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31.
Jui-Ting Weng Jiunn Ru Lai Wanjiun Liao 《Wireless Communications, IEEE Transactions on》2006,5(7):1676-1684
In this paper, we analyze node mobility for reliable packet delivery in mobile IP networks. In mobile IP, packets destined to roaming nodes are intercepted by their home agents and delivered via tunneling to their care of addresses (CoA). A mobile node may roam across multiple subnets. At each boundary crossing, a handoff is initiated such that the CoA is updated and a new tunnel is established. We consider both basic mobile IP handoff and smooth handoff. We find that reliable packet delivery in mobile IP networks can be modeled as a renewal process, because the retransmission over a new tunnel after each boundary crossing is independent of the previous history. We then derive the probability distribution of boundary crossings for each successful packet, based on which the packet reliable delivery time can be obtained. Our analytical model is derived based on a general distribution of residence time in a subnet and a general distribution of successful retransmission attempts in each subnet. The results can be readily applied to any distributions for both items. We also provide numerical examples to calculate the probability distribution of boundary crossings, and conduct simulations to validate our analytical results 相似文献
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33.
Chou Y.C. Leung D. Lai R. Grundbacher R. Barsky M. Kan Q. Tsai R. Wojtowicz M. Eng D. Tran L. Block T. Liu P.H. Nishimoto M. Oki A. 《Electron Device Letters, IEEE》2003,24(6):378-380
The authors have investigated the reliability performance of G-band (183 GHz) monolithic microwave integrated circuit (MMIC) amplifiers fabricated using 0.07-/spl mu/m T-gate InGaAs-InAlAs-InP HEMTs with pseudomorphic In/sub 0.75/Ga/sub 0.25/As channel on 3-in wafers. Life test was performed at two temperatures (T/sub 1/ = 200 /spl deg/C and T/sub 2/ = 215 /spl deg/C), and the amplifiers were stressed at V/sub ds/ of 1 V and I/sub ds/ of 250 mA/mm in a N/sub 2/ ambient. The activation energy is as high as 1.7 eV, achieving a projected median-time-to-failure (MTTF) /spl ap/ 2 /spl times/ 10/sup 6/ h at a junction temperature of 125 /spl deg/C. MTTF was determined by 2-temperature constant current stress using /spl Delta/G/sub mp/ = -20% as the failure criteria. The difference of reliability performance between 0.07-/spl mu/m InGaAs-InAlAs-InP HEMT MMICs with pseudomorphic In/sub 0.75/Ga/sub 0.25/As channel and 0.1-/spl mu/m InGaAs-InAlAs-InP HEMT MMICs with In/sub 0.6/Ga/sub 0.4/As channel is also discussed. The achieved high-reliability result demonstrates a robust 0.07-/spl mu/m pseudomorphic InGaAs-InAlAs-InP HEMT MMICs production technology for G-band applications. 相似文献
34.
The objective is to have uniformly distributed tangential stresses on the transition profile of a stepped bar subjected to tensile and torsional loading using an axisymmetric boundary element formulation. The transition curve is represented by the Langragian interpolation polynomial with progressive degrees to avoid shape distortion during the optimization procedure. The calculated result is compared with that obtained by fluid dynamics given in the literature. It is seen that the transition curve obtained in this paper is reasonable. 相似文献
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共晶碳化物团球化对铸铁激光熔敷层抗裂性的影响 总被引:1,自引:1,他引:0
为提高铸铁表面大面积激光熔敷层抗裂性问题,通过冶金因元素控制熔敷层组织形态在熔敷材料中加入碱金属元素钾,研究了在激光快速加热条件下钾对铸铁激光熔敷层组织团球化的影响,进而分析了该球状组织对熔敷层抗裂性的影响,结果表明随熔敷金属内钾含量增多熔敷层内共晶碳化物组织呈球状及孤岛状,这种组织明显提高了熔敷层抗裂性,此外大量的渗碳体组织确保了熔敷层具有较高的耐磨性;获得了无裂纹的大面积搭接熔敷层,其对应合金系统为Fe-C-Si-Ni-K。 相似文献
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38.
Juey H. Lai Curtis Knudson Leander Hallgren Richard B. Douglas Patrick Griffin 《Polymer Engineering and Science》1985,25(12):778-781
This paper reports the effect of humidity and temperature on the adhesive strength of a pressure sensitive adhesive (Flexbond 150) used to bond Mylar films. It has been found that, ill general, the adhesive strength decreases significantly with an increase in temperature. The effect of humidity on the bonding strength, however, was found to be process dependent. The sample preparation conditions, e.g., press weight for the bonding and the press time, are important in determining the humidity effect. The water sorption isotherm A 24°C for the adhesive was also determined. The amount of water sorbed by the adhesive at 95 percent relative pressure was found to be less than one weight percent. 相似文献
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40.
Dongming Peng Mi Lu 《Very Large Scale Integration (VLSI) Systems, IEEE Transactions on》2005,13(1):106-125
Although the notion of the parallelism in multidimensional applications has existed for a long time, it is so far unknown what the bound (if any) of inter-iteration parallelism in multirate multidimensional digital signal processing (DSP) algorithms is, and whether the maximum inter-iteration parallelism can be achieved for arbitrary multirate data flow algorithms. This paper explores the bound of inter-iteration parallelism within rate-balanced multirate multidimensional DSP algorithms and proves that this parallelism can always be achieved in hardware system given the availability of a large number of processors and the interconnections between them. 相似文献