous solar propane steam reformer (PSR). P1 approximation for radiation heat transfer is coupled with the CFD model, employing User-Defined Functions (UDFs). Innovative propane steam reformers have received less attention in terms of optimization and sensitivity analysis to improve their performance and efficiency. Hence, the effects of porosity, pore diameter, inlet velocity, solar irradiation flux, inlet temperature, and foam thermal conductivity on the propane conversion, hydrogen production rate, and pressure drop are studied using response surface methodology (RSM). The inlet velocity, solar irradiation flux, and pore diameter are found to be the most influential parameters, among those mentioned, on propane conversion, hydrogen productivity, and pressure drop, respectively. Furthermore, optimization is carried out in order to minimize pressure drop and maximize hydrogen production. The reformer with the 70% propane conversion provides the lowest pressure drop maintaining the same hydrogen productivity compared with 80% and 90% propane conversions.     

Multi-objective thermal design optimization and comparative analysis of electronics cooling technologies

A multi-objective thermal design optimization and comparative study of electronics cooling technologies is presented. The cooling technologies considered are: continuous parallel micro-channel heat sinks, in-line and staggered circular pin-fin heat sinks, offset strip fin heat sinks, and single and multiple submerged impinging jet(s). Using water and HFE-7000 as coolants, Matlab’s multi-objective genetic algorithm functions were utilized to determine the optimal thermal design of each technology based on the total thermal resistance and pumping power consumption under constant pressure drop and heat source base area of 100 mm². Plots of the Pareto front indicate a trade-off between the total thermal resistance and pumping power consumption. In general, the offset strip fin heat sink outperforms the other cooling technologies.     

Cooling performance investigation of electronics cooling system using Al2O3–H2O nanofluid

In this study, the cooling performance of Al₂O₃–H₂O nanofluid was experimentally investigated as a much better developed alternative for the conventional coolant. For this purpose the nanofluid was passed through the custom-made copper minichannel heat sink which is normally attached with the electronic heat source. The thermal performance of the Al₂O₃–H₂O nanofluid was evaluated at different volume fraction of the nanoparticle as well as at different volume flow rate of the nanofluid. The volume fraction of the nanoparticle varied from 0.05 vol.% to 0.2 vol.% whereas the volume flow rate was increased from 0.50 L/min to 1.25 L/min. The experimental results showed that the nanofluid successfully has minimized the heat sink temperature compared to the conventional coolant. It was noticed also that the thermal entropy generation rate was reduced via using nanofluid instead of the normal water. Among the other functions of the nanofluid are to increase the frictional entropy generation rate and to drop the pressure which are insignificant compared to the normal coolant. Given the improved performance of the nanofluid, especially for high heat transportation capacity and low thermal entropy generation rate, it could be used as a better alternative coolant for the electronic cooling system instead of conventional pure water.     

Experimental analysis of flow and heat transfer in a miniature porous heat sink for high heat flux application

A novel miniature porous heat sink system was presented for dissipating high heat fluxes of electronic device, and its operational principle and characteristics were analyzed. The flow and heat transfer of miniature porous heat sink was experimentally investigated at high heat fluxes. It was observed that the heat load of up to 280 W (heat flux of 140 W/cm²) was removed by the heat sink with the coolant pressure drop of about 34 kPa across the heat sink system and the heater junction temperature of 62.9 °C at the coolant flow rate of 6.2 cm³/s. Nu number of heat sink increased with the increase of Re number, and maximum value of 323 for Nu was achieved at highest Re of 518. The overall heat transfer coefficient of heat sink increased with the increase of coolant flow rate and heat load, and the maximal heat transfer coefficient was 36.8 kW(m² °C)^?1 in the experiment. The minimum value of 0.16 °C/W for the whole thermal resistance of heat sink was achieved at flow rate of 6.2 cm³/s, and increasing coolant flow rate and heat fluxes could lead to the decrease in thermal resistance. The micro heat sink has good performance for electronics cooling at high heat fluxes, and it can improve the reliability and lifetime of electronic device.     

Numerical study on enhanced heat transfer and flow characteristics of supercritical hydrogen rocket engine's chamber wall using cylindrical ribs structure

One of the most critical issues in supersonic flight is the thermal protection of the rocket engine combustion chamber. The ribs' construction can improve heat transfer and coolant flow characteristics significantly. Ansys fluent was used to investigate the supercritical hydrogen fuel flow and heat transfer characteristics. Ribs spacing of 10 mm, 5 mm, and 2.5 mm were compared to determine the optimal spacing required to achieve maximum cooling influence and lower pressure drop to safeguard the overheated structure and lower the temperature of the walls. Compared to the smooth channel, the thermal performance factor and pressure drop of the 5 mm spacing increased by 32.5% and 16.64%, respectively, while the maximum temperature reduced by 12.07%. Therefore, the cylindrical rib construction with a 5 mm spacing is perfect for improving heat transfer, has acceptable pressure drops, and reduces thermal stratification inside the channel.     

