钡盐法处理六价铬电镀废水及最优工艺参数研究

使用钡盐法对铬废水处理,对p H值在废水中的初值、反映温度计量结果、重铬酸钾的浓度等,在回收六价铬的影响效果进行了分析。对废水中的六价铬使用了源自吸收的分光光度法回收。经过处理后,废水中的p H为8~9的时候,六价铬的回收在9%。废水中的六价铬随着其浓度不断上升增加。超过10℃的时候,六价铬的反应没有非常大的影响,但是当温度降低到10℃以下的时候,回收率就逐步下降了。经过处理之后,六价铬的浓度达到了0.276 7 mg/L,达到了相关规定的标准。     

Electroplating of nickel-cadmium alloys from alkaline solutions

The electroplating of Ni-Cd alloy coatings was carried out from alkaline baths (pH 10). For comparison, electroplating of the parent metals, Ni and Cd, was performed individually under the same conditions. The cathodic current efficiency for codeposition was high and decreased with increasing current density. The codeposition process is an anomalous type of plating with Cd being the preferentially deposited metal. The Ni content in the deposits increased with increasing current density. This increase in Ni content improves the corrosion resistance and microhardness of the deposits. X-ray diffraction analysis showed that the deposits consist of a mixture of Ni, β, γ, γ¹ phases.     

New approach to enhance adhesions between carbon nanotube emitters and substrate by the combination of electrophoresis and successive electroplating

Complementary electroplating combined with electrophoresis enhanced the field emission characteristics of emitters by improving the adhesions between CNT emitters and substrate. The emitting current of the CNT emitters prepared by our combined method increased nine times higher than that of CNT emitters prepared by electrophoresis only, since electroplating improved the adhesion of CNT emitters. During the life-time measurement for 10 h, the emitting current of CNT emitters fabricated by electrophoresis only was drastically decreased to 13% of the initial current, while that prepared by the combination of electrophoresis and successive electroplating decreased to 64% of the initial current. We suggest that our method is a promising approach for the efficient fabrication of reliable CNT emitters.     

Hydrogen embrittlement of high strength steel electroplated with zinc-cobalt alloys

Slow strain rate tests were performed on quenched and tempered AISI 4340 steel to measure the extent of hydrogen embrittlement caused by electroplating with zinc-cobalt alloys. The effects of bath composition and pH were studied and compared with results for electrodeposited cadmium and zinc-10%nickel. It was found that zinc-1%cobalt alloy coatings caused serious hydrogen embrittlement (EI 0.63); almost as severe as that of cadmium (EI 0.78). Baking cadmium plated steel for 24 h at 200 °C gave full recovery of mechanical properties but specimens plated with zinc-1%cobalt and then baked still failed in 89% of the time of unplated controls. It was shown that hydrogen uptake and embrittlement could be controlled by depositing thin layers of cobalt or nickel at the steel/coating interface. For example, the least embrittlement was caused by zinc-10%nickel (EI 0.037) due to a nickel rich layer with very low hydrogen diffusion coefficient that formed during the initial stages of electroplating. Similarly, a 0.5 μm nickel layer was effective in lowering the embrittlement caused by zinc-1%cobalt to that of zinc-10%nickel. Furthermore, a 0.5 μm cobalt layer deposited before a zinc-1%cobalt coating gave virtually 100% recovery of mechanical properties after baking.     

Simultaneous recovery of copper and surfactant by an electrolytic process from synthetic solution prepared to simulate a concentrate waste stream of a micellar-enhanced ultrafiltration process

Electroplating method was employed to recover copper and surfactant simultaneously from synthetic solutions prepared to simulate concentrated waste stream generated from micellar-enhanced ultrafiltration. Effects of surfactant and copper (II) concentrations, surfactant to copper (II) molar ratio (S/M), electroplating voltage and time, solution pH, and ionic strength on metal recovery and electrical current efficiency were investigated. Results show that at a fixed S/M ratio of 5, the first-order kinetic constant for Cu (II) removal by electroplating increases with decreasing SDS concentration. At fixed SDS concentration of 8.5 mM, increasing initial Cu (II) concentration increases both Cu (II) recovery and current efficiency. Electrolyte pH has profound effects on the metal recovery and current efficiency due to the difference in solution conductivity after pH adjustment and the extent of Cu (II) adsorption onto SDS at different pHs.     

