非一致曲率表面下的气压砂轮磨粒剪胀及加工试验研究

针对软固结磨粒气压砂轮在加工异形曲面时,工件所受的切削力以及接触区内磨粒速度因工件曲率发生变化,导致工件不同曲率处材料去除量不均匀的问题,基于修正的Rowe剪胀理论建立砂轮切削力模型,提出了非一致曲率表面下修正的气压砂轮材料去除模型。通过EDEM软件建立了软固结磨粒气压砂轮模型,分析了砂轮下压量为1.5 mm时工件曲率对接触力以及接触区内磨粒速度的影响。搭建气压砂轮加工试验平台,通过光整加工试验验证修正的材料去除模型。研究结果表明:修正的材料去除模型平均绝对值误差为0.095,而原始的材料去除模型平均绝对值误差为0.291,说明修正的材料去除模型可以用于气压砂轮抛光过程中的定量分析,且工件加工表面划痕明显减少。     

软固结磨粒群内部磨粒拓扑结构对材料去除的影响

针对软固结磨粒气压砂轮光整加工新方法,研究气压砂轮软固结磨粒群的内部磨粒拓扑结构对被加工材料去除率的影响规律。建立气压砂轮材料去除机理模型,分析软固结磨粒群在单压缩载荷下内部细观组构参量及力链网络的演化过程,研究了软固结磨粒群的宏观力学特征与细观结构演化之间的关系,数值模拟了具有不同拓扑结构的磨粒层与工件接触区域内的应力分布规律。将软固结磨粒气压砂轮用于激光强化自由曲面光整加工实验,得到了磨粒目数及体积配比对材料去除量及表面粗糙度的影响规律,试验结果表明,软固结磨粒气压砂轮可用于激光强化表面的光整加工并获得良好的加工效果。     

基于G-W模型的软固结磨粒群接触力分析研究

针对激光强化模具自由曲面的光整加工问题,对软固结磨粒群气压砂轮与模具表面接触力、下压量进行了研究,对砂轮接触模具表面时的磨粒姿态进行了分析,提出了一种基于G-W接触模型构建了软固结磨粒群接触力模型。利用ANSYS WORKBENCH对不同的下压量进行了仿真分析,得到了相应接触力的分布情况,验证了接触力模型的有效性。通过气压砂轮光整实验平台,利用Kistler 9129AA切削力测试仪对不同下压量的接触力进行了测试。研究结果表明,基于G-W的软固结磨粒群接触力模型能够用于计算气压砂轮与模具表面的接触力,接触力与下压量的成类线性关系,且线性关系良好。     

软固结磨粒群剪胀效应及材料去除特性分析

针对软固结磨粒群气压砂轮复杂曲面精密加工问题,提出了一种软固结磨粒群剪胀分析模型,并以微观视角为切入点研究气压砂轮软固结磨粒群的微观剪胀效应对被加工件材料去除特性的影响规律。基于磨粒群剪胀效应分析,建立了孔隙率与黏结磨粒系统阻尼系数的数学模型,结合孔隙比与平均应力的关系,推导了磨粒群作用接触面的应力方程,建立了发软固结磨粒群材料去除模型。通过PFC3D仿真和力传感器测力设备验证了剪胀效应对接触力的影响规律。光整加工试验结果表明,可根据剪胀效应的规律来提高黏结剂阻尼系数从而提高曲面模具材料的去除效果,相同加工时间内,阻尼系数提高约5.0×105,材料去除量累计提高近31.91%,曲面模具的粗糙度降低近32.34%,工件划痕明显减少。     

软固结磨粒群加工方法及材料去除特性的分析

为了解决高硬度模具自由曲面光整技术难点,提出一种软固结磨粒群加工新方法(Softness consolidation abrasives,SCA).所谓软固结磨粒群,特指由高聚物黏结剂黏结于气压砂轮基体表面的磨粒群体,其宏观上不像游离磨粒那样可自由移动,而微观上每个磨粒均受到黏结剂在各个方向的弹性支撑.结合层间弹性力学体系分析,讨论双层弹性体中(橡胶基体层-磨粒层)的力穿越问题,得到表层单颗磨粒的切削力学模型.建立基于应力修正的Preston方程,解决柔性基体供力时存在的应力滞后问题.根据磨粒硬度特性进行系数修正,给出材料去除经验公式.对磨粒群的切削力和速度进行数值模拟,建立材料去除的定量预估模型.总结高效光整加工的配比条件,并通过针对激光强化模具表面的光整试验,验证修正后的Preston方程的准确性.     

