Transmission electron microscopy characterization of the erbium silicide formation process using a Pt/Er stack on a silicon-on-insulator substrate

Very thin erbium silicide layers have been used as source and drain contacts to n‐type Si in low Schottky barrier MOSFETs on silicon‐on‐insulator substrates. Erbium silicide is formed by a solid‐state reaction between the metal and silicon during annealing. The influence of annealing temperature (450 °C, 525 °C and 600 °C) on the formation of an erbium silicide layer in the Pt/Er/Si/SiO₂/Si structure was analysed by means of cross‐sectional transmission electron microscopy. The Si grains/interlayer formed at the interface and the presence of Si grains within the Er‐related layer constitute proof that Si reacts with Er in the presence of a Pt top layer in the temperature range 450–600 °C. The process of silicide formation in the Pt/Er/Si structure differs from that in the Er/Si structure. At 600 °C, the Pt top layer vanishes and a (Pt–Er)Si_x system is formed.     

Investigation of thermoelectric silicide thin films by means of analytical transmission electron microscopy

The microstructure of rhenium silicide thin films and its progress by annealing were investigated by means of analytical transmission electron microscopy. Sputtered amorphous films were characterised by analysis of the radial distribution function (RDF). The position of the first maximum of RDF represents the most probable distance between neighbouring atoms and decreases from 2.75 to 2.62 A in films with an increasing Si-content from 60 to 75 at%. This decrease correlates with the change of the temperature coefficient (TC) of the electrical resistivity. During in situ annealing, the formation of nanocrystals in films with different Si-contents was observed. In thin films with 64 at% the quantity of nanocrystals increases after 1 h at 900 K whereas their sizes remain unchanged. The crystallisation in Re-rich thin films proceeds lower and produces larger crystals than in films near to the ReSi1.75 stoichiometry. Sputtered epitaxial ReSi1.75 films on Si (1 0 0) consist of crystals with nanometer size and an azimuthal torsion of 45 degrees.     

Heteroepitaxy of AIIIBV films on vicinal Si(001) substrates

GaAs films on Si substrates miscut from the (001) plane by 6° in the [110] direction are grown by molecular beam epitaxy (MBE). GaAs films are grown both on the Si surface terminated by arsenic atoms and on thin pseudomorphic GaP/Si layers. The condition of formation of the As sublayer and the first monolayer of GaP on the Si surface is defined as the GaAs film orientation (001) or \((00\bar 1)\) . The processes of Si surface preparation and formation of the As sublayer and GaAs and GaP epitaxial layers are monitored by means of high-energy electron diffraction reflection (RHEED). The grown structures are investigated by methods of X-ray diffraction, atomic force microscopy (ATM), high-resolution transmission electron microscopy (HRTEM), and low-temperature luminescences. It is shown that the epitaxial film orientation affects both the surface morphology and its crystalline properties. Intense photoluminescence is obtained from the In_0.17Ga_0.83As quantum well structure grown on the GaAs/Si buffer layer.     

Arsenic-terminated silicon and germanium surfaces studied by scanning tunnelling microscopy

The epitaxial growth of As on the (111) and (100) faces of Si and the (111) face of Ge has been studied with vacuum tunnelling microscopy. The (111) faces of both semiconductors display a principally 1×1 termination, but differ with the presence of point defects on the Si(111): As-1×1 surface and trenches separating large (～ 100 Å) domains on the Ge(111): As-1×1 surface. I-V characteristics of the tunnel junction show a surface energy gap of approximately 1·9 eV for the Si(111): As-1×1 surface and 0·9 eV for the Ge(111): As-1×1 surface, in good agreement with recent theoretical calculations for these systems. As deposition on Si(001) results in a nominal 2×1 reconstruction of symmetric As dimers and elimination of missing dimer defects characteristic of the native Si(001) 2×1 surface. Further studies on vicinal, double-stepped substrates shows the orientation of the dimers with respect to the substrate depends critically on the substrate temperature during the growth phase, with destruction of the single principle domain surface order occurring at temperatures in excess of 700°C.     

