流式细胞仪液流聚焦系统仿真分析与设计

使用FLUENT对流式细胞仪液流系统中的核心部件流动室进行了流体仿真分析。探讨了样品流速、鞘液流速、进样针位置对聚焦效果的影响,分析了鞘液不对称进样的实施可能性,以及对鞘液脉动性的补偿措施。搭建了流式平台进行荧光微球的CV值测定,其变化趋势与仿真结果较为吻合。仿真结果为流式细胞仪液流系统的设计提供了参考依据。     

流式细胞仪流动室多参数仿真优化研究

针对现有流式细胞仪样品液聚焦效果不良的现状,提出鞘液入口错位结构以改善聚焦效果,并提出利用截面密度的变化来确定样品液的聚焦直径。分别对鞘液入口速度和错开程度两个影响聚焦效果的因素进行分析。然后结合改进的坐标轮换法对仪器流动室2个重要参数进行联合仿真优化。最后利用流量守恒计算出鞘液的流速与仿真模型得到的流速对比,验证了仿真模型的适用及可靠性。优化结果表明:鞘液入口流速在一定范围内增大时,样品液聚焦直径逐渐减小;鞘液入口错开程度在(0～2.043)mm之间增加时,聚焦直径随之逐渐减小,超过2.043mm后,聚焦直径明显增大。经优化改进后的流动室对样品液的聚焦效果有明显的提升,其聚焦直径减小了64.14%,明显提高了细胞检测的准确率。     

具有三维聚焦功能的微流控芯片

为了使用微流体细胞仪对细胞精确计数,采用紫外光刻工艺制作了能够真正实现三维聚焦功能的微流体检测芯片(微流控芯片).使用聚二甲基硅氧烷(PDMS)进行二次倒模复制其结构以缩短微流控芯片制作周期、降低制作成本,并进行了芯片的封装与测试.首先,利用沉浸式光刻技术和斜曝光工艺制作了具有三维聚焦功能的SU-8微流沟道;然后,利用PDMS对所制作的SU-8微流沟道进行一次倒模,得到其负模结构;对负模结构进行表面处理后,再进行二次倒模,得到PDMS微流沟道;最后,封装PDMS微流沟道与盖片,制得微流控芯片,并对微流控芯片的沟道聚焦效果进行了测试.实验测试发现随着鞘流与样本流流速比不同,得到样本流的聚焦宽度也不同.当鞘流与样本流流速比为20∶1时,可以得到约10.4 μm的聚焦宽度.结果表明,该芯片结构可靠,可以满足进一步的流体聚焦检测要求.采用该方法制作的微流控芯片具有生产周期短、成本低、效率高和结构可靠的特点.     

焊接用三极电子枪设计及电磁聚焦系统研究

研究了150 kV焊接用三极电子枪的束流发生、静电聚焦和磁聚焦过程。基于电子光学理论和三维粒子仿真分析,设计了电子枪静电聚焦系统和磁聚焦系统,建立了适合电子束焊接使用的聚焦距离150~350 mm范围内焦点位置连续可调的电子枪模型。针对现有焊接电子枪手动调焦效率低、焦点位置不易精确控制的问题,通过磁聚焦理论与三维粒子仿真相结合,研究了聚焦电流对应聚焦距离的变化过程,建立了聚焦距离与聚焦电流的非线性函数模型,可为电子枪聚焦的精确控制提供依据。     

基于CFX的某型推流式潜水搅拌器导流罩位置对工作效率的影响

利用CAD软件建立搅拌器的三维模型,并采用流体动力学软件ANSYS-CFX对现有某型推流式搅拌器流场结构进行有限元仿真模拟,得到其总体流场分布、各截面流速分布等结果。证明添加可调节导流罩部分后能根据不同工况使潜水搅拌器保持较高的工作效率,并通过在泵厂装配测试,检验了仿真结果的准确性。     

正交铺层碳纤维复合材料板电涡流分布三维有限元仿真

采用ANSYS软件对正交铺层CFRP板电涡流分布进行了有限元仿真。建立了包括线圈、复合材料板和空气区域的三维仿真模型,采用谐响应分析方法对模型电涡流进行了计算,重点给出了CFRP板电涡流分布规律。开展了电涡流分布的影响因素分析,分别研究了探头线圈激励频率、激励电压以及探头与CFRP板之间距离对电涡流分布的影响规律,给出了各因素对电涡流强度和分布形状的影响结果。     

