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1.
《电力与能源》2015,(6):845-848
太阳能聚光光伏发电系统中电池温度过高会导致发电效率降低,对太阳能电池进行有效的冷却已经成为聚光光伏发电系统保证发电效率和安全运行的关键技术。介绍了采用两相闭式热虹吸管散热器(热管)的方式。根据已知参数设计一个热虹吸管,并做强度校核,保证在极限内热虹吸管可以正常的工作,并选取水作为工作介质。通过实验对热虹吸管的实际工作性能进行分析,得出提高热虹吸管工作效能的结论。  相似文献   

2.
《节能》2017,(6)
为了研究含有内肋的平板通道的强化传热性能,文中建立了3种不同形状的内肋几何模型,采用CFD技术对以水为流体的平板通道内的强化传热性能进行了数值模拟,获得3种模型在层流并且定雷诺数条件下的速度场、压力场及温度场,基于场协同原理对其速度与温度梯度的协同效果和速度与压降梯度的协同效果进行分析和比较。通过分析综合传热性能增强因子获得强化换热情况最佳的内肋平板通道模型,为平板通道工程应用中的节能优化设计提供参考依据。  相似文献   

3.
利用数值模拟方法分析了高度、直径和间距分别为15.0mm、0.1mm和0.5mm的型号1纯铜丝针肋散热器的散热和流动阻力特性,并与相同材料、相同高度,直径和间距分别为1.0mm和5.0mm的型号2在相同边界条件下进行对比。结果表明,前者散热性能高6%,但是后者通过增加丝径和扩大间距进行结构优化,针体总质量没有发生改变,而阻力损失从624.06Pa大幅降低到33.74Pa,并且在工艺上也容易实现。另外,由于两种针肋的针体在13.0~15.0mm高度上温度分布基本没有变化,可以适当降低高度,节省材料。  相似文献   

4.
为了研究内翅几何形状对平行流式油散热器流道流动性能及换热性能的影响,文中对平行流式油散热器流道进行简化,并建立矩形、锯齿形、正梯形及倒梯形4种不同内翅几何形状的流道物理模型,采用Fluent软件对4种流道进行数值仿真分析。以液压油为流道工质,对比4种不同内翅几何形状的流道在不同流体入口速度时流体的出口平均温度及进出口压降。结果发现,在换热条件相同的情况下,四种内翅几何形状的流道中,锯齿形内翅流道的换热性能最好,流动性能也最好。  相似文献   

5.
孙浩琳  李科群  汤盛 《节能》2014,(2):27-30
以芯片最高温度为试验指标,翅片高度、翅片厚度和翅片数目为影响因素,对平直型散热器进行正交设计和数值模拟,求出在影响因素的范围内平直型散热器的最佳结构参数。通过对正交试验结果的极差分析,找出散热器影响因素的主次顺序。并通过对优选出的散热器结构和原来的一款散热器进行流场和温度场的对比分析。  相似文献   

6.
用数值方法分析了圆形热负荷作用面电器件散热器的结构参数对热阻的影响。定义了无量纲坐标及无量纲热阻R,得到了在不同几何参数条件下毕渥数Bi与无量纲热阻R的关系。在大量数据基础上拟合获得了Bi及散热器几何参数与R的关联式,该关联式不仅可以获得热阻随参数变化的趋势,而且能够直接预测散热器的热阻,揭示了热负荷作用面为圆形的电器件散热器散热特性。研究结果为使用这类散热器的设计提供了理论和计算依据。  相似文献   

7.
设计了一套水冷散热器以控制光伏电池运行温度,研究了不同水流量下电池温度及散热器压力损失的变化规律和对应的光伏电池输出特性,实验表明:辐射器温度l 373K、冷却水流量为25 mL/s时,电池温度为302K,所设计的散热器可以有效控制光伏电池的温度;利用Fluent软件分析了导流片高度、导流片数目、冷却水进出口管径等结构参数对其性能的影响,计算表明:增大冷却水进出口管径可以有效的降低压力损失而不影响散热效果;数值模拟结果和实验结果比较吻合,验证了数值模拟方法的正确性.  相似文献   

8.
宫克勤  李浩洁  张大英  迟旭 《节能技术》2009,27(6):513-514,533
本文对供热系统中四种重要型式散热器的热特性进行了理论分析。考虑流量和供水温度的关键影响,根据传热学原理和工程实践,定量地并形象地给出了敏感性分析结果。研究表明,和流量的影响相比,供水温度对四种散热器的散热量具有近线性的更显著的敏感影响,而流量增加到一定数值后,敏感性影响明显减弱。比较发现,钢制柱式散热器由于相对不敏感的热特性使之调节性能差,但稳定性能好;M-132型散热器的可调节性最好。本文的研究为供热系统的节能提供了参考。  相似文献   