Surface analyses by low energy SEM in ultra high vacuum

The design and performance of an ultra high vacuum SEM with a field emission gun for solid surface are described. In situ observations of an Si surface are demonstrated for processes of surface cleaning by flashing, step formation of Si(111) surface by annealing, epitaxial growth of metal-deposited layers on Si surfaces by heat treatment, surface segregation of Ni-contaminated layer on the Si(110) by heat treatments and phase transitions of reconstructed structures by electron energy loss spectroscopy.     

Influence of substrate orientation on the morphologyand orientation of LaNiO3 thin films

LaNiO₃ thin films were successfully prepared by a chemical method from citrate precursors. The LNO precursor solution was spin‐coated onto Si (100) and Si (111) substrates. To obtain epitaxial or highly oriented films, the deposited layers were slowly heated in a gradient thermal field, with a heating rate of 1° min^?1, and annealed at 700°C. The influence of different substrate orientations on the thin film morphology was investigated using atomic force microscopy and X‐ray diffraction analysis. Well‐crystallized films with grains aligned along a certain direction were obtained on both substrates. Films deposited on both substrates were very smooth, but with a different grain size and shape depending on the crystal orientation. Films deposited on Si (100) grew in the (110) direction and had elongated grains, whereas those on Si (111) grew in the (211) direction and had a quasi‐square grain shape.     

Randomization of heavily damaged regions in annealed low energy Ge(+)-implanted (001)Si

Apparent growth of amorphous layers during low temperature annealing was observed in low energy Ge(+)-implanted (001)Si by high-resolution transmission electron microscopy. The occurrence of abnormal growth is due to the randomization of heavily damaged regions beneath the original amorphous/crystalline interfaces. The randomization process is attributed to the strain, incurred by the presence of a high density of large Ge atoms in the heavily damaged Si substrate, relaxation to lower the free energy of the systems. The randomization upon annealing may be fruitfully applied to minimize the transient enhanced diffusion in shallow junction formation.     

Characterization of crystallographic properties of SMC poly Si using electron backscattered diffraction

Crystallographic properties of silicide mediated crystallization (SMC) polycrystalline silicon (poly Si) and excimer laser annealing (ELA) poly Si were studied by electron backscattered diffraction. Large‐grain sized poly Si with a large fraction of low‐angle grain boundaries was acquired by SMC, and small‐grain sized poly Si with high‐angle grain boundaries especially around 60° was acquired by ELA. The thin film transistor (TFT) device characteristics were investigated in view of short‐range crystallinity (pattern quality) and long‐range crystallinity (misorientation distribution) of the specimens. Short‐range crystallinity did not significantly affect the TFT device characteristics, and long‐range crystallinity considering the low energy level of special boundaries could be better related to the TFT device characteristics of poly Si.     

001] zone-axis bright-field diffraction contrast from coherent Ge(Si) islands on Si(001)

Coherent Ge(Si)/Si(001) quantum dot islands grown by solid source molecular beam epitaxy at a growth temperature of 700 degrees C were investigated using transmission electron microscopy working at 300kV. The [001] zone-axis bright-field diffraction contrast images of the islands show strong periodicity with the change of the TEM sample substrate thickness and the period is equal to the effective extinction distance of the transmitted beam. Simulated images based on finite element models of the displacement field and using multi-beam dynamical diffraction theory show a high degree of agreement. Studies for a range of electron energies show the power of the technique for investigating composition segregation in quantum dot islands.     

Measurement of elastic strains and small lattice rotations using electron back scatter diffraction

A method is presented for the determination of elastic strains from electron back scatter diffraction patterns, which are obtained at high spatial resolution, from bulk specimens in a scanning electron microscope. It is estimated that the method is sensitive to strains of the order of 0.02%. Strains in Si(1-x)Ge(x) epitaxial layers grown on planar Si substrates were measured for x from 0.2 to 0.015, there being excellent agreement with X-ray diffraction results. Small lattice rotations can also be measured, the technique being sensitive to rotations of 0.01 degrees, which offers an improvement of approximately two orders of magnitude from the more usual EBSD measurements of misorientation. Small lattice rotations were measured in Si(0.85)Geo(0.15) grown on a patterned Si substrate and were consistent with elastic relaxation of the epilayer strain energy.