全文获取类型
收费全文 | 2217篇 |
免费 | 266篇 |
国内免费 | 111篇 |
专业分类
电工技术 | 41篇 |
综合类 | 101篇 |
化学工业 | 111篇 |
金属工艺 | 642篇 |
机械仪表 | 104篇 |
建筑科学 | 32篇 |
矿业工程 | 31篇 |
能源动力 | 12篇 |
轻工业 | 31篇 |
水利工程 | 3篇 |
石油天然气 | 7篇 |
武器工业 | 12篇 |
无线电 | 1086篇 |
一般工业技术 | 271篇 |
冶金工业 | 70篇 |
自动化技术 | 40篇 |
出版年
2024年 | 3篇 |
2023年 | 11篇 |
2022年 | 35篇 |
2021年 | 31篇 |
2020年 | 31篇 |
2019年 | 28篇 |
2018年 | 34篇 |
2017年 | 57篇 |
2016年 | 43篇 |
2015年 | 78篇 |
2014年 | 93篇 |
2013年 | 106篇 |
2012年 | 143篇 |
2011年 | 163篇 |
2010年 | 141篇 |
2009年 | 182篇 |
2008年 | 170篇 |
2007年 | 192篇 |
2006年 | 209篇 |
2005年 | 153篇 |
2004年 | 137篇 |
2003年 | 98篇 |
2002年 | 84篇 |
2001年 | 79篇 |
2000年 | 60篇 |
1999年 | 57篇 |
1998年 | 43篇 |
1997年 | 17篇 |
1996年 | 18篇 |
1995年 | 20篇 |
1994年 | 34篇 |
1993年 | 12篇 |
1992年 | 3篇 |
1991年 | 3篇 |
1990年 | 8篇 |
1989年 | 4篇 |
1988年 | 3篇 |
1987年 | 2篇 |
1986年 | 1篇 |
1985年 | 1篇 |
1984年 | 2篇 |
1982年 | 1篇 |
1981年 | 1篇 |
1980年 | 1篇 |
1979年 | 1篇 |
1978年 | 1篇 |
排序方式: 共有2594条查询结果,搜索用时 15 毫秒
1.
The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder. 相似文献
2.
城域网的建设是今后光纤网络建设的一个热点,根据城域网的特点和系统技术要求选择光纤光缆是网络设计的重要组成部分。本根据城域网的特点和需求,对市场上现有的光纤光缆做了详细的分析和探讨,提出了城域网规划中光纤光缆选择的原则和具体的建议。 相似文献
3.
The In-Sn-Ni alloys of various compositions were prepared and annealed at 160°C and 240°C. No ternary compounds were found;
however, most of the binary compounds had extensive ternary solubility. There was a continuous solid solution between the
Ni3Sn phase and Ni3In phase. The Sn-In/Ni couples, made of Sn-In alloys with various compositions, were reacted at 160°C and 240°C and formed
only one compound for all the Sn-In alloys/Ni couples reacted up to 8 h. At 240°C, Ni28In72 phase formed in the couples made with pure indium, In-10at.%Sn and In-11at.%Sn alloys, while Ni3Sn4 phase formed in the couples made of alloys with compositions varied from pure Sn to In-12at.%Sn. At 160°C, except in the
In/Ni couple, Ni3Sn4 formed by interfacial reaction. 相似文献
4.
YOSHIHARU KARIYA TADATOMO SUGA 《Fatigue & Fracture of Engineering Materials & Structures》2007,30(5):413-419
This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8Tm). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys. 相似文献
5.
T. YAMAMOTO M. IWATA M. SAKANE Y. TSUKADA H. NISHIMURA 《Fatigue & Fracture of Engineering Materials & Structures》2007,30(5):376-386
This paper describes the creep‐fatigue life of Sn–8Zn–3Bi under push–pull loading. Creep‐fatigue tests were carried out using Sn–8Zn–3Bi specimens in fast–fast, fast–slow, slow–fast, slow–slow and hold–time strain waveforms. Creep‐fatigue lives in the slow–slow and hold‐time waveforms showed a small reduction from the fast–fast lives but those in the slow–fast and fast–slow waveforms showed a significant reduction from the fast–fast lives. Conventional creep‐fatigue life prediction methods were applied to the experimental data and the applicability of the methods was discussed. Creep‐fatigue characteristics of Sn–8Zn–3Bi were compared with those of Sn–3.5Ag and Sn–37Pb. 相似文献
6.
