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The serious warpage issues of ultrathin chip-on-flex (UTCOF) assembly induced by mismatched thermal stresses have greatly affected the mechanical stability and reliability of emerging ultrathin chip packaging technology. Currently, a theoretical prediction as a convenient and straightforward approach is still lacked for describing effectively the thermal-mechanical behavior of UTCOF during the adhesive curing and cooling process. In consideration of the adhesive thickness approximating to ultrathin chip and flexible substrate thickness, we develop a layerwise-model of ultrathin chip-adhesive-flex structure under plain strain condition, where the behavior of thick adhesive bonding can be described precisely through increasing the subdivided mathematical plies. Further, the analytical results show that the concave and convex forms of ultrathin chip warpage yield at the end of the curing and cooling process respectively. Meanwhile, the effects of its structure dimensions and material properties are also revealed for discussing a way to relieve the extent of ultrathin chip warpage. Additionally, in order to verify the validity of the theoretical prediction, we also introduce the corresponding numerical technique and experimental method. These results suggest that a kind of rigid and ultrathin flexible substrate such as metal foil should be adopted for small warpage of ultrathin assembly.  相似文献   
2.
The components of combustion chamber (cylinder head-cylinder liner-piston assembly-oil film) were taken as a coupled body.Based on the three-dimensional heat transfer numerical simulation of the coupled body,a coupled three-dimensional calculation model for in-cylinder working process and the combustion chamber components was built with domain decomposition and boundary coupled method,which implements the coupled three-dimensional simulation of in-cylinder working process and the combustion chamber components.The model was applied in the influence investigation of the space non-uniformity in heat transfer among combustion chamber components on the generation of in-cylinder emissions:NOx.The results showed that the heat transfer space non-uniformity of combustion chamber components directly influences the formation of in-cylinder NOx.The main area being influenced was the accessory area on the wall,while the influence on the generation of NOx in the central area couold be omitted.  相似文献   
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Chatter is a kind of self-excited vibration and causes negative effects in machining processes. This paper presents a practical method to identify the chatter with cutting force signals in milling processes. Since the spectrum of the chatter signal exhibits discrete spectral lines around the chatter frequencies and the Rényi entropy is an effective index to characterize the randomness of data series, the frequency-domain Rényi entropy is proposed as a chatter indicator. As the chatter severity level grows, the signal components at the chatter frequencies become more and more significant, which means a reduction of the randomness of the spectral series. As a result, the value of the Rényi entropy-based indicator decreases rapidly at the onset of the chatter. In order to eliminate the interference of the normal signal components, i.e., the spindle speed-related frequency components, the spectrum is preprocessed to filter out those components first. Various milling experiments are conducted. The results show that the value of the proposed indicator changes sharply at the onset of chatter in various milling conditions with different spindle speeds and cutting depths. Also, the proposed indicator is compared with the commonly used Shannon entropy-based indicator and verified to have a larger difference between the stable and chatter statuses and is higher sensitivity to the chatter.  相似文献   
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