基于浸入固体法的湿式离合器调压阀流场数值仿真

以船用湿式摩擦离合器调压阀内流道流场为研究对象,运用浸入固体方法模拟接脱排过程中调压阀阀芯的运动状态,建立了椭球形调压阀流体域和固体域的三维计算模型,借助CFX软件分析离合器接脱排过程中调压阀内润滑油的压力和速度分布情况。结果表明:油液流经阀口后,压力明显下降,并在阀口右侧形成低压区;流速迅速上升,并伴有涡流和回流现象;仿真结果与试验得到的调压阀压力试验曲线吻合良好。     

搅拌过滤过程的CFD仿真

螺旋搅拌过滤器的搅拌轴转速直接影响过滤过程的过滤效果。文中采用计算流体力学的方法对过滤器的工作过程进行仿真。分析了过滤过程中,搅拌腔内流体的流速、流态、压力和固含量随搅拌轴转速的影响,讨论了流场内截面的切向流速大小随工作转速的变化规律、各截面涡流的形成和对过滤效率的提高作用,以及工作转速对分离效率的影响。结果表明,随工作转速从200 r/min增加到800 r/min过滤腔内切向流速上升近4倍,边界压力上升15%,分离效率提升5.3%;域内各截面涡流数目增加、涡流直径变大,对混合液的过滤效果增强。文中还给出了螺旋搅拌过滤设备的过滤方程,方程的计算值与仿真值的误差在15%左右,可以为后续设备的结构优化和改进提供必要的依据。     

多孔均流式流量计的结构设计与特性仿真

文中采用CFD数值模拟的方法对多孔均流式流量计进行仿真研究。首先利用正交试验法确定了其最优结构参数,然后分析了流场的特点,进而比较了管道雷诺数、等效直径比、孔板厚度和不同流体类型对多孔均流式流量计与标准孔板流量计的性能的影响。结果表明,多孔均流式流量计孔板产生的涡流的尺寸更小,也更加均匀,且压损系数小,流出系数更大、更稳定;在湍流状态下,多孔均流式孔板的流出系数与雷诺数和流体基本无关。     

芯片拾取新型顶针装置的设计与仿真分析

针对芯片拾取过程中,传统顶针装置对芯片中心冲击过大和芯片受过大剥离力从而导致芯片损坏的问题,提出一种具有柔性缓冲机构的新型顶针装置。首先,进行了具有柔性缓冲机构的顶针装置的结构设计并运用SolidWorks软件建立了该新型顶针装置的三维模型;其次,基于三维模型,运用ANSYS软件对传统顶针装置和新型顶针装置拾取芯片的过程进行动力学建模及仿真,重点研究分析了芯片拾取过程中传统顶针装置和新型顶针装置对芯片、蓝膜产生应力及蓝膜受力的影响和新型顶针装置顶针速度的变化。仿真结果表明,新型顶针装置可以明显降低顶针冲击引起的芯片中心应力,改善顶针速度变化规律,有效降低蓝膜的受力,从而可以提高芯片剥离的有效效率。     

基于气动微流控芯片的新型智能痕量灌溉系统动态流量特性研究

提出一种基于气动微流控芯片的新型智能痕量灌溉系统，利用气动微流控芯片片上膜阀作为控水元件,阐述了新型智能痕量灌溉系统和片上膜阀的结构设计和工作原理，建立了新型智能痕量灌溉系统和片上膜阀的物理模型。对单个片上膜阀不同气体驱动压力、不同液流驱动压力下的出口流量，以及片上膜阀不同组合时的动态流量特性进行仿真分析，给出了不同情况下智能痕量灌溉系统出口流量和出口截面流速、压力分布等特性的分析结果。利用PDMS材料和软刻蚀技术对痕量灌溉系统控水元件进行封装，并对其流量特性进行了实验研究。讨论了在液流驱动压力为10 kPa、不同气体驱动压力时和气体驱动压力为0、不同液流驱动压力时，影响痕量灌溉系统流量的几种因素，并对实验现象进行理论分析。     