高耐蚀性Zn—Co合金镀层钝化工艺的研究

研究了电镀Zn-Co合金镀层的钝化液的组成及工艺条件，溶液各成分及工艺条件对钝化膜质量的影响，通过几种腐蚀试验方法，测量了钝化膜的耐蚀性，结果表明，研究的钝化工艺可以得到耐蚀性良好的钝化膜。     

Electroplating synthesis and electrochemical properties of macroporous Sn-Cu alloy electrode for lithium-ion batteries

Macroporous material of Sn-Cu alloy of different pore sizes designated as anode in lithium-ion batteries were fabricated through colloidal crystal template method. The structure and electrochemical properties of the macroporous Sn-Cu alloy electrodes were examined by using scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and galvanostatic cycling. The results demonstrated that the electrodes of macroporous Sn-Cu alloy with pore size respectively of 180 and 500 nm can deliver reversible capacity of 350 and 270 mAh g⁻¹ up to 70th cycles of charge/discharge. The cycle performance of the macroporous Sn-Cu alloy of 180 nm in pore size is better than that of the macroporous Sn-Cu alloy with 500-nm-diameter pores. It has revealed that the porous structure of the macroporous Sn-Cu alloy material is of importance to strengthen mechanically the electrode and to reduce significantly the effect of volume expansion during cycling.     

羟基烷基磺酸镀液电镀Sn—Pb合金的研究

我国自行研制生产的羟基烷基磺酸电镀Sn-Pb合金镀液已经在部分厂家投产使用.生产实践证明,该镀液能获得不同铅含量的、可焊性优良且镀层结晶细致而光亮的Sn-Pb合金镀层.本研究重点测定了该镀液的电化学性能,如阴极电流效率、分散能力及深镀能力.并对添加剂的作用进行了研究探讨.     

PLANAR COPPER PLATING AND ELECTROPOLISHING TECHNIQUES

Electrochemical mechanical deposition (ECMD) is a novel technique that has the ability to deposit planar conductive films on non planar substrate surfaces. This technique involves electrochemical deposition (ECD) while simultaneously polishing the substrate surface. Preferential deposition of the conductor into the cavities on the substrate surface may be achieved through two different mechanisms. The first mechanism is more mechanical in nature and it involves material removal from the top surface. The second mechanism is more chemical in nature, and it involves enhancing the deposition into the cavities where mechanical sweeping does not reach and reducing deposition onto surfaces that are swept. In this study we demonstrate that in an ECMD process, low-pressure mechanical sweeping of the wafer surface during copper plating can establish a differential in the activity of the organic accelerator species between the surface and the cavity regions of the substrate and thus give rise to bottom-up filling in even the lowest aspect-ratio cavities. Planar layers obtained by the ECMD technique have been successfully employed in an electrochemical polishing technique for stress-free removal of Cu.     

Adsorption of mercaptopropionic acid onto Au(1 1 1): Part II. Effect on copper electrodeposition

Copper deposition in the presence of an organic additive (3-mercaptopropionic acid, MPA) was studied by cyclic voltammetry and in situ scanning tunneling microscopy (STM) and the results are compared to those for additive-free solutions. It is shown that underpotential deposition (upd) of copper onto a fully MPA-covered electrode produces a defect-rich substrate, but the defects are blocked by the dense organic film for bulk deposition, resulting in a low number of nuclei. A grain-refining effect of MPA, however, was found, when Cu deposition was initiated shortly after addition of MPA to the solution, i.e., for a low-coverage MPA adlayer.