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On a self-developed circular-translation polishing machine, the influence of different electric potentials on the friction coefficient and wear properties of SiC/HT200 friction pair, which contacted as one electrode, were studied in NaOH solutions. The results show that the friction coefficient of SiC/HT200 pair is 0.25 under no externally applied potential; but it decreases to 0.23 while applying +3 V polarization potential on the pair; in contrast, it increases to 0.30 when applying -3 V polarization potential on the pair. And the polished SiC surface under +3 V potential is much smoother, while there are clear ploughing marks and adhesive region on the polished SiC surface under zero and -3 V potential, respectively. The mixed tribo-electrochemical friction model has been proposed and the mechanisms of the electric effects on the tribological properties of SiC/HT200 friction pair in NaOH electrolyte are addressed. Results and discussion show that the anodic passivation technique may be used for hastening the running-in process of SiC/Fe friction pairs, as well as for polishing SiC to increase its materials removal efficiency while maintaining good surface quality. 相似文献
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电势对硅片摩擦电化学材料去除特性的影响 总被引:1,自引:0,他引:1
为了提高硅片抛光效率,改善抛光表面质量,采用电化学交流阻抗谱法实验研究了极化电势对硅片表面钝化作用的影响规律,结合摩擦电化学实验探讨了极化电势对硅片表面摩擦系数及材料去除特性的影响.结果表明,在碱性CeO2抛光液中,对硅片施加1 V阳极极化电势能够促进其表面形成抑制腐蚀的钝化层,极化电势过高会破坏表面钝化层,过低则抑制钝化层形成.良好的硅片表面钝化层能够有效增大其摩擦系数,提高摩擦电化学实验过程中的材料去除率. 相似文献
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Zhai Wenjie 《Frontiers of Mechanical Engineering in China》2007,2(4):463-467
In this paper, the status quo and recent progress in the research on tribo-electrochemistry in aqueous and non-aqueous media,
respectively, are reviewed. Much more attention has been paid to the tribo-electrochemical mechanisms for the control of friction
and wear. Based on a summary of the conventional polishing principles of hard and brittle materials, the tribo-electrochemical
polishing method is proposed. The results of the preliminary test show that tribo-electrochemical polishing is promising to
become a critical technology in the high efficient polishing and planarization of microelectronic materials.
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Translated from Tribology, 2006, 26(1): 159–162 [译自 摩擦学学报] 相似文献
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