Components of variation in normal personality.

Applied a random effects linear model to personality data (e.g., the Eysenck Personality Questionnaire and the Comrey Personality Scales) gathered from 138 adult Swedish twins and their families. The multiple relationships surrounding the twins allowed for the estimation of variance fractions due to several genetic and environmental factors. A striking pattern of similarity among personality traits emerged. All variables were characterized by having near-zero additive genetic, small–moderate nonadditive genetic, negligible prenatal, small postnatal familial, and quite large postnatal extrafamilial effects. Personality traits were influenced primarily by the environment, especially those outside the home. Genetic influences were confounded by cultural factors. It is suggested that temporal instability, genetic epistasis, or both could be underlying factors that unify the results for personality variables. (22 ref) (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

Spectral selectivity and accelerated life testing of Al-PbS solar selective surfaces

High absorptance and low thermal emittance selective surfaces have been formed by evaporating lead sulphide onto Al evaporated Al substrates. The dependence of selectivity, α/?, on thickness has been studied. The maximum selectivity was obtained for PbS thickness of 400 Å. The emissivity is found to increase with temperature. The coatings are stable up to a temperature of 240°C in air. Long term ultraviolet irradiation causes the photo-oxidation of PbS to PbSO₄ which results in the increase of emittance and a decrease in absorptance. When cycled between 0°C and 200°C, the coatings do not show any signs of degradation.     

Reliable Lead-Free Rework Process for Stacked CSP Components

Memory module manufacturers face an ongoing challenge to incorporate more functionality and superior performance with each new generation of product offering. The growth in demand for memory capacity is surpassing the pace at which memory component manufacturers are able to cost-effectively produce the next generation of monolithic memory devices. This drives the need for utilizing stacked components for memory module assemblies. The complex nature of stacked chip-scale package (CSP) components coupled with a lead-free process presents unique rework challenges that needed to be studied and addressed. Reworking a CSP is complicated as the solder joints are hidden underneath the component. The process window available for the lead-free rework process is very narrow. There are number of other critical factors, which complicate and affect the repeatability of the rework process. The complications only increase with the use of stacked CSP devices. The rework of package stacked CSP components, which are complex in nature, is a daunting task. The key issues and observations with regard to the issues and challenges associated with the lead-free rework of mirror-imaged package stacked CSP components has been presented in this paper. In addition, the paper also provides a recipe for reliably reworking these packages.     

PAR2-Induced Tissue Factor Synthesis by Primary Cultures of Human Kidney Tubular Epithelial Cells Is Modified by Glucose Availability

Coagulopathies common to patients with diabetes and chronic kidney disease (CKD) are not fully understood. Fibrin deposits in the kidney suggest the local presence of clotting factors including tissue factor (TF). In this study, we investigated the effect of glucose availability on the synthesis of TF by cultured human kidney tubular epithelial cells (HTECs) in response to activation of protease-activated receptor 2 (PAR2). PAR2 activation by peptide 2f-LIGRLO-NH₂ (2F, 2 µM) enhanced the synthesis and secretion of active TF (~45 kDa) which was blocked by a PAR2 antagonist (I-191). Treatment with 2F also significantly increased the consumption of glucose from the cell medium and lactate secretion. Culturing HTECs in 25 mM glucose enhanced TF synthesis and secretion over 5 mM glucose, while addition of 5 mM 2-deoxyglucose (2DOG) significantly decreased TF synthesis and reduced its molecular weight (~40 kDa). Blocking glycosylation with tunicamycin also reduced 2F-induced TF synthesis while reducing its molecular weight (~36 kDa). In conclusion, PAR2-induced TF synthesis in HTECs is enhanced by culture in high concentrations of glucose and suppressed by inhibiting either PAR2 activation (I-191), glycolysis (2DOG) or glycosylation (tunicamycin). These results may help explain how elevated concentrations of glucose promote clotting abnormities in diabetic kidney disease. The application of PAR2 antagonists to treat CKD should be investigated further.     

Scuffing resistance of salt bath nitrocarburized medium carbon steel

The usefulness of the ferritic nitrocarburizing treatment for improving the tribological properties of ferrous components is well established. However, the thin compound layer of beneficial epsilon carbonitride that develops at the surface lacks the ability to bear high Hertzian stresses. Nitrocarburizing in the austenite phase field of the Fe---N---C system overcomes this disadvantage since the formation of a hard zone of martensite-bainite below the compound layer provides the back-up to withstand point loads. Results of the Falex scuffing test indicate that the failure load increases on account of the thicker compound layer at the surface. The results indicate further that the frictional heat generated during the test coupled with working by the jaws convert the retained austenite present in the sub-compound layer to harder microconstituents. The study suggests that the austenitic treatment could be useful for applications involving simultaneous heat and work such as hot working dies.     

Wear of steel in rolling contact with silicon nitride

Wear of steel (AISI M-50 and AISI 52100) bearing balls in lubricated rolling contact with ground and ground-and-lapped silicon nitride rods was studied using a ball-on-rod rolling-contact-fatigue (RCF) tester. The steel balls suffered significant wear in rolling contact with the as-ground (R_a = 0.18 μm) silicon nitride rods. The wear volume loss was approximately linear with the rolling distance. The wear rate increased linearly with the initial Hertzian contact stress in the range, 3–6.5 GPa. Examination of the wear tracks in a scanning electron microscope revealed surface features that suggested a wear mechanism that involved plastic deformation of the steel surface, squeezing of the metal symmetrically outward and rupture of the metal layers at the edges. The steel balls suffered negligible wear but failed by spalling in rolling contact with the ground-and-lapped silicon nitride rods (R_a = 0.08 μm) at an initial contact stress of 5.5 GPa. The as-ground silicon nitride rods exhibited neither wear nor spalling in the RCF tests, while the ground-and-lapped silicon nitride rods showed no wear but occasional spalling failure.     

RECDWELL-Computer aided design of six-link planar dwell mechanisms

Linkage-type dwell mechanisms are less expensive to manufacture and maintain, and can be superior to cams at high speed. They are also easily adjustable for satisfying variable output motion requirements. In spite of these advantages they have not found wide application. Part of the reason for this lack of popularity is the absence of proper design tools. The inspiration for this work stems from the need to bridge this technological gap. RECDWELL helps to design both circular-arc and straight-line dwell mechanisms using a technique which is simple, efficient and accurate.     

Design, implementation, and characterization of an optical power supply spot-array generator for a four-stage free-space optical backplane

The design and implementation of a robust, scalable, and modular optical power supply spot-array generator for a modulator-based free-space optical backplane demonstrator is presented. Four arrays of 8 x 4 spots with 6.47-mum radii (at 1/e(2) points) pitched at 125 mum in the vertical direction and 250 mum in the horizontal were required to provide the light for the optical interconnect. Tight system tolerances demanded careful optical design, robust optomechanics, and effective alignment techniques. Issues such as spot-array generation, polarization, power efficiency, and power uniformity are discussed. Characterization results are presented.