Effects of shield on thermal-fluid performance of vapor chamber heat sink

This work investigates the effects of a shield on the thermal and hydraulic characteristics of plate-fin vapor chamber heat sinks under cross flow cooling. The surface temperature distributions of the vapor chamber heat sinks are measured using infrared thermography. The thermal-fluid performance of vapor chamber heat sinks with a shield is determined by varying the fin width, the fin height, the fin number and the Reynolds number. The experimental data thus obtained are compared with those without a shield.Experimental results indicate that the maximum surface temperature of the vapor chamber heat sink is effectively reduced by adding the shield, which forces more cooling fluid into the inter-fin channel to exchange heat with the heat sink. However, using the shield increases the pressure drop across the heat sink. The experimental data also show that the enhancement of the heat transfer increases with the Reynolds number, but the improvement declines as the Reynolds number increases. When the pumping power and heat transfer are simultaneously considered, vapor chamber heat sinks with thinner, higher or more fins exhibit better thermal-hydraulic performance.     

Experimental investigations of flow boiling heat transfer and pressure drop in straight and expanding microchannels – A comparative study

Flow boiling experiments were conducted in straight and expanding microchannels with similar dimensions and operating conditions. Deionized water was used as the coolant. The test vehicles were made from copper with a footprint area of 25 mm × 25 mm. Microchannels having nominal width of 300 μm and a nominal aspect ratio of 4 were formed by wire cut Electro Discharge Machining process. The measured surface roughness (Ra) was about 2.0 μm. To facilitate easier comparison with the straight microchannels and also to simplify the method of fabrication, the expanding channels were formed with the removal of fins at selected location from the straight microchannel design, instead of using a diverging channel. Tests were performed on both the microchannels over a range of mass fluxes, heat fluxes and an inlet temperature of 90 °C. It was observed that the two-phase pressure drop across the expanding microchannel heat sink was significantly lower as compared to its straight counterpart. The pressure drop and wall temperature fluctuations were seen reduced in the expanding microchannel heat sink. It was also noted that the expanding microchannel heat sink had a better heat transfer performance than the straight microchannel heat sink, under similar operating conditions. This phenomenon in expanding microchannel heat sink, which was observed in spite of it having a lower convective heat transfer area, is explained based on its improved flow boiling stability that reduces the pressure drop oscillations, temperature oscillations and hence partial dry out.     

Three dimensional numerical analyses and optimization of offset strip-fin microchannel heat sinks

This paper presents a numerical study on laminar forced convection of water in offset strip-fin microchannels network heat sinks for microelectronic cooling. A 3-dimensional mathematical model, consisting of N–S equations and energy conservation equation, with the conjugate heat transfer between the heat sink base and liquid coolant taken into consideration is solved numerically. The heat transfer and fluid flow characteristics in offset strip-fin microchannels heat sinks are analyzed and the heat transfer enhancement mechanism is discussed. Effects of geometric size of strip-fin on the heat sink performance are investigated. It is found that there is an optimal strip-fin size to minimize the pressure drop or pumping power on the constraint condition of maximum wall temperature, and this optimal size depends on the input heat flux and the maximum wall temperature. The results of this paper are helpful to the design and optimization of offset strip-fin microchannel heat sinks for microelectronic cooling.     

Cooling performance of a microchannel heat sink with nanofluids

In this paper, the cooling performance of a microchannel heat sink with nanoparticle–fluid suspensions (“nanofluids”) is numerically investigated. By using a theoretical model of thermal conductivity of nanofluids that accounts for the fundamental role of Brownian motion, we investigate the temperature contours and thermal resistance of a microchannel heat sink with nanofluids such as 6 nm copper-in-water and 2 nm diamond-in-water. The results show that the cooling performance of a microchannel heat sink with water-based nanofluids containing diamond (1 vol.%, 2 nm) at the fixed pumping power of 2.25 W is enhanced by about 10% compared with that of a microchannel heat sink with water. Nanofluids reduce both the thermal resistance and the temperature difference between the heated microchannel wall and the coolant. Finally, the potential of deploying a combined microchannel heat sink with nanofluids as the next generation cooling devices for removing ultra-high heat flux is shown.     

Parametric performance analysis of multiple Re-Cooled Cycle for hydrogen fueled scramjet

A Re-Cooled Cycle is newly proposed for a regeneratively cooled scramjet to reduce the hydrogen fuel flow for cooling. Upon the completion of the first cooling, hydrogen fuel can be used for secondary cooling by transferring the enthalpy from fuel to work. Fuel heat sink (cooling capacity) is thus repeatedly used to indirectly increase the fuel heat sink. Instead of carrying excess fuel for cooling or seeking for any new coolant, the cooling fuel flow is reduced, and fuel onboard is adequate to satisfy the cooling requirement for the whole hypersonic vehicle. Two new performance parameters are defined combining the characteristics of scramjet, differences between RCC and expander cycle is discussed, and pressure loss in cooling passage is also considered. Performance comparison is carried among multiple RCCs, and preliminary application limit and real possibility of RCC for scramjet is discussed.     