Y. W. Kim 《International Journal of Thermophysics》2002,23(4):1103-1113
A new all-spectroscopic method for depth-resolved thermal diffusivity measurement of metallic specimens has been demonstrated. The method entails measurement of the mass entrained into a laser-produced plasma (LPP) plume in such a manner that the plume is representative of the specimen in elemental composition. Both the abundance of matter and its elemental composition are measured by time-resolved spectroscopy for each LPP plume. In order to delineate the morphology versus composition basis of the depth dependence, a new study on a Nichrome ribbon specimen heated by ohmic heating in a vacuum is presented. A set of depth-resolved thermal diffusivity measurements is carried out, while noting the attendant changes in the spectral emissivity and elemental composition at succeeding ablation layers. Additional measurements are carried out after the specimen has been treated under varying heating conditions. Preferential diffusion of chromium at high temperatures has been found to contribute to the dynamics of surface thermophysical properties at high temperatures. Representative LPP ablation is well suited for removal of surface impurities prior to thermophysical property measurements by the pulse heating technique. 相似文献
7.
本文介绍印制板液态感光阻焊油墨的工艺流程、工艺控制,并对生产中较常出现的几种质量问题进行讨论,进而提出解决措施。 相似文献
8.
The reaction between the Sn-Ag-Cu solders and Ni at 250°C for 10 min and 25 h was studied. Nine different Sn-Ag-Cu solders,
with the Ag concentration fixed at 3.9 wt.% and Cu concentrations varied between 0.0–3.0 wt.%, were used. When the reaction
time was 10 min, the reactions strongly depended on the Cu concentration. At low-Cu concentrations (≦0.2 wt.%), only a continuous
(Ni1−xCux)3Sn4 layer formed at the interface. When the Cu concentration increased to 0.4 wt.%, a continuous (Ni1−xCux)3Sn4 layer and a small amount of discontinuous (Cu1−yNiy)6Sn5 particles formed at the interface. When the Cu concentration increased to 0.5 wt.%, the amount of (Cu1−yNiy)6Sn5 increased and (Cu1−yNi6)6Sn5 became a continuous layer. Beneath this (Cu1−yNiy)6Sn5 layer was a very thin but continuous layer of (Ni1−xCux)3Sn4. At higher Cu concentrations (0.6–3.0 wt.%), (Ni1−xCux)3Sn4 disappeared, and only (Cu1−yNiy)6Sn5 was present. The reactions at 25 h also depended strongly on the Cu concentration, proving that the strong concentration
dependence was not a transient phenomenon limited to a short reaction time. The findings of this study were rationalized using
the Cu-Ni-Sn isotherm. This study shows that precise control over the Cu concentration in solders is needed to produce consistent
results. 相似文献
9.
W. J. PLUMBRIDGE Y. KARIYA 《Fatigue & Fracture of Engineering Materials & Structures》2004,27(8):723-734
With continuing miniaturisation, increased performance demands and the requirement to remove lead from solder alloys, the challenges to structural integrity and reliability of electronic equipment are substantial and increasing. This paper outlines typical features in electronic equipment of which the structural integrity community may be generally unaware. Potential failure modes in service are described, and the problems of scale and material characteristics are considered. Progress in the application of fracture mechanics to the life prediction of interconnections is reviewed. The limited evidence available suggests that the crack growth resistance of silver‐containing lead‐free solders is superior to that of the traditional Sn‐37Pb under cycle‐controlled conditions but there is no difference when time‐dependent conditions prevail. In several respects, it is contended that the electronics sector is faced with challenges at least equivalent to those encountered in gas turbines and nuclear power generation. 相似文献
10.
推导出了成叠带状光纤在松套管中余长的两个计算公式,此两公式是带状光纤缆结构设计需要用到的基本公式。此外,还对带状光纤缆结构设计作了初步讨论。 相似文献