多丝正比室中电子的最大漂移时间

多丝正比室中电子的最大漂移时间是逃逸门电路中的一个重要参数。这个参数的选择将影响逃逸门工作方式的多丝正比室的整体性能。通过实验测量得到了多丝正比室中电子的最大漂移时间的实际值和最大漂移时间随多丝正比室工作状态的变化，测量结果在实际中得到应用。     

WLSP852型微量硫分析仪在原料气分析中的应用

介绍WLSP852微量硫分析仪成功取代陈旧的汞量法用于原料气硫分析。不仅能准确分析进口管线、气液离器、加氢转化炉等位号硫的总含量，还能分别测定各种形态硫的含量。     

用直流标准电阻箱测量数字直流电桥测量不确定度评定

本文介绍了用直流标准电阻箱测量数字直流电桥,对测量结果的不确定度进行分析。     

Templated synthesis of ordered porous TiO2 films and their application in dye-sensitized solar cell

Ordered porous TiO₂ thin films were fabricated on conductive glass by using colloid crystal template of polystyrene (PS) spheres. Microstructural characterization by scanning electron microscopy techniques was carried out to explore the porous structural changes due to the PS templates which could be controlled by adjusting the drawing rate. Photovoltaic performance was measured and this revealed the effect of microstructural changes. The results showed that monolayer porous TiO₂ films and multilayer porous TiO₂ films could be successfully prepared. And multilayer porous TiO₂ films provided large surface area for dye absorption to increase the efficiency of dye-sensitized solar cells (DSSCs) which were assembled by porous TiO₂ films.     

Defect inspection of flip chip package using SAM technology and fuzzy C-means algorithm

Solder bumps are widely used in surface mount components, which provide electrical and mechanical connection between the chip/package and the substrate. As the solder bump getting smaller in dimension and pitch, it becomes more difficult to inspect the solder defects hidden in the IC package. In this paper, an intelligent inspection method using the scanning acoustic microscopy(SAM) and the fuzzy C-means(FCM) algorithm was investigated. A flip chip package of FA10 was chosen as the test sample. The SAM tests of FA10 were carried out in C-scan mode. The sub-image of every solder bump was segmented from the SAM image. The statistical features were then calculated and adopted for clustering of solder bumps using the FCM algorithm. The recognition results of FCM reached a high accuracy of 94.3%. The intelligent system is effective for defect inspection in high density packages.     

深基坑土钉支护的有限元模拟与现场实测对比分析

本文运用大型非线性有限元软件ADINA对广州某深基坑土钉支护结构进行了模拟分析.通过建立带有接触界面的局部三维有限元模型,模拟了基坑开挖与支护的施工过程,得出了土钉的轴力,支护面层的水平位移及土压力的分布规律,并与现场实测值进行了对比分析.结果表明,计算值与实测值基本吻合,说明本文建立的非线性有限元计算模型和分析方法是可靠的,且满足工程的精度要求,能够较好地运用于实际工程的分析和预测.同时,分析结果也验证了ADINA软件在土工分析方面的优势.     

建立诚信机制应对玩具仿冒

目前．玩具企业产品被仿冒的现象比较严重。往往是一个企业苦心研制的新产品刚刚投放市场．仿冒的产品即跟随而来。由于省却了研发费用．仿冒产品的成本低廉．反而更容易占领市场．选成了玩具企业老板们气愤不过却又无可奈何的心痛。     

CCC认证玩具检测中的共性问题

2006年,我国开始对童车、电玩具、弹射玩具、金属玩具、娃娃玩具、塑胶玩具等6类玩具产品实施CCC认证.     

玩具设计，如何保护版权

核心提示：知识产权在玩具企业研发销售新产品中，越来越重要，新产品包含了企业的知识产权，它能通过一定的方式和途径加以保护，如果保护得当，它能给企业带来许多的商机和财富；如果保护不当，它不会给企业造成很大的损失。     

Analysis of process variations impact on the single-event transient quenching in 65 nm CMOS combinational circuits

Single-event transient pulse quenching(Quenching effect)is employed to effectively mitigate WSET(SET pulse width).It enhanced along with the increased charge sharing which is norm for future advanced technologies.As technology scales,parameter variation is another serious issue that significantly affects circuit’s performance and single-event response.Monte Carlo simulations combined with TCAD(Technology Computer-Aided Design)simulations are conducted on a six-stage inverter chain to identify and quantify the impact of charge sharing and parameter variation on pulse quenching.Studies show that charge sharing induce a wider WSET spread range.The difference of WSET range between no quenching and quenching is smaller in NMOS(N-Channel Metal-Oxide-Semiconductor Field-Effect Transistor)simulation than that in PMOS’(P-Channel Metal-Oxide-Semiconductor Field-Effect Transistor),so that from parameter variation view,quenching is beneficial in PMOS SET mitigation.The individual parameter analysis indicates that gate oxide thickness(TOXE)and channel length variation(XL)mostly affect SET response of combinational circuits.They bring 14.58%and 19.73%average WSET difference probabilities for no-quenching cases,and 105.56%and 123.32%for quenching cases.