9.
本文用Icepak软件分别对有热管和无热管散热器进行了数值模拟对比研究,对数值模拟的过程和结果进行分析比较,结果表明有热管散热器的效果明显强于无热管散热器,同时显示了Icepak在电子设备散热研发过程中的重要作用.  相似文献   

10.
对椭圆芯管矩形翅片和大功率晶闸管用热管散热器偏心圆芯管矩形翅片的传热进行了分析和数值模拟,获得了相应的肋效率曲线,并与已有的近似解作了比较。初步考查了偏心度、材料变物性和翅基温度的不均匀性对偏心圆芯管矩形翅片传热的影响。  相似文献   

11.
The influence of the period of rotation on the effectiveness of the thermophotovoltaic (TPV) rotary regenerator was theoretically and experimentally investigated.It was found that the deviations of the...  相似文献   

12.
We investigated natural convection heat transfer around a radial heat sink adapted for dissipating heat on a circular LED (light emitting diode) light and optimized heat sink. The numerical results were validated with experimental results and it showed a good agreement. To select the optimum reference model, three types of heat sinks (L, LM and LMS model) were compared. Parametric studies were performed to compare the effects of the number of fins, long fin length, middle fin length and heat flux on the thermal resistance and average heat transfer coefficient. Finally, multi-objective optimizations considering thermal performance and mass simultaneously were performed and Pareto front were conducted with various weighting factors. It was found that it was impossible to optimize both thermal performance and heat sink mass at the same time, and there existed an upper limit to the ratio of weighting factors (ω12).  相似文献   

13.
A three-dimensional heat sink module design problem is examined in this work to estimate the optimum design variables using the Levenberg–Marquardt Method (LMM) and a general purpose commercial code CFD-ACE+. Three different types of heat sinks are designed based on the original fin arrays with a fixed volume. The objective of this study is to minimize the maximum temperature in the fin array and to determine the best shape of heat sink. Results obtained by using the LMM to solve this 3-D heat sink module design problem are firstly justified based on the numerical experiments and it is concluded that for all three cases, the optimum fin height H tends to become higher and optimum fin thickness W tends to become thinner than the original fin array, as a result both the fin pitch D and heat sink base thickness U are increased. The maximum temperature for the designed fin array can be decreased drastically by utilizing the present fin design algorithm. Finally, temperature distributions for the optimal heat sink modules are measured using thermal camera and compared with the numerical solutions to justify the validity of the present design.  相似文献   

14.
A channel with a height- or width-tapered variation is designed to improve the thermal performance of a microchannel heat sink (MCHS). To this end, a three-dimensional MCHS model is constructed to analyze the effects of the height- and width-tapered ratios on the thermal performance of the MCHS. The thermal resistance and temperature distribution are taken as the thermal performance indicators. Numerical predictions show that the relationship between the thermal resistance and the width-tapered ratio is not monotonic at the fixed pumping power. The thermal resistance first decreases and then increases. A similar behavior is also exhibited by the height-tapered ratio. However, the height-tapered ratio effects can be negligible. It is also found that the width-tapered-channel design has a lower and a relatively uniform temperature distribution compared to parallel or height-tapered channel design. Moreover, the MCHS with width-tapered channel design showed a maximum enhancement in thermal performance of around 16.7% over that of the parallel-channel design when the pumping power is larger than 0.4 W.  相似文献   

