Robust optimisation of sustainable food grain transportation with uncertain supply and intentional disruptions

The proliferating need for sustainability intervention in food grain transportation planning is anchoring the attention of researchers in the interests of stakeholders and environment at large. Uncertainty associated with food grain supply further intensifies the problem steering the need for designing robust, cost-efficient and sustainable models. In line with this, this paper aims to develop a robust and sustainable intermodal transportation model to facilitate single type of food grain commodity shipments while considering procurement uncertainty, greenhouse gas emissions, and intentional hub disruption. The problem is designed as a mixed integer non-linear robust optimisation model on a hub and spoke network for evaluating near optimal shipment quantity, route selection and hub location decisions. The robust optimisation approach considers minimisation of total relative regret associated with total cost subject to several real-time constraints. A version of Particle Swarm Optimisation with Differential Evolution is proposed to tackle the resulting NP-hard problem. The model is tested with two other state-of the art meta-heuristics for small, medium, and large datasets subject to different procurement scenarios inspired from real time food grain operations in Indian context. Finally, the solution is evaluated with respect to total cost, model and solution robustness for all instances.     

Quantum computation based bundling optimization for combinatorial auction in freight service procurements

Combinatorial auction is a useful trade manner for transportation service procurements in e-marketplaces. To enhance the competition of combinatorial auction, a novel auction mechanism of two-round bidding with bundling optimization is proposed. As the recommended the auction mechanism, the shipper/auctioneer integrates the objects into several bundles based on the bidding results of first round auction. Then, carriers/bidders bid for the object bundles in second round. The bundling optimization is described as a multi-objective model with two criteria on price complementation and combination consistency. A Quantum Evolutionary Algorithm (QEA) with β-based rotation gate and the encoding scheme based on non-zero elements in complementary coefficient matrix is developed for the model solution. Comparing with a Contrast Genetic Algorithm, QEA can achieve better computational performances for small and middle size problems.     

针对不同地质目标的叠前时间偏移成像解释评价

随着计算机硬件和地震勘探成像技术的发展，叠前时间偏移正逐步替代常规的NMO加DMO加叠后时间偏移成为地震数据成像处理方法的主流。但对于不同的地质目标，叠前时间偏移的成像效果是否优于常规NMO加DMO加叠后时间偏移的成像效果呢？为此，从地震数据成像处理方法、处理流程和处理参数等方面进行了讨论，并基于某地区三维数据常规处理结果和叠前时间偏移处理结果，针对不同地质目标进行了剖析与评价。认为：叠前时间偏移成像的垂向分辨率较常规处理明显降低，但对于空间波阻抗变化明显的河流和断层，叠前时间偏移成像的空间分辨率要高于常规处理；对于小于1／4波长的叠置薄储层，叠前时间偏移成像的垂向和空间分辨率低于常规处理结果。     

细节决定采输卤的成败

通过认真学习《细节决定成败》，结合井矿盐开采的实际，分别以生产过程中的三个细节为主，讨论了在采输卤生产技术控制中的细节的重要性。     

一种自动布线方法：多级线探索法

本文介绍了一种在微机上实现的印制板自动布线方法──多级线探索法及其编程方法。这种方法是基于完备布线算法的概念，通过分析李氏算法和传统线探索法的不足之处而得到的。虽然它也是一种线探索法，但有较传统线探索法更强的探索能力，不需要结合李氏算法而能单独完成布线任务，是一种较理想的算法，通过实验获得了较为满意的效果。     

BEM 系列原油流动性改进剂的应用

对BEM系列原油流动性改进剂的基本原理以及在中洛、濮临、东临、东黄、鲁宁、魏荆等几条原油长输管道工业应用的现场测试情况进行了介绍。结果表明，BEM系列原油流动性改进剂在降低原油凝点和粘度方面性能良好，能满足管道安全，平稳运行的要求。     

铁路冷藏运输运价分析

本文对各种运输方式易腐货物的运价进行了比较分析,对铁路冷藏运输的现行运价和保本运价进行了讨论,提出了铁路冷藏运输运价改革的若干建议,可供铁路进行冷藏运输改革参考。     

船闸直立墙基坑开挖与锚固施工程序

三峡船闸深槽开挖与锚固工程量大，工期紧，施工强度高，施工难度大。因此，合理的施工程序有利于边坡稳定和施工，是快速和高质量施工的关键。分析了永久船闸直立墙基坑开挖与锚固施工程序的复杂性和进行研究的必要性。介绍了设计阶段研究船闸开挖与锚固的施工程序。对施工过程中研究施工程序时考虑的因素，研究的主要内容以及实际采用的施工程序作了简要的分析，归纳和总结。     

储层压力与天然气分布关系——以鄂北塔巴庙地区上古生界储层为例

通过分析塔巴庙地区储层压力的分布特征，建立了研究区泥岩压实曲线，并对影响和控制该区储层压力的主要因素和机理进行了探讨，对“欠压实”剩余压力、生气增压、抬升引起的降压进行了定量计算。分析结果表明，晚三叠-早白垩世末“欠压实”作用和晚侏罗-早白垩世末烃源岩大量生烃作用使塔巴庙地区上古生界形成异常高压；晚白垩系构造抬升降压，使得现今储层为正常-低异常压力。同时证实了“欠压实”对天然气有压力封盖作用，天然气都分布在最大“欠压实”幅度以下的储层当中。烃源岩生气高峰为晚侏罗-早白垩世末，但天然气大规模运移是在晚白垩世，方向以沿过剩压力梯度降低较快的方向（太原-山西组至下石盒子组）垂向运移，通道主要为裂缝，运移的动力主要为异常高压。由于储层致密，聚集成藏能量有限，造成天然气充注不足、气水分异不好、含气饱和度低。     

3-D MCM封装技术及其应用

介绍了超大规模集成电路（VLSI）用的3-D MCM封装技术的最新发展，重点介绍了3-D MCM封装垂直互连工艺，分析了3-D MCM封装技术的硅效率、复杂程度、热处理、互连密度、系统功率与速度等问题，并对3-D MCM封装的应用作了简要说明。