软固结磨粒群气压砂轮的力学特性分析

提出以软固结磨粒群(Softness consolidation abrasives,SCA)气压砂轮为工具的加工方法,对磨粒群密集颗粒系统的力学特性进行分析,用于解决激光强化后局部高硬度区域难以高效光整的问题。引入软球接触模型建立磨粒软固结形态下的微观接触力模型,引入全局阻尼系数得出了磨粒蠕变时的位移和速度公式。通过PFC3D仿真,验证了接触力计算公式,建立了颗粒系统的接触力网。对单颗磨粒在z轴方向上的速度进行跟踪研究,证实了SCA在加工时的存在蠕变现象。结合修正的Preston的方程,针对激光强化自由表面进行加工试验。试验结果表明:在相同加工时间内,SCA累积高出游离磨粒近34.35%的材料去除量,且避免了刚性砂轮面向曲面加工时产生的划痕,SCA加工可大幅提升面向高硬度曲面的光整效率。     

软固结磨粒群宏观力学特性对材料去除的影响研究

针对软固结磨粒气压砂轮不同成分组成的粘磨层(粘结剂与磨粒混合层)影响模具激光强化表面材料去除的问题,对不同目数磨粒与粘结剂百分比的粘磨层在单轴压缩载荷下的宏观力学特性展开了分析,提出了将离散元方法 PFC3D模拟技术应用于软固结气压砂轮光整加工领域,利用该软件建立了软固结磨粒群模型,建立了其与材料去除之间的联系。最后,通过Instron-5966l拉伸试验机进行了压缩实验,验证了仿真准确性;并针对激光强化模具表面进行了光整试验。研究结果表明,磨粒目数及粘结剂百分比不同的粘磨层对模具激光强化表面将产生不同的材料去除。     

软固结气压砂轮磨粒磨损研究

为解决自由曲面高效光整加工的问题,将软固结气压砂轮光整技术应用到模具加工中。软固结磨粒群在磨削时能受到柔性支撑,其磨削特性既不同于砂带,也不同于游离磨粒,然而气压砂轮有效加工的时间很短,磨损情况较为严重。针对这一情况,开展了软固结磨粒群磨粒的磨损过程及磨损机理分析,通过实验分别对气压砂轮自转速度ω、气压砂轮下压量d以及磨粒种类等与气压砂轮磨粒磨损之间的关系进行了研究和评价,并对不同种类磨粒的磨损表面进行了观测。研究结果表明:软固结磨粒磨损可以分为初期磨损阶段、正常磨损阶段和严重磨损阶段;磨粒的磨损随着气压砂轮自转速度ω和下压量d的增大而变得严重,但是当气压砂轮自转速度ω增加到某一定的值时,磨粒的磨损反而会下降。     

激光强化模具过渡区的气压砂轮压力控制光整试验

为了实现局部激光熔覆强化自由曲面模具的软固结气压砂轮均匀光整加工,以激光熔覆PHNi25WC-60A粉末的自由曲面模具为对象,通过激光熔覆强化试验与硬度测试得到了不同硬度梯度变化曲线,根据激光熔覆强化区模具的气压砂轮光整加工试验结果,且由数值拟合方法得到材料去除率与表面硬度之间的关系与解析表达式,通过软固结磨粒气压砂轮接触压力控制方法的光整加工试验,较好实现了局域强化硬度过渡区柔性气压砂轮光整加工材料均匀化去除,说明了接触力控制方法在针对局部激光熔覆强化自由曲面模具的气压砂轮光整中的可行性和必要性。     

