Stages of surface erosion under ion irradiation

Initial stages of surface erosion have been studied for NaCl and LiF single crystals bombarded by Ar⁺ ions with 20 keV. For irradiation with doses D=10¹⁰-10¹¹ ions/cm², exoelectron emission has been used, whereas for higher doses, we have used electron microscopy. Two stages of initial surface erosion have been identified; for small doses, there is slow development of atomic-scale roughening, which reaches its peak when areas damaged by closest incident ions start to overlap, and then, beginning with D=10¹⁶ ions/cm², there is rapid etching, deep into the crystal, followed by the emergence of secondary microscopic structure, i.e. caverns, concentric closed steps and terraces. Ion-induced surface structure of alkali halide crystals has been shown to depend strongly on the presence of foreign particles on the surface, as well as on segregation. Topography of thin carbon films and some metals have been discussed.     

Secondary ion emission from Ti and Si targets induced by medium energy Ar ion bombardment - Experiment and computer simulation

The paper presents experimental results of secondary ion energy distributions obtained for Ti and Si targets bombarded by 20-30 keV monoisotope Ar⁺ ion beam. The influence of the extraction voltages between target and a slit of the electrostatic energy analyzer entrance on the energy distributions of secondary ions was investigated. After optimization of the secondary ion extraction system, the mass spectra of secondary ions were also measured. The investigations were done using recently built experimental system. Experimental data are compared with the computer simulation results obtained using TRQR and SATVAL codes.     

Effect of Thickness on the Structure and Tribological Properties of MoSx Coating

MoSx coatings were prepared by bipolar-pulse DC unbalanced magnetron-sputtering system with the variation of coating thickness at different Ar pressures.The composition and surface morphology were determined by using energy dispersive X-ray and scanning electron microscopy;the structural characterization was analyzed by X-ray diffraction.The friction and wear properties were investigated by fretting tests in air with less than 10% and 50% relative humidity.At 0.40 Pa pressure,(002) basal plane orientation was formed throughout the coatings.At 0.88 Pa and 1.60 Pa pressures,(002) basal plane orientation was only noticed in the first stage of coating growth(around 0.20 μm in thickness), and then edge orientations with their basal planes perpendicular to the surface would be evolved in the coatings.Humidity has a minor influence on the coatings that have(002) basal plane orientation,whereas the tribological properties of MoSx coatings with edge orientations are greatly affected by humidity.The mechanisms of coating growth and friction and wear processes are discussed.     

Thin film deposition on a corrugated surface: A molecular dynamics approach

This paper presents the use of molecular dynamics (MD) simulation in the investigation of the surface topography of early-stage film growth on a GMR (giant-magnetoresistance) corrugated structure. The size of the simulated system is limited in order to reduce the computational workload. The numerical model adopts the Morse potential and the Verlet-leapfrog time evolution scheme [R.W. Hockney, 1970; D. Potter, 1972 (Chapter 5). [1]] to describe the atomic interactions which take place between the atoms. The impact energy transferred from the incident atoms to the substrate is modeled by rescaling the atoms within the upper substrate layers. It is found that the important properties of the film-substrate system may be obtained after the deposition of just several atomic layers. The influence of the impact velocity upon the coating parameters is investigated by varying the incident energy of the deposited atoms. The current results indicate that the surface coverage is poor, when atoms are deposited at low incident energies upon a low temperature substrate. At a higher incident energy, the deposited film tends to exhibit a quasi-layer-by-layer growth mechanism, which results in an improved surface coverage. Finally, it is demonstrated that a distinct quasi-fluid behavior is evident on the substrate when the atoms are deposited at high incident energies.     

光信息存储与溅射靶材

在光盘制造过程中，需要使用多种溅射靶材。本文简介溅射靶材的制造及主要应用情况。     

Self-aligned fabrication of single crystal diamond gated field emitter array

This paper describes a self-aligned fabrication process for diamond gated field emitter array (FEA). Utilizing the non-conformal coverage sputtering conditions of silicon oxide, an interesting “sphere on cone” structure is formed on diamond nano tip array, which is the key point of gate hole opening process. This structure causes shadowing at certain regions of side-wall during Ti / Au gate metal deposition. Removal of “sphere” by wet etching leads to the successful fabrication of a single crystalline diamond gated FEA. Scanning electron microscope observations reveal the fabrication of a uniform emitter array with tip radius of curvature (20 nm) and gate hole (1.4 μm). We also confirmed that no noticeable physical damage exists on tip. In field emission characteristics of the fabricated single crystal diamond gated FEA, gate voltage control of field emission current is realized.     

Electrochemical properties of boron-carbon-nitride films formed by magnetron sputtering

The electrochemical behavior of B_1.0C_2.4N_1.0 thin film was investigated in acidic, neutral and alkaline solutions. The anodic polarization curve of the film in 1 M NaOH showed the anodic dissolution of the film. The curve of the film in 1 M HCl showed no anodic dissolution. The cathodic polarization curve in 1 M NaCl showed shift to a negative potential side, but the anodic polarization curve was the same as that of Pt. The anodic dissolution in 1 M NaOH depended on potentials, that is, no anodic dissolution was recognized in a potential range of −0.2 to 0.1 V but the dissolution rate increased with increasing potential in a range of 0.1-0.6 V. The anodic current density of the film is directly proportional to the dissolution rate at potentials higher than 0.1 V. The dissolution rate of the film was increased with increasing solution pH.     

Optimization of the sputter-deposited platinum cathode for a direct methanol fuel cell

The electrodes prepared by a sputtering method were evaluated as the cathodes for direct methanol fuel cells (DMFCs). Pt loading below 0.25 mg cm⁻² achieved higher mass activities than that of 0.5 mg cm⁻² prepared by the paste method, which was general conventional method. However, an increase in Pt loading reduced the catalyst activity for the oxygen reduction reaction (ORR). This result may suggest an increase in only electrochemically inactive Pt. Pt utilization efficiency can be found about ten times higher at Pt loading of 0.04 mg cm⁻². Moreover, addition of Nafion to sputter-deposited Pt cathodes is found possible to improve the catalyst activity for the ORR, but the excess Nafion over the optimum condition reduces the active sites.     

切削刀具PVD涂层技术的发展及应用

PVD涂层是利用蒸发、辉光放电等物理过程 ,在基材表面沉积出所需要的涂层的技术 ,通常采用的 PVD技术有蒸发镀膜、离子镀膜和溅射镀膜三大类 ,其中离子镀和溅射镀适合于对切削刀具进行超硬材料涂层。本文着重介绍了溅射镀技术及采用该技术生产的几种重要的涂层 ,结合实例介绍了它们的使用性能 ,并对 PVD涂层切削刀具技术的研究进展 ,工业化生产及应用现状进行了综述。     

磁控溅射在镁合金表面处理中的应用

采用磁控溅射制备的合金表面膜层具有防腐蚀性能优异、耐磨性强等优点,其作为镁合金表面处理技术具有良好的发展趋势。简要介绍了磁控溅射的基本原理及其在镁合金表面处理中的一些应用,并着重给出了反应磁控溅射“Berg”模型的简化计算方法,最后对国内外磁控溅射的最新技术以及应用于镁合金表面处理的趋势进行了展望。