管道风险管理方法研究

按照管道风险管理的流程分别对管道风险评价、风险控制和决策支持、效能测试和响应进行了论述。针对目前国内管道行业的情况，提出了进行管道风险评价的有效方法及维护措施。着重介绍了国外管道风险可接受标准的情况，作为国内制定管道风险评价标准的参考。     

Applications and Technologies of All-Solid State Blue Laser

1 Introduction Along with the matureness of laser diode (LD) manufacturing technology, the performance of LD has been improved greatly since 1980s, so various kinds of laser devices based on LD have been developed rapidly, especially the all-solid state lasers. After early experiments and researches, the all-solid state lasers have been commercialized successfully.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Gamma-irradiation-induced Ag/SiO2 composite films and their optical absorption properties

Small Ag particles or clusters dispersed mesoporous SiO₂ composite films were prepared by a new method: First the matrix SiO₂ films were prepared by sol-gel process combined with the dip-coating technique, then they were soaked in AgNO₃ solutions followed by irradiation of γ-ray at room temperature and in ambient pressure. The structures of these films were examined by X-ray diffraction (XRD), high-resolution transmission electron microscope (HRTEM), and optical absorption spectroscopy. It has been shown that the Ag particles grown within the porous SiO₂ films are very small, and they are isolated and dispersed from each other with very narrow size distributions. With increasing the soaking concentration and an additional annealing, an opposite peakshift effect of the surface plasmon resonance (SPR) was observed in the optical absorption measurements.     

6σ设计水平的评价

在介绍6σ设计概念和目标的基础上，给出设计水平与百万机会缺陷数(DPMO)关系的计算表达式和关系曲线，并开发了计算机模块，能自动计算与不同设计水平对应的DPMO值，也可以根据实际的DPMO值，自动评价达到的设计水平。     

射频电缆组件组装工艺浅谈

近年来国内外射频电缆组件的发展很快,射频电缆组件的性能不断提高,对射频电缆组件组装工艺也提出了更高的要求.射频电缆组件组装过程多是手工操作,产品的一致性及性能很难控制,要求有良好的工艺保证,为此介绍了射频电缆组件组装工艺,包括电缆的裁剪及剥皮、内导体的连接、外导体的连接和电气性能的测试;探讨了在组装过程中应注意的问题,以及针对内导体焊接易出现虚焊问题进行研究.     

T8钢－聚有机硅氧烷仿生减粘降阻复合涂层的特性

研究了Ｔ８钢－聚有机硅氧烷仿生减粘降阻复合涂层的表面润湿性、磨料磨损特性及对土壤的减粘降阻性能与金属材料相比，仿生复合涂层的表面憎水性显著提高，水在其表面上的接触角达９２°；与４５钢相比，其磨料磨损的体积相对耐磨系数为６３％，降阻率达１５．２２％～２２．２７％     

通用绘图软件NuSlides中的面向对象的用户界面设计

本文描述在Ｕｎｉｘ环境下开发的通用绘图软件ＮｕＳｌｉｄｅ中的图形用户界面的设计思想和实际方法。其特点是基子面向对象的技术，提供多窗口、菜单驱动、选择面板、键盘输入等多种才法。该图形用户界面具有灵活性、可扩充性和易使用性。     

Influence of interfacial microcracks on the elastic properties of composites

A model is established to quantify the influence of interfacial microcracks on the elastic properties of a particulate composite using a combination of theoretical and finite element analysis. A unique way to construct physical models which could accommodate both crack size and crack density is proposed. Based on energy principles, the influence of a dilute concentration of interfacial microcracks is first studied. The case of a finite concentration of microcracks is solved subsequently by combining the dilute concentration solutions and the differential scheme. Both cases agreed well with existing composite theories for the limiting condition of complete decohesion. The final model predicts the effective elastic properties as functions of both crack size and microcrack density.     

南222改建

密度首先是这个设计存在的前提。（1个老师+7个学生+许多书+4-5台电脑+办公、画图、评图、会客、休息等等活动种类）/16m2=超载的各种密度:人的密度、物品的密度,以及不同性质空间的密度。密度首先需要我们解决问题。于是我们将上述等式中的除数转化成16m2×3.85m（净高）,将平面