Abrasive water and slurry jet micro-machining techniques for fabrication of molds containing raised free-standing micro-features

The demand for metallic micro-molds that can be used for inexpensive mass production of polymeric microfluidic chips is increasing. Existing manufacturing techniques such as soft-lithography and photolithography can require multiple time-consuming steps, especially when the aim is to create three-dimensional features. In this study, the feasibility of using abrasive water jet machining (AWJM) and abrasive slurry jet machining (ASJM) to fabricate such micro-molds in Al6061-T6 and SS316 was studied. Jet raster scans under various combinations of process parameters were used in order to machine micro-pockets containing free-standing structures, representing molds for casting microfluidic chips with channel networks. As expected, for both materials and using both ASJM and AWJM, the pocket roughness decreased as the distance between adjacent raster scans (step size) decreased, but the lowest waviness occurred at an intermediate step size. The best quality pockets were achieved on SS316 using ASJM with the intermediate step size and the highest possible slurry mass flow rate. Unmasked machining could not be used to fabricate molds with sharp-edged intersecting features, and a novel hybrid AWJM/ASJM masked machining technique was thus introduced. An undercut and an undesirable erosion near the edges of the mask formed if the position of the last raster scan closest to the mask was not carefully controlled. Possible reasons for these phenomena were discussed in terms of the likelihood of jet deflection off the machining kerf and mask, and the resulting erosion due to secondary slurry flow. By careful selection of the process parameters, it was demonstrated that high quality molds with both single and intersecting free-standing structures at multiple heights could be fabricated, thus making three-dimensional microfluidic chip mold fabrication feasible.     

PC微流控芯片黏接筋与溶剂的协同辅助键合

为了在微流控芯片上形成封闭的微通道等功能单元,克服热压键合中微流控结构的塌陷和热压所致芯片微翘曲对后续键合的影响,提出了一种适用于硬质聚合物微流控芯片的黏接筋与溶剂协同辅助的键合方法。以聚碳酸酯(PC)微流控芯片为研究对象,通过热压法在PC微流控芯片上的微通道两侧制作凸起的黏接筋,通过化学溶剂丙酮微溶PC圆片的表面,然后将PC圆片与带有黏接筋的PC微流控芯片贴合、加压、加热,从而实现微流控芯片的键合。分析了键合机理,并对键合工艺参数进行了优化。实验结果表明:键合质量受丙酮溶剂溶解PC圆片的时间和键合温度的影响,能够保证键合质量的最佳键合温度为80~90°,溶解时间为35~45s,芯片的键合总耗时为3min。与已有键合工艺相比,所提出的黏接筋与溶剂辅助键合工艺有效提高了键合效率。该键合方法不仅适用于具有不同宽度尺寸微通道的微流控芯片,还可扩展用于不同材料的硬质聚合物微流控芯片。     

航空铝合金7075-T7451三维铣削过程有限元仿真

采用有限元分析软件AdvantEdge建立反映金属切削过程高温、大应变及高应变率状态的切削模型，模拟了航空铝合金7075-T7451铣削加工过程，获得了两个铣削周期内的铣削力变化曲线，并预测了工件及刀具上的温度分布;模拟了铣削过程中切屑的形成，获得了与实际切屑相似的切屑形状。通过铣削力实验获得了相同铣削条件下的铣削力值，与模拟铣削力值比较，发现两者具有较好的一致性，从而证明了有限元模型的正确性。     

EXPERIMENTAL STUDY ON THE HOT EMBOSSING POLYMER MICROFLUIDIC CHIP

Experiments are used to study the fabrication of polymer microfluidic chip with hot embossing method. The pattern fidelity with respect to the process parameters is analyzed. Experiment results show that the relationship between the imprint temperature and the microchannel width is approximately exponential. However, the depth of micro channel isn＇t sensitive to the imprint temperature. When the imprint pressure is larger than 1 MPa and the imprint time is longer than 2 min, the increasing of imprint pressure and holding time has little impact on the microchannel width. So over long holding time is not needed in hot embossing. Based on the experiment analysis, a series of optimization process parameters is obtained and a fine microfluidic chip is fabricated. The electrophoresis separation experiment are used to verify the microfluidic chip performance after bonding. The results show that 100bp-ladder DNA sample can be separated in less than 5 min successfully.     

