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91.
92.
93.
Robert G. Whirley Gregory A. Henshall 《International journal for numerical methods in engineering》1992,35(7):1427-1442
This paper presents a fast numerical algorithm for the implementation of material models for creep into finite element codes. First, an overview of existing algorithms for transient and steady-state creep is given. Next, a new formulation is presented which reduces the constitutive integration to the solution of a scalar non-linear algebraic equation. A solution is shown to exist without the need for subincrementation. Details of the numerical algorithm are then discussed. The paper closes with several numerical examples which illustrate the speed, robustness and accuracy of the proposed procedure as implemented in the Lawrence Livermore National Laboratory finite element codes NIKE2D and NIKE3D. 相似文献
94.
A method of posterior mitral annulus remodeling is presented. The posterior annulus is divided into three segments, each segment encircled by a suture that is passed in a tourniquet. Coaptation of the leaflets can be achieved by tightening the tourniquets while the ventricle is being filled. This technique is simple and quick, avoids the use of foreign material, and requires less expertise and judgment than traditional annuloplasties. 相似文献
95.
96.
A. Witvrouw K. Maex W. De Ceuninck G. Lekens J. D'Haen L. De Schepper 《Microelectronics Reliability》1998,38(6-8)
The degradation due to stress induced voiding of nitride passivated Al-1 wt.% Si and Ti/TN/ Al-1wt.% Si-0.5 wt. % Cu/Ti/TN interconnects with widths ranging between 0.4 and 1.2 μm was studied by in-situ conventional
high resolution resistance measurements (HRRM) during storage at temperatures between 168 and 240°C. The conventional measurements on Al-Si lines, which lasted more than one year, clearly showed that the interconnect lifetime decreases with decreasing line width. With HRRM the degradation due to stress induced voiding can be detected much sooner and with much more detail. From the HRRM it is clear that the resistance changes during storage often happen in jumps and that the degradation has a rather complex alloy, line width and temperature dependence. Both for 0.4 and 0.6 μm wide Al---Si lines more degradation occurred for storage at 175 °C compared to storage at 200 °C. For the Al---Si---Cu stacks the degradation of 0.4 μm wide lines was worse for storage at 240°C compared to storage at 200 °C, but the opposite was true for the 0.6 μm wide lines. 相似文献
97.
98.
Balasa F. Catthoor F. Hugo De Man 《Very Large Scale Integration (VLSI) Systems, IEEE Transactions on》1995,3(2):157-172
Memory cost is responsible for a large amount of the chip and/or board area of customized video and image processing system realizations. In this paper, we present a novel technique-founded on data-flow analysis which allows one to address the problem of background memory size evaluation for a given nonprocedural algorithm specification, operating on multidimensional signals with affine indexes. Most of the target applications are characterized by a huge number of signals, so a new polyhedral data-flow model operating on groups of scalar signals is proposed. These groups are obtained by a novel analytical partitioning technique, allowing to select a desired granularity, depending on the application complexity. The method incorporates a way to tradeoff memory size with computational and controller complexity 相似文献
99.
Pb1–x
Ca
x
[(Co0.5W0.5)0·05Ti0.95]O3 ceramics with x = 0.24, 0.30 and 0.35, are prepared by a solid state reaction of oxides. Deviations from nominal chemical compositions and formation of segregated phases different from modified lead titanate perovskites, are studied. Pyro- and non-pyroelectric currents excited in the material by a thermal wave are investigated and related to mobility of electrical charges in the materials. 相似文献
100.
The conclusions are put forward that are adopted by a discussion group preparing the framework for a limitation policy of the radon problem in Belgium. Existing and future situations are treated in a coherent policy that is adequate for practical implementation. An action level is defined, together with a hierachy of levels for new constructions. The decision logic for the acceptance of building materials is explained. 相似文献