快速点磨削侧边接触层模型及CBN砂轮磨损特性

根据点磨削原理和技术特征,讨论薄层CBN砂轮侧边实际接触区在材料去除过程中的作用,建立快速点磨削侧边接触区几何模型,对侧边接触区工件等效直径、几何与动态接触弧长、单颗磨粒切削深度、平均切屑断面积等接触层参数进行数学建模与解析。结合快速点磨削加工试验研究结果,分析侧边接触层参数对快速点磨削过程的影响机理及薄层CBN点磨削砂轮的磨损特征及规律。结果表明,点磨削过程中材料的去除主要是在侧边接触区内完成,薄层CBN点磨削砂轮的最大磨损速率发生在砂轮侧边最大直径处。     

螺杆转子砂带磨削装置开发及材料去除率预测

为实现螺杆转子表面磨削材料的均匀去除,开发了一种新型砂带磨削装置,该装置由接触轮式及自由式砂带磨削工具组成。针对磨削工具与工件的接触特点分别采用半解析法及几何近似法建立接触模型,获得接触区域内接触应力分布规律。提出了基于ThunderGBM算法的材料去除率预测模型,以接触应力及磨削工艺参数作为输入,对螺杆转子砂带磨削材料去除率进行了预测,然后针对五头螺杆转子设计并实施了磨削实验。实验数据与数值计算结果的对比表明提出的去除率预测模型具有较高的准确性与有效性。     

Modeling and simulation of cutting forces generated during vertical micro-grinding

Micro-grinding using micro-tools has become very prevalent due to the miniaturization of products with increased process requirements. Moreover, this process provides an edge over other competitive processes, especially as a final process step. The quality of the part produced by the micro-scale grinding process can be influenced by various factors, particularly by the induced mechanical forces. Therefore, predictive model of cutting force can provide guidance for further development and optimization of the process. Although there has been a lot of a research conducted on conventional grinding, little knowledge has been accumulated on micro-scale grinding due to the fact that it is an emerging field of research. The early grinding models developed are mostly based on parameters such as wheel and workpiece velocity, depth of cut and grit size of the grinding wheel. Those early models narrated that the grits penetrate and cut the material from the workpiece surface with the generated grinding forces proportional to the removed material. However, those models may not be appropriate for micro-scale grinding due to the mode of material removal and the method of contact between surfaces which is different from the macro-scale method. In addition to that, due to the small feed rate used in brittle material machining, ploughing force needs to be considered intensively in addition to the chip formation force. Therefore, a new analytical model has been proposed to evaluate cutting forces of micro-grinding process based on the process configuration, workpiece material properties and micro-grinding tool topography. The size effect of micro-machining has been carefully considered in this proposed model. Therefore, this approach allows the derivation of cutting force comprising of both the chip formation force and ploughing force. Experimental investigation in a micro-grinding configuration has been pursued to validate the proposed predictive model. The estimated cutting force showed a good correlation with the experimental values except for higher depth of cut and lower feed rate. Additionally, paired T test has been performed to quantify the difference between the predicted and experimental results.     

Modeling of metal removal during an internal grinding in view of kinematics cutting features

A new model of the metal removal in internal grinding permits calculation of the margin actually removed, the internal radius, the time for complete removal of the margin, and other parameters. In the model, the metal removal is determined with specified machining parameters; elastic deformation and the cutting kinematics are taken into account. The calculation is based on the model of the cutting force in internal grinding, which covers most of the factors affecting the cutting force (such as changes in the programmed and actual radial supply, the mechanical properties of the workpiece, the geometry of the wheel–workpiece contact zone, the wheel characteristics, and the blunting of the abrasive grains). Types of wheel–workpiece contact with inclination of the wheel axis on account of elastic deformation of the system are noted.     

Reduced models of grinding wheel topography and material removal to simulate dynamical aspects in grinding

Increasing competition and short product life cycles make it necessary to optimize and evaluate the outcome of manufacturing processes. In tool grinding, models for the final workpiece geometry and cutting forces are of particular interest. To establish a valid general grinding model, we investigated the cutting process and the influence of local grinding wheel engagements on the material removal. We consequently developed models of material removal and grinding wheel topography, which capture the main correlations in grinding. In combination, temporal cutting forces and final workpiece geometry are predictable and are in excellent agreement with experimental data. The introduced models are valid for grinding in general, since they are solely based on the geometry and process parameters, and hence are applicable for manufacturing process optimization.     