Numerical study of the inlet/outlet arrangement effect on microchannel heat sink performance

In this study, fluid flow and heat transfer in microchannel heat sinks are numerically investigated. The three-dimensional governing equations for both fluid flow and heat transfer are solved using the finite-volume scheme. The computational domain is taken as the entire heat sink including the inlet/outlet ports, inlet/outlet plenums, and microchannels. The particular focus of this study is the inlet/outlet arrangement effects on the fluid flow and heat transfer inside the heat sinks.The microchannel heat sinks with various inlet/outlet arrangements are investigated in this study. All of the geometric dimensions of these heat sinks are the same except the inlet/outlet locations. Because of the difference in inlet/outlet arrangements, the resultant flow fields and temperature distributions inside these heat sinks are also different under a given pressure drop across the heat sink. Using the averaged velocities and fluid temperatures in each channel to quantify the fluid flow and temperature maldistributions, it is found that better uniformities in velocity and temperature can be found in the heat sinks having coolant supply and collection vertically via inlet/outlet ports opened on the heat sink cover plate. Using the thermal resistance, overall heat transfer coefficient and pressure drop coefficient to quantify the heat sink performance, it is also found these heat sinks have better performance among the heat sinks studied. Based on the results from this study, it is suggested that better heat sink performance can be achieved when the coolant is supplied and collected vertically.     

DF7型内燃机车散热器散热特性研究

利用FLUENT软件对DF7型内燃机车散热器散热性能进行了建模与数值仿真，通过对仿真数据的拟合处理分别获得了散热器水阻、风阻、散热量和消耗功率特性曲线图及关系式，分析了它们与水速和风的质量流速之间的相互关系及产生原因，并通过试验验证了仿真模型的准确性和可行性，实现DF7型内燃机车冷却系统的最佳功率匹配。     

Heat transfer of nanofluids in the mini-rectangular fin heat sinks

In the present study, the heat transfer characteristics of nanofluids cooling in the mini-rectangular fin heat sink are studied. The heat sinks with three different channel heights are fabricated from the aluminum by the wire electrical discharge machine with the length, width and base thickness of 110, 60, and 2 mm, respectively. The nanofluids are the mixture of de-ionized water and nanoscale TiO₂ particles. The results obtained from the nanofluids cooling in mini-rectangular fin heat sink are compared with those from the de-ionized water cooling method. Effects of the inlet temperature of nanofluids, nanofluid Reynolds number, and heat flux on the heat transfer characteristics of mini-rectangular fin heat sink are considered. It is found that average heat transfer rates for nanofluids as coolant are higher than those for the de-ionized water as coolant. The results of this study are of technological importance for the efficient design of cooling systems of electronic devices to enhance cooling performance.     

数据中心服务器水冷散热器的数值模拟与实验验证

水冷散热器在数据中心服务器CPU芯片冷却技术中发挥着重要的作用。如何获得高性能的散热效率成为了该领域关注的重点。针对一种翅柱式水冷散热器,用数值模拟的方法,通过改变翅柱的结构参数来优化散热器的散热性能以及流动特性。在相同的翅柱间距下,改变翅柱的直径和高度,在不同的入口流量下,研究其温度,努塞尔数,压降,摩擦系数,分析比较其综合系数对散热性能的影响,并对结果进行了实验验证。结果表明翅柱高度3.9mm,直径为0.9mm的散热器其综合系数最大     

Microscale heat transfer enhancement using thermal boundary layer redeveloping concept

We demonstrated a new silicon microchannel heat sink, composing of parallel longitudinal microchannels and several transverse microchannels, which separate the whole flow length into several independent zones, in which the thermal boundary layer is in developing. The redeveloping flow is repeated for all of the independent zones thus the overall heat transfer is greatly enhanced. Meanwhile, the pressure drops are decreased compared with the conventional microchannel heat sink. Both benefits of enhanced heat transfer and decreased pressure drop ensure the possibility to use “larger” hydraulic diameter of the microchannels so that less pumping power is needed, which are attractive for high heat flux chip cooling. The above idea fulfilled in microscale is verified by a set of experiments. The local chip temperature and Nusselt numbers are obtained using a high resolution Infrared Radiator Imaging system. Preliminary explanation is given on the decreased pressure drop while enhancing heat transfer. The dimensionless control parameter that guides the new heat sink design and the prospective of the new heat sink are discussed.