锂离子电池用聚合物电解质的最新进展II.含液聚合物电解质

由于干态聚合物电解质目前还不能满足聚合物锂离子电池的应用要求,人们致力于开发含液体增塑剂的聚合物电解质,包括凝胶型和微孔型两类体系。本文综述了含液聚合物电解质的最新进展,重点论述了各种新体系和新方法。     

φ90mm低铬铸球开裂失效分析

φ90mm低铬铸球在做落球试验中过早出现开裂现象。将该铸球材质进行化学成分分析、力学性能测定及金相组织观察。分析结果表明，该铸球的材料中夹杂物含量较高，其硬度值又偏高，铸球内部又存在严重缩松及其铸态组织中存在大量奥氏体转变产物，致使铸球在落球试验中过早开裂。经过工艺措施的改进，解决了铸球出现过早开裂的现象。     

微桥法镍膜的弹性模量和残余应力测量

利用MEMS技术制作了不同尺寸的镍(Ni)膜微桥结构样品。采用纳米压痕仪XP系统测量了微桥载荷与位移的关系,并结合微桥力学理论模型得到了两种不同尺寸的Ni膜的弹性模量和残余应力。结果表明,两种不同尺寸的Ni膜的弹性模量结果一致,为190 GPa左右,但是残余应力变化较大。与采用纳米压痕仪直接测得的带有硅(Si)基底的Ni膜弹性模量186.8 7.5 GPa相比较,两者符合较好。     

Preparation, patterning and luminescent properties of nanocrystalline Gd2O3:A (A=Eu, Dy, Sm, Er) phosphor films via Pechini sol–gel soft lithography

Nanocrystalline Gd₂O₃:A (A=Eu³⁺, Dy³⁺, Sm³⁺, Er³⁺) phosphor films and their patterning were fabricated by a Pechini sol–gel process combined with a soft lithography. X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM) and optical microscopy, UV/vis transmission and photoluminescence (PL) spectra as well as lifetimes were used to characterize the resulting films. The results of XRD indicated that the films began to crystallize at 500 °C and that the crystallinity increased with the elevation of annealing temperatures. Uniform and crack free non-patterned phosphor films were obtained by optimizing the composition of the coating sol, which mainly consisted of grains with an average size of 70 nm and a thickness of 550 nm. Using micro-molding in capillaries technique, we obtained homogeneous and defects-free patterned gel and crystalline phosphor films with different stripe widths (5, 10, 20 and 50 μm). Significant shrinkage (50%) was observed in the patterned films during the heat treatment process. The doped rare earth ions (A) showed their characteristic emission in crystalline Gd₂O₃ phosphor films due to an efficient energy transfer from Gd₂O₃ host to them. Both the lifetimes and PL intensity of the rare earth ions increased with increasing the annealing temperature from 500 to 900 °C, and the optimum concentrations for Eu³⁺, Dy³⁺, Sm³⁺, Er³⁺ were determined to be 5, 0.25, 1 and 1.5 mol% of Gd³⁺ in Gd₂O₃ films, respectively.     

基于VXI总线的超宽带线性调频信号源的设计

主要介绍了VXI总线C尺寸超宽带线性调频信号源的设计方法，重点描述了利用现场可编程逻辑器件FPAG和DSP设计VXI总线接口电路，以及数字波形存储直读技术在线性调频信号源中的应用。     

一维光子晶体禁带反射率随结构的变化

用特征矩阵方法得出了一维光子晶体的反射率计算公式,以/4波片堆为例,计算了当两种介质采用不同折射率的物质时,在第一光子禁带TE波及TM波的反射率随入射角的变化。结果显示,TE波与TM波的情况不完全相同。总的来说,增大两种介质折射率的差别,或者同时提高两种介质的折射率,或者增加周期数都有利于制造出具有完全光子禁带的一维光子晶体。     

数值试井在白6-2井测试资料分析评价中的应用

数值试井是在近来发展的一项新的试井解释技术，具有处理非均质，复杂边界油气藏问题的优点，弥补了常规解析试井技术的不足。运用数值试井解释技术，结合动、静态资料，通过对白6-1断块白6-2井测试资料的综合分析评价，确定了储层渗流参数，落实了该气藏的边界情况，为该断块下一步开发提供可靠依据。     

宝力格油田保护油层钻井液技术

钻井液作为与油层首先接触的外来流体极易对油层造成损害,做好钻井液保护油层工作在整个油层保护系统工程中非常重要.针对华北油田宝力格油田的储层物性,室内从岩心的敏感性评价入手,开展了钻井液保护油层技术的研究.通过对油层封堵技术的研究,研制出了适合于该油田储层特征的油层保护剂,结合现场钻井液施工的特点,制定了便于现场操作的保护油层施工措施.该技术自2002年开始,在二连地区宝力格油田共实施162口井.采取油层保护措施的井,完善井为86%,说明该钻井液技术在宝力格油田应用效果较好.     

现役水工钢闸门结构可靠性鉴定时荷载取值分析

采用类比法确定现役水工钢闸门结构的荷载评估基准期。以静水压力为例，得了其在荷载评估基准期内的统计参数，讨论了闸门主梁受弯碱坏时可靠指标随继续使用期的变化。     

Analysis of the mechanism of die soldering in aluminum die casting

A mechanism of soldering of an aluminum alloy die casting to a steel die is proposed. A soldering critical temperature is postulated, at which iron begins to react with aluminum to form an aluminum-rich liquid phase and solid intermetallic compounds. The liquid joins the die with the casting upon solidification. The critical temperature is determined by the elements in both the casting alloy and the die material and is equal to the solidus temperature of the resulting alloy. The critical temperature is used to predict the onset of die soldering, and the local liquid fraction is related to the soldering tendency. Experiments have been carried out to validate the concept and to determine the critical temperature for die soldering in an iron-aluminum system. Thermodynamic calculations are used to determine the critical temperature and soldering tendency for the cases of pure aluminum and a 380 alloy in a steel mold. Factors affecting the soldering tendency are discussed, and methods for reducing die soldering are suggested.