超声振动螺线磨削表面微观形貌建模与仿真研究

为了实现高效率、高质量、低损伤的硬脆材料加工,对工件或砂轮同时施加砂轮轴向和径向的超声振动,该方法的显著特点是磨粒切削轨迹呈三维空间螺旋线型,将其定义为超声振动螺线磨削方法。在磨削工艺和二维超声振动的多参数共同作用下,材料去除机理产生复杂变化,表面微观形貌创出过程变得极其复杂。为此,提出一种超声振动螺线磨削加工表面数值仿真方法。基于超声振动螺线磨削几何映射关系,建立磨粒相对工件的空间螺旋线切削运动模型,进而给出超声振动螺线磨削加工表面生成模型,模拟出普通磨削和超声振动磨削的三维表面微观形貌,对比分析了超声振动对表面形成过程的影响规律。最后将仿真表面与磨削试验表面对比,发现两者微观形貌特征规律基本一致,验证了仿真方法的正确性和有效性。     

A new approach to calculating the workpiece temperature distributions in grinding

In a previous paper it was shown how the wear of the grinding wheel could be characterized by an increase in negative rake angle of the cutting edges in addition to a growth in area of the wear flats on the grits and how in this way the increase in grinding forces with wheel wear could be accounted for. The results for cutting and rubbing forces from the previous paper are used in this paper to determine the heat fluxes needed in calculating temperatures in the contact area between wheel and workpiece. The temperature distributions are obtained by superimposing the distributions in the vicinity of individual cutting edges and wear flats currently engaged with the workpiece upon the temperatures produced by grits which have left the contact area. A random approach, in the sense that the effect of many abrasive grits of varying sizes subjected to different forces and randomly distributed on the wheel is considered, is adopted. Results are presented showing the influence of wheel wear on temperatures.     

3D metal removal simulation to determine uncut chip thickness, contact length, and surface finish in grinding

The two most important geometric parameters that describe the mechanics of grinding are the uncut chip thickness and the contact length. Currently, analytical approaches are used to estimate these parameters. The accuracy of these approaches, however, is limited because they do not take into account the random shape, size, and protrusion height and placement of the abrasive grains around the circumference of the grinding wheel. In this paper, a simulation technique was used to gain new insight into the effect of the stochastic nature of grinding wheels on the geometric properties of the grinding process. The simulator was used to calculate the number of active grains, uncut chip thickness, and contact length for a stochastic wheel model of Radiac Abrasive’s WRA-60-J5-V1 grinding wheel. These values were then mapped to every grain on the grinding wheel and used to determine the instantaneous material removal rate of the wheel and workpiece surface finish. There was excellent agreement between the predicted and experimentally measured surface topology of the workpiece. The results suggest that only 10–25 % of the grains on the grinding wheel are active and that the average grinding chip may be as much as ten times thicker and ten times shorter than would be produced by a grinding wheel with a regular arrangement of cutting edges as assumed by existing analytical approaches.     

Molecular dynamics modeling of a single diamond abrasive grain in grinding

In this paper the nano-metric simulation of grinding of copper with diamond abrasive grains, using the molecular dynamics (MD) method, is considered. An MD model of nano-scale grinding, where a single diamond abrasive grain performs cutting of a copper workpiece, is presented. The Morse potential function is used to simulate the interactions between the atoms involved in the procedure. In the proposed model, the abrasive grain follows a curved path with decreasing depth of cut within the workpiece to simulate the actual material removal process. Three different initial depths of cut, namely 4 ?, 8 ? and 12 ?, are tested, and the influence of the depth of cut on chip formation, cutting forces and workpiece temperatures are thoroughly investigated. The simulation results indicate that with the increase of the initial depth of cut, average cutting forces also increase and therefore the temperatures on the machined surface and within the workpiece increase as well. Furthermore, the effects of the different values of the simulation variables on the chip formation mechanism are studied and discussed. With the appropriate modifications, the proposed model can be used for the simulation of various nano-machining processes and operations, in which continuum mechanics cannot be applied or experimental techniques are subjected to limitations.