小型机载数字视频记录系统的设计与实现

采用嵌入式控制模块SOM2386和专用视频处理芯片SZ1510,设计和实现了一种基于电子硬盘存储的嵌入式小型机载数字视频记录系统。给出了系统总体方案,阐述了视音频解码编码、接口、控制及存储单元的硬件设计,介绍了系统的软件设计,并给出了系统软件的整体工作流程。该系统体积小、重量轻、抗震性好、使用维护方便,已在某型飞机上得到应用。     

干涉型激光直写技术用于光盘防伪

利用作者研制的干涉型激光直写系统，阐述了干涉型激光直写设计OVD的方法，防伪特征，介绍了应用于光盘防伪的OVD技术和应用前景，给出了实验结果。     

N-苄基丙烯酰胺的合成

以丙烯腈和苯甲醇为原料，浓硫酸作催化剂，合成了N-苄基丙烯酰胺（N-BAA）。考察了反应温度、反应时间和催化剂用量等因素对产物收率的影响，得出了最佳反应条件：n（丙烯腈）：n（苯甲醇）：n（浓硫酸）=3：1：1．2，反应时间3h，反应温度60℃。在最佳条件下，N-BAA的收率可达92％。每100g粗产物用10％氢氧化钠溶液提纯，精制产物纯度可达99．80％，熔点为64～65℃。通过红外光谱对产物结构进行了表征。     

高酸原油脱酸工艺技术研究

介绍了一种原油脱酸工艺方法。研究了温度、时间对高酸原油脱酸的影响,脱酸温度大于 260℃,脱酸反应较快。分析了高酸原油脱酸前后馏分酸值的变化,脱酸反应对130℃以上各馏分酸值降低都较多,180℃以上馏分脱酸率在80％以上。     

FCC油浆提高废胶粉改性沥青热存储稳定性试验

废胶粉用FCC油浆进行预处理后用于沥青改性,制备出沥青与胶粉间相容性好、高温存储性能稳定的胶粉改性沥青.考察并得出相关工艺条件,同时应用多种评价手段分析改性后沥青的性能,结果表明,预处理后胶粉改性沥青的高温存储性能稳定,低温时柔韧性、抗开裂性能明显提高,高温时稳定性、抗车辙能力及弹性回变性能增强,沥青粘弹区间明显变宽.     

复合固体超强酸SO42-/Fe2O3-γ-Al2O3催化合成丁酸丁酯

采用沉淀硫酸化法制备了复合固体超强酸催化剂SO2-4/Fe2O3-γ-Al2O3,确定了其最佳制备工艺条件:硫酸浸渍浓度为0.6 mol/L,浸渍时间4 h;焙烧温度550℃,焙烧时间3 h.并采用该催化剂合成丁酸丁酯,考察了物料配比、催化剂用量和反应时间对酯化反应的影响,确定了丁酸丁酯的最佳合成条件:丁醇与丁酸摩尔比为1.4:1,催化剂用量0.9%(以反应物质量计),回流条件下反应3.0 h,在此最佳合成条件下,酯化率可达95.6%.     

Profile-Driven Component Placement for Cluster-Based Online Services

The growth of the Internet and of various intranets has spawned a wealth of online services, most of which are implemented on local-area clusters using remote invocation (for example, remote procedure call/remote method invocation) among manually placed application components. Component placement can be a significant challenge for large-scale services, particularly when application resource needs are workload dependent. Automatic component placement has the potential to maximize overall system throughput. The key idea is to construct (offline) a mapping between input workload and individual-component resource consumption. Such mappings, called component profiles, then support high-performance placement. Preliminary results on an online auction benchmark based on J2EE (Java 2 Platform, Enterprise Edition) suggest that profile-driven tools can identify placements that achieve near-optimal overall throughput.     

Monte Carlo simulation of gas phase polymerization of 1,3‐butadiene. Part II: Kinetics optimization and confirmation

Studies on the deactivations and initiations of gas phase polymerizations of 1,3‐butadiene have been achieved by Monte Carlo simulation. Initiation and deactivation control the reaction before and after the peak of the polymerization rate, respectively. The influence of polymerization temperature has been studied. Monte Carlo modeling of polymerization kinetics and mechanism was confirmed by the agreement of experimental data and simulation results of polymerizations run with a temporary evacuation of monomer. The balance of catalysts and active chains is established by both initiation and chain transfer reactions with cocatalyst, which causes a ‘pseudo‐stability’ stage. © 2003 Society of Chemical Industry     

Characteristics of low-leakage deep-trench diode for ESD protection design in 0.18-/spl mu/m SiGe BiCMOS process

This paper proposes a novel low-leakage BiCMOS deep-trench (DT) diode in a 0.18-/spl mu/m silicon germanium (SiGe) BiCMOS process. By means of the DT and an n/sup +/ buried layer in the SiGe BiCMOS process, a parasitic vertical p-n-p bipolar transistor with an open-base configuration is formed in the BiCMOS DT diode. Based on the two-dimensional (2-D) simulation and measured results, the BiCMOS DT diode indeed has the lowest substrate leakage current as compared to the conventional p/sup +//n-well diode even at high temperature conditions, which mainly results from the existence of the parasitic open-base bipolar transistor. Considering the applications of the diode string in electrostatic discharge (ESD) protection circuit designs, the BiCMOS DT diode string also provides a good ESD performance. Owing to the characteristics of the low leakage current and high ESD robustness, it is very convenient for circuit designers to use the BiCMOS DT diode string in their IC designs.     

以3D软件应用为中心的设计管理模式——PDS在配管设计中的应用

由PDS的特点入手,结合工程实践的应用情况,阐明了3D软件可以更广泛的应用于配管的设计中,强调了以3D模型为中心开展设计和管理的新模式.