计及Spark和属性权重的售电套餐推荐方法

针对电力市场用户群庞大，交易过程中售电套餐选择困难的问题，在Spark环境下设计了一种售电套餐推荐方法，同时也解决了售电套餐推荐过程中在大数据环境下的可扩展性及实时性问题。首先，计算出每个套餐属性的权重值，从而计算得到售电套餐综合相似度。然后，计及用户和套餐两方面提出一种售电套餐推荐方法，实现售电套餐的精准推荐。实验表明，提出的推荐方法能够明显提高推荐的准确度，并且在分布式环境下具有良好的推荐效率和可扩展性。     

浅谈应用标准进行软件测试

国家标准GB T175 44规定了软件包的质量要求及针对这些要求如何对软件包进行测试的细则。质量要求从产品描述、用户文档、程序及数据三个方面进行了规定 ,测试细则依据这些规定制定。ISO IEC912 6 (1991)版由ISO IEC 912 6 (软件产品质量 )和ISO IEC14 5 98(软件产品评测 )两个标准代替 ,ISO IEC912 6表述了软件产品质量的内部质量、外部质量和使用中的质量 ,规定了内部质量、外部质量的六个质量特性 ,并细分为 2 1个子特性 ,使用中的质量规定了四个使用质量特性 ,使用质量是指六个软件产品质量特性的综合效果。进行软件测试时 ,可以依据GB T175 44中的规定组织测试过程再结合ISO IEC912 6中的质量特性及子特性的规定确定测试需求的内容和测试的重点 ,利用ISO IEC912 6质量的规定建立质量评级的标准。     

绿色包装材料——生物降解塑料

对绿色包装材料-生物降解塑料的降解机理、特点，国内外研究现状和进展及存在的问题和发展前景进行了介绍。     

Business programmes and information systems methodologies

Abstract. An Information Systems Methodology is usually presented as a sequential set of tasks — planning, analysis, design and construction — resulting in a new business application. This classical 'forward-engineering' approach must be adapted to changing business needs — business process redesign, quality management, process and systems templates, advanced technologies, application packages, the reuse of existing information systems resources, and rapid delivery cycles. Using the most general concept of a Business Programme, this paper describes a methodological approach incorporating these modern themes that is qualitatively and quantitatively different from the classical model. It provides a framework for the integration of otherwise independent methodologies, and shows how an entire programme can be formulated, planned and executed. An example is provided, and the approach is justified.     

对集成电路封装塑封料湿敏性评定技术的探讨

在有关塑封料的湿度浸入研究中,湿气或者是穿过聚合物渗透,或者是沿着引线与密封树脂之间的界面渗透。本文主要是通过试验对与湿度渗透有关的新一代树脂的特性给予评定,并判定引线框架通路是如何影响湿度浸入的。     

面阵列封装器件的贴装技术

面阵列封装器件在电子产品中的使用率逐年上升，如何实现其高速贴装是影响生产线效率的重要因素。从不同的角度论述了面阵列封装器件实现高速贴装的手段与技术。     

A copper/polyimide Metal-base packaging technology

A unique substrate MCPM (Mitsubishi Copper Polyimide Metal-base) technology has been developed by applying our basic copper/polyimide technology.¹ This new substrate technology MCPM is suited for a high-density, multi-layer, multi-chip, high-power module/package, such as used for a computer. The new MCPM was processed using a copper metal base (110 × 110 mm), full copper system (all layers) with 50-μm fine lines. As for pad metallizations for the IC assembly, we evaluated both Ni/Au for chip and wire ICs and solder for TAB ICs. The total number of assembled ICs is 25. To improve the thermal dispersion, copper thermal vias are simultaneously formed by electro-plating. This thermal via is located between the IC chip and copper metal base, and promotes heat dispersion. We employed one large thermal via (4.5 mm^?) and four small vias (1.0 mm^?) for each IC pad. The effect of thermal vias and/or base metal is simulated by a computer analysis and compared with an alumina base substrate. The results show that the thermal vias are effective at lowering the temperature difference between the IC and base substrate, and also lowering the temperature rise of the IC chip. We also evaluated the substrate’s reliability by adhesion test, pressure cooker test, etc.     

Modelling and Thermal Analysis of Tray‐layered Fruits inside Ventilated Packages during Forced‐air Precooling

Ventilated packaging is widely used in the forced‐air precooling practice for horticultural produce. Fresh fruits are living organisms which are sensitive to temperature in turn related to airflow and heat transfer inside package. In this study, a transient mathematical model considering heat of respiration and evaporation is developed to predict the thermal response of tray‐layered fruits in ventilated packages during forced‐air precooling. Specifically, the heat source is combined with the energy conservation equation and loaded into numerical solution by User Defined Function (UDF). Temperature profiles of three variously distributed circular and oblong vents in three different patterns (spaced, paralleled and crossed stacking) are simulated, separately. The results show that the heat source affects fruit cooling process, and the layered fruit in paralleled stacking pattern tends to be cooled better than others. Furthermore, the results indicate that vertical oblong vent could improve the longitudinal and lateral airflow, while non‐central vent design could greatly improve the overall cooling performance. Definitely a triangular distribution of three circular vents was superior to laterally distributed centre vents with 66.5% higher uniformity and 2.5°C lower of the highest temperature. Compared with the three identical vertical oblong vent conditions, vent design with one hand hole and two side vertical oblong vents can be cooled more uniformly with an increase of 6.5%. It is revealed that vents with large major‐to‐minor axis ratio could be applied to balance airflow and ease cooling differences for a rapid but uniform cooling. Experimental validations were performed for Sim2, Sim4 and Sim6, Sim8, Sim9, and good agreement was obtained considering the five vent conditions with the error less than 3.5°C but coordinated later (within the limits of the experimental uncertainty).Thus the numerical model can be used to predict and optimize temperature distribution within precooling packages. Copyright © 2016 John Wiley & Sons, Ltd.     

Empirical comparison of three metrics suites for fault prediction in packages of object-oriented systems: A case study of Eclipse

Packages are important high-level organizational units for large object-oriented systems. Package-level metrics characterize the attributes of packages such as size, complexity, and coupling. There is a need for empirical evidence to support the collection of these metrics and using them as early indicators of some important external software quality attributes. In this paper, three suites of package-level metrics (Martin, MOOD and CK) are evaluated and compared empirically in predicting the number of pre-release faults and the number of post-release faults in packages. Eclipse, one of the largest open source systems, is used as a case study. The results indicate that the prediction models that are based on Martin suite are more accurate than those that are based on MOOD and CK suites across releases of Eclipse.     

Adaptive Bas‐relief Generation from 3D Object under Illumination

Bas‐relief is designed to provide 3D perception for the viewers under illumination. For the problem of bas‐relief generation from 3D object, most existing methods ignore the influence of illumination on bas‐relief appearance. In this paper, we propose a novel method that adaptively generate bas‐reliefs with respect to illumination conditions. Given a 3D object and its target appearance, our method finds an adaptive surface that preserves the appearance of the input. We validate our approach through a variety of applications. Experimental results indicate that the proposed approach is effective in producing bas‐reliefs with desired appearance under illumination.