15.
Nowadays, the most recent optical configuration based on Cassegrain and Fresnel lens designs of concentrator photovoltaic(CPV) has shown a race to achieve the ultrahigh concentration ratio. Still, none of those has experimentally shown an optical concentration ratio (GC) beyond 2000 suns. This is because their energy concentration ratios are challenged by the excessive temperature raised throughout the optical stages, which diminishes the efficiency of the solar cell. In this context, this research work aims to numerically investigate a microscale pin-fins heat sink configuration to enhance the thermal performance and the cost-competitivity of ultrahigh CPV thermal receiver. The impacts of the solar cell area, cell efficiency, and heat sink's material have been analyzed and discussed. The results showed that a circular pin-fins heat sink could accomplish a drop of 23.28% in the maximum operating cell temperature at 10 000 suns for cell area of 1 × 1 mm2 relatively compared to the conventional flat-plate heat sink. Furthermore, for a circular pin-fins heat sink with a cell area of 2 × 2 mm2, the cell temperature started exceeding the safe operating range of temperature (80°C) at 8000 suns with an average temperature of 96.1°C and reaching a maximum of 113.91°C at 10 000 suns. A gradient temperature on the planar direction of the aluminum circular pin-fins heat sink was about 1.187°C at 10 000 suns whereas 0.703°C was recorded in the case of a copper circular pin-fins heat sink. The circular pin-fins heat sink showed the highest thermal performance resulting in maintaining the solar cell temperature within its safe operating range even beyond 10 000 suns. From an economic point of view, aluminum circular pin-fins heat sink has been found to be less costly than the copper one. Finally, it was found that at 8000 suns, the flat-plate heat sink cost is more expensive than the traditional pin-fins heat sink by 14.7%, where the flat-plate heat sink becomes the worst economic configuration at 10 000 suns. At that concentration ratio, the cost has increased by 43.38%, 5.75%, and 10.61% compared to the traditional pin-fins heat sink, cylindrical pin-fins heat sink, and circular pin-fins heat sink, respectively.  相似文献   

16.
In this paper, the finite element method (FEM) and experiment were adopted to evaluate the thermal performance of a multi-chip COB LED lamp based on the cold spray technology. The results show that the junction temperature can be limited under 110 °C. Compared to an aluminum-substrate LED module pressed on the heat sink, the soldering structure of a copper-substrate LED can reduce the junction temperature. The junction temperature of the LED module soldered on the heat sink is only 97.3 °C, while one of the pressing structures is 103.5 °C. It is further found that the chip gaps and the thickness of the copper-circuit layer have significant effect on the heat spread. Increasing the chip gaps and the thickness of the copper-circuit layer can effectively reduce the junction temperature and improve the LED lamp's thermal performance.  相似文献   

17.
A simplified model predicting the heat transfer performance of a heat sink base with a high thermal conductivity was developed. Numerical analysis was performed using the commercial software FLUENT. The investigation indicates that for heat sink bases with a high effective thermal conductivity, such as the base embedded with a typical heat pipe, the entire heat sink can be modeled as a flat plate with a uniform temperature and an effective convection heat transfer coefficient. This simplified model can be used to determine the heat transfer performance of a heat sink embedded with a typical heat pipe or vapor chamber.  相似文献   

18.
This study presents the numerical simulation of the heat sink with an un-uniform fin height with a confined impingement cooling. The governing equations are discretized by using a control-volume-based finite-difference method with a power-law scheme on an orthogonal non-uniform staggered grid. The coupling of the velocity and the pressure terms of momentum equations are solved by the SIMPLEC algorithm. The well-known kε two-equations turbulence model is employed to describe the turbulent structure and behavior. The parameters include the Reynolds number (Re = 15,000 and Re = 25,000) and 12 un-uniform fin height designs (Type-b to Type-m). The objective of this study is to examine the effects of the fin shape of the heat sink on the thermal performance. It is found that the junction temperature can be reduced by increasing the fin height near the center of the heat sink. The results also show that there is a potential for optimizing the un-uniform fin height design.  相似文献   

19.
A simplified model predicting the heat transfer performance of a heat sink base with a high thermal conductivity was developed. Numerical analysis was performed using the commercial software FLUENT. The investigation indicates that for heat sink bases with a high effective thermal conductivity, such as the base embedded with a typical heat pipe, the entire heat sink can be modeled as a flat plate with a uniform temperature and an effective convection heat transfer coefficient. This simplified model can be used to determine the heat transfer performance of a heat sink embedded with a typical heat pipe or vapor chamber.  相似文献   

20.
Present investigation analyzes the issue of entropy generation in a uniformly heated microchannel heat sink (MCHS). Analytical approach used to solve forced convection problem across MCHS, is a porous medium model based on extended Darcy equation for fluid flow and two-equation model for heat transfer. Simultaneously, closed form velocity solution in a rectangular channel is employed to capture z-directional viscous effect diffusion and its pronounced effect on entropy generation through fluid flow. Subsequently, governing equations are cast into dimensionless form and solved analytically. Second law analysis of problem is then conducted on the basis of obtained velocity and temperature fields and expressions for local and average entropy generation rate are derived in dimensionless form. Average entropy generation rate is then utilized as a criterion for assessing the system performance. Finally, the effect of influential parameters such as, channel aspect ratio (αS), group parameter (Br/Ω), thermal conductivity ratio (C) and porosity (ε) on thermal and total entropy generation is investigated. In order to examine the accuracy of the analysis, the results of thermal evaluation are compared to one of the previous investigations conducted for thermal optimization of MCHS.  相似文献   

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