非对称截面螺旋流道中微粒的惯性聚焦效应

为实现生物微粒/细胞的精确操控,提出了一种非对称截面螺旋流道结构的惯性微流控芯片.基于仿真和实验的方法,对不同尺寸微粒在微流道中的惯性聚焦行为进行了研究.设计了一种"L"形截面的螺旋流道,采用仿真软件COMSOL研究微流道中的二次流场及微粒的运动轨迹.使用UV激光切割与等离子清洗键合的工艺制作芯片样件,采用高速摄像机和...     

金属切削过程的三维显式动力分析

利用非线性有限元程序LS-DYNA,对低碳钢直角自由切削过程进行三维显式动力分析.模型采用单点积分Lagrange算法的三维显式实体单元solid164,以各向同性应变率相关分段线性塑性材料本构模拟切削层材料,以面-面固连断开接触算法模拟切屑与工件母体的分离过程,以同时考虑滑动摩擦与粘结摩擦的模型模拟切屑与前刀面的接触关系.显式分析结果预测低碳钢切削过程中切削力的大小,切削力分析值与已有实验值相比误差为0.6%;模拟出切屑变形过程中金属晶粒的剪切滑移和流动现象;获得切屑的变形形态及切屑中压力及应力应变的分布情况.     

电场驱动μ-3D打印蜡基微流控模具

提出了一种基于电场驱动微尺度3D打印制备蜡基材料微结构的工艺。通过脉冲直流产生自激发静电场驱动皮升级体积石蜡微滴喷射沉积成形；研究了打印参数如气压、电场强度、脉冲频率及占空比等因素对于蜡模打印的影响；优化实验参数，制作了可用于PDMS转印的石蜡微模板，模板线宽为61.25 μm，高度为44.13 μm；结合微转印技术和等离子改性技术制作了微米级微流道芯片样件，并通过实验验证了其具备微流控芯片的基本特征。     

Fundamental modeling for oblique cutting by thermo-elastic-plastic FEM

In this paper, the finite deformation theory and updated Lagrangian formulation were used to describe the oblique cutting process. Either the tool geometrical location condition or the strain energy density constant was combined with the twin node processing method to act as the chip separation criterion. An equation of three-dimensional tool face geometrical limitation was first established to inspect and correct the relation between the chip node and the tool face. And, a three-dimensional finite-difference heat transfer equation was derived. Based on this approach, tool advancement was achieved in displacement increment step by step from the initial tool contact with the workpiece till the formation of steady cutting force. In this case, a large deformation thermo-elastic–plastic finite element model for oblique cutting was established. The mild steel was used as the workpiece, the tool was P20 and the cutting speed was 274.8 mm/s in this article. The chip deformation process and temperature effect on the strain energy density, chip flow angle, cutting force and specific cutting energy were studied first. Finally, the integrity on machined workpiece surface was explored from the variation of residual stresses and temperature distribution on it after cutting. During the chip deformation process, the chip flow angle obtained by this simulation result was approximately equal to the tool inclination angle, which confirmed with the geometrical requirement of Stabler’s criterion. Besides, the simulated specific cutting energy was compared with the experimental specific cutting energy value, the result of which was within acceptable range. It is obvious from the above findings that the model presented in this paper is consistent with the geometrical and mechanical requirements, which verifies the proposed model is acceptable.     

Computational study of flow in a curved pipe with circular cross section

Laminar imcompressible flows in a circular sectioned pipe were investigated by seeking numerical solutions to the Navier-Stokes equations. Three semi-circular pipes of radius ratios 0.05, 0.143 and 0.148 were studied. These calculations covered the Dean number ranging from 183 to 3847. In the range of low and medium Dean numbers, a steady-state solution was obtained; when the Dean number was high, a three-dimensional separation and the associated secondary flow were clearly observed far downstream near the outlet. Extensive flow visualizations were made to depict the computed results.